A modular radiation-resistant power supply based on reconfigurable technology

By deconstructing the power supply system into independent modules and adopting a modular design that combines HTCC-AlN ceramics and thick film technology, the problems of insufficient power density, high cost, and insufficient flexibility of high-current, high-power radiation-resistant DC/DC converters in microwave communication and FPGA power supply systems are solved, realizing a miniaturized, low-cost, and highly reliable modular radiation-resistant power supply.

CN122092679APending Publication Date: 2026-05-26NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
Filing Date
2026-01-15
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing high-current, high-power radiation-resistant DC/DC converters suffer from insufficient power density, high cost, long development cycle, and insufficient flexibility in microwave communication and FPGA power supply systems, especially in thick-film hybrid integration and PCB process solutions where further improvement is difficult.

Method used

The modular radiation-resistant power supply based on reconfigurable technology deconstructs the power system into independent power supply module units, signal module units, primary power module units, secondary power module units, and magnetic component units. It adopts HTCC-AlN ceramic integrated shell packaging and thick film technology combined with DBC substrate packaging to achieve modular design and interconnection through standardized electrical interfaces.

Benefits of technology

It achieves a modular radiation-resistant power supply that is miniaturized, low-cost, highly reliable, and has high R&D efficiency. It supports rapid reconfiguration to adapt to different voltage and current requirements, significantly shortens the R&D cycle, and improves system maintainability.

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Abstract

This invention discloses a modular radiation-hardened power supply based on reconfigurable technology, relating to the field of switching power supply circuit technology. The power supply is composed of physically independent power supply module units, signal module units, primary power module units, secondary power module units, and magnetic component units, which are then deconstructed and interconnected. The power supply module units are responsible for supplying power to the control and drive circuits; the signal module units act as the control center, outputting drive signals and performing synchronous rectification control; the primary and secondary power module units are respectively connected to the primary and secondary sides of the magnetic component units to form a power conversion circuit. This invention, through standardized modular design and differentiated packaging processes, solves the problems of long development cycles, poor flexibility, and difficult heat dissipation under high current in traditional radiation-hardened power supplies, aiming to provide a highly reliable and easily reconfigurable power supply solution.
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Description

Technical Field

[0001] This invention relates to the field of switching power supply circuit technology, and in particular to a modular radiation-resistant power supply based on reconfigurable technology. Background Technology

[0002] High-current, high-power radiation-resistant DC / DC converters have broad application prospects in electronic systems such as microwave communication and FPGA power supply. Although existing thick-film hybrid integrated DC / DC converters in China perform reasonably well in terms of power density, they have limitations in terms of high current carrying losses and the fabrication of magnetic component interconnections, and it is difficult to further improve the power level.

[0003] While PCB-based radiation-resistant power supply solutions can mitigate some current loss through multi-layer wiring, their reliance on expensive pre-packaged components significantly increases costs. Furthermore, the series-parallel design of the input bus capacitors occupies a large board area, meaning the overall size of the product offers no clear advantage over thick-film products. In addition, current power supply development often begins at the component level, lacking standardized module reuse mechanisms. This results in long development cycles and insufficient flexibility when dealing with power systems with multiple outputs or varying power requirements.

[0004] Therefore, how to achieve a modular radiation-resistant power supply that balances miniaturization, low cost, high reliability, and high R&D efficiency has become an urgent technical challenge. Summary of the Invention

[0005] The main objective of this invention is to provide a modular radiation-resistant power supply based on reconfigurable technology, aiming to achieve a modular radiation-resistant power supply that balances miniaturization, low cost, high reliability, and high R&D efficiency.

[0006] To achieve the above objectives, this invention proposes a modular radiation-resistant power supply based on reconfigurable technology. The power supply is configured to convert an input bus voltage into an output voltage. It is constructed and interconnected from physically independent power supply module units, signal module units, primary power module units, secondary power module units, and magnetic component units. Each power supply module unit establishes power supply connections with both the signal module unit and the primary power module unit, and is configured to provide control loop power to the signal module unit and drive loop power to the primary power module unit. The signal module unit, acting as a control hub, is configured to output drive control signals to the primary power module unit and receive current sampling signals from the primary power module unit. The signal module unit also includes a synchronous rectification control interface for connecting to the secondary power module unit. The primary power module unit is connected to the primary side of the magnetic component unit, and the secondary power module unit is connected to the secondary side of the magnetic component unit, forming a power conversion loop that transfers energy from the primary side to the secondary side.

[0007] Preferably, both the power supply module unit and the signal module unit are packaged in an HTCC-AlN ceramic integrated shell; both the primary power module unit and the secondary power module unit are packaged using a thick-film process combined with a DBC substrate and an all-metal shell.

[0008] Preferably, the input terminal of the power supply module unit and the input terminal of the primary power module unit are both connected to the input bus voltage. The first output terminal of the power supply module unit A power supply side connected to the signal module unit is provided to supply power to the control loop; the second output terminal of the power supply module unit Connected to the power supply side of the primary power module unit to provide power to the drive circuit; the drive signal output terminal of the signal module unit. The synchronous rectification control interface is connected to the drive terminal of the primary power module unit; the synchronous rectification control interface includes a first synchronous rectification enable terminal. Second synchronous rectification enable terminal The first synchronous rectification enable terminal and the second synchronous rectification enable terminal They are respectively connected to the secondary power module unit.

[0009] Preferably, the power supply module unit integrates an RCC auxiliary power supply circuit and an undervoltage protection circuit; the undervoltage protection function terminal of the power supply module unit is connected through a first resistor. Second resistor The undervoltage protection signal input terminal connected to the signal module unit .

[0010] Preferably, the RCC auxiliary power supply circuit includes an auxiliary transformer. and the first power transistor The auxiliary transformer The same terminal of the first primary winding Connect the first power transistor The collector of the auxiliary transformer The opposite terminals of the first primary winding Connect the input bus And via the oscillation resistor Connected to the first power transistor The base of the auxiliary transformer; The same terminal of the second primary winding Connect to the input location, its variant end Connected to the first diode Second diode The series branch consisting of the auxiliary transformer; The same-named terminals of the first winding Connect the first Schottky diode Its alternative name is Duan Grounding; the auxiliary transformer The same terminal of the second stage winding Connect the second Schottky diode The undervoltage protection circuit is connected to the auxiliary transformer. On the third-stage winding, the corresponding terminals of the third-stage winding Grounding, its synonym terminal Connect the third Schottky diode The third Schottky diode Connect to undervoltage protection sampling point .

[0011] Preferably, the signal module unit integrates a current sampling circuit, an autonomous current sharing circuit, an over-temperature protection circuit, and an inhibit circuit.

[0012] Preferably, the current sampling circuit includes a current transformer connected to the primary power module unit. Sampling resistor and diodes The output of the current sampling circuit is through a resistor. Current sampling pin connected to the PWM controller .

[0013] Preferably, the autonomous current sharing circuit includes an operational amplifier. Zener diode The operational amplifier The power supply terminal is connected to the power supply of the control circuit. The grounding terminal is connected to the output ground; the operational amplifier The inverting input terminal is connected to the first current sharing resistor. Second current sharing resistor A current-sharing capacitor is connected to the non-inverting input terminal. and resistance The output is connected to a current-sharing transistor. and diodes Output current sharing signal.

[0014] Preferably, the over-temperature protection circuit includes an operational amplifier. The operational amplifier Configured as a comparator, the comparator The first input terminal is connected to a thermistor. The inhibit circuit includes an inhibit terminal. The forbidden end Through resistance and transistor The undervoltage protection signal input terminal connected to the signal module unit .

[0015] Preferably, the magnetic component unit includes a main transformer. The primary power module unit includes an input filter circuit, a power MOSFET group, and a drive controller. The input filtering circuit includes a first filter capacitor. Second filter capacitor The input filter circuit is connected to the main transformer. The primary winding's corresponding terminal; the drain of the power MOSFET group is connected to the main transformer. The opposite terminal of the primary winding, and the gate of the power MOSFET group are connected to the drive controller via a drive resistor. .

[0016] Preferably, the secondary power module unit includes a first synchronous rectifier diode. Second synchronous rectifier tube and output filtering circuit; the magnetic component unit includes a main transformer. and output inductor The first synchronous rectifier tube and the second synchronous rectifier tube The control terminals are respectively connected to the first synchronous rectification enable terminal. and the second synchronous rectification enable terminal The main transformer The secondary winding output terminal is connected to the output inductor. The input terminal of the primary power module and the input terminal of the secondary power module unit.

[0017] This invention constructs a standardized modular power supply architecture by deconstructing the power supply system into physically independent power supply module units, signal module units, primary power module units, secondary power module units, and magnetic component units. The power supply and signal module units are packaged in an integrated HTCC-AlN ceramic housing, leveraging its high thermal conductivity and airtightness to ensure the control core's radiation resistance and heat dissipation performance. The primary and secondary power module units employ thick-film technology combined with a DBC substrate and an all-metal housing, effectively solving the problems of heat loss and electromagnetic shielding during high-current transmission. The modules are interconnected through standard-defined electrical interfaces. The signal module unit acts as the central coordinator for primary drive and secondary synchronous rectification, the power supply module unit provides auxiliary power, and the independently packaged magnetic component units allow for flexible selection of transformers and inductors. This design not only reduces the thermal stress of individual modules but also supports rapid power supply reconfiguration to adapt to different voltage and current requirements by simply replacing magnetic components or paralleling power modules, significantly shortening the development cycle and improving system maintainability. Attached Figure Description

[0018] The present invention will now be described in detail with reference to specific embodiments and accompanying drawings, wherein: Figure 1 The structural block diagram of the modular radiation-resistant power supply based on reconfigurable technology provided in the embodiments of the present invention is shown.

[0019] Figure 2 This is a schematic diagram of the internal circuit of the power supply module unit provided in an embodiment of the present invention.

[0020] Figure 3 This is a schematic diagram of the current sampling circuit in the signal module unit provided in an embodiment of the present invention.

[0021] Figure 4 This is a schematic diagram of the autonomous current sharing circuit in the signal module unit provided in an embodiment of the present invention.

[0022] Figure 5 This is a schematic diagram of the over-temperature protection circuit in the signal module unit provided in an embodiment of the present invention.

[0023] Figure 6 This is a schematic diagram of the disable circuit in the signal module unit provided in an embodiment of the present invention.

[0024] Figure 7 The schematic diagram of the internal circuit of the primary power module unit provided in the embodiment of the present invention.

[0025] Figure 8The schematic diagram of the internal circuit of the secondary power module unit provided in the embodiment of the present invention.

[0026] Figure 9 This is a schematic diagram of the physical structure of a power supply prototype provided in an embodiment of the present invention. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0028] Example 1 like Figures 1 to 9 As shown, this embodiment provides a modular radiation-resistant power supply based on reconfigurable technology, configured to convert the input bus voltage into a stable output voltage. In the specific application scenario of this embodiment, the power supply is designed to adapt to a wide range of input voltages from 20V to 50V, and provides an output voltage of 5V and a rated output current of 24A. The core design concept of this power supply system lies in deconstruction and reconstruction, that is, deconstructing the traditional complex power supply system into five physically independent and functionally standardized core modular units.

[0029] These five core module units specifically include: power supply module unit A, signal module unit B, primary power module unit C, secondary power module unit D, and magnetic component unit E. This modular architecture significantly differs from the integrated design in existing technologies. By physically separating control, drive, power conversion, and magnetic components, it not only reduces the thermal stress of individual modules but also makes rapid reconfiguration possible for different radiation environments or power requirements. In terms of physical packaging, to balance heat dissipation performance and radiation resistance, power supply module unit A and signal module unit B both adopt HTCC-AlN ceramic integrated shell packaging, which has excellent thermal conductivity and hermeticity. Primary power module unit C and secondary power module unit D both adopt thick-film technology combined with DBC substrate and all-metal shell packaging to accommodate the heat generated by high current transmission and provide electromagnetic shielding.

[0030] The circuit connections in this embodiment establish a complete power and control flow. Input bus voltage It is simultaneously connected to the input terminal of power supply module unit A and the input terminal of primary power module unit C. Power supply module unit A serves as the system's auxiliary energy center, and its first output terminal... Connected to the power supply side of signal module unit B, it provides a stable low-voltage power supply to the control circuit; its second output terminal Connected to the power supply side of the primary power module unit C, it provides energy to the drive circuit of the power switching transistor. The signal module unit B, acting as the control center, outputs drive signals. Connected to the drive terminal of the primary power module unit C, it enables PWM control of the primary-side power switch. Simultaneously, the signal module unit B is also equipped with a synchronous rectification control interface, which includes a first synchronous rectification enable terminal. Second synchronous rectification enable terminal These two ports are connected to the secondary power module unit D, respectively, to control the synchronous rectifier diodes on the secondary side, thereby improving rectification efficiency. In addition, the signal module unit B also receives current sampling signals from the primary power module unit C, used for overcurrent protection and current loop control.

[0031] In the power transmission path, primary power module unit C is connected to the primary side of magnetic component unit E, inverting the DC input voltage into high-frequency AC; secondary power module unit D is connected to the secondary side of magnetic component unit E, rectifying and filtering the high-frequency AC into DC output. Magnetic component unit E includes a main transformer. and output inductor This achieves primary and secondary electrical isolation and energy transfer.

[0032] The internal circuit structure of each module unit is described in detail below.

[0033] First is power supply module unit A. For example... Figure 2 As shown, this unit integrates an RCC auxiliary power supply circuit and an undervoltage protection circuit. The core of the RCC auxiliary power supply circuit is the auxiliary transformer. and the first power transistor Auxiliary transformer The same terminal of the first primary winding Connect the first power transistor The collector, its synonym terminal Connect the input bus And via the oscillation resistor Connected to the first power transistor The base of the auxiliary transformer forms a self-excited oscillation circuit. The same terminal of the second primary winding Connect to GND1, its heteronym end Connected to the first diode Second diode and capacitors The feedback branch is formed. On the secondary side, the auxiliary transformer... The same-named terminals of the first winding Connect the first Schottky diode Its alternative name is Duan Connect to output ground and a capacitor is connected. and dead load resistor Auxiliary transformer The same terminal of the second stage winding Connect the second Schottky diode Its alternative name is Duan Also connected with a filter capacitor Dead load resistor And the output ground. The undervoltage protection circuit is connected to the auxiliary transformer. On the third stage winding, the corresponding terminal of this winding Connect the output to ground and connect a capacitor. and dead load Its alternative name is Duan Connect the third Schottky diode The diode Further connect to the undervoltage protection sampling point The undervoltage protection function terminal of power supply module unit A is also connected via the first resistor. Second resistor Connect to the undervoltage protection signal input terminal of signal module unit B When the input voltage is too low, the control signal can be blocked in time.

[0034] Secondly, there is signal module unit B. For example... Figures 3 to 6 As shown, this unit integrates a current sampling circuit, an autonomous current sharing circuit, an over-temperature protection circuit, and an inhibit circuit. The current sampling circuit is used to monitor the primary current in real time, including the current transformer. Sampling resistor and diodes Current transformer Connected to the primary power module unit C, the induced current signal passes through a diode. Rectifier and resistor After sampling, its output terminal is connected to a resistor. Current sampling pin connected to the PWM controller The autonomous current sharing circuit is used for load balancing when multiple modules are connected in parallel. Its core components include operational amplifiers. Zener diode Specifically, operational amplifiers The eighth pin is connected to the power supply voltage. The fourth pin is connected to the output ground. Its second pin is connected to the first current-sharing resistor. Second current sharing resistor The third pin is connected to the current sharing capacitor. and resistance The first pin is connected to the current sharing transistor. ,diode and capacitors This outputs a current sharing signal. Zener diode. Then through the resistor Connect to power To provide a reference. The over-temperature protection circuit utilizes an operational amplifier. Construct a comparator, where the operational amplifier The fifth pin is used as the first input terminal to connect the resistor. and thermistors placed in key heat-generating areas of the PCB board Its sixth pin serves as the second input terminal, connected to a resistor network. and Pin 7 is used as the third input terminal to connect a resistor. When the temperature exceeds a set threshold, the circuit toggles to trigger protection. The disable circuit is used to control the start / stop of the external power supply, including the disable terminal. This port is connected to a resistor. ,resistance ,capacitance and transistors Connect to the undervoltage protection signal input terminal of signal module unit B Among them, the resistance Pull up to power supply level ,triode The emitter is connected to ,when When the terminal signal is activated, it is forcibly pulled low. The level is adjusted to turn off the power output.

[0035] Next is the primary power module unit C. For example... Figure 7 As shown, this module includes an input filter circuit, a power MOSFET group, and a drive controller. The input filter circuit mainly consists of a first filter capacitor. Second filter capacitor These components are connected to the main transformer in magnetic component unit E. The primary winding's corresponding terminal is used to absorb input ripple current. The power MOSFET group includes the first MOSFET. Second MOSFET Their drains are connected to the main transformer. The primary winding's opposite-name terminal has its source grounded. Its gate is connected to a drive resistor. and Connect to drive controller Receives signal from signal module unit B The signal is amplified to drive the high-speed switching action of the MOSFET.

[0036] Next is the secondary power module unit D. For example... Figure 8 As shown, this module mainly includes a first synchronous rectifier tube. Second synchronous rectifier tube And the output filter circuit. First synchronous rectifier diode. Second synchronous rectifier tube The control terminals are respectively connected to the first synchronous rectification enable terminal provided by signal module unit B. Second synchronous rectification enable terminal These two synchronous rectifier diodes are connected to the main transformer of magnetic component unit E. The secondary winding is connected, in conjunction with the output filter capacitor. This achieves efficient rectification and filtering. Compared to traditional diode rectification, synchronous rectification technology significantly reduces conduction losses, especially under high current output conditions of 24A, effectively improving the overall efficiency of the power supply.

[0037] Finally, there is the magnetic component unit E. This unit, as a separate physical module, contains the main transformer. and output inductor Main transformer Primary winding lead-out and Connected to the output terminal of the primary power module unit C; secondary winding lead-out terminal and Connect to the input terminal of secondary power module unit D. Output inductor input terminal and Connected to the main transformer The secondary output and secondary power module unit D are specifically connected to the synchronous rectifier tube in the secondary module unit. and capacitor This is used to smooth the output current. By independently packaging the magnetic components into unit E, the problem of manufacturing large-volume magnetic components using traditional thick-film processes is solved. Furthermore, it allows for flexible replacement of magnetic components based on voltage and current requirements without the need to redesign other circuit modules.

[0038] In summary, this embodiment achieves a high-performance radiation-hardened DC / DC converter through the organic interconnection of five standardized modules. The modules are connected via standard electrical interfaces, which not only simplifies the assembly process but also enables rapid porting and reconfiguration of the power system at the PCB level. For example, when higher power output is required, power expansion can be easily achieved by connecting multiple primary power module units C and secondary power module units D in parallel, along with the autonomous current sharing circuit in the signal module unit B.

[0039] Example 2 This embodiment focuses on illustrating the signal control logic and autonomous current sharing mechanism of the aforementioned modular radiation-resistant power supply in practical operation. Based on the hardware architecture described in Embodiment 1, signal module unit B not only undertakes basic PWM driving functions, but also achieves load balancing during parallel operation of multiple modules through its internally integrated autonomous current sharing circuit. This feature is particularly important for spacecraft payloads that require high-power supply.

[0040] Specifically, the autonomous current sharing circuit operates by relying on precise current sampling and feedback regulation. When multiple identical power supply modules are connected in parallel, the operational amplifiers in the signal module unit B of each module... This forms the current sharing error amplifier. The current sampling circuit of each module first converts the primary-side current signal into a voltage signal, which reflects the magnitude of the load current handled by that module. This voltage signal is then fed into the operational amplifier. The inverting input terminal, i.e., the second pin, is also connected to the first current-sharing resistor. Second current sharing resistor Simultaneously, the current-sharing buses of all parallel modules converge through physical connections to form a reference voltage representing the maximum single-module current in the system. This reference voltage is introduced into the operational amplifiers of each module. The non-inverting input terminal.

[0041] During dynamic adjustment, if the output current of a module is less than the average or maximum current represented by the current sharing bus, its operational amplifier... The voltage at the inverting input will be lower than the voltage at the non-inverting input, causing the output to go high. This high-level signal passes through the current-sharing transistor. and diodes The voltage is injected into the feedback loop of the PWM controller, forcibly increasing the output voltage of the module, thereby increasing its output current until it matches the system average level. Conversely, if the current of a module is too high, the regulation mechanism operates in the opposite direction. To ensure the stability of the regulation, a Zener diode... Matching resistor The current-sharing capacitor provides a stable bias point for the circuit. This smooths the signal, filters out high-frequency noise, and prevents oscillations in the current sharing loop. This autonomous current sharing strategy based on "automatic maximum current following" eliminates the need for an external independent current sharing controller, greatly simplifying the complexity of parallel systems and improving system redundancy and reliability.

[0042] Furthermore, this embodiment also involves the logic implementation of over-temperature protection. Thermistor It is tightly mounted near the power MOSFET group, which generates the most heat, in the primary power module unit C, or on its heat dissipation substrate. As the temperature rises, the thermistor... The resistance value changes, causing the operational amplifier to... The comparator's input voltage changes. When the temperature reaches a preset danger threshold, such as 115 degrees Celsius, the comparator flips, and the output signal blocks the drive signal through internal logic circuitry. and synchronous rectification enable signal and This cuts off power transmission, preventing permanent damage to the device due to thermal runaway. This design, which integrates protection circuitry within signal module unit B while extending the sensor to the heat source, demonstrates the flexibility of modular architecture in terms of physical layout.

[0043] Example 3 This embodiment further illustrates the specific design scheme of the modular power supply in terms of physical implementation process and radiation hardening, especially the specific implementation details of the packaging structure described in claim 2. This application adopts differentiated process routes for modules with different functions to achieve the best balance between performance and cost, taking into account the special requirements of the space radiation environment.

[0044] For power supply module unit A and signal module unit B, since they contain a large number of control chips, operational amplifiers, and precision reference sources, these devices are highly sensitive to radiation-induced displacement damage and total dose effects, and their power consumption is relatively low. Therefore, in this embodiment, both modules adopt HTCC-AlN, i.e., high-temperature co-fired ceramic-aluminum nitride ceramic integrated shell packaging. Aluminum nitride material has extremely high thermal conductivity, typically greater than 170 W / mK, approaching the level of metallic aluminum, while also possessing excellent electrical insulation properties. Using the HTCC process, multilayer wiring can be directly sintered into the ceramic substrate, achieving high-density interconnection and significantly reducing parasitic parameters. More importantly, the ceramic package provides excellent hermetic protection, effectively blocking the erosion of the chip by space plasma and providing a stable electromagnetic shielding environment for the internal chip.

[0045] For the primary power module unit C and the secondary power module unit D, since they primarily handle the switching and transmission of large currents, heat loss is mainly concentrated on the power MOSFETs and synchronous rectifier diodes. Therefore, these two modules employ a thick-film process combined with DBC (Direct Copper Ceramic Substrate) and an all-metal casing. The DBC substrate, by directly depositing thick copper foil on the surface of alumina or aluminum nitride ceramic, can carry currents up to tens or even hundreds of amperes with extremely low thermal resistance. The all-metal casing not only serves as structural support but also directly acts as part of the heat sink, rapidly conducting heat from the DBC substrate to the external heat dissipation surface of the power system. Furthermore, the thickness of the metal casing is specially designed to provide physical shielding against low-energy electrons and protons, thereby reducing the total dose accumulation effect on the gate oxide layer of the power devices.

[0046] In the construction of magnetic component unit E, in order to adapt to the reconfiguration requirements of different voltage levels, the main transformer... It employs planar transformer technology or low-profile magnetic integration technology. Its core material uses high Curie temperature ferrite or magnetic powder cores to ensure stable magnetic performance over a wide temperature range. By independently packaging the magnetic components, designers can quickly reconfigure the power supply from 5V output to 12V, 15V, or 28V output simply by changing the turns ratio parameter of magnetic component unit E, while keeping the four modules A, B, C, and D unchanged. This significantly shortens the development cycle of radiation-resistant power supply products.

[0047] Example 4 This embodiment describes an extended application of a power supply system based on the aforementioned modular architecture and its startup timing control. In practical satellite power systems, the power supply startup process must be strictly controlled to avoid surge current impacting the busbars.

[0048] In this embodiment, the RCC auxiliary power supply circuit integrated in power supply module unit A plays a crucial role in this process. When the input bus voltage... Upon power-up, the main power circuit is not yet operational. Current first flows through the starting resistor. Injection into the first power transistor The base of the auxiliary transformer is started. The self-excited oscillation. The induced voltage generated by the auxiliary winding is rectified and quickly establishes the power supply for the control circuit. and drive circuit power supply At this time, signal module unit B is powered on and performs a self-test.

[0049] The undervoltage protection circuit simultaneously monitors the input voltage. It only applies when the auxiliary transformer... The voltage detected by the third winding reflects the input bus. When the voltage exceeds the minimum operating voltage threshold (e.g., 18V), the undervoltage protection signal input terminal... Only then will it be released. Subsequently, signal module unit B begins to output a soft-start PWM pulse sequence. In the initial stage, the duty cycle slowly increases from 0, and the MOSFET in the primary power module unit C... and It initially conducts with an extremely narrow pulse width. As the output voltage builds up, the synchronous rectifier diodes in the secondary power module unit D... and exist and Under the control of the signal, it intervenes to operate, gradually replacing the body diode for rectification, and finally the system enters a steady-state operating mode.

[0050] If an external prohibition command is received during operation, i.e. The terminal is pulled low, transistor Conducting, will The terminal potential is forcibly pulled low. At this moment, signal module unit B immediately stops outputting. , and The power stage is shut down, but power supply module A remains in standby mode to ensure that the system can quickly resume output via soft start once the disable signal is removed, without having to go through the RCC circuit's oscillation process again. This hierarchical sleep and wake-up mechanism effectively improves the real-time response of the power supply system to commands.

[0051] Finally, it should be noted that the above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A modular radiation-resistant power supply based on reconfigurable technology, characterized in that, The power supply is configured to convert the input bus voltage into an output voltage. The power supply is composed of physically independent power supply module units, signal module units, primary power module units, secondary power module units, and magnetic component units, which are then deconstructed and interconnected. Each power supply module unit establishes a power supply connection with both the signal module unit and the primary power module unit, and is configured to provide control circuit power to the signal module unit and drive circuit power to the primary power module unit. The signal module unit, acting as a control hub, is configured to output drive control signals to the primary power module unit and receive current sampling signals from the primary power module unit. The signal module unit also has a synchronous rectification control interface for connecting to the secondary power module unit. The primary power module unit is connected to the primary side of the magnetic component unit, and the secondary power module unit is connected to the secondary side of the magnetic component unit, forming a power conversion circuit that transfers energy from the primary side to the secondary side.

2. The modular radiation-resistant power supply based on reconfigurable technology according to claim 1, characterized in that, Both the power supply module unit and the signal module unit are packaged in an integrated HTCC-AlN ceramic housing; both the primary power module unit and the secondary power module unit are packaged using a thick-film process combined with a DBC substrate and an all-metal housing.

3. The modular radiation-resistant power supply based on reconfigurable technology according to claim 1, characterized in that, The input terminal of the power supply module unit and the input terminal of the primary power module unit are both connected to the input bus voltage. ; The first output terminal of the power supply module unit A power supply side connected to the signal module unit is provided to supply power to the control loop; the second output terminal of the power supply module unit Connected to the power supply side of the primary power module unit to provide power to the drive circuit; the drive signal output terminal of the signal module unit. The synchronous rectification control interface is connected to the drive terminal of the primary power module unit; the synchronous rectification control interface includes a first synchronous rectification enable terminal. Second synchronous rectification enable terminal The first synchronous rectification enable terminal and the second synchronous rectification enable terminal They are respectively connected to the secondary power module unit.

4. The modular radiation-resistant power supply based on reconfigurable technology according to claim 1, characterized in that, The power supply module unit integrates an RCC auxiliary power supply circuit and an undervoltage protection circuit; the undervoltage protection function terminal of the power supply module unit is connected through a first resistor. Second resistor The undervoltage protection signal input terminal connected to the signal module unit .

5. The modular radiation-resistant power supply based on reconfigurable technology according to claim 4, characterized in that, The RCC auxiliary power supply circuit includes an auxiliary transformer. and the first power transistor The auxiliary transformer The same terminal of the first primary winding Connect the first power transistor The collector of the auxiliary transformer The opposite terminals of the first primary winding Connect the input bus And via the oscillation resistor Connected to the first power transistor The base of the auxiliary transformer; The same terminal of the second primary winding Connect to the input location, its variant end Connected to the first diode Second diode The series branch consisting of the auxiliary transformer; The same-named terminals of the first winding Connect the first Schottky diode Its alternative name is Duan Grounding; the auxiliary transformer The same terminal of the second stage winding Connect the second Schottky diode The undervoltage protection circuit is connected to the auxiliary transformer. On the third-stage winding, the corresponding terminals of the third-stage winding Grounding, its synonym terminal Connect the third Schottky diode The third Schottky diode Connect to undervoltage protection sampling point .

6. The modular radiation-resistant power supply based on reconfigurable technology according to claim 1, characterized in that, The signal module unit integrates a current sampling circuit, an autonomous current sharing circuit, an over-temperature protection circuit, and an inhibit circuit.

7. The modular radiation-resistant power supply based on reconfigurable technology according to claim 6, characterized in that, The current sampling circuit includes a current transformer connected to the primary power module unit. Sampling resistor and diodes The output of the current sampling circuit is through a resistor. Current sampling pin connected to the PWM controller .

8. The modular radiation-resistant power supply based on reconfigurable technology according to claim 6, characterized in that, The autonomous current sharing circuit includes an operational amplifier. Zener diode The operational amplifier The power supply terminal is connected to the power supply of the control circuit. The grounding terminal is connected to the output ground; the operational amplifier The inverting input terminal is connected to the first current sharing resistor. Second current sharing resistor A current-sharing capacitor is connected to the non-inverting input terminal. and resistance The output is connected to a current-sharing transistor. and diodes Output current sharing signal.

9. The modular radiation-resistant power supply based on reconfigurable technology according to claim 6, characterized in that, The over-temperature protection circuit includes an operational amplifier. The operational amplifier Configured as a comparator, the comparator The first input terminal is connected to a thermistor. The inhibit circuit includes an inhibit terminal. The forbidden end Through resistance and transistor The undervoltage protection signal input terminal connected to the signal module unit .

10. The modular radiation-resistant power supply based on reconfigurable technology according to claim 3, characterized in that, The magnetic component unit includes a main transformer. The primary power module unit includes an input filter circuit, a power MOSFET group, and a drive controller. The input filtering circuit includes a first filter capacitor. Second filter capacitor The input filter circuit is connected to the main transformer. The primary winding's corresponding terminal; the drain of the power MOSFET group is connected to the main transformer. The opposite terminal of the primary winding, and the gate of the power MOSFET group are connected to the drive controller via a drive resistor. .

11. The modular radiation-resistant power supply based on reconfigurable technology according to claim 3, characterized in that, The secondary power module unit includes a first synchronous rectifier diode. Second synchronous rectifier tube and output filtering circuit; the magnetic component unit includes a main transformer. and output inductor The first synchronous rectifier tube and the second synchronous rectifier tube The control terminals are respectively connected to the first synchronous rectification enable terminal. and the second synchronous rectification enable terminal The main transformer The secondary winding output terminal is connected to the output inductor. The input terminal of the primary power module and the input terminal of the secondary power module unit.