Finishing method and system for multi-assembly-site mainboard

Abstract

The application relates to the technical field of processing platforms, in particular to a fine processing method and system of a multi-assembly-site mainboard. The multi-assembly-site mainboard comprises a bottom plate, an assembly frame and a reinforcing unit; the reinforcing unit and the assembly frame are connected to the first surface of the bottom plate; and the inner wall of the assembly frame is an assembly surface. The fine processing method of the multi-assembly-site mainboard comprises the following steps: in response to a feeding instruction, moving the multi-assembly-site mainboard to the upper surface of a suction cup positioning tool for positioning; and controlling the suction cup positioning tool to adsorb the multi-assembly-site mainboard; wherein the adsorption force of the suction cup positioning tool on a first area is greater than the adsorption force of the suction cup positioning tool on a second area, the first area is at least the area of the projection of the reinforcing unit on the bottom plate in the thickness direction of the bottom plate, and the second area is other areas of the bottom plate; and based on the adsorption of the multi-assembly-site mainboard on the suction cup positioning tool, a cutter is controlled to sequentially fine-process the multiple assembly surfaces. The application can solve the problem that the thin-wall area of the multi-assembly-site mainboard is prone to deformation during fine processing.

Description

Technical Field

[0001] This invention relates to the field of machining platform technology, and more specifically, to a method and system for precision machining of multi-assembly motherboards. Background Technology

[0002] Large, complex, thin-walled mainboards are core components in high-end equipment, aerospace, and other fields. They are characterized by large overall size, high structural integration, and uneven wall thickness. The mainboard has multiple irregularly shaped mating structures, reinforcing ribs, and functional interfaces. The overall rigidity is relatively weak, and there are strict control requirements for processing accuracy and assembly surface form and position tolerances.

[0003] After rough machining removes most of the machining allowance, this type of motherboard requires high-precision finishing to ensure the dimensional accuracy and surface quality of the assembly surfaces. Due to its thin wall thickness and the large number and dispersed distribution of assembly surfaces requiring finishing, excessive suction and clamping forces can easily cause stress concentration in weak areas of the structure when using traditional vacuum adsorption or tooling clamping for fixation. This can lead to local warping, dents, or overall deformation of the motherboard, resulting in dimensional deviations and non-compliance with form and position tolerances after finishing, directly affecting the subsequent assembly accuracy and product performance. Summary of the Invention

[0004] To address the problem of deformation in weak areas during the machining of multi-assembly-position motherboards, this invention provides a finishing method and system for multi-assembly-position motherboards. The multi-assembly-position motherboard includes a base plate, assembly frames, and reinforcing units; multiple assembly frames are connected to a first surface of the base plate; the reinforcing units are connected to the base plate; the reinforcing units are located on the first surface; and the inner walls of the assembly frames serve as assembly surfaces.

[0005] In a first aspect, the present invention proposes a finishing method for a multi-assembly-position motherboard, comprising:

[0006] In response to the feeding command, the multi-assembly motherboard is moved to the upper surface of the suction cup positioning fixture for positioning;

[0007] The suction cup positioning fixture is controlled to adsorb the multi-assembly motherboard; wherein, the adsorption force of the suction cup positioning fixture on the first region is greater than the adsorption force of the suction cup positioning fixture on the second region, the first region is at least the region of the projection of the reinforcing unit on the base plate along the thickness direction of the base plate, and the second region is other regions of the base plate.

[0008] Based on the adsorption of the multi-assembly motherboard onto the suction cup positioning fixture, the control tool sequentially performs precision machining on the multiple assembly surfaces.

[0009] Optionally, the finishing method for the multi-assembly motherboard further includes:

[0010] The suction force distribution of the suction cup positioning fixture on the second region is adjusted according to the machining position of the cutting tool.

[0011] Optionally, the number of reinforcing units is two, and the two reinforcing units are symmetrically arranged along the center plane of the base plate; the second region includes a third sub-region and a fourth sub-region; the third sub-region and the fourth sub-region are respectively located on opposite sides of the two reinforcing units;

[0012] The step of adjusting the suction force distribution of the suction cup positioning fixture on the second region according to the machining position of the cutting tool includes:

[0013] Based on the fact that the tool is processing in the third sub-region, the suction cup positioning fixture reduces the suction force on the fourth sub-region.

[0014] Based on the cutting tool processing in the fourth sub-region, the suction cup positioning fixture reduces the adsorption force on the third sub-region.

[0015] Optionally, the suction cup positioning fixture is provided with an air guide groove; the air guide groove is divided into a first air guide grid corresponding to a first area and a second air guide grid corresponding to a second area; the suction cup positioning fixture includes a first air valve module and a second air valve module; the first air guide grid is connected to an external air extraction device through the first air valve module; the second air guide grid is connected to an external air extraction device through the second air valve module.

[0016] In the process of controlling the suction cup positioning fixture to adsorb the multi-assembly motherboard: by adjusting the first air valve module and the second air valve module, the vacuum negative pressure value of the area where the first air guide grid is located is stronger than the vacuum negative pressure value of the area where the second air guide grid is located, so as to achieve that the adsorption force of the suction cup positioning fixture on the first area is greater than the adsorption force of the suction cup positioning fixture on the second area.

[0017] Optionally, the suction cup positioning fixture is provided with an air guide groove; the air guide groove is divided into a first air guide grid corresponding to a first area and a second air guide grid corresponding to a second area; the suction cup positioning fixture includes a first air valve module and a second air valve module; the first air guide grid is connected to an external air extraction device through the first air valve module; the second air guide grid is connected to an external air extraction device through the second air valve module.

[0018] The second air valve module includes a third air valve and a fourth air valve; the second air guide grid includes a third grid and a fourth grid; the third grid corresponds to the third sub-region; the fourth grid corresponds to the fourth sub-region;

[0019] In the process of reducing the adsorption force on the fourth sub-region by using the suction cup positioning fixture to reduce the adsorption force on the fourth sub-region based on the tool processing in the third sub-region: the adsorption force on the fourth sub-region is reduced by adjusting the air volume in the fourth air valve;

[0020] In the process of machining in the fourth sub-region using a cutting tool and reducing the suction force on the third sub-region using the suction cup positioning fixture: the suction force on the third sub-region is reduced by decreasing the amount of air in the third air valve.

[0021] Optionally, the second surface of the base plate is provided with a weight-reducing groove; the suction cup positioning fixture is provided with a positioning protrusion corresponding to the weight-reducing groove;

[0022] The step of moving the multi-assembly motherboard to the upper surface of the suction cup positioning fixture for positioning in response to the feeding command includes:

[0023] The multi-assembly motherboard is hoisted above the suction cup positioning fixture;

[0024] The multi-assembly motherboard is hoisted to the positioning protrusion and fits into the weight-reducing groove.

[0025] Optionally, the first region includes a first sub-region and a second sub-region; the first sub-region corresponds to the reinforcing unit near the third sub-region; the second sub-region corresponds to the reinforcing unit near the fourth sub-region.

[0026] The finishing method for the multi-assembly motherboard also includes:

[0027] Based on the cutting tool processing in the third sub-region, the reinforcing unit above the second sub-region is pressed by a floating pressure plate;

[0028] Based on the cutting tool processing in the fourth sub-region, the reinforcing unit corresponding to the first sub-region is pressed by a floating pressure plate.

[0029] Secondly, the present invention also proposes a multi-assembly-position motherboard processing system, which is applied to the finishing method of the multi-assembly-position motherboard described in any one of the first aspects; the multi-assembly-position motherboard includes a base plate, an assembly frame, and a reinforcing unit; a plurality of the assembly frames are connected to a first surface of the base plate; the reinforcing unit is connected to the base plate; the reinforcing unit is located on the first surface; the inner wall of the assembly frame is an assembly surface; the multi-assembly-position motherboard processing system includes a suction cup positioning fixture;

[0030] The suction cup positioning fixture includes a base unit and a fixing unit; the fixing unit is used to fix the base plate to the base unit.

[0031] Optionally, the base unit includes a base body and an air guide groove; the air guide groove is recessed into the surface of the base body; the air guide groove is divided into a first air guide grid corresponding to a first region and a second air guide grid corresponding to a second region; the fixing unit includes a first air valve module, a second air valve module, and an air extraction part; the first air guide grid is connected to the air extraction part through the first air valve module; the second air guide grid is connected to the air extraction part through the second air valve module.

[0032] Optionally, the number of reinforcing units is two, and the two reinforcing units are symmetrically arranged along the center plane of the length of the base plate; the first region includes a first sub-region and a second sub-region, wherein the first sub-region is the region of the projection of one of the reinforcing units on the base plate along the thickness direction of the base plate, and the second sub-region is the region of the projection of the reinforcing unit on the other base plate along the thickness direction of the base plate;

[0033] The second air valve module includes a third air valve and a fourth air valve; the second air guide grid includes a third grid and a fourth grid; the third grid is located on the side of the first sub-region away from the second sub-region; the fourth grid is located on the side of the second sub-region away from the first sub-region; the third air valve is connected to the third grid; the fourth air valve is connected to the fourth grid.

[0034] To address the problem of easy deformation in weak areas during the processing of multi-assembly motherboards, this invention has the following advantages:

[0035] By responding to the loading command, the multi-assembly motherboard is moved to the upper surface of the suction cup positioning fixture for positioning, providing a precision machining benchmark for the multi-assembly motherboard and thus avoiding machining errors in subsequent assembly surface finishing caused by workpiece placement deviations. By controlling the suction cup positioning fixture to adsorb the multi-assembly motherboard, and ensuring that the suction force of the suction cup positioning fixture on the first area is greater than that on the second area (where the first area is at least the area projected along the thickness direction of the reinforcing unit on the base plate, and the second area is other areas of the base plate), compared to fixing by mechanical clamping force, this avoids stress concentration on the thin-walled structure. It can be squeezed and deformed, while ensuring clamping firmness and suppressing processing vibration under the premise of not easily deforming, and avoiding warping and deformation of thin-walled parts due to excessive suction force, thereby protecting the thin-walled structure while ensuring clamping stability; by adsorbing the multi-assembly position motherboard onto the suction cup positioning fixture, the tool is controlled to perform precision machining on multiple assembly surfaces in sequence, which can prevent the workpiece from moving or vibrating during the precision machining process, ensure the stability of the machining process, and ultimately solve the problems of dimensional deviation and non-compliance of form and position tolerance of assembly surfaces caused by traditional fixing methods, ensuring the dimensional accuracy and surface quality of assembly surfaces, and meeting the stringent machining requirements of multi-assembly position motherboards. Attached Figure Description

[0036] Figure 1A flowchart illustrating a finishing method for a multi-assembly motherboard according to one embodiment;

[0037] Figure 2 This is a schematic diagram of the structure of a multi-assembly-position motherboard processing system according to one embodiment;

[0038] Figure 3 for Figure 2 Schematic diagram of the middle suction cup positioning fixture;

[0039] Figure 4 for Figure 2 Another structural diagram of the suction cup positioning fixture;

[0040] Figure 5 for Figure 2 A schematic diagram of the structure of a multi-assembly motherboard;

[0041] Figure 6 for Figure 5 A structural schematic diagram of a multi-assembly motherboard from another perspective.

[0042] Figure label:

[0043] 10. Multi-assembly position mainboard; 11. Mainboard unit; 111. Base plate; 112. Side plate; 113. Partition plate; 114. Weight reduction groove; 115. Assembly hole; 12. Reinforcing unit; 121. First reinforcing plate; 122. Second reinforcing plate; 20. Suction cup positioning fixture; 21. Base unit; 211. Base body; 212. Air guide groove; 213. Positioning protrusion; 22. Fixing unit; 221. Sealing strip; 31. First sub-area; 32. Second sub-area; 33. Third sub-area; 34. Fourth sub-area; 35. Fifth sub-area. Detailed Implementation

[0044] The present disclosure will now be discussed with reference to several exemplary embodiments. It should be understood that these embodiments are discussed only to enable those skilled in the art to better understand and thus implement the present disclosure, and are not intended to imply any limitation on the scope of the disclosure.

[0045] As used herein, the term "comprising" and its variations are to be interpreted as open-ended terms meaning "including but not limited to". The term "based on" is to be interpreted as "at least partially based on". The terms "one embodiment" and "an embodiment" are to be interpreted as "at least one embodiment". The term "another embodiment" is to be interpreted as "at least one other embodiment". The terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments and are not intended to limit the indicated devices, elements, or components to having a specific orientation or being constructed and operated in a specific orientation. Furthermore, some of the above terms may be used to indicate other meanings besides orientations or positional relationships; for example, the term "upper" may in some cases indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application according to the specific circumstances. In addition, the terms "installed", "set up", "equipped with", "connected", and "linked" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, elements, or components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. Furthermore, the terms "first," "second," etc., are mainly used to distinguish different devices, elements, or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0046] The multi-position assembly board includes a base plate, assembly frames, and reinforcing units. Multiple assembly frames, base plates, and reinforcing units are connected to the first surface. The inner wall of the assembly frame is the assembly surface that needs to be precision machined. This type of multi-position assembly board has a large overall size, high structural integration, and uneven wall thickness, resulting in relatively weak overall rigidity. Furthermore, it has a large number of assembly surfaces that require precision machining, and these surfaces are widely distributed. Before performing precision machining on the assembly surfaces of this multi-position assembly board, when using conventional suction cup positioning fixtures 20 for adsorption or clamping, the thin wall thickness and weak structural areas of the board cause stress concentration in the corresponding areas of the base plate. This can lead to localized warping, dents, or overall deformation of the multi-position assembly board. Additionally, the projection area of ​​the reinforcing unit along the thickness direction of the base plate differs from other areas of the base plate in terms of structural characteristics. Conventional uniform adsorption fixing methods cannot adapt to these structural features, ultimately resulting in dimensional deviations and non-compliance with form and position tolerances after precision machining, failing to meet the precision machining requirements of the assembly surfaces.

[0047] Example 1:

[0048] This embodiment proposes a finishing method for multi-assembly motherboards, such as... Figure 2 As shown, the multi-assembly-position main board 10 includes a base plate 111, an assembly frame, and a reinforcing unit 12; multiple assembly frames are connected to the first surface of the base plate 111; the reinforcing unit 12 is connected to the base plate 111; the reinforcing unit 12 is located on the first surface; the inner wall of the assembly frame is an assembly surface; and assembly positions are provided within the assembly frame. Figure 1 As shown, the finishing method for a multi-assembly motherboard includes steps S10, S20, and S30.

[0049] Step S10: In response to the loading command, the multi-assembly motherboard 10 is moved to the upper surface of the suction cup positioning fixture 20 for positioning; this provides a precision machining reference for the workpiece and avoids machining errors caused by workpiece placement deviations during subsequent assembly surface precision machining.

[0050] Step S20: Control the suction cup positioning fixture 20 to adsorb the multi-assembly main board 10; wherein, the adsorption force of the suction cup positioning fixture 20 on the first area is greater than the adsorption force of the suction cup positioning fixture 20 on the second area, the first area is at least the area projected by the reinforcing unit 12 on the base plate 111 along the thickness direction of the base plate 111, and the second area is other areas of the base plate 111; by using the suction cup positioning fixture 20 to adsorb and fix the main board, compared with the traditional rigid clamping, stress concentration or extrusion deformation of the thin-walled structure can be avoided by the mechanical clamping force; moreover, a larger adsorption force is used on the projection area of ​​the reinforcing unit 12 with higher structural strength, which can ensure the clamping firmness and suppress processing vibration without deformation; while reducing the adsorption force on the other weak areas of the base plate 111 can avoid warping and deformation of the thin-walled parts due to excessive adsorption force, and protect the thin-walled structure while ensuring clamping stability and ensuring precision machining.

[0051] Step S30: Based on the multi-assembly motherboard 10 being adsorbed onto the suction cup positioning fixture 20, the cutting tool is controlled to perform precision machining on multiple assembly surfaces sequentially. This method, using greater adsorption force on the projection area of ​​the reinforcing unit 12 with higher structural strength, prevents workpiece movement and vibration during precision machining, ensuring the stability of the machining process.

[0052] Furthermore, the finishing method for multi-assembly motherboards also includes step S40; steps S10, S20, S30 and S40 are executed sequentially.

[0053] Step S40: Adjust the suction force distribution of the chuck positioning fixture 20 on the second region according to the machining position of the tool. This allows the tool to specifically increase the suction force in the second region near a certain assembly surface during machining, enhancing local rigidity, suppressing machining vibration, and preventing dimensional deviations and insufficient machining accuracy caused by local vibration of the workpiece during machining. Simultaneously, the suction force is appropriately reduced in areas far from the machining position to minimize continuous stress on thin-walled, weak parts and prevent deformation due to excessive suction force. This method of dynamically adjusting the suction strength according to the machining position reduces the risk of deformation in thin-walled structures while ensuring machining stability, resulting in more stable finishing accuracy and surface quality for multiple assembly surfaces.

[0054] Furthermore, such as Figure 5 As shown, there are two reinforcing units 12, which are symmetrically arranged along the center plane of the base plate 111. Figure 4 As shown, the second region includes a third sub-region 33 and a fourth sub-region 34; the third sub-region 33 and the fourth sub-region 34 are respectively located on opposite sides of the two reinforcing units 12.

[0055] Step S40 includes steps S41 and S42. After step S30 is completed, either step S41 or step S42 is executed.

[0056] Step S41: Based on the tool processing in the third sub-region 33, the suction cup positioning fixture 20 is used to reduce the suction force on the fourth sub-region 34;

[0057] Step S42: Based on the machining of the tool in the fourth sub-region 34, the suction force on the third sub-region 33 is reduced by the suction cup positioning fixture 20. Using two reinforcing units 12 symmetrically arranged along the center plane of the length, the second region is divided into the third sub-region 33 and the fourth sub-region 34 on both sides. When machining the third sub-region 33, the suction force of the fourth sub-region 34 is reduced; when machining the fourth sub-region 34, the suction force of the third sub-region 33 is reduced. In this way, actively reducing the suction force on one side of the region and lowering the suction force on the thin-walled region on the non-machined side can prevent warping and twisting deformation of weak parts far from the machining position due to continuous suction force, and prevent the overall motherboard from experiencing dimensional and positional deviations due to uneven force on both sides.

[0058] In other embodiments, such as Figure 4 As shown, the second region also includes a fifth sub-region 35, which is located between the two reinforcing units 12.

[0059] Furthermore, such as Figure 3 As shown, the suction cup positioning fixture 20 is provided with an air guide groove 212; the air guide groove 212 is divided into a first air guide grid corresponding to the first area and a second air guide grid corresponding to the second area; the suction cup positioning fixture 20 includes a first air valve module and a second air valve module; the first air guide grid is connected to an external air extraction device through the first air valve module; the second air guide grid is connected to an external air extraction device through the second air valve module.

[0060] In step S20: by adjusting the first air valve module and the second air valve module, the vacuum negative pressure value of the area where the first air guide grid is located is stronger than the vacuum negative pressure value of the area where the second air guide grid is located, so as to achieve that the suction cup positioning fixture 20 has a greater adsorption force on the first area than the suction cup positioning fixture 20 has a greater adsorption force on the second area.

[0061] This allows for independent vacuum negative pressure in different adsorption areas. By independently adjusting the vacuum negative pressure of the corresponding air guide grid using the air valve module, the first area projected by the reinforcing unit 12 can be precisely made to obtain higher negative pressure and greater adsorption force, ensuring that the workpiece is firmly fixed without deformation and avoiding vibration and movement during finishing. At the same time, the thin-walled and weak second area maintains a lower negative pressure and a smaller adsorption force, avoiding structural deformation caused by excessive adsorption force.

[0062] Furthermore, such as Figure 3As shown, the suction cup positioning fixture 20 is provided with an air guide groove 212; the air guide groove 212 is divided into a first air guide grid corresponding to the first area and a second air guide grid corresponding to the second area; the suction cup positioning fixture 20 includes a first air valve module and a second air valve module; the first air guide grid is connected to an external air extraction device through the first air valve module; the second air guide grid is connected to an external air extraction device through the second air valve module.

[0063] The second air valve module includes a third air valve and a fourth air valve; the second air guide grid includes a third grid and a fourth grid; the third grid corresponds to the third sub-region 33; the fourth grid corresponds to the fourth sub-region 34;

[0064] In step S41: the adsorption force on the fourth sub-region 34 is reduced by decreasing the amount of gas in the fourth gas valve;

[0065] In step S42: The adsorption force on the third sub-region 33 is reduced by decreasing the air volume in the third air valve. By further dividing the second air guide grid into the third and fourth grids corresponding to the two sub-regions, and configuring independent third and fourth air valves respectively, independent, precise, and non-interfering control of the adsorption force of the thin-walled areas on the left and right sides of the second region is achieved, providing reliable structural support for dynamically adjusting the adsorption force according to the processing position.

[0066] When machining the third sub-region 33, reducing the air volume in the fourth air valve decreases the adsorption force of the fourth sub-region 34; when machining the fourth sub-region 34, reducing the air volume in the third air valve decreases the adsorption force of the third sub-region 33. This reduces the vacuum negative pressure and adsorption force in the corresponding areas, ensuring sufficient adsorption support on the side where the current tool is machining, effectively suppressing machining vibration, and guaranteeing the dimensional accuracy and surface quality of the assembly surface finish; it also minimizes the adsorption stress in the thin-walled areas on the non-machining side, preventing warping, twisting, and other deformations in weak parts far from the machining position due to continuous stress.

[0067] In other embodiments, the sum of the air volume in the third and fourth air valves remains constant. When the air volume in the fourth air valve is reduced, decreasing the adsorption force of the fourth sub-region 34, the air volume in the third air valve increases, enhancing the adsorption force of the third region; similarly, when the air volume in the third air valve is reduced, decreasing the adsorption force of the third sub-region 33, the air volume in the fourth air valve increases, enhancing the adsorption force of the fourth region. This maintains a constant adsorption force on the multi-assembly motherboard 10, preventing excessive vibration in the processed area that could lead to insufficient processing accuracy.

[0068] It is worth noting that the third air valve can reduce the air volume to 0; the fourth air valve can reduce the air volume to 0.

[0069] Furthermore, such as Figure 6As shown, the second surface of the base plate 111 is provided with a weight-reducing groove 114; the suction cup positioning fixture 20 is provided with a positioning protrusion 213 corresponding to the weight-reducing groove 114;

[0070] Step S10 includes steps S11 and S12. Steps S11, S12, S20, and S30 are executed sequentially.

[0071] Step S11: Hoist the multi-assembly motherboard 10 above the suction cup positioning fixture 20;

[0072] Step S12: Hoist the multi-assembly motherboard 10 to the positioning protrusion 213 to engage with the weight reduction groove 114.

[0073] By utilizing the interlocking structure of the weight-reducing groove 114 on the base plate 111 and the positioning protrusion 213, pre-positioning can be performed during the hoisting and loading process. Compared with simple flat placement, the relative position of the main board and the suction cup positioning fixture 20 can be determined quickly and accurately, avoiding workpiece placement offset and misalignment.

[0074] Moreover, the weight-reducing groove 114 not only achieves motherboard lightweighting but also serves as a positioning and mating structure, which can simplify the workpiece and tooling structure.

[0075] Furthermore, the first region includes a first sub-region 31 and a second sub-region 32; the first sub-region 31 corresponds to the reinforcing unit 12 near the third sub-region 33; the second sub-region 32 corresponds to the reinforcing unit 12 near the fourth sub-region 34.

[0076] The finishing method for multi-assembly motherboards also includes steps S51 and S52. After step S40 is completed, step S51 or step S52 is executed.

[0077] Step S51: Based on the cutting tool processing in the third sub-region 33, the floating pressure plate presses against the reinforcing unit 12 corresponding to the second sub-region 32.

[0078] Step S52: The cutting tool processes in the fourth sub-region 34 and presses the reinforcing unit 12 corresponding to the first sub-region 31 with a floating pressure plate.

[0079] This reduces the adsorption force in thin-walled and weak areas and prevents deformation. At the same time, the floating pressure plate provides auxiliary clamping force to ensure that the workpiece still has sufficient fixing force in the processing position. This avoids the problem of excessive fixing force on one side and insufficient fixing force on the other side, which could cause displacement of the multi-assembly main board 10 and ensure the precision and quality of the assembly surface.

[0080] In other embodiments, the floating pressure plate presses against the reinforcing unit 12 corresponding to the second sub-region 32 with elastic contact between the floating pressure plate and the reinforcing unit 12; the floating pressure plate presses against the reinforcing unit 12 corresponding to the third sub-region 33 with elastic contact between the floating pressure plate and the reinforcing unit 12. In this way, when the floating pressure plate presses against the reinforcing unit 12, it can absorb the vibration generated when the tool is machining the assembly surface, thereby improving the precision of the finishing process.

[0081] Furthermore, a reinforcing unit 12 separates the floating pressure plate from the machining position. The staggered fit between the floating pressure plate and the machining position prevents interference between the pressure plate and the cutting path of the tool, ensuring smooth finishing. In addition, this staggered clamping method, combined with dynamically adjusted adsorption force, can improve the overall fixing force of the multi-assembly main board without increasing the adsorption load in the thin-walled area, reducing vibration during machining and ensuring the finishing accuracy of the multi-assembly surfaces.

[0082] In other embodiments, the reinforcing unit 12 is inclined in the width direction of the multi-assembly main board 10; in the floating pressure plate pressing the reinforcing unit 12, the distance from the floating pressure plate to the end of the reinforcing unit 12 away from the other reinforcing unit 12 is less than 1 / 2 of the length of the reinforcing unit 12. Because the reinforcing unit 12 is arranged at an incline, the adsorption force of the fourth region decreases when processing the third region, and the end of the reinforcing unit 12 near the fourth region that is away from the other reinforcing unit 12 is located at the edge of the adsorption region; when processing the fourth region, the adsorption force of the third region decreases, and the end of the reinforcing unit 12 near the third region that is away from the other reinforcing unit 12 is located at the edge of the adsorption region. These two edges are far apart, which easily leads to adsorption dispersion, causing warping and vibration at this end during processing. This arrangement of the contact position between the floating pressure plate and the reinforcing unit 12 can compensate for the insufficient adsorption force at the far end of the reinforcing unit 12, improve the stability of the assembly surface during processing, and ensure processing accuracy.

[0083] In other embodiments, the reinforcing unit 12 includes a pressure-bearing boss, and the floating pressure plate presses the reinforcing unit 12 by the floating pressure plate abutting against the pressure-bearing boss.

[0084] Example 2:

[0085] This embodiment also proposes a multi-assembly-position motherboard 10 processing system. The multi-assembly-position motherboard 10 includes a base plate 111, an assembly frame, and a reinforcing unit 12. Multiple assembly frames are connected to the first surface of the base plate 111. The reinforcing unit 12 is connected to the base plate 111. The reinforcing unit 12 is located on the first surface. The inner wall of the assembly frame is the assembly surface. The multi-assembly-position motherboard 10 processing system is applied to any of the multi-assembly-position motherboard 10 finishing methods in Embodiment 1. The multi-assembly-position motherboard 10 system includes a suction cup positioning fixture 20.

[0086] The suction cup positioning fixture 20 includes a base unit 21 and a fixing unit 22; the fixing unit 22 is used to fix the base plate 111 to the base unit 21. The assembly position main board processing system can fully realize strong adsorption in rigid areas and weak adsorption in thin-walled areas. Compared with traditional rigid clamping, it can avoid stress concentration or extrusion deformation of thin-walled structures caused by mechanical clamping force. Moreover, a larger adsorption force is used in the projection area of ​​the reinforcing unit 12 with higher structural strength, which can ensure clamping firmness and suppress processing vibration without deformation. The adsorption force is reduced in other weak areas of the base plate 111, which can avoid warping and deformation of thin-walled parts due to excessive adsorption force. While ensuring clamping stability and ensuring precision machining, it can protect the thin-walled structure. While achieving reliable fixation, it will not cause processing interference to the assembly surface of the inner wall of the assembly frame, thus balancing processing stability and processing efficiency.

[0087] Furthermore, the base unit 21 includes a base body 211 and an air guide groove 212; the air guide groove 212 is recessed in the surface of the base body 211; the air guide groove 212 is divided into a first air guide grid corresponding to a first region and a second air guide grid corresponding to a second region; the fixing unit 22 includes a first air valve module, a second air valve module, and an air extraction part; the first air guide grid is connected to the air extraction part through the first air valve module; the second air guide grid is connected to the air extraction part through the second air valve module. The air guide groove 212 is divided into a first air guide grid and a second air guide grid according to the processing area. They are connected to the air extraction unit through independent air valve modules, which can make the vacuum negative pressure of different adsorption areas independent. By using the air valve modules to independently adjust the vacuum negative pressure of the corresponding air guide grid, sufficient adsorption force can be provided in the first area with strong rigidity to ensure stable processing, while the adsorption force can be reduced in the second area with weak rigidity. This ensures that the workpiece is firmly fixed without deformation, avoiding vibration and movement during precision machining. At the same time, the thin-walled second area maintains a low negative pressure and a small adsorption force to avoid structural deformation caused by excessive adsorption force.

[0088] Furthermore, there are two reinforcing units 12, which are symmetrically arranged along the center plane of the base plate 111. The first region includes a first sub-region 31 and a second sub-region 32, wherein the first sub-region 31 is the region on which one of the reinforcing units 12 on the base plate 111 is projected along the thickness direction of the base plate 111, and the second sub-region 32 is the region on which the other reinforcing unit 12 on the base plate 111 is projected along the thickness direction of the base plate 111.

[0089] The second air valve module includes a third air valve and a fourth air valve; the second air guide grid includes a third grid and a fourth grid; the third grid is located on the side of the first sub-region 31 away from the second sub-region 32; the fourth grid is located on the side of the second sub-region 32 away from the first sub-region 31; the third air valve is connected to the third grid; the fourth air valve is connected to the fourth grid.

[0090] The two symmetrically arranged reinforcing units 12 ensure that the multi-assembly mainboard 10 provides sufficient support strength for the load components while also ensuring that there are reserved installation positions for the load components. Furthermore, the air guide grid formed by the air guide grooves 212 is also symmetrically arranged, ensuring that the multi-assembly mainboard 10 experiences balanced overall force during processing. This prevents overall displacement and deformation caused by excessive suction force on one side or uneven force on both sides, thereby improving the precision machining accuracy of the multi-assembly mainboard 10.

[0091] Furthermore, when processing the third sub-region 33, the fourth sub-region 34 is separated from the third sub-region 33 by two inclined reinforcing units 12, so the fourth region is less affected by vibrations caused by processing; and when processing the fourth sub-region 34, the third sub-region 33 is separated from the fourth sub-region 34 by two inclined reinforcing units 12, so the third region is less affected by vibrations caused by processing.

[0092] In other embodiments, the multi-assembly mainboard 10 includes a mainboard unit 11 and a reinforcing unit 12; the mainboard unit 11 includes a base plate 111, side plates 112, partitions 113, weight-reducing grooves 114, and assembly holes 115; multiple side plates 112, multiple partitions 113, and reinforcing units 12 are respectively connected to the first surface of the base plate 111, and multiple side plates 112 and multiple partitions 113 together form multiple assembly surfaces; the weight-reducing grooves 114 are recessed on the second surface of the base plate 111, and multiple assembly holes 115 penetrate through the thickness direction of the base plate 111.

[0093] In some other embodiments, the reinforcing unit 12 includes a first reinforcing plate 121 and a second reinforcing plate 122; the two first reinforcing plates 121 are respectively connected to the first surface; the two first reinforcing plates 121 are parallel and spaced apart; and a plurality of second reinforcing plates 122 are respectively connected to the first reinforcing plate 121 and the second reinforcing plate 122.

[0094] In other embodiments, the suction cup positioning fixture 20 includes a base unit 21 and a fixing unit 22. The base unit 21 includes a base body 211, an air guide groove 212, and a positioning protrusion 213. The air guide groove 212 is recessed in the base body 211, and the positioning protrusion 213 protrudes from the surface of the base body 211. The fixing unit 22 includes a sealing strip 221, an air valve, and an air extraction part. The air guide groove 212 is connected to an air extraction pump through the air valve. The sealing strip 221 encloses an adsorption area on the surface of the base body 211. The positioning protrusion 213 is located outside the adsorption area. When adsorbing the second surface of the base plate 111 through the adsorption area, the weight reduction groove 114 and the assembly hole 115 are located outside the adsorption area.

[0095] Those skilled in the art will understand that the above embodiments are specific examples of implementing this disclosure, and in practical applications, various changes can be made in form and detail without departing from the scope of this disclosure.

Claims

1. A method for finishing a multi-assembly-position mainboard, the multi-assembly-position mainboard comprising a base plate, an assembly frame, and a reinforcing unit; a plurality of the assembly frames are connected to a first surface of the base plate; the reinforcing unit is connected to the base plate; The reinforcing unit is located on the first surface; The inner wall of the assembly frame is an assembly surface; the method for finishing the multi-assembly position main board includes: In response to the feeding command, the multi-assembly motherboard is moved to the upper surface of the suction cup positioning fixture for positioning; The suction cup positioning fixture is controlled to adsorb the multi-assembly motherboard; wherein, the suction force of the suction cup positioning fixture on the first region is greater than the suction force of the suction cup positioning fixture on the second region, the first region is at least the region of the projection of the reinforcing unit on the base plate along the thickness direction of the base plate, and the second region is other regions of the base plate. Based on the adsorption of the multi-assembly motherboard onto the suction cup positioning fixture, the control tool sequentially performs precision machining on the multiple assembly surfaces.

2. The finishing method for a multi-assembly motherboard according to claim 1, characterized in that, The finishing method for the multi-assembly motherboard also includes: The suction force distribution of the suction cup positioning fixture on the second region is adjusted according to the machining position of the cutting tool.

3. The finishing method for a multi-assembly motherboard according to claim 2, characterized in that, The number of the reinforcing units is two, and the two reinforcing units are symmetrically arranged along the center plane of the base plate; the second region includes a third sub-region and a fourth sub-region; the third sub-region and the fourth sub-region are respectively located on two opposite sides of the two reinforcing units; The step of adjusting the suction force distribution of the suction cup positioning fixture on the second region according to the machining position of the cutting tool includes: Based on the fact that the cutting tool is processing in the third sub-region, the suction cup positioning fixture reduces the suction force on the fourth sub-region. Based on the cutting tool processing in the fourth sub-region, the suction cup positioning fixture reduces the adsorption force on the third sub-region.

4. The finishing method for a multi-assembly motherboard according to claim 1, characterized in that, The suction cup positioning fixture is provided with an air guide groove; the air guide groove is divided into a first air guide grid corresponding to the first area and a second air guide grid corresponding to the second area; the suction cup positioning fixture includes a first air valve module and a second air valve module; the first air guide grid is connected to an external air extraction device through the first air valve module; the second air guide grid is connected to an external air extraction device through the second air valve module. In the process of controlling the suction cup positioning fixture to adsorb the multi-assembly motherboard: by adjusting the first air valve module and the second air valve module, the vacuum negative pressure value of the area where the first air guide grid is located is stronger than the vacuum negative pressure value of the area where the second air guide grid is located, so as to achieve that the adsorption force of the suction cup positioning fixture on the first area is greater than the adsorption force of the suction cup positioning fixture on the second area.

5. The finishing method for a multi-assembly motherboard according to claim 3, characterized in that, The suction cup positioning fixture is provided with an air guide groove; the air guide groove is divided into a first air guide grid corresponding to the first area and a second air guide grid corresponding to the second area; the suction cup positioning fixture includes a first air valve module and a second air valve module; the first air guide grid is connected to an external air extraction device through the first air valve module; the second air guide grid is connected to an external air extraction device through the second air valve module. The second air valve module includes a third air valve and a fourth air valve; the second air guide grid includes a third grid and a fourth grid; the third grid corresponds to the third sub-region; the fourth grid corresponds to the fourth sub-region; In the process of machining in the third sub-region based on the tool, and reducing the adsorption force on the fourth sub-region by the suction cup positioning fixture: the adsorption force on the fourth sub-region is reduced by adjusting the air volume in the fourth air valve; In the process of machining in the fourth sub-region based on the tool, and reducing the adsorption force on the third sub-region by using the suction cup positioning fixture: the adsorption force on the third sub-region is reduced by adjusting the air volume in the third air valve.

6. The finishing method for a multi-assembly motherboard according to claim 1, characterized in that, The second surface of the base plate is provided with a weight-reducing groove; the suction cup positioning fixture is provided with a positioning protrusion corresponding to the weight-reducing groove; The step of moving the multi-assembly motherboard to the upper surface of the suction cup positioning fixture for positioning in response to the loading command includes: The multi-assembly motherboard is hoisted above the suction cup positioning fixture; The multi-assembly motherboard is hoisted to the positioning protrusion and engages with the weight-reducing groove.

7. The finishing method for a multi-assembly motherboard according to claim 3, characterized in that, The first region includes a first sub-region and a second sub-region; the first sub-region corresponds to the reinforcing unit near the third sub-region; the second sub-region corresponds to the reinforcing unit near the fourth sub-region. The finishing method for the multi-assembly motherboard also includes: Based on the cutting tool processing in the third sub-region, the reinforcing unit above the second sub-region is pressed by a floating pressure plate; Based on the cutting tool processing in the fourth sub-region, the reinforcing unit corresponding to the first sub-region is pressed against the surface by a floating pressure plate.

8. A multi-assembly-position mainboard processing system, wherein the multi-assembly-position mainboard includes a base plate, assembly frames, and reinforcing units; a plurality of the assembly frames are connected to a first surface of the base plate; the reinforcing units are connected to the base plate; the reinforcing units are located on the first surface; the inner wall of the assembly frames is an assembly surface; characterized in that, The multi-assembly-position motherboard processing system is applied to the finishing method of the multi-assembly-position motherboard according to any one of claims 1-7; the multi-assembly-position motherboard processing system includes a suction cup positioning fixture; The suction cup positioning fixture includes a base unit and a fixing unit; the fixing unit is used to fix the base plate to the base unit.

9. A multi-assembly-position motherboard processing system according to claim 8, characterized in that, The base unit includes a base body and an air guide groove; the air guide groove is recessed into the surface of the base body; the air guide groove is divided into a first air guide grid corresponding to a first region and a second air guide grid corresponding to a second region; the fixing unit includes a first air valve module, a second air valve module, and an air extraction part; the first air guide grid is connected to the air extraction part through the first air valve module; the second air guide grid is connected to the air extraction part through the second air valve module.

10. A multi-assembly-position motherboard processing system according to claim 9, characterized in that, The number of the reinforcing units is two, and the two reinforcing units are symmetrically arranged along the center plane of the length of the base plate; the first region includes a first sub-region and a second sub-region, wherein the first sub-region is the region of the projection of the reinforcing unit on one base plate along the thickness direction of the base plate, and the second sub-region is the region of the projection of the reinforcing unit on the other base plate along the thickness direction of the base plate. The second air valve module includes a third air valve and a fourth air valve; the second air guide grid includes a third grid and a fourth grid; the third grid is located on the side of the first sub-region away from the second sub-region; the fourth grid is located on the side of the second sub-region away from the first sub-region; the third air valve is connected to the third grid; the fourth air valve is connected to the fourth grid.

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