A device suitable for small printed board production and processing

Abstract

The application relates to a device suitable for small printed board production and processing, which comprises a clamp plate, components and devices to be welded on the printed board, a plurality of printed boards spliced into one and arranged in a matrix along a first direction and a second direction; the clamp plate clamps the side edges of all the printed boards extending along the first direction; the clamp plate is provided with component and device positioning holes, the components and devices to be welded pass through the component and device positioning holes and the printed board, and the components and devices to be welded face the same direction; the clamp plate and the printed boards clamped by the clamp plate are put into a wave soldering furnace for component and device welding. Compared with the prior art, the device has the advantages that the printed boards after splicing are clamped by the clamp plate, the components and devices to be welded on the printed boards are fixed through the component and device positioning holes on the clamp plate, especially the components and devices with requirements on the welding direction, the component and device positioning holes can fix the installation direction of the components and devices, the direction is consistent after wave soldering, a plurality of printed boards can be welded at one time, and the production efficiency is improved.

Description

Technical Field

[0001] This invention relates to printed circuit board (PCB) production, and more particularly to an apparatus adapted for the production and processing of small PCBs. Background Technology

[0002] The backplane printed circuit board for railway signaling analog network disks needs to be customized according to specific requirements and specifications.

[0003] In the existing circuit board manufacturing process, the backplane printed circuit board of the analog network disk is small in size and the components on the printed circuit board are all discrete components. The production process has always used manual soldering, which results in low production efficiency. When the production volume is large, it seriously affects the delivery rate and does not meet the requirements of lean production and workstation takt time. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a device suitable for the production and processing of small printed circuit boards.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] According to one aspect of the present invention, an apparatus adapted for the production and processing of small printed circuit boards is provided, comprising a clamping plate, components to be soldered on printed circuit boards, multiple printed circuit boards spliced ​​together and arranged in a matrix along a first direction and a second direction; the clamping plate clamps the sides of all the multiple printed circuit boards extending along the first direction; the clamping plate is provided with component positioning holes, the components to be soldered pass through the component positioning holes and the printed circuit boards, and the components to be soldered face the same direction; the clamping plate and the multiple printed circuit boards it clamps are placed in a wave soldering oven for component soldering.

[0007] As a preferred technical solution, there are N columns of printed circuit boards extending along the first direction, and there are 4×N clamping plates; each column of printed circuit boards includes a first side and a second side, and the first side and the second side of each column of printed circuit boards are respectively clamped by two clamping plates.

[0008] As a preferred technical solution, the clamping plate and the component positioning hole are both elongated and extend in the same direction. The component positioning hole is located on one side of the clamping plate, and the components to be soldered on the same side of each column of printed circuit boards are located in the same component positioning hole.

[0009] As a preferred technical solution, the width of the component is a, where a < 1, in mm; the width of the positioning hole of the component is a ± 0.01 mm.

[0010] As a preferred technical solution, the device also includes a connector, and one side of the clamping plate is provided with a connection hole; two clamping plates located on the same side of the printed circuit board are connected by the connector passing through the connection hole.

[0011] As a preferred technical solution, the connector is a self-tapping screw.

[0012] As a preferred technical solution, the clamping plate is made of synthetic stone.

[0013] As a preferred technical solution, V-grooves are provided between the multiple printed circuit boards.

[0014] As a preferred technical solution, the surface of the printed circuit board is uniformly sprayed with flux.

[0015] As a preferred technical solution, the flux is a no-clean flux.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1) This invention uses clamps to hold the assembled printed circuit boards and uses component positioning holes on the clamps to fix the components to be soldered on the printed circuit boards. In particular, for components that require a specific soldering direction, the component positioning holes can fix their installation direction, ensuring that the direction is consistent after wave soldering, thus preparing for the next processing step. Moreover, multiple printed circuit boards can be soldered at one time, which improves production efficiency.

[0018] 2) The component positioning holes of this invention are elongated, and the components of multiple printed circuit boards are located in the same component positioning hole, which reduces the difficulty of component installation; the composite stone material of the clamp has excellent electrical, thermal and chemical properties, which can meet the needs of high-temperature production lines during welding. Attached Figure Description

[0019] Figure 1 This is a front view of the clamp holding the printed circuit board according to the present invention;

[0020] Figure 2 This is a top view of the clamp holding the printed circuit board in this invention.

[0021] Figure 3 This is a schematic diagram of the clamping plate structure of the present invention;

[0022] The numbers in the diagram are as follows:

[0023] 1. Clamping plate; 11. Component positioning hole; 2. Printed circuit board; 3. Component; 4. Connector; 5. Connecting hole. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0025] This invention provides a device adapted for the production and processing of small printed circuit boards (PCBs), including a clamping plate 1 and a connector 4. Multiple PCBs 2 are spliced ​​together into one, and the splicing method is determined based on the current wave soldering equipment fixtures and the dimensions of the PCBs 2. Figure 1 The circuit adopts a 21-to-1 configuration (7 rows and 3 columns of printed circuit boards 2 arranged in a matrix), with V-grooves (i.e., V-cut connections) between the printed circuit boards 2. The clamping plate 1 holds multiple printed circuit boards 2 and components 3 located in the component positioning holes 11, and together they are placed in a wave soldering oven for component 3 soldering.

[0026] Each printed circuit board 2 has positioning holes for easy fixing of the clamping plate 1. After assembly, the printed circuit boards 2 are not divided before processing; the division is performed after soldering is completed. There are a total of 3 rows of multiple printed circuit boards 2.

[0027] The clamping plate 1 is long and narrow. Each column of printed circuit board 2 has two sides, a first side and a second side. Two clamping plates 1 clamp the first side and two clamping plates 1 clamp the second side. All sides of the printed circuit board 2 are clamped. Therefore, the number of clamping plates 1 is four times the number of columns of printed circuit board 2.

[0028] The clamping plate 1 has component positioning holes 11. The components 3 to be soldered pass through the component positioning holes 11 and the printed circuit board 2. The component positioning holes 11 restrict the orientation of the components 3 to be soldered to the same direction. The component positioning holes 11 are elongated. The components 3 to be soldered on the same side of the same column of printed circuit boards 2 are located in the same component positioning hole 11. The elongated component positioning holes 11 not only restrict the orientation of the components 3 to be soldered, but also reduce the installation difficulty compared to one component 3 corresponding to one component positioning hole 11. When the width of the component 3 is a (unit: mm) and a is less than 1, the width of the component positioning hole 11 is a ± 0.01 mm.

[0029] The clamping plate 1 is also provided with a connecting hole 5. The connector 4 passes through the positioning holes on the two clamping plates 1 and the printed circuit board 2 located on the same side of the printed circuit board 2, positioning the clamping plate 1 and fixing it. The connector 4 can be a self-tapping screw. After the self-tapping screw is fixed, the clamping plate 1 can effectively clamp the printed circuit board 2 and prevent the printed circuit board 2 from shifting.

[0030] Considering both cost and performance, composite stone was chosen as the material for clamping plate 1. Composite stone is a composite material made of glass fiber and high-strength resin. Its manufacturing process involves mixing natural stone powder, polyester, and binders under vacuum, followed by pressure and vibration molding. It possesses excellent electrical, thermal, and chemical properties. It maintains good mechanical strength even after continuous use at 280 degrees Celsius (maximum operating temperature 385 degrees Celsius for 10-20 seconds), exhibiting excellent flatness, smoothness, and color, making it suitable for continuous use on high-temperature production lines subject to RoHS regulations. Currently, in wave soldering production, the solder bath temperature is 250 degrees Celsius, and the maximum board surface temperature is 220 degrees Celsius; the temperature requirements are fully met by using composite stone. Furthermore, the flux used in the soldering process is corrosive; the composite stone clamping plate 1 possesses a certain degree of corrosion resistance, meeting the soldering requirements.

[0031] Before soldering, flux is sprayed onto the surface of multiple printed circuit boards 2. IF2009MLF-TDS flux can be selected, which is a non-volatile organic compound (VOC) no-clean flux. This flux has suitable viscosity, excellent solderability, and long-term uniform pin transfer, avoiding the problem of cold solder joints caused by changes in solder joint quality over time and uneven deposition size. This flux also has good cleanability and can be cleaned with deionized water at room temperature.

[0032] This invention splices multiple printed circuit boards 2 together and uses clamps 1 to fix the components 3 to be soldered, which improves production efficiency and avoids soldering errors. This invention is applicable to different types of printed circuit boards 2. The spacing of the clamps 1 can be determined according to the thickness of the printed circuit board 2 and adjusted by the connectors 4.

[0033] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An apparatus adapted for the production and processing of small printed circuit boards, characterized in that, The device includes a clamping plate (1), a printed circuit board (2) on which components (3) are to be soldered, and multiple printed circuit boards (2) are spliced ​​together and arranged in a matrix along a first direction and a second direction; the clamping plate (1) clamps the sides of all the multiple printed circuit boards (2) extending along the first direction; the clamping plate (1) is provided with component positioning holes (11), the components (3) to be soldered pass through the component positioning holes (11) and the printed circuit board (2), and the components (3) to be soldered face the same direction; the clamping plate (1) and the multiple printed circuit boards (2) it clamps are placed in a wave soldering oven for soldering the components (3).

2. The apparatus for small-scale printed circuit board production and processing according to claim 1, characterized in that, The printed circuit boards (2) extending along the first direction have a total of N columns, and the clamping plates (1) have a total of 4×N pieces; each column of printed circuit boards (2) in the N columns includes a first side and a second side, and the first side and the second side of each column of printed circuit boards (2) are respectively clamped by two clamping plates (1).

3. The apparatus for small printed circuit board production and processing according to claim 2, characterized in that, The clamping plate (1) and the component positioning hole (11) are both long strips and extend in the same direction. The component positioning hole (11) is located on one side of the clamping plate (1). The components (3) to be welded on the same side of each column of printed circuit boards (2) are all located in the same component positioning hole (11).

4. The apparatus for small printed circuit board production and processing according to claim 3, characterized in that, The width of the component (3) is a, a<1, in mm; the width of the positioning hole (11) of the component is a±0.01mm.

5. The apparatus for small printed circuit board production and processing according to claim 2, characterized in that, The device also includes a connector (4), and a connection hole (5) is provided on one side of the clamp (1); the two clamps (1) located on the same side of the printed circuit board (2) are connected by the connector (4) passing through the connection hole (5).

6. The apparatus for small-scale printed circuit board production and processing according to claim 5, characterized in that, The connector (4) is a self-tapping screw.

7. The apparatus for small-scale printed circuit board production and processing according to claim 1, characterized in that, The clamp (1) is made of synthetic stone.

8. The apparatus for small-scale printed circuit board production and processing according to claim 1, characterized in that, V-grooves are provided between the multiple printed circuit boards (2).

9. The apparatus for small printed circuit board production and processing according to claim 1, characterized in that, The surface of the printed circuit board (2) is uniformly coated with flux.

10. The apparatus for small printed circuit board production and processing according to claim 9, characterized in that, The flux mentioned is a no-clean flux.

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