Method for manufacturing electromagnetic shielding layer, electromagnetic shielding layer and display module

Abstract

The application discloses a preparation method of an electromagnetic shielding layer, the electromagnetic shielding layer and a display module, and relates to the technical field of display modules. The preparation method of the electromagnetic shielding layer comprises the following steps: forming a corrosion grain boundary layer on a first surface of a metal layer; and forming an organic material layer on the first surface of the metal layer, and part of the organic material layer invades the corrosion grain boundary layer to form a first composite layer. In the preparation method of the electromagnetic shielding layer, the corrosion grain boundary is formed on one side of the metal layer, and part of the organic material layer invades the corrosion grain boundary layer. The first composite layer improves the bonding area and the bonding strength between the organic material layer and the metal layer, improves the adhesion between the organic material layer and the metal layer, and helps to improve the rigidity of the overall structure of the electromagnetic shielding layer. Meanwhile, after the organic material invades the metal grain boundary, the organic material layer and the metal layer form an interlocking structure, the first composite layer can disperse impact force and reduce stress concentration, thereby preventing local damage of the metal layer.

Description

Technical Field

[0001] This invention relates to the field of display panel technology, and in particular to a method for preparing an electromagnetic shielding layer, the electromagnetic shielding layer, and a display module. Background Technology

[0002] In flexible screen products and some rigid screen products, the electromagnetic shielding layer can develop dents due to external impacts or screen bending. These dents can cause the electromagnetic shielding layer to malfunction or may result in Mura-type defects in the screen's image quality.

[0003] In existing technologies, the shock resistance of electromagnetic shielding layers is achieved by applying a large amount of thick, shock-absorbing material to one side of the metal layer to improve the shock resistance of the electromagnetic shielding layer. Summary of the Invention

[0004] This invention provides a method for preparing an electromagnetic shielding layer, an electromagnetic shielding layer, and a display module, in order to improve the overall rigidity of the electromagnetic shielding layer and prevent local damage to the metal layer.

[0005] In a first aspect, the present invention provides a method for preparing an electromagnetic shielding layer, the method comprising:

[0006] A corrosion grain boundary layer is formed on the first surface of the metal layer;

[0007] An organic material layer is formed on the first surface of the metal layer, and a portion of the organic material layer penetrates the grain boundary layer to form a first composite layer.

[0008] Optionally, forming a corrosion grain boundary layer on the first surface of the metal layer includes:

[0009] The first surface of the metal layer is pickled; wherein the pickling solution includes a nitric acid-hydrofluoric acid solution.

[0010] Optionally, an organic material layer is formed on the first surface of the metal layer, and a portion of the organic material layer penetrates the grain boundary layer to form a first composite layer, comprising:

[0011] An organic material layer is coated on the first surface of the metal layer;

[0012] The organic material layer is made of epoxy resin or polyurethane.

[0013] Optionally, after coating the first surface of the metal layer with an organic material layer, the process further includes:

[0014] A foam layer is attached to the side of the organic material layer away from the metal layer.

[0015] Optionally, after coating the first surface of the metal layer with an organic material layer, the process further includes:

[0016] The first surface of the organic material layer away from the metal layer is heated for a first preset time;

[0017] A foam layer is attached to the first surface of the organic material layer, and a portion of the foam layer forms a second composite layer with the first composite layer; wherein the first surface of the organic material layer is in contact with the side of the foam layer that has not undergone planarization treatment.

[0018] Optionally, after heating the organic material layer on its first surface away from the metal layer for a first preset duration, the method further includes:

[0019] Mechanical stretching and hooking treatment is performed on the first surface of the foam layer;

[0020] A foam layer is attached to the first surface of the organic material layer, including:

[0021] The first surface of the foam layer is attached to the first surface of the organic material layer.

[0022] According to a second aspect of the present invention, an electromagnetic shielding layer is provided, the electromagnetic shielding layer comprising: a metal layer, an organic material layer, and a first composite layer;

[0023] The organic material layer is located on one side of the metal layer;

[0024] Between the organic material layer and the metal layer, the first composite layer is a film layer formed by the organic material layer penetrating the grain boundaries of the metal layer.

[0025] Optionally, the electromagnetic shielding layer further includes: a foam layer;

[0026] The foam layer is located on the side of the organic material layer away from the metal layer, and the foam layer is in contact with the organic material layer.

[0027] Optionally, the electromagnetic shielding layer further includes: a foam layer and a second composite layer;

[0028] The foam layer is located on the side of the organic material layer away from the metal layer;

[0029] Between the foam layer and the organic material layer, the second composite layer is a film layer formed by the foam fibers of the foam layer penetrating into the organic material layer.

[0030] According to a third aspect of the present invention, a display module is provided, the display module comprising: a display panel and an electromagnetic shielding layer according to any one of the embodiments of the present invention; the electromagnetic shielding layer is located on one side of the display panel.

[0031] The present invention discloses a method for preparing an electromagnetic shielding layer, an electromagnetic shielding layer, and a display module. In the method for preparing the electromagnetic shielding layer, a corrosion grain boundary is formed on one side of the metal layer, allowing a portion of the organic material layer to invade the grain boundary layer. The first composite layer increases the bonding area and bonding strength between the organic material layer and the metal layer, improves the adhesion between the organic material layer and the metal layer, and helps to improve the overall rigidity of the electromagnetic shielding layer structure. Simultaneously, after the organic material invades the metal grain boundary, the organic material layer and the metal layer form an interlocking structure. The first composite layer can disperse impact forces, reduce stress concentration, and thus prevent localized damage to the metal layer. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a flowchart illustrating a method for preparing an electromagnetic shielding layer according to an embodiment of the present invention;

[0034] Figure 2 A flowchart illustrating another method for preparing an electromagnetic shielding layer provided in an embodiment of the present invention;

[0035] Figure 3 A flowchart illustrating another method for preparing an electromagnetic shielding layer provided in an embodiment of the present invention;

[0036] Figure 4 A flowchart illustrating another method for preparing an electromagnetic shielding layer provided in an embodiment of the present invention;

[0037] Figure 5 This is a schematic diagram of the structure of an electromagnetic shielding layer provided in an embodiment of the present invention;

[0038] Figure 6 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention. Detailed Implementation

[0039] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0040] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0041] Figure 1 This is a flowchart illustrating a method for preparing an electromagnetic shielding layer according to an embodiment of the present invention. This embodiment is applicable to the preparation of electromagnetic shielding layers. Figure 1 As shown, the method includes:

[0042] S101, A corrosion grain boundary layer is formed on the first surface of the metal layer.

[0043] Specifically, a corrosion grain boundary layer with a special microstructure is formed on the surface of the metal layer through corrosion. The process of corrosion on the surface of the metal layer changes the grain boundary morphology, forming micropores, cracks, or rough grain boundary structures.

[0044] Optionally, methods for etching the grain boundaries of the metal layer include chemical etching, electrochemical etching, or physical etching.

[0045] S102. An organic material layer is formed on the first surface of the metal layer, and part of the organic material layer invades the grain boundary layer to form a first composite layer.

[0046] Specifically, because the organic material in the organic material layer has a certain degree of fluidity or plasticity, it can fill the micropores and cracks formed on the corrosion grain boundary layer of the metal layer. Therefore, when the organic material layer is formed on the first surface of the metal layer, the organic material layer will partially penetrate into the corrosion grain boundary layer formed on the first surface of the metal layer. After the partial penetration of the organic material layer into the metal layer, the first composite layer is formed.

[0047] The first composite layer features an interlocking structure, where the organic material layer is tightly bonded to the corrosion grain boundaries of the metal layer, forming a mutually locked structure. This interlocking structure increases the physical bonding area and bonding strength between the metal layer and the organic material layer, thus enhancing the overall rigidity of the electromagnetic shielding layer.

[0048] Optionally, during the process of forming the organic material layer on the first surface of the metal layer, the method for forming the organic material layer includes spin coating, spray coating, or dip coating, and the specific method for forming the organic material layer is not limited herein. The organic material layer includes polymers, resins, or other organic materials with specific properties, and the specific material of the organic material layer is also not limited herein.

[0049] In the electromagnetic shielding layer preparation method provided in this invention, a corrosion grain boundary is formed on one side of the metal layer, allowing part of the organic material layer to invade the grain boundary layer. The first composite layer increases the bonding area and bonding strength between the organic material layer and the metal layer, improves the adhesion between the organic material layer and the metal layer, and helps to improve the overall rigidity of the electromagnetic shielding layer structure. Simultaneously, after the organic material invades the metal grain boundary, the organic material layer and the metal layer form an interlocking structure. The first composite layer can disperse the impact force, reduce stress concentration, and thus prevent localized damage to the metal layer. The electromagnetic shielding layer still has good impact resistance even with a relatively thin overall structure.

[0050] Based on the above embodiments, Figure 2 A flowchart of another method for preparing an electromagnetic shielding layer provided in an embodiment of the present invention is shown below. Figure 2 As shown, the method includes:

[0051] S201. Pickling is performed on the first surface of the metal layer.

[0052] The pickling solution is a nitric acid-hydrofluoric acid solution.

[0053] Specifically, the first surface of the metal layer is acid-washed using a nitric acid-hydrofluoric acid solution. In the nitric acid-hydrofluoric acid solution, nitric acid is a strong oxidizing agent that reacts with oxides on the metal surface to form soluble nitrates, thereby removing the oxide layer. Hydrofluoric acid is an acid that reacts with metal ions to form soluble fluorides. On the metal surface, hydrofluoric acid reacts with metal ions to form fluorides, thus creating micropores, cracks, or rough grain boundary structures on the metal surface. Optionally, the metal layer material is copper.

[0054] Acid pickling solution is used to pickle the first surface of the metal layer to form a grain boundary layer. The pickling operation is simple and safe. By controlling the pickling time, the degree of grain boundary corrosion on the first surface of the metal layer can be controlled, making the preparation of the electromagnetic shielding layer stable and controllable.

[0055] S202, Coat the first surface of the metal layer with an organic material layer.

[0056] The organic material layer can be made of epoxy resin or polyurethane.

[0057] Specifically, after a corrosion grain boundary layer is formed on the first surface of the metal layer, an organic material is coated onto the corrosion grain boundary layer. Due to the microporous grain boundary structure of the corrosion grain boundary layer, the organic material layer invades the grain boundary layer, thereby forming the first composite layer. Coating with an organic material layer can provide a protective layer for the metal, increasing the metal layer's impact resistance or other specific physical and chemical properties.

[0058] Table 1 below shows a comparison of the properties of epoxy resin and polyurethane.

[0059]

[0060] Table 1. Comparison of the properties of epoxy resin and polyurethane

[0061] As shown in Table 1, epoxy resin has relatively weak water and corrosion resistance, but high hardness and low material cost. When epoxy resin is chosen as the material for the organic material layer, its high hardness enables the electromagnetic shielding layer to have excellent impact resistance against the metal layer.

[0062] Polyurethane has strong water and corrosion resistance, making it suitable for harsh conditions. When polyurethane is chosen as the material for the organic material layer, it can improve the water and corrosion resistance of the first surface of the metal layer. At the same time, when providing impact protection for the metal layer, the strong water and corrosion resistance of polyurethane itself can ensure the duration of impact protection for the metal layer, reducing the maintenance cost of the electromagnetic shielding layer.

[0063] S203. A foam layer is attached to the side of the organic material layer away from the metal layer.

[0064] Specifically, the foam layer can absorb the impact energy on the metal layer and reduce vibration transmission. When the foam layer is attached to the side of the organic material layer away from the metal layer, when the metal layer is subjected to external impact force, the first composite layer can absorb the impact energy of the external impact force, while the foam layer can absorb the impact energy transmitted through the first composite layer, thereby absorbing the external impact force on the metal layer.

[0065] The foam layer can have a closed-cell or open-cell structure. Optional materials for the foam layer include polyurethane, polyethylene, and EVA (ethylene-vinyl acetate copolymer). The specific material for the foam layer is determined based on the actual situation and is not limited here.

[0066] Based on the above embodiments, Figure 3 A flowchart of another method for preparing an electromagnetic shielding layer provided in an embodiment of the present invention is shown below. Figure 3 As shown, the method includes:

[0067] S301. Pickling is performed on the first surface of the metal layer.

[0068] S302. Coat the first surface of the metal layer with an organic material layer.

[0069] S303, Heating the first surface of the organic material layer away from the metal layer for a first preset duration.

[0070] Specifically, when the first surface of the organic material layer is heated for a first preset duration, the controllable heating for the first preset duration enables the formation of a thin, viscous layer on the first surface of the organic material layer. The organic material layer in this viscous layer exhibits a certain degree of fluidity after heating, resulting in a smoother first surface.

[0071] Optionally, the first preset duration includes: a heating time that allows the organic material layer to form an adhesive layer without causing the organic material layer to completely melt.

[0072] S304. A foam layer is attached to the first surface of the organic material layer, and the foam portion forms a second composite layer with the first composite layer.

[0073] The first surface of the organic material layer is in contact with the side of the foam layer that has not been smoothed.

[0074] Specifically, the first surface of the organic material layer has a thin adhesive layer. A foam layer is then adhered to this first surface. The first surface of the organic material layer contacts the un-smoothed side of the foam layer, ultimately forming the second composite layer. The un-smoothed side of the foam layer contains a layer of raised foam fibers, so the second composite layer contains a portion of the organic material layer and a portion of the raised foam fibers. In the structure of the second composite layer, the presence of both the organic material from the organic material layer and the foam fibers enhances the rigidity of the second composite layer.

[0075] When the metal layer is subjected to external impact, the first composite layer in the electromagnetic shielding layer enhances the metal layer's impact resistance, meaning it absorbs the impact stress. However, when the impact force on the metal layer is significant, the organic material layer may exceed its stress absorption capacity, causing the electromagnetic shielding layer to break. By fabricating the second composite layer, foam fibers, acting as reinforcing fibers, are encapsulated within the organic material layer. This second composite layer increases the inherent strength of the electromagnetic shielding layer, thereby improving its stress absorption capacity.

[0076] Based on the above embodiments, Figure 4 A flowchart of another method for preparing an electromagnetic shielding layer provided in an embodiment of the present invention is shown below. Figure 4 As shown, the method includes:

[0077] S401. Pickling is performed on the first surface of the metal layer.

[0078] S402, Coat the first surface of the metal layer with an organic material layer.

[0079] S403. The first surface of the organic material layer away from the metal layer is heated for a first preset time.

[0080] S404. Mechanical stretching and hooking treatment is performed on the first surface of the foam layer.

[0081] Specifically, the first surface of the foam layer needs to have a layer of raised foam fibers to form the second composite layer. The more raised foam fibers there are, the more foam fibers there are as reinforcing fibers, which can further improve the strength of the electromagnetic shielding layer itself. Therefore, the first surface of the foam layer is mechanically stretched and hooked to form more raised foam fibers.

[0082] Mechanical stretching and hooking are performed on the first surface of the foam layer to form a large number of raised foam fibers. The more foam fibers there are, the greater the strength of the second composite layer; however, too many foam fibers can lead to difficulties in bonding the foam layer to the organic material layer. Therefore, the amount of foam fibers needs to be sufficient to better enhance the strength of the electromagnetic shielding layer itself; at the same time, the amount of foam fibers also needs to ensure effective bonding between the organic material layer and the foam layer.

[0083] S405, The first surface of the foam layer is attached to the first surface of the organic material layer.

[0084] Specifically, the first surface of the foam layer has a layer of raised foam fibers, and the first surface of the organic material layer has an adhesive layer. When the first surface of the foam layer is attached to the first surface of the organic material layer, the foam fibers are wrapped by the adhesive layer, forming a second composite layer. The second composite layer enhances the strength of the electromagnetic shielding layer itself.

[0085] Figure 5 This is a schematic diagram of the structure of an electromagnetic shielding layer provided in an embodiment of the present invention, as shown below. Figure 5 As shown, the structure includes: a metal layer 501, an organic material layer 502, and a first composite layer 510; the organic material layer 502 is located on one side of the metal layer 501; between the organic material layer 502 and the metal layer 501, the first composite layer 510 is a film layer formed by the organic material layer 502 intruding into the grain boundary of the metal layer.

[0086] Specifically, a corrosion grain boundary layer is formed on one side of the metal layer 501. Because the organic material in the organic material layer 502 has a certain degree of fluidity during coating, it can fill the micropores and cracks formed on the corrosion grain boundary layer of the metal layer. Therefore, when the organic material layer 502 is formed on the first surface of the metal layer 501, the organic material in the organic material layer 502 will partially penetrate into the corrosion grain boundary layer formed on the first surface of the metal layer 501. After the partial penetration of the organic material layer 502 into the metal layer 501, a first composite layer 510 is formed. The first composite layer 510 has an interlocking structure, meaning that the portion of the organic material layer 502 is tightly bonded to the corrosion grain boundary portion of the metal layer 501, forming an interlocked structure. This interlocking structure improves the metallic rigidity and impact resistance of the metal layer 501 and the organic material layer 502.

[0087] In the electromagnetic shielding layer provided by this invention, the first composite layer formed between the metal layer and the organic material layer has an interlocking structure that improves the bonding strength between the metal layer and the organic material layer. Therefore, the electromagnetic shielding layer provided by this invention has high impact resistance. Furthermore, the high bonding strength between the metal layer and the organic material layer means that when the metal layer receives an external impact, the first composite layer can effectively transfer the impact force to the organic material layer. Simultaneously, due to its inherent material properties, the organic material layer exhibits high stress absorption characteristics and high elasticity. The organic material layer can absorb the received impact force better than the metal layer, thus determining that the overall electromagnetic shielding layer has a higher stress absorption capacity.

[0088] Based on the above embodiments, the electromagnetic shielding layer further includes: a foam layer 503;

[0089] The foam layer 503 is located on the side of the organic material layer 502 away from the metal layer 501, and the foam layer 503 is in contact with the organic material layer 502.

[0090] Specifically, the foam layer 503 is located on one side of the metal layer 501 and is in contact with the organic material layer. The foam layer 503 can absorb the impact energy transmitted from the first composite layer 510, thereby absorbing the external impact force on the metal layer 501. This improves the overall impact absorption capacity of the electromagnetic shielding layer.

[0091] Based on the above embodiments, the electromagnetic shielding layer further includes: a foam layer 503 and a second composite layer 520; the foam layer 503 is located on the side of the organic material layer 502 away from the metal layer 501; between the foam layer 503 and the organic material layer 502, the second composite layer 520 is a film layer formed by the foam fibers of the foam layer 503 penetrating into the organic material layer 502.

[0092] Specifically, the second composite layer 520 includes at least a portion of organic material in the organic material layer 502 and a portion of foam fiber in the foam layer 503.

[0093] When the metal layer 501 is subjected to external impact, the first composite layer 510 can absorb the impact stress experienced by the metal layer 501. In the second composite layer 520, the foam fibers of the foam layer 503 are wrapped as reinforcing fibers by at least a portion of the organic material of the organic material layer 502. Since the organic material layer 502 needs to absorb the impact force transmitted by the metal layer 501, the second composite layer 520 further enhances the strength of the organic material layer 502 itself, increases the upper limit of the stress absorption capacity of the organic material layer 502, and prevents the organic material layer 502 from breaking under large impact forces.

[0094] For example, the metal layer 501 has a thickness of 0.03 mm; the organic material layer 502 has a thickness of 0.02 mm; and the foam layer 503 has a thickness of 0.25 mm.

[0095] The electromagnetic shielding layer provided in this embodiment of the invention includes a second composite layer, in which the foam fibers of the foam layer are wrapped by at least a portion of the organic material of the organic material layer as reinforcing fibers. This increases the upper limit of stress absorption of the electromagnetic shielding layer and enhances its impact resistance.

[0096] Figure 6 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention. Based on the above embodiments, as follows... Figure 6 As shown, the display module includes an electromagnetic shielding layer 50 and a display panel 60 provided in any embodiment of the present invention; the electromagnetic shielding layer 50 is located on one side of the display panel 60.

[0097] For example, the electromagnetic shielding layer 50 is attached to one side of the display panel 60. Because the first composite layer 510 has an interlocking structure, a portion of the organic material layer 502 is tightly bonded to the corrosion grain boundary portion of the metal layer 501, improving the metallic rigidity and impact resistance of both the metal layer 501 and the organic material layer 502. Therefore, when the electromagnetic shielding layer 50 is subjected to impact or the screen is bent, large-area dents will not appear on the electromagnetic shielding layer 50. The electromagnetic shielding layer 50 will not compress the display panel 60 due to deformation, and thus will not cause mura-type defects in the display panel 60. Simultaneously, the first composite layer 510 is formed by the organic material penetrating the corrosion grain boundary layer of the metal layer 501; therefore, the first composite layer 510 has a relatively thin thickness. By placing the electromagnetic shielding layer 50 in the display module, it saves internal space of the display module while maintaining good impact resistance.

[0098] The electromagnetic shielding layer 50 includes a foam layer 503 on the side of the organic material layer 502 away from the metal layer 501. When the display module is subjected to an impact, the foam layer 503 can absorb the impact force, prevent the electromagnetic shielding layer 50 from breaking or deforming, and help prevent damage to the display panel 60 caused by the breakage of the electromagnetic shielding layer 50.

[0099] The second composite layer 520 in the electromagnetic shielding layer 50 enhances the inherent strength of the organic material layer 502, increases the upper limit of the stress absorption capacity of the organic material layer 502, and prevents debris generated by the breakage of the organic material layer 502 under large impact from penetrating into the display panel 60, thereby reducing mura-type defects in the display panel 60. This display module includes the electromagnetic shielding layer provided in any embodiment of the present invention. Therefore, the display module provided in the embodiments of the present invention possesses the corresponding beneficial effects of the electromagnetic shielding layer provided in the embodiments of the present invention, which will not be elaborated further here. Exemplarily, the display device can be an electronic device such as a mobile phone, computer, smart wearable device (e.g., smartwatch), and in-vehicle display device; the embodiments of the present invention do not limit this.

[0100] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0101] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method for preparing an electromagnetic shielding layer, characterized in that, The method includes: A corrosion grain boundary layer is formed on the first surface of the metal layer; An organic material layer is formed on the first surface of the metal layer, and a portion of the organic material layer penetrates the grain boundary layer to form a first composite layer.

2. The method for preparing the electromagnetic shielding layer according to claim 1, characterized in that, The formation of a corrosion grain boundary layer on the first surface of the metal layer includes: The first surface of the metal layer is pickled; wherein the pickling solution includes a nitric acid-hydrofluoric acid solution.

3. The method for preparing the electromagnetic shielding layer according to claim 1, characterized in that, An organic material layer is formed on the first surface of the metal layer, and a portion of the organic material layer penetrates the grain boundary layer to form a first composite layer, comprising: An organic material layer is coated on the first surface of the metal layer; The organic material layer is made of epoxy resin or polyurethane.

4. The method for preparing the electromagnetic shielding layer according to claim 3, characterized in that, After coating the first surface of the metal layer with an organic material layer, the process further includes: A foam layer is attached to the side of the organic material layer away from the metal layer.

5. The method for preparing the electromagnetic shielding layer according to claim 3, characterized in that, After coating the first surface of the metal layer with an organic material layer, the process further includes: The first surface of the organic material layer away from the metal layer is heated for a first preset time; A foam layer is attached to the first surface of the organic material layer, and a portion of the foam layer forms a second composite layer with the first composite layer; wherein the first surface of the organic material layer is in contact with the side of the foam layer that has not undergone planarization treatment.

6. The method for preparing the electromagnetic shielding layer according to claim 5, characterized in that, After heating the first surface of the organic material layer away from the metal layer for a first preset time, the process further includes: Mechanical stretching and hooking treatment is performed on the first surface of the foam layer; A foam layer is attached to the first surface of the organic material layer, including: The first surface of the foam layer is attached to the first surface of the organic material layer.

7. An electromagnetic shielding layer, characterized in that, The electromagnetic shielding layer comprises: a metal layer, an organic material layer, and a first composite layer; The organic material layer is located on one side of the metal layer; Between the organic material layer and the metal layer, the first composite layer is a film layer formed by the organic material layer penetrating the grain boundaries of the metal layer.

8. The electromagnetic shielding layer according to claim 7, characterized in that, The electromagnetic shielding layer further includes: a foam layer; The foam layer is located on the side of the organic material layer away from the metal layer, and the foam layer is in contact with the organic material layer.

9. The electromagnetic shielding layer according to claim 7, characterized in that, The electromagnetic shielding layer further includes: a foam layer and a second composite layer; The foam layer is located on the side of the organic material layer away from the metal layer; Between the foam layer and the organic material layer, the second composite layer is a film layer formed by the foam fibers of the foam layer penetrating into the organic material layer.

10. A display module, characterized in that, The display module includes: a display panel and an electromagnetic shielding layer according to any one of claims 7-9; the electromagnetic shielding layer is located on one side of the display panel.

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