A low dielectric resin composition, a method for preparing the same, and an application thereof

Abstract

The present application relates to a kind of low dielectric resin composition and its preparation method and application, the low dielectric resin composition includes: flame retardant 5~40 parts;Inorganic filler 70~200 parts;Initiator 0.1~0.3 parts;One or more of modified styrene-diene block copolymer 30-60 parts, modified polyphenyl ether 30-60 parts, modified maleimide resin 10-40 parts;The modified styrene-diene block copolymer is maleic anhydride grafted styrene-diene block copolymer;The double bond grafting rate of the maleic anhydride grafted styrene-diene block copolymer is 1.0-1.7wt.%.Compared with prior art, by increasing maleic anhydride grafted styrene-diene block copolymer, the resin composition has lower dielectric constant and loss factor, in addition, it can also improve the peel strength of resin polymer, reduce the thermal expansion coefficient low.

Description

Technical Field

[0001] This invention relates to the field of materials preparation technology, and in particular to a low-dielectric resin composition, its preparation method, and its application. Background Technology

[0002] With the emergence of numerous electronic intelligent devices developed at different times, which are becoming increasingly miniaturized, multifunctional, and used at high frequencies and speeds, more stringent requirements are being placed on the substrate materials used in PCBs, including higher interlayer bonding and peel strength, lower dielectric constant and dielectric loss, and lower coefficient of thermal expansion.

[0003] Curable crosslinkable hydrocarbon resins have become a hot research topic due to their low dielectric properties. However, hydrocarbon resins have low peel strength and interlayer bonding strength with metals, and a high coefficient of thermal expansion. CN 112724640A proposes to use an SBS polyolefin resin with over 90% 1,2-vinyl units in combination with modified polyphenylene ether to prepare a laminate with high peel strength, low dielectric constant, low dielectric loss, excellent heat resistance, and CAF resistance. CN114058150A proposes to use hydrogenated SEBS to prepare a laminate with sufficiently small dielectric constant and dielectric loss tangent and high elongation at high elastic modulus.

[0004] Current efforts to improve hydrocarbon resins and their compositions focus on leveraging their low dielectric constant and low dielectric loss characteristics, combining them with other resins to compensate for their low peel strength and low Tg, thereby preparing a resin composition that balances excellent electrical properties, heat resistance, and high peel strength. However, the high coefficient of thermal expansion of hydrocarbon resins is often overlooked, and its contribution to the thermal expansion of the resin composition and laminate has not been discussed or addressed.

[0005] Therefore, there is an urgent need to study a method for preparing a low-dielectric resin composition that can contribute to the thermal expansion of metal foil laminates. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art by providing a low-dielectric resin composition, its preparation method, and its application. By adding maleic anhydride-grafted styrene-butadiene block copolymer, the resin composition exhibits a lower dielectric constant and loss factor, improves the peel strength of the resin polymer, and reduces the coefficient of thermal expansion.

[0007] The objective of this invention can be achieved through the following technical solutions:

[0008] This invention provides a low-dielectric resin composition comprising:

[0009] 5-40 parts flame retardant;

[0010] 70-200 parts of inorganic filler;

[0011] Initiator 0.1–0.3 parts;

[0012] One or more of the following: 30-60 parts of modified styrene-butadiene block copolymer, 30-60 parts of modified polyphenylene ether, and 10-40 parts of modified maleimide resin;

[0013] The modified styrene-butadiene block copolymer is a maleic anhydride-grafted styrene-butadiene block copolymer;

[0014] The double bond grafting rate of the maleic anhydride-grafted styrene-butadiene block copolymer is 1.0-1.7 wt.%.

[0015] Furthermore, the maleic anhydride-grafted styrene-butadiene block copolymer has an unsaturation degree of 30%-60%.

[0016] Furthermore, the maleic anhydride-grafted modified styrene-butadiene block copolymer includes one of formula (I) and formula (II):

[0017]

[0018] Where X, Y, Z, and H are positive integers, and the butene segment in the formula has a succinic anhydride structure on its side group.

[0019] Furthermore, the modified polyphenylene ether is selected from one of methacryloyl-modified polyphenylene ether and styrene-terminated modified polyphenylene ether;

[0020] The modified maleimide resin is selected from one or more of diphenyl bismaleimide resin, biphenyl polymaleimide resin, methacrylate-modified polyphenylene ether resin, and MED bismaleimide.

[0021] Furthermore, the flame retardant is selected from one or more of bromine-containing flame retardants, phosphorus-containing flame retardants, and nitrogen-based flame retardants, and the bromine-containing flame retardant includes one or more of decabromodiphenyl ether, decabromodiphenyl ethane, brominated styrene, decabromodiphenyl ether, and ethylenebistetrabromophthalimide;

[0022] The phosphorus-containing flame retardant includes one or more of the following: tris(2,6-dimethoxyphenyl)phosphine, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphenanthrene-10-oxide, 2,6-di(2,6-dimethylphenyl)phosphobenzene, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, and 10-phenyl-9,10-dihydro-9-oxa-10-phosphenanthrene-10-oxide;

[0023] Nitrogen-based flame retardants include one or more of triazine compounds, cyanuric acid compounds, isocyanate compounds, and phenothiazines.

[0024] Furthermore, the inorganic filler is selected from one or more of aluminum nitride, aluminum borate, magnesium oxide, magnesium carbonate, cubic boron nitride, crystalline silicon dioxide, synthetic silicon dioxide, hollow silicon dioxide, spherical silicon dioxide, fused silicon dioxide, talc, aluminum oxide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, or titanium dioxide.

[0025] Further, the initiator is selected from one or more of the following: di-tert-butyl peroxide, dilauroyl peroxide, benzoyl peroxide, cumene peroxyneodecanate, tert-butyl peroxyneodecanate, hexadecyl peroxydicarbonate, tetradecyl peroxydicarbonate, dipentylhexyl peroxide, diisopropylbenzene peroxide, bis(tert-butylperoxyisopropyl)benzene, 2,5-dimethyl-2,5-di-tert-butylperoxyhexane, 2,5-dimethyl-2,5-di-tert-butylperoxyhexyne, diisopropylbenzene hydrogen peroxide, isopropylbenzene hydrogen peroxide, tert-pentyl hydrogen peroxide, tert-butyl hydrogen peroxide, tert-butyl peroxyisopropylbenzene, diisopropylbenzene hydrogen peroxide, tert-butyl peroxycarbonate-2-ethylhexanoate, tert-butyl percarbonate-2-ethylhexyl ester, 4,4-di(tert-butylperoxy)pentanoate, and methyl ethyl ketone peroxide.

[0026] The present invention also provides a method for preparing a low-dielectric resin composition, wherein the preparation method comprises: thoroughly mixing and stirring a flame retardant, an inorganic filler, an initiator, a modified styrene-butadiene block copolymer, a modified polyphenylene ether, and a modified maleimide resin to obtain a low-dielectric resin composition.

[0027] The present invention also provides an application of a low-dielectric resin composition for preparing a metal foil laminate.

[0028] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0029] This invention, by adding maleic anhydride-grafted styrene-butadiene block copolymer, results in a resin composition with a lower dielectric constant and loss factor. Furthermore, it improves the peel strength of the resin polymer and reduces the coefficient of thermal expansion. The resin composition prepared by this invention exhibits high glass strength and a low coefficient of thermal expansion in testing. Detailed Implementation

[0030] The following examples illustrate specific implementations of the present invention. These examples are carried out based on the solution described in the present invention, and provide detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following examples.

[0031] The present invention will be further described below with reference to specific embodiments. Any component models, material names, connection structures, manufacturing methods, materials, structures, or composition ratios not explicitly stated in this technical solution are considered common technical features disclosed in the prior art.

[0032] In the modified styrene-butadiene block copolymer of this invention, the maleic anhydride-grafted styrene-butadiene block copolymer is KRAT ON FG1901, and the hydrogenated SEBS is P1500.

[0033] The modified polyphenylene ether used in this invention is methacryloyl-modified polyphenylene ether (SA9000) and styrene-terminated modified polyphenylene ether (OPE-2ST2200).

[0034] The bismaleimide resin (BMI) used in this invention is model BMI-70 from KI Corporation of Japan.

[0035] The triallyl isocyanurate (TAIC) mentioned in this invention is a crosslinking agent with many active groups, which can effectively improve the crosslinking density of the resin system.

[0036] The decabromodiphenyl ethane used in this invention is produced by Albemarle Corporation of the United States, with the brand name Saytex 8010.

[0037] The inorganic filler used in this invention is Jinyi Silicon SE0047, and the initiator is Perhexa25B from Nikkei Corporation.

[0038] The glass fiber cloth of this invention has a specification of 2116NE*8; the Cu foil has a specification of SI 1OZ. The Cu foil is then pressed onto the glass fiber cloth.

[0039] The metal foil laminate referred to in this invention can be available in various sizes, such as 36×48, 36.5×48.5, 37×49, 40×48, 40.5×48.5, 41×49, 42×48, 42.5×48.5, 43×49, etc. (unit: inches), but is not limited to these sizes.

[0040] The glass fiber cloth referred to in this invention is of grade E, and the specifications can be various types such as 101, 104, 106, 1078, 1080, 2113, 2116, 1506 or 7628, but are not limited to these sizes.

[0041] The metal foil referred to in this invention may be 1 / 3 oz, Hoz, 1 oz, 2 oz, 3 oz, 4 oz or RTF copper foil or aluminum foil, but is not limited to these sizes.

[0042] Example 1

[0043] This embodiment provides a method for preparing a resin composition, including the following steps:

[0044] S1: Add methyl ethyl ketone and toluene to the reactor and stir at a high speed of 1500 rpm, while controlling the temperature of the reactor at 45°C to obtain a mixture.

[0045] S2: Add 30 parts of maleic anhydride-grafted styrene-butadiene KRATON FG1901, 45 parts of methacryloyl-modified polyphenylene ether SA9000, 22 parts of diphenyl bismaleimide resin BMI-70, and 30 parts of triallyl isocyanate resin TAIC to the mixture in S1, and continue stirring for 60 minutes until the resin is completely dissolved to obtain a resin mixture.

[0046] S3: In the reactor, add 15 parts of flame retardant Saytex 8010 and 130 parts of inorganic filler SE0047 to the resin mixture in S2, turn on the high-speed stirrer at 1800 rpm, and continue stirring for 60 minutes after the addition is complete.

[0047] S4: In the reactor, add 0.13 parts of initiator 25B to the resin mixture containing flame retardant and inorganic filler in S3. After the addition is complete, turn on the cooling water circulation and control the tank temperature at 45°C at a speed of 1500 rpm. Stir continuously for 180 minutes to obtain resin slurry. After curing, obtain resin composition.

[0048] Example 2

[0049] This embodiment provides a method for preparing a resin composition, including the following steps:

[0050] S1: Add methyl ethyl ketone and toluene to the reactor and stir at a high speed of 1500 rpm, while controlling the temperature of the reactor at 45°C to obtain a mixture.

[0051] S2: Add 30 parts of maleic anhydride-grafted styrene-butadiene, 45 parts of styrene-terminated modified polyphenylene ether OPE-2ST 2200, 22 parts of diphenyl bismaleimide resin BMI-70, and 30 parts of triallyl isocyanate resin TAIC to the mixture in S1, and continue stirring for 60 minutes until the resin is completely dissolved to obtain the resin mixture.

[0052] S3: In the reactor, add 15 parts of flame retardant Saytex 8010 and 130 parts of inorganic filler SE0047 to the resin mixture in S2, turn on the high-speed stirrer at 1800 rpm, and continue stirring for 60 minutes after the addition is complete.

[0053] S4: In the reactor, add 0.13 parts of initiator 25B to the resin mixture containing flame retardant and inorganic filler in S3. After the addition is complete, turn on the cooling water circulation and control the tank temperature at 45°C at a speed of 1500 rpm. Stir continuously for 180 minutes to obtain resin slurry. After curing, obtain resin composition.

[0054] Example 3

[0055] This embodiment provides a method for preparing a resin composition, including the following steps:

[0056] S1: Add methyl ethyl ketone and toluene to the reactor and stir at a high speed of 1500 rpm, while controlling the temperature of the reactor at 45°C to obtain a mixture.

[0057] S2: Add 60 parts of maleic anhydride-grafted styrene-butadiene KRATON FG1901, 45 parts of methacryloyl-modified polyphenylene ether SA9000, 22 parts of diphenyl bismaleimide resin BMI-70, and 30 parts of triallyl isocyanate resin TAIC to the mixture in S1, and continue stirring for 60 minutes until the resin is completely dissolved to obtain the resin mixture.

[0058] S3: In the reactor, add 15 parts of flame retardant Saytex 8010 and 130 parts of inorganic filler SE0047 to the resin mixture in S2, turn on the high-speed stirrer at 1800 rpm, and continue stirring for 60 minutes after the addition is complete.

[0059] S4: In the reactor, add 0.13 parts of initiator 25B to the resin mixture containing flame retardant and inorganic filler in S3. After the addition is complete, turn on the cooling water circulation and control the tank temperature at 45°C at a speed of 1500 rpm. Stir continuously for 180 minutes to obtain resin slurry. After curing, obtain resin composition.

[0060] Example 4

[0061] This embodiment provides a method for preparing a resin composition, including the following steps:

[0062] S1: Add methyl ethyl ketone and toluene to the reactor and stir at a high speed of 1500 rpm, while controlling the temperature of the reactor at 45°C to obtain a mixture.

[0063] S2: Add 60 parts of maleic anhydride-grafted styrene-butadiene, 45 parts of styrene-terminated modified polyphenylene ether OPE-2ST 2200, 22 parts of diphenyl bismaleimide resin BMI-70, and 30 parts of triallyl isocyanate resin TAIC to the mixture in S1, and continue stirring for 60 minutes until the resin is completely dissolved to obtain the resin mixture.

[0064] S3: In the reactor, add 15 parts of flame retardant Saytex 8010 and 130 parts of inorganic filler SE0047 to the resin composition in S2, turn on the high-speed stirrer at 1800 rpm, and continue stirring for 60 minutes after the addition is complete.

[0065] S4: In the reactor, add 0.13 parts of initiator 25B to the resin mixture containing flame retardant and inorganic filler in S3. After the addition is complete, turn on the cooling water circulation and control the tank temperature at 45°C at a speed of 1500 rpm. Stir continuously for 180 minutes to obtain resin slurry. After curing, obtain resin composition.

[0066] Comparative Example 1

[0067] This comparative example provides a method for preparing a resin composition, comprising the following steps:

[0068] S1: Add methyl ethyl ketone and toluene to the reactor and stir at a high speed of 1500 rpm, while controlling the temperature of the reactor at 45°C to obtain a mixture.

[0069] S2: Add 30 parts of styrene-butadiene with a saturation of 45%, 45 parts of methacryloyl-modified polyphenylene ether SA9000, 30 parts of triallyl isocyanate resin TAIC, and 22 parts of diphenyl bismaleimide resin BMI-70 to the mixture in S1, and continue stirring for 60 minutes until the resin is completely dissolved to obtain the resin mixture.

[0070] S3: In the reactor, add 15 parts of flame retardant Saytex 8010 and 130 parts of inorganic filler SE0047 to the resin composition in S2, turn on the high-speed stirrer at 1800 rpm, and continue stirring for 60 minutes after the addition is complete.

[0071] S4: In the reactor, add 0.13 parts of initiator 25B to the resin mixture containing flame retardant and inorganic filler in S3. After the addition is complete, turn on the cooling water circulation and control the tank temperature at 45°C at a speed of 1500 rpm. Stir continuously for 180 minutes to obtain resin slurry. After curing, obtain resin composition.

[0072] Comparative Example 2

[0073] This comparative example provides a method for preparing a resin composition, comprising the following steps:

[0074] S1: Add methyl ethyl ketone and toluene to the reactor and stir at a high speed of 1500 rpm, while controlling the temperature of the reactor at 45°C to obtain a mixture.

[0075] S2: Add 30 parts of styrene-butadiene with a saturation of 45%, 45 parts of styrene-terminated modified polyphenylene ether OPE-2ST 2200, 30 parts of triallyl isocyanate resin TAIC, and 22 parts of diphenyl bismaleimide resin BMI-70 to the mixture in S1, and continue stirring for 60 minutes until the resin is completely dissolved to obtain the resin mixture.

[0076] S3: In the reactor, add 15 parts of flame retardant Saytex 8010 and 130 parts of inorganic filler SE0047 to the resin composition in S2, turn on the high-speed stirrer at 1800 rpm, and continue stirring for 60 minutes after the addition is complete.

[0077] S4: In the reactor, add 0.13 parts of initiator 25B to the resin mixture containing flame retardant and inorganic filler in S3. After the addition is complete, turn on the cooling water circulation and control the tank temperature at 45°C at a speed of 1500 rpm. Stir continuously for 180 minutes to obtain resin slurry. After curing, obtain resin composition.

[0078] Comparative Example 3

[0079] This comparative example provides a method for preparing a resin composition, comprising the following steps:

[0080] S1: Add methyl ethyl ketone and toluene to the reactor and stir at a high speed of 1500 rpm, while controlling the tank temperature at 45℃ to obtain a mixture.

[0081] S2: Add 45 parts of methacryloyl modified polyphenylene ether SA9000, 30 parts of triallyl isocyanate resin TAIC, and 22 parts of diphenyl bismaleimide resin BMI-70 to the mixture in S1, and continue stirring for 60 minutes until the resin is completely dissolved to obtain the resin mixture.

[0082] S3: In the reactor, add 15 parts of flame retardant Saytex 8010 and 130 parts of inorganic filler SE0047 to the resin mixture in S2, turn on the high-speed stirrer at 1800 rpm, and continue stirring for 60 minutes after the addition is complete.

[0083] S4: In the reactor, add 0.13 parts of initiator 25B to the resin mixture containing flame retardant and inorganic filler in S3. After the addition is complete, turn on the cooling water circulation and control the tank temperature at 45°C at a speed of 1500 rpm. Stir continuously for 180 minutes to obtain resin slurry. After curing, obtain resin composition.

[0084] Comparative Example 4

[0085] This comparative example provides a method for preparing a resin composition, comprising the following steps:

[0086] S1: Add methyl ethyl ketone and toluene to the reactor and stir at a high speed of 1500 rpm, while controlling the temperature of the reactor at 45°C to obtain a mixture.

[0087] S2: Add 30 parts of maleic anhydride-grafted styrene-butadiene KRATON FG1901, 22 parts of diphenyl bismaleimide resin BMI-70, and 30 parts of triallyl isocyanate resin TAIC to the mixture in S1, and continue stirring for 60 minutes until the resin is completely dissolved to obtain the resin mixture.

[0088] S3: In the reactor, add 15 parts of flame retardant Saytex 8010 and 130 parts of inorganic filler SE0047 to the resin mixture in S2, turn on the high-speed stirrer at 1800 rpm, and continue stirring for 60 minutes after the addition is complete.

[0089] S4: In the reactor, add 0.13 parts of initiator 25B to the resin mixture containing flame retardant and inorganic filler in S3. After the addition is complete, turn on the cooling water circulation and control the tank temperature at 45°C at a speed of 1500 rpm. Stir continuously for 180 minutes to obtain resin slurry. After curing, obtain resin composition.

[0090] The addition ratios for each embodiment and comparative example are shown in Table 1.

[0091] Table 1. Formulation amounts for each embodiment and comparative example.

[0092]

[0093]

[0094] Test Example 1

[0095] The glass transition temperature (Tg) of the resin compositions obtained in Examples 1-4 and Comparative Examples 1-4 was tested using a dynamic thermomechanical analyzer (DMA) according to the DMA test method specified in IPC-TM-650 2.4.24.4.

[0096] Test Example 2

[0097] The resin compositions obtained in Examples 1-4 and Comparative Examples 1-4 were subjected to Z&X axis coefficient of thermal expansion (CTE) testing using a thermomechanical analyzer (TMA) according to the TMA test method specified in IPC-TM-650 2.4.24.

[0098] Test Example 3

[0099] The resin compositions obtained in Examples 1-4 and Comparative Examples 1-4 were subjected to copper foil peel strength (PS) tests using a Shimadzu tensile testing machine, and the tests were performed according to the test method specified in IPC-TM-650 2.4.8.

[0100] Test Example 4

[0101] The resin compositions obtained in Examples 1-4 and Comparative Examples 1-4 were subjected to dielectric constant (Dk) and dielectric loss factor (Df) tests, which were performed according to the test methods specified in IPC-TM-650 2.5.5.9.

[0102] Test Example 5

[0103] The resin compositions obtained in Examples 1-4 and Comparative Examples 1-4 were subjected to a pressure cooker test (PCT). The obtained resin solution was coated onto a substrate to obtain a laminate, and the laminate was then subjected to a high-temperature cooking test at 120°C. The test was performed according to the test method specified in IPC-TM-6502.6.16.

[0104] Test Example 6

[0105] The resin compositions obtained in Examples 1-4 and Comparative Examples 1-4 were subjected to a stratification time (T300) test at 300°C using a thermomechanical analyzer (TMA) and determined according to the test method specified in IPC-TM-650 2.4.24.1.

[0106] Test Example 7

[0107] The resin compositions obtained in Examples 1-4 and Comparative Examples 1-4 were subjected to flame retardancy tests and classified according to the material flammability method specified in UL-94.

[0108] Test Example 8

[0109] The resin compositions obtained in Examples 1-4 and Comparative Examples 1-4 were subjected to water absorption tests, which were performed according to the laminate water absorption test method specified in IPC-TM-6502.6.2.1.

[0110] Test Example 9

[0111] The resin compositions obtained in Examples 1-4 and Comparative Examples 1-4 were tested for their conductivity anodic filler (CAF) performance. A double-sided copper-clad laminate was fabricated with an external PCB to form a CAF test model. The model underwent five reflow soldering pretreatments, followed by a high temperature and humidity treatment at 85%RH / 85℃ for 96 hours (without bias voltage). The model was then placed in a constant temperature and humidity chamber at 85%RH / 85℃ and tested with a 50V bias voltage for 240 hours.

[0112] The test results of Test Examples 1-9 are shown in Table 2. Combining Tables 1 and 2, it can be seen that Examples 1-4 exhibit excellent thermal and mechanical properties with the introduction of maleic anhydride. In Examples 1 and Comparative Example 1, the grafting of maleic anhydride reduced the resin's coefficient of thermal expansion, dielectric constant, and water absorption, while improving impact strength. Comparative Examples 2, 3, and 4 show that the thermal and mechanical properties of the polyphenylene ether material without methacryloyl modification and the saturated styrene-butadiene are somewhat reduced.

[0113] Table 2 Test Results of Each Embodiment and Comparative Example

[0114]

[0115]

[0116] Application examples

[0117] In this application example, the resin composition obtained in Example 1 is applied to a metal-clad foil board. The process is as follows: resin adhesive is impregnated and coated onto a 2116E-glass fiberglass cloth and then baked. The baking temperature is 140℃-160℃ and the coating speed is 10m / min.

[0118] Then, RTF copper foil is used to press the metal-coated board under a vacuum pressure of 50 Torr, a pressure of 1.2MPa-1.5MPa, and a hot plate temperature of 150℃-220℃, with a curing time of 200min.

[0119] The above description of the embodiments is provided to enable those skilled in the art to understand and use the invention. It will be apparent to those skilled in the art that various modifications can be made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present invention is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the invention should be within the protection scope of the present invention.

Claims

1. A low-dielectric resin composition, characterized in that, include: 5-40 parts flame retardant; 70-200 parts of inorganic filler; Initiator 0.1–0.3 parts; One or more of the following: 30-60 parts of modified styrene-butadiene block copolymer, 30-60 parts of modified polyphenylene ether, and 10-40 parts of modified maleimide resin; The modified styrene-butadiene block copolymer is a maleic anhydride-grafted styrene-butadiene block copolymer; The double bond grafting rate of the maleic anhydride-grafted styrene-butadiene block copolymer is 1.0-1.7 wt.%.

2. The low-dielectric resin composition according to claim 1, characterized in that, The maleic anhydride-grafted styrene-butadiene block copolymer has an unsaturation degree of 30%-60%.

3. The low-dielectric resin composition according to claim 1, characterized in that, The maleic anhydride-grafted modified styrene-butadiene block copolymer includes one of formula (I) and formula (II): Where X, Y, Z, and H are positive integers, and the butene segment in the formula has a succinic anhydride structure on its side group.

4. The low-dielectric resin composition according to claim 1, characterized in that, The modified polyphenylene ether is selected from one of methacryloyl-modified polyphenylene ether and styrene-terminated modified polyphenylene ether; The modified maleimide resin is selected from one or more of diphenyl bismaleimide resin, biphenyl polymaleimide resin, methacrylate-modified polyphenylene ether resin, and MED bismaleimide.

5. The low-dielectric resin composition according to claim 1, characterized in that, The flame retardant is selected from one or more of bromine-containing flame retardants, phosphorus-containing flame retardants, and nitrogen-based flame retardants. The bromine-containing flame retardant includes one or more of decabromodiphenyl ether, decabromodiphenyl ethane, brominated styrene, decabromodiphenyl ether, and ethylenebistetrabromophthalimide. The phosphorus-containing flame retardant includes one or more of tris(2,6-dimethoxyphenyl)phosphine, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphenanthrene-10-oxide, 2,6-di(2,6-dimethylphenyl)phosphobenzene, 9,10-dihydro-9-oxa-10-phosphenanthrene-10-oxide, and 10-phenyl-9,10-dihydro-9-oxa-10-phosphenanthrene-10-oxide.

6. The low-dielectric resin composition according to claim 5, characterized in that, Nitrogen-based flame retardants include one or more of triazine compounds, cyanuric acid compounds, isocyanate compounds, and phenothiazines.

7. The low-dielectric resin composition according to claim 1, characterized in that, The inorganic filler is selected from one or more of aluminum nitride, aluminum borate, magnesium oxide, magnesium carbonate, cubic boron nitride, crystalline silicon dioxide, synthetic silicon dioxide, hollow silicon dioxide, spherical silicon dioxide, fused silicon dioxide, talc, aluminum oxide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, or titanium dioxide.

8. The low-dielectric resin composition according to claim 1, characterized in that, The initiator is selected from one or more of the following: di-tert-butyl peroxide, dilauroyl peroxide, dibenzoyl peroxide, cumene peroxyneodecanate, tert-butyl peroxyneodecanate, hexadecyl peroxydicarbonate, tetradecyl peroxydicarbonate, dipentylhexyl peroxide, diisopropylbenzene peroxide, bis(tert-butylperoxyisopropyl)benzene, 2,5-dimethyl-2,5-di-tert-butylperoxyhexane, 2,5-dimethyl-2,5-di-tert-butylperoxyhexyne, diisopropylbenzene hydrogen peroxide, isopropylbenzene hydrogen peroxide, tert-pentyl hydrogen peroxide, tert-butyl hydrogen peroxide, tert-butyl peroxyisopropylbenzene, diisopropylbenzene hydrogen peroxide, tert-butyl percarbonate-2-ethylhexanoate, tert-butyl percarbonate-2-ethylhexyl ester, 4,4-di(tert-butylperoxy)pentanoate, and methyl ethyl ketone peroxide.

9. A method for preparing a low-dielectric resin composition according to any one of claims 1-8, characterized in that, The preparation method is as follows: flame retardant, inorganic filler, initiator, modified styrene-butadiene block copolymer, modified polyphenylene ether, and modified maleimide resin are thoroughly mixed and stirred evenly to obtain a low dielectric resin composition.

10. The application of a low-dielectric resin composition as described in any one of claims 1-8, characterized in that, The low-dielectric resin composition is used to prepare metal foil-coated laminates.

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