Wafer regeneration chemical mechanical polishing system and process

By designing an integrated wafer regeneration chemical mechanical polishing system, which uses an optical inspection station to identify the degree of damage and automatically set the polishing process, the system solves the problems of inflexible parameter adjustment and high risk of contamination in existing technologies, and achieves efficient and stable wafer regeneration results.

CN121973071APending Publication Date: 2026-05-05BEIJING SEMICORE MICROELECTRONICS EQUIPMENT CO LTD
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Patent Information

Application Number
CN202610030293.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-01-09
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

Existing chemical mechanical polishing equipment cannot flexibly adjust parameters, has poor process adaptability, is difficult to adapt to different film layers, and has a high risk of cross-process transfer of contamination, resulting in low wafer regeneration efficiency and unstable quality.

Method used

A wafer regeneration chemical mechanical polishing system was designed, including a buffer unit, a conveying unit, a polishing unit, and a cleaning unit. The system identifies the degree of wafer damage through an optical inspection station and automatically sets polishing processes and cleaning parameters according to the degree of damage, thereby achieving differentiated polishing treatment and integrated equipment control.

Benefits of technology

It improves polishing efficiency, reduces the probability of contamination, and increases the yield of regenerated wafers, meeting the multiple demands of high precision and low cost, and adapting to the needs of wafers with different damage levels.

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Abstract

The invention provides a wafer regeneration chemical mechanical polishing system and process, and belongs to the technical field of semiconductor manufacturing, and the wafer regeneration chemical mechanical polishing system comprises a buffer unit, a conveying unit, a polishing unit, a cleaning unit and a control unit, the conveying unit, the polishing unit and the cleaning unit are located on the same side of the buffering unit and are sequentially arranged along the first linear path, and the conveying unit is located between the polishing unit and the cleaning unit; the buffer unit comprises a plurality of wafer cassettes, an optical detection station located on one side of the plurality of wafer cassettes, and a transmission mechanism located on one side, close to the conveying unit, of the wafer cassettes; the conveying unit comprises a transfer disc moving along the second linear path; the polishing unit comprises a first polishing assembly and a second polishing assembly which are arranged along the second linear path. Each polishing assembly comprises at least two polishing discs and polishing heads corresponding to the polishing discs.
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