An integrated circuit block pin package device

Abstract

The application belongs to the technical field of chip manufacturing, and particularly relates to an integrated circuit block pin packaging device which comprises a feeding and discharging module, a conveying belt, a bonding module, a plastic packaging module, a solidification module and a rib cutting and forming module; further comprises a chip rack which is installed on the conveying belt and is provided with a suction disc at the center; when detection is performed, a detection arm slides along a cross rod on the chip rack, a probe smoothly slides along the cross rod on the chip rack while detecting the top of the chip, the probe keeps a distance from the chip and the pin through the chip rack, for example, when an electric push rod is elongated, a sliding rod extends to detect the arm, the detection distance is increased, when the electric push rod is shortened, the detection distance is reduced, so that the distance is adjusted to a suitable distance for process calibration, all detection areas of the chip plastic package body and the pin are within the clear depth of field of the lens, imaging blur and virtuality caused by too close or too far distance are avoided, and fine defects can be ensured to be identified.

Description

Technical Field

[0001] This invention belongs to the field of chip manufacturing technology, specifically an integrated circuit block pin packaging device. Background Technology

[0002] Integrated circuit block lead packaging equipment is a core piece of equipment in the semiconductor packaging and testing process. Its function is to connect the diced wafer chips to the lead frame and, through processes such as molding and lead trimming, create a finished integrated circuit with electrical connectivity and physical protection. The integrated circuit block lead packaging equipment can be functionally divided into a loading module, a bonding module, a molding module, a curing module, a lead trimming module, a testing module, a unloading module, and a control system. These modules work together to complete the entire packaging process. The testing module includes: a vision inspection instrument that photographs the product appearance to check for cracks, bubbles, and missing materials in the molding compound; a lead trimming module that checks for lead deformation and spacing defects; a continuity tester that uses probes to contact the leads to test the electrical conductivity and insulation resistance between the chip and the leads, identifying bonding defects; a tensile tester that randomly selects samples to test the tensile strength of the bonding wires to ensure reliability standards are met; and an unloading robot that, based on the test results, places qualified products into a finished product bin and defective products into a scrap bin.

[0003] In actual production testing, due to insufficient camera resolution or unreasonable light source angle, minor scratches on the surface of the molded body may be misjudged as cracks, or small pin deformations may be missed; or, uneven light source brightness or a single angle may cause defects in reflective or shadowed areas on the surface of the molded body to be missed; furthermore, during continuity testing, the probe may come into contact with the oxide layer on the pin surface, leading to a misjudgment of poor continuity; or the probe pressure may be too high, damaging the pin plating. Summary of the Invention

[0004] To overcome the shortcomings of existing technologies and solve the aforementioned technical problems, this invention proposes an integrated circuit block pin packaging device.

[0005] The technical solution adopted by this invention to solve its technical problem is as follows: This invention proposes an integrated circuit block pin packaging device, including a loading and unloading module, a conveyor belt, a bonding module, a molding module, a curing module, a lead cutting and forming module, a detection module, and a control system; the detection module includes a vision inspection unit, an electrical inspection unit, and a tensile strength inspection unit; it also includes:

[0006] A chip holder is mounted on a conveyor belt. A suction cup is provided at the center of the chip holder. Pads are evenly distributed at the bottom edge of the chip holder and are in contact with the pins. A rotating frame is provided on the outer periphery of the chip holder. A driving block is slidably connected to the outer periphery of the rotating frame. A driving rod is rotatably connected to the center of the driving block. A driving gear is provided on the driving rod and is connected to one side surface of the rotating frame. A rotary motor mounted on the driving rod is connected to the driving gear. A flipping motor mounted on the side wall of the conveyor belt is connected to the driving rod.

[0007] The detection arm is installed on the side wall of the conveyor belt. The probes of the vision detection unit and the electrical detection unit are installed at the end of the detection arm. The end of the detection arm is provided with a measuring rod. A sliding rod is slidably connected inside the measuring rod. The two ends of the sliding rod pass through the measuring rod. One end of the sliding rod is arc-shaped and slides on the chip holder. The other end is connected to the electric push rod installed on the detection arm.

[0008] Preferably, a grinding block is slidably connected to one side of the pad by a spring, and the inner side of the grinding block contacts the pin surface. A guide groove is provided on the side of one end of the grinding block, and the guide groove is close to the pad. A guide block is slidably connected to one side of the pad by a spring. One end of the guide block is away from the pin and contacts the inner wall of the guide groove, and the other end is located at the end of the pad away from the guide groove and contacts the pin surface. The pin is located between the grinding block and the guide block. The area of ​​the grinding block contacting the pin is smaller than the area of ​​the guide block contacting the pin, and the grinding block is close to the top of the guide block when it is stationary. A dust removal airbag is provided between the guide block and the pad, and the air outlet of the dust removal airbag is from top to bottom and towards the pin.

[0009] Preferably, a suction pipe is slidably connected to the side wall of the conveyor belt via a spring, the top of the suction pipe is covered with a pad and a grinding block, and a silicone strip is provided on one side of the suction pipe.

[0010] Preferably, a sliding post is slidably connected to one side of the vacuum tube via a spring. The sliding posts are evenly arranged and silicone strips are wrapped around both ends of the sliding posts. One end of the sliding post contacts the silicone strip via a rotating post that is rotatably connected to it.

[0011] Preferably, the outer peripheral surface of the rotating column is stepped, and anti-slip strips are uniformly provided on the rotating column and inserted into the silicone strips.

[0012] Preferably, a transmission rope is provided inside the silicone strip, and the transmission rope is sleeved in a recess on the surface of the rotating column.

[0013] Preferably, the silicone strip is provided with clips, one end of which is connected to the transmission rope and the other end faces the outer periphery of the silicone strip, and the clips are evenly arranged along the transmission rope.

[0014] Preferably, the silicone strip has a cleaning strip on the inner surface of the clip.

[0015] Preferably, the silicone strip has a compression airbag inside, and the air extraction end of the compression airbag is located on the outer periphery of the silicone strip, while the air outlet end is located on the inner side of the silicone strip.

[0016] Preferably, a cleaning motor is provided on the side wall of the suction pipe, and a cleaning wheel is provided at the end of the cleaning motor, with the cleaning wheel contacting the silicone strip.

[0017] The beneficial effects of this invention are as follows:

[0018] 1. In the integrated circuit block pin packaging device of the present invention, the chip carrier moves the chip to the position of the detection arm, and the detection arm moves the probe to detect the chip. If the detection is direct, the detection distance between the detection arm and each pin on the chip will change with the movement, affecting the detection result. For example, the change in detection distance will cause the vision probe to need to focus frequently or the image to be unclear, or the change in distance will affect the judgment of cracks, etc. Therefore, when the detection arm moves closer to the chip, the electric push rod drives the sliding rod to extend the measuring rod, and the detection arm drives the arc end of the sliding rod to grab the crossbar on the chip carrier. The crossbar on the chip carrier allows the sliding rod to slide on its surface.

[0019] 2. The integrated circuit block lead packaging device of the present invention, after the chip lead is cut and formed, the conventional loading and unloading module places the packaged and formed chip onto the chip holder. The bottom of the chip lead is fixed to the top of the pad to protect the lead when the chip moves, avoid the possibility of the chip lead bending due to vibration of the conveyor belt, reduce the error generated by the detection, improve the detection accuracy of the formed chip, and thus improve the production quality of the packaging device. Attached Figure Description

[0020] The invention will now be further described with reference to the accompanying drawings.

[0021] Figure 1 It is a 3D view of the chip molding and testing process in the packaging device;

[0022] Figure 2 This is a schematic diagram of the chip rack viewed from above;

[0023] Figure 3 yes Figure 2 A sectional view with the drive rod as the reference.

[0024] Figure 4 yes Figure 3 A three-dimensional image;

[0025] Figure 5 yes Figure 4 A magnified view of a portion of the image;

[0026] Figure 6 yes Figure 5 A cross-sectional view with the grinding block as the reference.

[0027] Figure 7 yes Figure 5 A cross-sectional view based on the silicone strip.

[0028] In the diagram: 1. Conveyor belt; 11. Chip holder; 12. Suction cup; 13. Pad; 14. Rotating frame; 15. Drive block; 16. Drive rod; 17. Drive gear; 18. Rotary motor; 19. Tilting motor; 2. Detection arm; 21. Probe; 22. Measuring rod; 23. Sliding rod; 24. Electric push rod; 25. Grinding block; 26. Guide groove; 27. Guide block; 28. Dust cleaning airbag; 29. ​​Suction pipe; 30. Silicone strip; 31. Sliding column; 32. Rotating column; 33. Anti-slip strip; 34. Transmission rope; 35. Clamping plate; 36. Cleaning strip; 37. Squeezing airbag; 38. Cleaning motor; 39. Cleaning wheel. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Example 1:

[0031] To effectively solve the above problems, see the attached diagram in the instruction manual. Figure 1-7 As shown, an integrated circuit block lead packaging device includes a loading and unloading module, a conveyor belt 1, a bonding module, a molding module, a curing module, a lead cutting and forming module, a detection module, and a control system; the detection module includes a vision inspection unit, an electrical inspection unit, and a tensile force inspection unit; it also includes:

[0032] A chip holder 11 is mounted on a conveyor belt 1. A suction cup 12 is provided at the center of the chip holder 11. Pads 13 are evenly provided at the bottom edge of the chip holder 11 and are in contact with the pins. A rotating frame 14 is provided on the outer periphery of the chip holder 11. A drive block 15 is slidably connected to the outer periphery of the rotating frame 14. A drive rod 16 is rotatably connected to the center of the drive block 15. A drive gear 17 is provided on the drive rod 16 and is connected to one side surface of the rotating frame 14. A rotary motor 18 is mounted on the drive rod 16 and is connected to the drive gear 17. A flip motor 19 is mounted on the side wall of the conveyor belt 1 and is connected to the drive rod 16.

[0033] The detection arm 2 is installed on the side wall of the conveyor belt 1. The probes 21 of the vision detection unit and the electrical detection unit are installed at the end of the detection arm 2. The end of the detection arm 2 is provided with a measuring rod 22. A sliding rod 23 is slidably connected inside the measuring rod 22. Both ends of the sliding rod 23 pass through the measuring rod 22. One end of the sliding rod 23 is arc-shaped and slides on the chip holder 11. The other end is connected to the electric push rod 24 installed on the detection arm 2.

[0034] The finished integrated circuit is a rectangular chip. The central area of ​​the encapsulation in the center of the chip die is a blank gap area without leads. This area is a pure epoxy resin encapsulation without any electrical or mechanical critical structures, so it will not affect the chip's detection or damage the chip. The chip is fixed by adsorption using a vacuum chuck 12, which is connected to an air pump unit configured in the packaging device. The rotary motor 18 is a self-powered type that is mounted on the drive rod 16 and moves with it. Alternatively, the worker can choose to mount the drive rod 16 on an electric telescopic device. When the chip holder 11 moves to the detection position, the electric telescopic device drives the drive rod 16 and the drive block 15 to insert into the outer periphery of the rotating frame 14, and then the conventional rotary motor 18 drives the rotating frame 14 to rotate. The detection arm 2 is a conventional robotic arm or moving device used to move the vision inspection unit, electrical inspection unit, and tensile inspection unit. The worker achieves automated detection through the detection arm 2, and the probes 21 of the vision inspection unit, electrical inspection unit, and tensile inspection unit are all mounted on the detection arm 2.

[0035] Specific workflow: After chip lead cutting and forming, the conventional loading and unloading module places the packaged and formed chip onto the chip holder 11. The bottom of the chip's leads is fixed to the top of the pad 13, which protects the leads during chip movement and prevents them from bending due to vibration from the conveyor belt 1. This reduces errors in detection, improves the accuracy of chip detection, and thus improves the production quality of the packaging device. Furthermore, the pads 13, by pressing against the bottom of the leads around the chip, not only fix the leads but also assist the chip in centering through the lead distribution, improving the accuracy of contact between the chip center and the chuck 12. This also improves the ease of chip centering, thereby increasing detection efficiency and ultimately improving chip packaging efficiency.

[0036] The chip holder 11 moves the chip to the position of the detection arm 2. The detection arm 2 moves the probe 21 to detect the chip. If the detection is direct, the detection distance between the detection arm 2 and each pin on the chip will change as it moves, affecting the detection results. For example, the change in detection distance may cause the vision probe 21 to need to focus frequently or the image to be unclear. Alternatively, the change in distance may affect the judgment of cracks. Therefore, when the detection arm 2 moves closer to the chip, the electric push rod 24 drives the sliding rod 23 to extend out of the measuring rod 22. The detection arm 2 drives the arc end of the sliding rod 23 to grab the crossbar on the chip holder 11. The crossbar on the chip holder 11 allows the sliding rod 23 to slide on its surface.

[0037] During inspection, the inspection arm 2 slides along the crossbar on the chip holder 11, and the probe 21 slides smoothly along the crossbar on the chip holder 11 while inspecting the top of the chip. The probe 21 maintains a distance between itself and the chip and pins through the chip holder 11. For example, when the electric push rod 24 extends, the sliding rod 23 extends out of the inspection arm 2, increasing the inspection distance; when the electric push rod 24 shortens, the inspection distance decreases. This adjusts the distance to the appropriate distance specified by the process, ensuring that all inspection areas of the chip package and pins fall within the clear depth of field of the lens. This avoids blurry or out-of-focus images caused by excessively close or far distances, ensuring the identification of minute defects. Furthermore, it ensures consistent inspection conditions for products of the same batch and model, avoiding distance differences caused by manual adjustments or equipment drift. This eliminates accidental errors at the source, reduces inspection errors, improves the inspection accuracy of the molded chip, and thus improves the production quality of the packaging device.

[0038] Moreover, the chip holder 11 not only has a fixed spacing, but also mechanically limits the horizontal and vertical offset of the probe 21 to prevent the probe 21 from shifting slightly due to equipment vibration and electromagnetic interference. This ensures that the probe 21 is always aligned with the preset detection point and prevents problems such as missed detection areas and probe contact with pin edges caused by probe 21 offset, thereby further improving the detection accuracy of the formed chip.

[0039] In addition, the auxiliary light source for visual inspection can also be integrated into the side wall of the conveyor belt 1 near the inspection arm 2, and the distance and angle between it and the sample can be fixed synchronously. This can ensure that the light is evenly irradiated on the sample surface, avoid excessive reflection caused by changes in the distance between the light sources, such as bright spots on the molding body obscuring defects or excessive shadows, make the defect features clearly stand out, and improve the accuracy of chip production inspection.

[0040] Furthermore, the chip holder 11 fixes the initial height of the probe. When the sample is in place, the electrical detection probe 21 is elastically pressed down to contact the pin according to the calibrated stroke, ensuring that the contact depth between the electrical detection probe 21 and the corresponding pin is consistent. This avoids the possibility of false contact with the pin oxide layer due to insufficient stroke, or the possibility of piercing the pin plating layer due to excessive stroke, thereby further improving the accuracy of chip detection.

[0041] The pins on the chip are distributed around the perimeter. After the pins or surface on one side are detected, the sliding rod 23 moves away from the chip holder 11 or remains in sliding connection with the chip holder 11. The rotary motor 18 drives the drive gear 17 to rotate. The drive gear 17 contacts the surface of the rotating frame 14 through meshing and other means and rotates it. The drive rod 16 slides on the outer periphery of the rotating frame 14 through the drive block 15. The rotating frame 14 drives the chip to rotate one revolution through the chip holder 11. The detection arm 2 detects the chip slowly as it rotates through the probe 21, while the chip holder 11 keeps the detection distance stable, thereby improving the accuracy of dynamic chip detection and also improving detection efficiency.

[0042] After the top of the chip is inspected, it is reversed and reset. The robotic arm releases the chip holder 11, and the flip motor 19 drives the drive rod 16 to flip. The drive rod 16 drives the rotating frame 14 to flip through the drive block 15. The rotating frame 14 drives the chip to flip so that the bottom is facing up. The robotic arm then grabs the chip holder 11 again and inspects the bottom of the chip in the same way as described above. That is, the chip rotates one full circle with the top facing up for inspection, and then the chip rotates one full circle with the bottom facing up for inspection. This achieves the purpose of keeping the chip centered while inspecting it from all angles, thereby improving the accuracy of chip inspection.

[0043] Example 2:

[0044] Based on Embodiment 1, a polishing block 25 is slidably connected to one side of the pad 13 via a spring, and the inner side of the polishing block 25 contacts the pin surface. A guide groove 26 is provided on the side of one end of the polishing block 25, and the guide groove 26 is close to the pad 13. A guide block 27 is slidably connected to one side of the pad 13 via a spring. One end of the guide block 27 is away from the pin and contacts the inner wall of the guide groove 26, and the other end is located at the end of the pad 13 away from the guide groove 26 and contacts the pin surface. The pin is located between the polishing block 25 and the guide block 27. The area of ​​the polishing block 25 contacting the pin is smaller than the area of ​​the guide block 27 contacting the pin, and the polishing block 25 is close to the top of the guide block 27 when stationary. A dust-cleaning airbag 28 is provided between the guide block 27 and the pad 13, and the air outlet of the dust-cleaning airbag 28 is from top to bottom and towards the pin.

[0045] A suction pipe 29 is slidably connected to the side wall of the conveyor belt 1 via a spring. The top of the suction pipe 29 is covered with a pad 13 and a grinding block 25. A silicone strip 3 is provided on one side of the suction pipe 29. One end of the suction pipe 29 is connected to the air pump unit to achieve the purpose of air suction.

[0046] One side of the vacuum tube 29 is slidably connected to a sliding post 31 via a spring. The sliding posts 31 are evenly arranged and the silicone strip 3 is wrapped around both ends of the sliding posts 31. One end of the sliding post 31 contacts the silicone strip 3 via a rotating post 32 that is rotatably connected.

[0047] The outer peripheral surface of the rotating column 32 is stepped, and anti-slip strips 33 are evenly provided on the rotating column 32 and inserted into the silicone strip 3;

[0048] Specific workflow: During the hot and rainy summer season, the metal substrate of the pin undergoes an electrochemical reaction with oxygen and water vapor in the environment, or the high temperature heating during the packaging process accelerates the formation of an oxide layer on the pin surface. The core of electrical testing is to achieve effective electrical conduction through the contact between the probe 21 and the pin. The oxide layer is an insulator, which will directly increase the contact resistance and may even form an insulating layer, leading to false detection. Therefore, before electrical testing, the sliding rod 23 moves along the crossbar of the chip holder 11 to contact the polishing block 25. The arc surface of one end of the polishing block 25 is squeezed by the sliding rod 23 and descends to expose the outside of the pin. When not testing, the polishing block 25 is raised by the spring to cover the pin and cooperates with the pad block 13 to wrap the pin, avoiding damage to the pin or the influence of contamination and dust, thereby improving the accuracy of testing.

[0049] The sliding rod 23 presses the polishing block 25 down and then returns away from the polishing block 25. The polishing block 25 is then raised and reset by the spring. This process is repeated so that the polishing block 25 repeatedly polishes the pin surface, removing the oxide layer on the pin surface and reducing the impact of the oxide layer on electrical detection, thereby improving the detection accuracy of the chip.

[0050] Furthermore, the grinding block 25 descends, causing the guide groove 26 to descend as well. The guide groove 26 presses against the guide block 27 and slides laterally. The grinding block 25 rises, causing the guide groove 26 to reset. After the guide groove 26 no longer contacts the guide block 27, the guide block 27 is affected by the spring and slides back to reset. The grinding block 25 repeatedly rises and falls, causing the guide block 27 to slide laterally back and forth. This allows the guide block 27 to repeatedly rub and grind the inner surface of the pin, thoroughly grinding the pin surface. This avoids a large area of ​​oxide layer on the inner side of the pin, which could cause poor contact during use due to the oxide layer on the inner side. This improves the cleanliness of the pin surface and thus improves the accuracy of chip detection.

[0051] Moreover, when the grinding block 25 is raised and lowered for grinding, it is easy to cause the chip to vibrate up and down or fluctuate slightly through the pins, which affects the stability of the suction cup 12. Since the guide block 27 slides laterally, it increases the frictional resistance when the pins are raised and lowered, maintains the stability of the chip pins during grinding, thereby improving the accuracy of the chip position and thus improving the accuracy of chip detection.

[0052] In addition, the clamping effect of the guide block 27 and the polishing block 25 on the pins can share the adsorption pressure of the suction cup 12 on the chip, thereby improving the stability of the chip movement. It can also expose the actual detection area of ​​the pins only when the sliding rod 23 pushes away the polishing block 25 during electrical testing, thereby reducing the exposure time of the pins and improving the cleanliness of the pins.

[0053] Because the contact area between the grinding block 25 and the pin is smaller than that between the guide block 27 and the pin, the other side of the pin can be supported by the guide block 27 when the grinding block 25 is grinding the pin. This prevents the pin from being bent or deformed by the grinding block 25, thus protecting the pin. While the guide block 27 is grinding the pin, it also repeatedly squeezes the cleaning airbag 28. The cleaning airbag 28 is compressed and blows the pin downwards, blowing away the grinding debris and preventing it from affecting the chip surface. After being compressed, the cleaning airbag 28 draws air from the surface above the chip to restore its original shape. During the air intake process, it removes impurities and dust from the chip surface or the gaps between adjacent pins, improving the cleanliness of the chip and thus improving the accuracy of chip testing, thereby improving the production quality of the packaging device.

[0054] By setting up a suction pipe 29, the bottom between the polishing block 25 and the guide block 27 is hollowed out when polishing the pins. Debris falls from the gap between the two. The suction pipe 29 sucks up the debris to the polishing area through the air pump unit, preventing debris from scattering and contaminating other chips and pins. Furthermore, when the chip holder 11 moves closer to the suction pipe 29, the suction pipe 29 is pressed against the bottom of the pad 13 and the polishing block 25 by a spring, maintaining the airtightness of the polishing area. At the same time, the silicone strip 3 covers the surface of the chip near the pins, preventing debris from contaminating the chip surface. The silicone strip 3 also adheres to the dust and impurities on the chip surface, improving the cleanliness of the chip. Moreover, when the chip holder 11 is flipped, the suction pipe 29 is squeezed down, causing the suction pipe 29 to move away from the chip and flip over to the other side of the chip holder 11, thus completing the flipping process with the chip holder 11.

[0055] By setting a sliding post 31, and the sliding post 31 is connected to the suction pipe 29 by a spring, the sliding post 31 is affected by the spring and drives the silicone strip 3 to adhere to the gap between the chip surface and the adjacent pins, thereby increasing the contact area between the silicone strip 3 and the chip, and thus improving the cleaning effect of the silicone strip 3.

[0056] Furthermore, when the chip holder 11 drives the chip to rotate, the chip drives the silicone strip 3 to rotate through contact friction. The silicone strip 3 rotates on the sliding post 31 via the rotating post 32. For example, the rotating post 32 is located in the middle of the silicone strip 3, so that the silicone strip 3 rotates around the rotating post 32. During the cleaning process, the silicone strip 3 passes through the inside of the suction pipe 29, and the suction pipe 29 sucks away the impurities on the silicone strip 3, thereby improving the cleanliness of the silicone strip 3 and thus improving the cleaning effect of the silicone strip 3 on the chip.

[0057] Furthermore, by setting anti-slip strips 33, which are inserted into the silicone strip 3, the silicone strip 3 is provided with support for contacting the chip, and the silicone strip 3 is pressed and adhered to the chip, thereby improving the cleaning effect and thus improving the cleanliness of the chip. Since the outer periphery of the rotating post 32 is stepped, the silicone strip 3 is guided by the rotating post 32 to form a stepped shape and adhere to the chip corners and other parts, further improving the cleaning effect.

[0058] Example 3:

[0059] Based on Embodiment 2, a transmission rope 34 is provided inside the silicone strip 3, and the transmission rope 34 is sleeved in the recess on the surface of the rotating column 32;

[0060] The silicone strip 3 is provided with a clip 35. One end of the clip 35 is connected to the transmission rope 34, and the other end faces the outer periphery of the silicone strip 3. The clips 35 are evenly arranged along the transmission rope 34.

[0061] The silicone strip 3 is provided with a cleaning strip 36 on the inner surface of the clip 35;

[0062] Specific workflow: By setting up a transmission rope 34, the transmission rope 34 drives the inner side of the silicone strip 3 to adhere to the stepped surface of the rotating post 32. When the silicone strip 3 contacts the rotating post 32, it is guided by the transmission rope 34 to undergo elastic deformation, so that the silicone strip 3 can adhere to the gap between the chip and the pin. When the silicone strip 3 rotates between adjacent rotating posts 32, it elastically recovers and ejects the dust and impurities that are trapped inside, which are then sucked away by the suction pipe 29. This improves the cleanliness of the chip and prevents dust from being transferred to other parts of the new product due to the rotation of the silicone strip 3.

[0063] By setting a clip 35, which is made of elastic material, when the clip 35 moves between the rotating post 32 and the chip, the rotating post 32 squeezes the clip 35 through the anti-slip strip 33, so that the clip 35 is squeezed in the middle while the upper and lower ends are fixed. This causes the clip 35 to drive the silicone strip 3 to open. When the clip 35 moves away from the chip and sticks to it, and when the clip 35 moves away from the rotating post 32, the clip 35 is no longer squeezed and gradually tightens. During the process of pinching dust with your fingers, the clip 35 pinches up the dust on the chip and collects it through the silicone strip 3. When the clip 35 contacts the side of the rotating post 32 away from the chip, it is opened again. The suction tube 29 sucks away the collected impurities and cleans the part of the silicone strip 3 near the clip 35, thereby improving the cleanliness of the chip and thus improving the chip testing and packaging quality.

[0064] By setting the cleaning strip 36, when the clamp 35 is opened, the cleaning strip 36 is exposed and extends into the pin gap to clean the impurities in the pin gap, improve the cleanliness of the cleaning dead corner, and thus improve the cleanliness of the chip; after the cleaning strip 36 is cleaned, the clamp 35 wraps the cleaning strip 36 inside to avoid excessive exposure of impurities and reduce the spread of contamination.

[0065] Example 4:

[0066] Based on Embodiment 3, the silicone strip 3 is provided with a compression airbag 37 inside, and the air extraction end of the compression airbag 37 is located on the outer periphery of the silicone strip 3, and the air outlet end is located on the inner side of the silicone strip 3.

[0067] The suction pipe 29 is provided with a cleaning motor 38 on its side wall, and a cleaning wheel 39 is provided at the end of the cleaning motor 38. The cleaning wheel 39 contacts the silicone strip 3.

[0068] Specific workflow: By setting up the squeeze airbag 37, when the clamping piece 35 is opened and the silicone strip 3 moves to the contact rotating column 32, the squeeze airbag 37 is compressed and vents. When the squeeze airbag 37 passes by, the squeeze airbag 37 draws air close to the chip part cleaned by the silicone strip 3 to remove residual dust and avoid dust residue, which may lead to false detection.

[0069] Furthermore, when the chip rotates, the cleaning motor 38 drives the cleaning wheel 39 to rotate, and the cleaning wheel 39 drives the silicone strip 3 to rotate. The cleaning motor 38 provides rotational power to the silicone strip 3, avoiding excessive frictional resistance between the chip and the silicone strip 3, which could lead to damage to the silicone strip 3 or bending of the pins, thereby improving the cleaning effect of the chip and thus improving the chip detection accuracy. Moreover, when the cleaning wheel 39 drives the silicone strip 3 to rotate, the cleaning wheel 39 can also rub the surface of the silicone strip 3 and the clamping plate 35, cleaning and sucking away the attached and collected impurities, improving the cleanliness of the silicone strip 3, and thus improving the cleanliness of the chip.

[0070] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit block lead packaging device, comprising a loading and unloading module, a conveyor belt (1), a bonding module, a molding module, a curing module, a lead cutting and forming module, a detection module, and a control system; the detection module includes a vision inspection unit, an electrical inspection unit, and a tensile force inspection unit; characterized in that, Also includes: A chip holder (11) is mounted on a conveyor belt (1). A suction cup (12) is provided in the center of the chip holder (11). A pad (13) is evenly provided at the bottom edge of the chip holder (11), and the pad (13) is in contact with the pin. A rotating frame (14) is provided on the outer periphery of the chip holder (11). A drive block (15) is slidably connected on the outer periphery of the rotating frame (14). A drive rod (16) is rotatably connected to the center of the drive block (15). A drive gear (17) is provided on the drive rod (16) and connected to one side surface of the rotating frame (14). A rotary motor (18) installed on the drive rod (16) is connected to the drive gear (17). A flip motor (19) installed on the side wall of the conveyor belt (1) is connected to the drive rod (16). The detection arm (2) is installed on the side wall of the conveyor belt (1). The probes (21) of the visual detection unit and the electrical detection unit are installed at the end of the detection arm (2). The end of the detection arm (2) is provided with a measuring rod (22). A sliding rod (23) is slidably connected inside the measuring rod (22). Both ends of the sliding rod (23) pass through the measuring rod (22). One end of the sliding rod (23) is arc-shaped and slides on the chip holder (11). The other end is connected to the electric push rod (24) installed on the detection arm (2).

2. The integrated circuit block pin packaging device according to claim 1, characterized in that: The pad (13) is slidably connected to a polishing block (25) by a spring on one side, and the inner side of the polishing block (25) contacts the pin surface. A guide groove (26) is provided on the side of one end of the polishing block (25), and the guide groove (26) is close to the pad (13). A guide block (27) is slidably connected to one side of the pad (13) by a spring. One end of the guide block (27) is away from the pin and contacts the inner wall of the guide groove (26), and the other end is located at the end of the pad (13) away from the guide groove (26) and contacts the pin surface. The pin is located between the polishing block (25) and the guide block (27). The area of ​​the polishing block (25) contacting the pin is smaller than the area of ​​the guide block (27) contacting the pin, and the polishing block (25) is close to the top of the guide block (27) when it is stationary. A dust cleaning airbag (28) is provided between the guide block (27) and the pad (13). The air outlet of the dust cleaning airbag (28) is from top to bottom and towards the pin.

3. The integrated circuit block pin packaging device according to claim 2, characterized in that: A suction pipe (29) is slidably connected to the side wall of the conveyor belt (1) by a spring. The top of the suction pipe (29) is covered by a pad (13) and a grinding block (25). A silicone strip (3) is provided on one side of the suction pipe (29).

4. The integrated circuit block pin packaging device according to claim 3, characterized in that: The vacuum tube (29) has a sliding post (31) connected to one side by a spring. The sliding posts (31) are evenly arranged and the silicone strip (3) is wrapped around both ends of the sliding posts (31). One end of the sliding post (31) contacts the silicone strip (3) through a rotating post (32) connected by rotation.

5. An integrated circuit block pin packaging device according to claim 4, characterized in that: The outer circumferential surface of the rotating column (32) is stepped, and anti-slip strips (33) are uniformly provided on the rotating column (32) and inserted into the silicone strip (3).

6. The integrated circuit block pin packaging device according to claim 5, characterized in that: A transmission rope (34) is provided inside the silicone strip (3), and the transmission rope (34) is sleeved in the recess on the surface of the rotating column (32).

7. An integrated circuit block pin packaging device according to claim 6, characterized in that: The silicone strip (3) is provided with clips (35), one end of which is connected to the transmission rope (34), and the other end faces the outer periphery of the silicone strip (3). The clips (35) are evenly arranged along the transmission rope (34).

8. An integrated circuit block pin packaging device according to claim 7, characterized in that: The silicone strip (3) has a cleaning strip (36) on the inner surface of the clip (35).

9. An integrated circuit block pin packaging device according to claim 8, characterized in that: The silicone strip (3) has a compression airbag (37) inside, and the air extraction end of the compression airbag (37) is located on the outer periphery of the silicone strip (3), and the air outlet end is located on the inner side of the silicone strip (3).

10. An integrated circuit block pin packaging device according to claim 9, characterized in that: The suction pipe (29) has a cleaning motor (38) on its side wall, and a cleaning wheel (39) is provided at the end of the cleaning motor (38). The cleaning wheel (39) contacts the silicone strip (3).

Images