A packaging method for carbon nanotube thin film and a thin film frame

Abstract

The application provides a packaging method for a carbon nanotube film, comprising the following steps: supporting the carbon nanotube film on a supporting layer material; manufacturing a packaging frame matched with the carbon nanotube film; adhering the carbon nanotube film to the packaging frame; performing energy irradiation on a bonding area of the carbon nanotube film and the packaging frame; and removing the supporting layer material from the carbon nanotube film after irradiation. The application realizes strong bonding between the carbon nanotube film and the packaging frame through chemical bonding between materials, and improves the reliability of packaging.

Description

Technical Field

[0001] This invention relates to the field of thin film encapsulation technology, and in particular to an encapsulation method and thin film frame for carbon nanotube thin films. Background Technology

[0002] Self-supporting carbon nanotube (CNT) films can be obtained through dry and wet methods. However, due to their thickness of only tens of nanometers, low density, small mass, and flexibility, these films cannot support themselves and therefore require encapsulation for application. Current encapsulation methods for self-supporting CNT films mainly include the following: first, using a perforated frame to retrieve them from a liquid; second, growing upright CNT forests using CVD, obtaining the film using an extraction method, and then transferring it to the frame surface; third, dry growth using a floating catalyst method followed by peeling with a perforated material; and fourth, directly forming the film on the frame during the film preparation process. The CNT encapsulated films obtained by these methods have weak adhesion and are prone to failure under thermal stress, exhibiting problems such as wrinkling, detachment, and cracking. Furthermore, physical clamping and in-situ film formation methods are difficult to control tension and stress, resulting in poor process flexibility and an inability to simultaneously meet the high strength, high flatness, and pollution-free requirements of large-area applications.

[0003] Therefore, those skilled in the art are dedicated to providing a method for encapsulating carbon nanotube films and a film framework thereby prepared, to achieve highly reliable encapsulation of carbon nanotube films. Summary of the Invention

[0004] In view of the deficiencies in the prior art, the technical problem to be solved by the present invention is how to provide a packaging method that can achieve highly reliable encapsulation of carbon nanotube films.

[0005] To achieve the above objectives, the present invention provides a method for encapsulating carbon nanotube thin films, comprising: Step 1: Attach the carbon nanotube film to the support layer material; Step 2: Fabricate an encapsulation frame adapted to the carbon nanotube film; Step 3: Attach the carbon nanotube film to the encapsulation frame; Step 4: Irradiate the bonding region between the carbon nanotube film and the encapsulation frame with energy; Step 5: Remove the support layer material from the irradiated carbon nanotube film.

[0006] Preferably, in step 1, the self-supporting carbon nanotube film is prepared by a dry or wet method.

[0007] Preferably, the support layer material in step 1 is one or more of silicon-based materials, ceramic materials, metal materials, and flexible polymer materials.

[0008] Preferably, in step 2, the surface of the encapsulation frame is subjected to an affinity treatment.

[0009] Preferably, the affinity treatment method includes one or more of surface plasma treatment and acid / alkali immersion treatment.

[0010] Preferably, the energy irradiation is performed using a laser in step 4.

[0011] Preferably, the wavelength range of the laser is 153-2000nm.

[0012] Preferably, the irradiation power of the laser is 0.01-1000W.

[0013] Preferably, the support layer material is removed using a wet or dry method in step 5.

[0014] The present invention also provides a self-supporting carbon nanofilm framework, which is prepared by the aforementioned encapsulation method.

[0015] The present invention has at least the following beneficial technical effects: The encapsulation method for carbon nanotube films provided by this invention pre-treats the surface of the encapsulation framework to change its affinity, and then uses energy beam irradiation to form chemical bonds between the carbon nanotube film and the framework surface. Through chemical bonding between materials, a strong bond is achieved between the film and the encapsulation material framework. The film and the framework are firmly bonded and are not prone to failure or detachment at high temperatures. Energy beam bonding is compatible with large-size film encapsulation, and non-mechanical fixation is less likely to generate stress and wrinkles, thus expanding application scenarios.

[0016] The following will further explain the concept, specific structure, and technical effects of the present invention in conjunction with the accompanying drawings, so as to fully understand the purpose, features, and effects of the present invention. Attached Figure Description

[0017] Figure 1 This is a flowchart of a method for encapsulating carbon nanotube films according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the encapsulation method for carbon nanotube films according to an embodiment of the present invention. Detailed Implementation

[0018] The preferred embodiments of the present invention are described below to make the technical content clearer and easier to understand. The present invention can be embodied in many different forms, and the scope of protection of the present invention is not limited to the embodiments mentioned herein.

[0019] In the accompanying drawings, components with the same structure are represented by the same numerical symbols, and components with similar structures or functions are represented by similar numerical designations. The dimensions and thicknesses of each component shown in the drawings are arbitrary, and the present invention does not limit the dimensions and thicknesses of each component. To make the illustrations clearer, the thickness of some components has been appropriately exaggerated in the drawings.

[0020] This invention provides a method for encapsulating carbon nanotube films, in which chemical bonds are formed on the surfaces of the carbon nanotube film and the encapsulation frame. Through the chemical bonding between the film and the encapsulation frame, a strong bond is achieved between the two, improving mechanical strength and reliability, thereby achieving highly reliable encapsulation.

[0021] like Figure 1 As shown, the specific implementation process of the encapsulation method for carbon nanotube films in this embodiment is as follows.

[0022] Step 1: Attach the carbon nanotube film to the support layer material.

[0023] In this step, the carbon nanotube film is a self-supporting CNT film, which can be prepared by dry or wet methods. The support layer material can be silicon-based, ceramic, metallic, or flexible polymer, specifically polyethylene terephthalate (PET), polyphenylene sulfide (PPS), etc. The carbon nanotube film is attached to the support layer material, that is, the support layer material is usually placed at the bottom of the carbon nanotube film.

[0024] Step 2: Fabricate an encapsulation frame that is compatible with the carbon nanotube film.

[0025] In this step, the size of the encapsulation frame should be adapted to the size of the carbon nanotube film to achieve effective encapsulation. Simultaneously, the surface of the encapsulation frame undergoes an affinity treatment. This treatment can be achieved through surface plasma treatment, acid / alkali immersion treatment, other surface modification methods, or a combination of multiple treatment methods.

[0026] Step 3: Attach the carbon nanotube film to the encapsulation frame.

[0027] In this step, the carbon nanotube film is aligned with the encapsulation frame and brought into close contact. When the carbon nanotube film is attached to the encapsulation frame, it is positioned between the support layer material and the encapsulation frame.

[0028] Step 4: Irradiate the bonding region between the carbon nanotube film and the encapsulation framework with energy.

[0029] In this step, heterogeneous bonding can be formed by irradiating the bonding region with energy, achieving a strong bond between the thin film and the encapsulation framework. Energy irradiation can be achieved using laser irradiation or other energy sources.

[0030] When selecting laser irradiation, the laser wavelength range is 153-2000nm, and the irradiation power of the energy beam is 0.01-1000W. Different pulse widths can be used, such as femtosecond, picosecond, and nanosecond pulse lasers. The energy beam can also use lower wavelength energy sources, including but not limited to ultraviolet light sources, X-ray sources, etc., and the irradiation time ranges from 100 femtoseconds to 1 minute.

[0031] Step 5: Remove the support layer material from the irradiated carbon nanotube film.

[0032] In this step, the support layer material can be removed by dry or wet methods to obtain the encapsulated self-supporting CNT film.

[0033] like Figure 2 As shown, in a specific embodiment of the encapsulation method for carbon nanotube films of the present invention, a self-supporting CNT film is obtained by dry process, a PET material is used to support the CNT film, a molybdenum-titanium-zirconium alloy encapsulation frame is prepared, and the surface of the encapsulation frame is treated with hydrogen plasma for affinity treatment. The self-supporting CNT film is then bonded to the encapsulation frame, and the surface of the bonded film is treated with a 248nm wavelength nanosecond laser beam with a laser pulse width of 500ns and a laser power of 10W. Finally, the support layer material is removed by dry process to obtain the encapsulated self-supporting CNT film frame.

[0034] The above describes the implementation process of the carbon nanotube thin film encapsulation method of this embodiment. It should be understood that the self-supporting carbon nanotube thin film framework obtained by this encapsulation method should also be within the scope of protection of this patent.

[0035] The encapsulation method for carbon nanotube thin films of this invention utilizes energy beam bonding, resulting in high mechanical strength and reliability, achieving highly reliable encapsulation of carbon nanotube thin films. The encapsulation process is simple, adaptable to frames of different sizes, and enables large-area uniform encapsulation. The encapsulation process completely eliminates the use of organic adhesives, reducing outgassing contamination under high-temperature, high-vacuum conditions and meeting the stringent ultra-high vacuum requirements of EUV lithography machines. This encapsulation method lays the foundation for the application of self-supporting carbon nanotube thin films in cutting-edge fields such as flexible electronics and sensors.

[0036] The preferred embodiments of the present invention have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of the present invention without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of the present invention through logical analysis, reasoning, or limited experimentation on the basis of existing technology should be within the scope of protection defined by the claims.

Claims

1. A method for encapsulating carbon nanotube films, characterized in that, include: Step 1: Attach the carbon nanotube film to the support layer material; Step 2: Fabricate an encapsulation frame adapted to the carbon nanotube film; Step 3: Attach the carbon nanotube film to the encapsulation frame; Step 4: Irradiate the bonding region between the carbon nanotube film and the encapsulation frame with energy; Step 5: Remove the support layer material from the irradiated carbon nanotube film.

2. The encapsulation method for carbon nanotube films as described in claim 1, characterized in that, In step 1, self-supporting carbon nanotube films are prepared by dry or wet methods.

3. The encapsulation method for carbon nanotube films as described in claim 1, characterized in that, The support layer material in step 1 is one or more of silicon-based materials, ceramic materials, metal materials, and flexible polymer materials.

4. The encapsulation method for carbon nanotube films as described in claim 1, characterized in that, In step 2, the surface of the encapsulation frame is subjected to affinity treatment.

5. The encapsulation method for carbon nanotube films as described in claim 4, characterized in that, The affinity treatment methods include one or more of surface plasma treatment and acid / alkali immersion treatment.

6. The encapsulation method for carbon nanotube thin films as described in claim 1, characterized in that, In step 4, the energy irradiation is performed using a laser.

7. The encapsulation method for carbon nanotube thin films as described in claim 6, characterized in that, The wavelength range of the laser is 153-2000nm.

8. The encapsulation method for carbon nanotube thin films as described in claim 7, characterized in that, The irradiation power of the laser is 0.01-1000W.

9. The encapsulation method for carbon nanotube thin films as described in claim 1, characterized in that, In step 5, the support layer material is removed using either a wet or dry method.

10. A self-supporting carbon nanofilm framework, characterized in that, It is prepared by the encapsulation method according to any one of claims 1-9.

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