The connecting piece connecting the probe head and the PCB board and the probe card

Abstract

This application discloses a connector and a probe card for connecting a probe tip to a PCB board. The connector includes a connector body and a dielectric receiving tube disposed on the connector body. The dielectric receiving tube contains a dielectric medium with a specific heat capacity of not less than 1 KJ / (Kg·℃). This increased specific heat capacity of the connector improves thermal stability and reduces the impact of thermal disturbances on the PCB board from the probe tip side. On the one hand, when the system comes into contact with a heat source (or cold source), the temperature of the connector changes slowly, resulting in a relatively mild impact on the structure. On the other hand, when the system temperature reaches a steady state, it can smooth out disturbances caused by repeated contact and separation between the probe card and the wafer under test during the testing process. Ultimately, this helps to reduce or avoid thermal displacement and thermal deformation between components (such as between the connector and the probe tip), ensuring that the probe and chip pins correspond one-to-one under extreme temperature conditions (high and low temperatures) without misalignment.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, and specifically relates to a connector and probe card for connecting a probe tip to a PCB board. Background Technology

[0002] A probe card is a specialized device used for wafer testing (before chip packaging). It includes a PCB board, probe tips (PH), and other components. During wafer testing, one end of the probe card connects to the testing machine, and the other end connects to the wafer under test, serving as the medium for signal transmission between the testing machine and the wafer. Before testing, the probe card is connected to the testing machine but not to the wafer under test. During testing, the probe station lifts the wafer under test until it makes full contact with the probe card to establish electrical continuity.

[0003] Generally, it is required that the probes correspond one-to-one with the chip pins; any misalignment will affect the test results. Typically, the probe head consists of probes, which are not directly mounted on the PCB board but are assembled via connectors.

[0004] However, technicians have discovered that existing probe cards can cause misalignment between probes and chip pins, resulting in poor testing accuracy, especially under extreme temperature testing conditions. Summary of the Invention

[0005] The purpose of this application is to overcome the shortcomings of the prior art and provide a connector and probe card for connecting the probe head to the PCB board. The connector helps to avoid or reduce thermal displacement or thermal deformation between the components, ensures that the probe and the chip pins correspond one-to-one, and ensures high test accuracy.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0007] A connector for connecting a probe head to a PCB board includes a connector body and a medium receiving tube disposed on the connector body. The medium receiving tube contains a medium, and the specific heat capacity of the medium is not less than 1 KJ / (Kg·℃).

[0008] In some embodiments, the connector body is provided with a groove extending circumferentially along the connector body, and the medium receiving tube is embedded in the groove.

[0009] In some embodiments, the medium receiving tube is arranged around the entire circumference of the connector body.

[0010] In some embodiments, the thermal expansion coefficient of the probe tip is b, the thermal expansion coefficient of the wafer under test is c, and the thermal expansion coefficient of the connector body is a, satisfying at least one of the following conditions: a) 1 ≤ a / b ≤ 1.2; b) 1 ≤ a / c ≤ 1.2; c) 1 ≤ b / c ≤ 1.1.

[0011] In some embodiments, the main body of the connector is made of metal.

[0012] In some embodiments, the connector connecting the probe head and the PCB board further includes a temperature sensor, a heating element, and a processor. The heating element is integrally constructed with the medium receiving tube or connected to it as a separate component; the temperature sensor is disposed on the main body of the connector, and both the temperature sensor and the heating element are connected to the processor; the processor controls the heating element to heat or stop heating the medium based on the detection value of the temperature sensor.

[0013] In some embodiments, the temperature sensors are evenly distributed along the circumference of the connector body.

[0014] In some embodiments, there is one heating element that surrounds the main body of the connector, or there are multiple heating elements that are evenly distributed around the circumference of the main body of the connector.

[0015] A probe card includes any of the aforementioned connectors for connecting a probe head to a PCB board, a probe head, and a PCB board, wherein the main body of the connector is connected to the PCB board and the probe head.

[0016] In some embodiments, the probe head includes a support member, and the edge of the connector body overlaps with the edge of the support member to form a plurality of overlapping portions, the plurality of overlapping portions being distributed at intervals around the connector body, and at least some of the overlapping portions being dot-shaped or line-shaped.

[0017] This application has the following advantages compared with the prior art:

[0018] The medium is contained in a dielectric container tube, and the specific heat capacity of the medium is not less than 1 KJ / (Kg·℃). This increases the specific heat capacity of the connector (for example, compared to the case without a dielectric container tube or without added medium), requiring more heat to raise the connector's temperature. Therefore, the connector has better thermal stability and can reduce the impact of thermal disturbances on the PCB board (e.g., buffering). Thus, on the one hand, when the system comes into contact with a heat source (or cold source), the connector's temperature changes slowly, with a relatively mild impact on the structure; on the other hand, when the system temperature reaches a steady state, it can smooth out disturbances caused by repeated contact and separation between the probe card and the wafer under test during the testing process. Ultimately, at least the aforementioned "smoothing out disturbances" and "relatively mild impact on the structure" will help reduce or avoid thermal displacement and thermal deformation, ensuring that the probe and chip pins correspond one-to-one under extreme temperature conditions (high and low temperatures), without misalignment. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a probe card according to one embodiment of related technologies;

[0020] Figure 2 This is a schematic diagram of a probe card testing a wafer in related technologies;

[0021] Figure 3 This is a schematic diagram showing the connection between the probe head and the PCB board, the PCB board and the probe card as a whole in this application;

[0022] Figure 4 This is a schematic diagram of the connection between the connection probe head and the PCB board in this application;

[0023] Figure 5 yes Figure 4 Top view;

[0024] Figure 6 yes Figure 4 Rear view;

[0025] Figure 7 This is a schematic diagram illustrating temperature control of the connector between the probe head and the PCB board;

[0026] Figure 8a This is a schematic diagram illustrating the ideal positional relationship between the connector and the probe head.

[0027] Figure 8b This is a schematic diagram showing the relative rotation of the connector and the probe head;

[0028] Figure 8c This is a schematic diagram showing the relative offset between the connector and the probe head;

[0029] Figure 9a This is a side view of the first embodiment of the connection between the connector and the probe head and the PCB board;

[0030] Figure 9b yes Figure 9a A schematic diagram showing that the overlapping parts are distributed in a dotted pattern on the support in the first embodiment;

[0031] Figure 10a This is a side view of a second embodiment of the connection between the connector and the probe head and the PCB board;

[0032] Figure 10b Figure 10a A schematic diagram showing that the overlapping parts are distributed linearly on the support in the second embodiment;

[0033] Figure 11a This is a schematic diagram of the probe card in contact with the heat source;

[0034] Figure 11b This is a schematic diagram showing the separation of the probe card from the heat source. Detailed Implementation

[0035] To illustrate the technical content, structural features, achieved objectives, and effects of the invention in detail, the technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. In the following description, for illustrative purposes, numerous specific details are set forth to provide a detailed description of various exemplary embodiments or implementations of the invention. However, various exemplary embodiments can also be implemented independently without these specific details or in one or more equivalent arrangements. Furthermore, the various exemplary embodiments may differ, but are not necessarily exclusive. For example, without departing from the inventive concept, the specific shape, structure, and characteristics of the exemplary embodiments may be used or implemented in another exemplary embodiment.

[0036] See Figure 1 , Figure 2 and Figure 3 , Figure 1 A probe card 100 is illustrated. This probe card 100 is a vertical probe card, including a probe head 10, a PCB board 20, and a conversion base 30. The probe head 10 includes a probe 1, a probe guide plate 2, and a support member 3. The support member 3 is located between two probe guide plates 2. During testing, one end of the probe card 100 is connected to a testing machine 200, and the other end is connected to the wafer under test 300, serving as the medium for signal transmission between the testing machine 200 and the wafer under test 300. Before testing, the probe card 100 is connected to the testing machine 200 but not to the wafer under test 300. During testing, the probe stage 400 lifts the wafer under test 300 until it makes full contact with the probe card 100 to establish conductivity.

[0037] See Figure 3 The connector (hereinafter referred to as connector 40) connecting the probe head 10 and the PCB board 20 is used to connect the PCB board 20 and the probe head 10. It should be noted that, although... Figure 3 The probe card shown is a vertical probe card; however, the probe card described in this application is not limited to vertical probe cards. Figures 8a to 8c In analyzing why the probe 1 and the chip pins cannot correspond one-to-one, resulting in misalignment and poor testing accuracy, the inventors of this application discovered that the connector 40 is more sensitive to temperature than the probe head 10 and the wafer under test 300. This difference causes varying degrees of thermal displacement and thermal deformation between the components when the system temperature changes.

[0038] For example, taking thermal expansion as an example, on the one hand, the expansion degree of connector 40 exceeds that of probe head 10, adding tensile force to probe head 10, causing probe head 10 to expand further; on the other hand, due to systemic differences, under the combined action of probe head 10, PCB board 20, and other structural components, connector 40 may shift, even rotate or warp. Figure 8a illustrates the positional relationship between probe head 10 and connector 40 under ideal conditions. Figure 8b The diagram illustrates the relative rotation of the connector 40 and the probe head 10. Figure 8c This illustrates the relative offset between the connector 40 and the probe head 10 (i.e., the connector 40 undergoes displacement; in some cases, rotation and displacement may coexist). Comparison Figure 8a , Figure 8b and Figure 8c It is known that due to the differences in thermal expansion characteristics between materials, even a micrometer-level offset can have a significant impact on the contact between the probe and the chip pin under extremely high temperature conditions (high and low temperatures).

[0039] Based on the above analysis, this application provides a connector 40. See also... Figures 4 to 6 The connector 40 includes a connector body 401 and a medium receiving tube 402. The medium receiving tube 402 is disposed on the connector body 401. The medium receiving tube 402 contains a medium with a specific heat capacity of not less than 1 KJ / (Kg·℃).

[0040] As described above, the medium is contained in the medium receiving tube 402, and the specific heat capacity of the medium is not less than 1 KJ / (Kg·℃). Therefore, the overall specific heat capacity of the connector 40 increases (for example, compared to the case without the medium receiving tube or without the medium), requiring more heat to raise the connector's temperature. Thus, the connector has better thermal stability and can reduce the impact of thermal disturbances on the PCB board from the probe head 10 side (e.g., buffering). Therefore, on the one hand, when the system comes into contact with a heat source (or cold source), the temperature of the connector 40 changes slowly, with a relatively mild impact on the structure; on the other hand, when the system temperature reaches a steady state, it can smooth out the disturbances caused by repeated contact and separation between the probe card 100 and the wafer 300 under test during the testing process. Ultimately, at least the aforementioned "smoothing out disturbances" and "relatively mild impact on the structure" will help reduce or avoid thermal displacement and thermal deformation, ensuring that under extreme temperature conditions (high and low temperatures), the probe and chip pins correspond one-to-one and no misalignment occurs. Furthermore, by containing the medium in the medium receiving tube 402, although the coefficient of thermal expansion of the connector body 401 is not directly changed, it indirectly affects the consequences of the coefficient of thermal expansion by changing the way the temperature changes.

[0041] Based on the function of the medium receiving tube 402 in containing the medium, the connection method between the medium receiving tube 402 and the connector body 401 is not limited, as long as the stability of the connector 40 is good. The following describes one method of connecting the connector body 401 and the medium receiving tube 402.

[0042] See Figure 4 and Figure 5 In some embodiments, the connector body 401 is provided with a groove 4011. The groove 4011 extends circumferentially along the connector body. The medium receiving tube 402 is embedded in the groove 4011.

[0043] As described above, the medium receiving tube 402 is embedded in the groove 4011. As a result, the contact area between the medium receiving tube 402 and the connector body 401 is larger. If the connector body 401 is heated, more heat can be absorbed by the medium. The temperature change amplitude and the rate of change of the connector body 401 are reduced. This ensures better thermal stability of the connector 40. Ultimately, it is more conducive to ensuring that the probe and the chip pin correspond one-to-one and are not misaligned.

[0044] In some embodiments, the medium receiving tube 402 wraps around the entire circumference of the connector body 401. Of course, this "entire circumference" is not limited to a square shape as shown in the figure; it can also be other types of ring shapes. For example, if the medium receiving tube 402 needs to avoid one or more components, the shape formed by the medium receiving tube 402 will not be square. Of course, in some embodiments, the medium receiving tube 402 may not wrap around the entire circumference of the connector body 401.

[0045] As described above, with the medium receiving tube 402 circumferentially surrounding the connector body 401, it has at least the following advantages:

[0046] Firstly, the medium receiving tube 402 surrounds the connector body 401, enabling the medium to exchange heat with the connector body 401 in all directions. Regardless of the source of the heat (such as a local heat source on the probe head 10 side, heat conduction on the PCB board 20 side, uneven ambient temperature distribution, etc.), the surrounding structure ensures that the medium absorbs or releases heat along the shortest path, avoiding an uneven state where "the temperature of some parts has been adjusted while the temperature of other parts remains at the original temperature".

[0047] Secondly, when there is a circumferential temperature difference in the main body 401 of the connector (for example, the temperature is high at one location and low at another location), the surrounding medium receiving pipe 402 can continuously carry heat away from the high-temperature area and replenish heat to the low-temperature area through the flow of the medium or heat conduction, dynamically maintaining temperature uniformity and acting as a temperature equalization ring, reducing or eliminating the circumferential temperature gradient, thereby suppressing warping deformation caused by uneven temperature distribution.

[0048] Thirdly, compared to partial arrangements (such as only on one side or in a U-shape), the surrounding medium receiving pipe 402 makes full use of the circumferential space of the connector body 401, maximizes the heat exchange area, and makes the heat conduction between the medium and the connector body 401 more efficient, thereby improving the heat buffering efficiency.

[0049] Fourthly, thermal deformation originates not only from overall temperature changes but also from uneven temperature distribution. The arrangement of the medium-containing pipe 402 around the entire circumference of the connector body 401 ensures that the connector body 401 is subjected to uniform thermal influence in the circumferential direction, avoiding uneven expansion / contraction caused by local overheating or undercooling, thereby effectively suppressing deformations such as warping and bending.

[0050] Fifthly, after the medium receiving tube 402 (especially the medium receiving tube 402 made of metal) surrounds the connector body 401, it is equivalent to forming a ring-shaped reinforcing structure inside the connector body 402 (for example, the medium receiving tube 402 is embedded in the connector body 401) or on its surface, which increases the overall rigidity and torsional strength of the connector body 401, making it less prone to deformation when subjected to external forces or thermal stress.

[0051] Sixthly, the medium receiving tube 402 surrounds the main body 401 of the connector, allowing the medium inlet 4021 and the medium outlet 4022 to be set in a suitable position (such as the medium inlet 4021 and the medium outlet 4022 being separated by a certain angle, or located on the same side but circulating through an internal flow channel), which facilitates connection with an external circulation system and enables continuous renewal or recycling of the medium.

[0052] In some embodiments, the coefficient of thermal expansion of the probe tip is b, the coefficient of thermal expansion of the wafer under test is c, and the coefficient of thermal expansion of the connector body is a, and they satisfy at least one of the following conditions: a) 1 ≤ a / b ≤ 1.2; b) 1 ≤ a / c ≤ 1.2; c) 1 ≤ b / c ≤ 1.1.

[0053] As described above, their coefficients of thermal expansion satisfy the above relationship, reducing the temperature sensitivity of the connector body 401, so that the temperature sensitivity of the connector body 401 is no higher than that of the probe head 10 and the wafer under test 300. In this way, thermal deformation and thermal displacement are suppressed from the material itself, while the dielectric receiving tube 402 contains the dielectric to suppress thermal deformation and thermal displacement from the heat input aspect. Finally, the combination of the two is more conducive to the one-to-one correspondence between the probe and the chip pin, and will not be misaligned.

[0054] In some embodiments, the connector body 401 is made of metal. The metal includes pure metals and alloys.

[0055] As described above, the connector body 401 is made of metal, which has at least the following advantages:

[0056] Firstly, the high elastic modulus of the metal material makes the connector body 401 less prone to elastic deformation when subjected to thermal stress or mechanical force. When the probe head 10 or PCB board 20 generates stress due to thermal expansion, the high-rigidity metal connector body 401 can effectively resist the bending, torsion and warping caused by these stresses, ultimately ensuring that the probe and chip pins correspond one-to-one and are not misaligned.

[0057] Secondly, when the system is locally heated, the metal connector body 401 can quickly conduct heat to the entire body, avoiding uneven expansion caused by local hot spots. Furthermore, the high thermal conductivity of metal allows heat to be quickly transferred from the connector body 401 to the medium in the medium receiving tube 402, fully utilizing the buffering effect of the medium. This, in turn, ensures better thermal stability of the connector 40, ultimately helping to ensure that the probes and pins correspond one-to-one and are not misaligned.

[0058] See Figure 7In some embodiments, the connector 40 includes a temperature sensor 403, a heating element 404, and a processor 405. The temperature sensor 403 is disposed on the connector body 401. Both the temperature sensor 403 and the heating element 404 are connected to the processor 405. The processor 405 controls the heating element 404 to heat or stop heating the medium based on the detection value of the temperature sensor 403. That is, if the detection value of the temperature sensor 403 is lower than the target temperature, the processor 405 controls the heating element 404 to heat the medium, and the temperature of the connector body 401 rises. If the detection value of the temperature sensor 403 is higher than the target temperature, the processor 405 controls the heating element 404 to stop heating the medium, and the medium can dissipate heat naturally or through other means. Thus, this control allows the temperature of the connector 40 to be stabilized at or near the target temperature. The heating element 404 is either integrally constructed with the medium receiving tube 402 or connected together as a separate component. The connection method is not limited, as long as the heating element 404 can heat or stop heating the medium in the medium receiving tube 402. The heating element 404 is not limited, as long as it can achieve the function of heating or stopping heating the medium; for example, the heating element 404 is a heating resistor.

[0059] One purpose of temperature control is to reduce the impact of temperature fluctuations during testing. In actual testing, probe card 100 repeatedly switches between contact and non-contact states. When in contact, probe card 100 is directly connected to the heat source 500 (such as the wafer and wafer stage). See [link to relevant documentation]. Figure 11a When not in contact, probe card 100 is separated from heat source 500, see [link / reference]. Figure 11b (The bottom consists of a wafer and a wafer stage 500, also known as a Chuck). As described above, the processor 405 heats the medium via the heating element 404 based on the temperature detected by the temperature sensor 403, thereby adjusting the overall temperature of the connector 40. This has the following advantages:

[0060] Firstly, the above-mentioned settings enable the temperature of the connector body 401 to be maintained at the set target temperature. As a result, the temperature difference between the connector body 401, the probe head 10 and the PCB board 20 is small, and the thermal displacement and thermal deformation between the connector body 401, the probe head 10 and the PCB board 20 can be better eliminated. The relative position between the probe tip and the chip pin no longer changes with the ambient temperature or thermal disturbance during the test process, which can better ensure that the probe and the chip pin correspond one-to-one and is less prone to misalignment.

[0061] Secondly, during testing, the probe card is subject to various external thermal disturbances, such as periodic thermal shocks from wafer contact / separation, ambient temperature fluctuations, or self-heating of the device during testing. The processor 405 controls the heating element 404 to heat or stop heating based on the detection value of the temperature sensor 403, providing real-time feedback and heating compensation to actively counteract these disturbances. This ensures stable probe positioning, a one-to-one correspondence between the probe and chip pins, and reduces the likelihood of misalignment.

[0062] Thirdly, the specific heat capacity of the medium at the aforementioned value can store a large amount of heat, resulting in slow temperature changes, reducing the start-stop frequency of the heating element 404, and lowering power consumption. Furthermore, by controlling the heating element 404 to heat or not heat the medium to maintain the target temperature through the processor 405, external disturbances can be compensated. In this way, using the medium as an energy storage pool enables stable control and is more conducive to achieving a one-to-one correspondence between the probe and the chip pin, preventing misalignment.

[0063] In some embodiments, the temperature sensors 403 are uniformly distributed along the circumference of the connector body 401. For example... Figure 6 As shown, there is a temperature sensor 403 on the top, bottom, left and right sides of the connector body 401. These temperature sensors 403 are arranged in a square to achieve uniform distribution. However, uniform distribution is not limited to this, and the number of temperature sensors 403 on each side is not limited to this.

[0064] As described above, the temperature sensors 403 are evenly distributed circumferentially along the main body 401 of the connector, which has at least the following advantages:

[0065] Firstly, multiple temperature sensors 403 monitor the temperature of different circumferential regions, providing comprehensive temperature field information. The processor 405 compares the detection values ​​of different temperature sensors 403 to determine whether there is a circumferential temperature gradient (i.e., one side is hot and the other side is cold). Since there are multiple heating elements 404, the processor 405 can control the corresponding heating elements 404 to stop heating in high-temperature areas and increase heating in low-temperature areas, thereby achieving precise temperature control in different zones. Ultimately, the circumferential temperature gradient is eliminated, making the temperature distribution of the entire connector body 401 uniform and the temperature stability good. This, in turn, facilitates the one-to-one correspondence between the probe and the chip pin, preventing misalignment.

[0066] Secondly, the temperature sensors 403 are uniformly distributed circumferentially, enabling the identification of the heat source direction based on the positions of multiple temperature sensors 403. Furthermore, by comparing the order and magnitude of temperature increases at each temperature sensor 403, the direction of the heat source can be determined. During testing, the heat source position may change as the probe moves or the test item changes. The uniformly distributed sensors can capture these changes in real time, and the processor 405 can control the corresponding heating element 404 to heat or stop heating based on these changes. Ultimately, this ensures that the temperature of the connector body 401 is uniform and stable under various test conditions, resulting in good temperature stability. This, in turn, facilitates the one-to-one correspondence between the probe and the chip pins, preventing misalignment.

[0067] In some embodiments, the heating element 404 is one that surrounds the connector body 401, or see [link to other embodiments]. Figure 5 The connector 40 includes a plurality of heating elements 404, which are evenly distributed around the circumference of the connector body 401.

[0068] As described above, the heating element 404 has at least the following advantages:

[0069] Firstly, there is one heating element 404, which is evenly distributed around the connector body 401 or around the connector body 401 in a circumferential interval, so that heat is evenly transferred to the connector body 401 from all directions, eliminating the circumferential temperature gradient and avoiding thermal deformation such as bending and warping caused by asymmetrical temperature distribution.

[0070] Secondly, when the heating element 404 and the temperature sensor 403 are evenly distributed along the circumference, independent temperature control of each zone can be achieved. The processor 405 controls the heating element 404 of the corresponding zone according to the detection value of the temperature sensor 403 of each zone, and actively balances the temperature field.

[0071] Thirdly, the above-mentioned configuration results in a short conduction path for the heating element 404, allowing each area to respond independently and quickly. It only compensates for areas that deviate from the target value when needed, making it energy-saving and efficient.

[0072] At least the above three aspects ultimately ensure that the probe and chip pins correspond one-to-one, preventing misalignment.

[0073] See Figure 3 This application discloses a probe card. The probe card includes any of the aforementioned connectors 40, a probe head 10, and a PCB board 20, wherein the connector body 401 is connected to the PCB board 20 and the probe head 10. Figure 3 As shown, in a further embodiment, the connector body 401 is connected to the support member 3 of the probe head 10.

[0074] See Figure 3 , Figure 9a , Figure 9b , Figure 10a and Figure 10b The probe head 10 includes a support member 3. The edge of the connector body 401 overlaps with the edge of the support member 3 to form a plurality of overlapping portions 4011. The plurality of overlapping portions 4011 are distributed at intervals around the connector body 401, and at least some of the overlapping portions are dotted (see [link to documentation]). Figure 9b ) or linear (see Figure 10b ).

[0075] As described above, by using a dotted or linear arrangement, the contact area between the probe head 10 and the connector 40 is reduced, which better ensures that the probe head 10 is not affected by the temperature of the connector 40, thereby ensuring that the probe and the chip pin correspond one-to-one and are not misaligned.

[0076] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope. The scope of protection of the present invention is defined by the appended claims, specification, and their equivalents.

Claims

1. A connector for connecting a probe tip to a PCB board, characterized in that, It includes a connector body and a medium receiving tube disposed on the connector body, the medium receiving tube containing a medium, the specific heat capacity of the medium being not less than 1 KJ / (Kg·℃).

2. The connector for connecting the probe head and the PCB board according to claim 1, characterized in that, The connector body is provided with a groove that extends circumferentially along the connector body, and the medium receiving tube is embedded in the groove.

3. The connector for connecting the probe head and the PCB board according to claim 2, characterized in that, The medium receiving tube is wrapped around the entire body of the connector.

4. The connector for connecting the probe head and the PCB board according to claim 1, characterized in that, The thermal expansion coefficient of the probe tip is b, the thermal expansion coefficient of the wafer under test is c, and the thermal expansion coefficient of the connector body is a, satisfying at least one of the following conditions: a) 1 ≤ a / b ≤ 1.2; b) 1 ≤ a / c ≤ 1.2; c) 1 ≤ b / c ≤ 1.

1.

5. The connector for connecting the probe head and the PCB board according to claim 4, characterized in that, The main body of the connector is made of metal.

6. The connector for connecting the probe head and the PCB board according to any one of claims 1 to 5, characterized in that, It also includes a temperature sensor, a heating element, and a processor, among which: The heating element is integrally constructed with the medium receiving tube or is a separate component connected together; the temperature sensor is disposed on the main body of the connector, and both the temperature sensor and the heating element are connected to the processor; the processor controls the heating element to heat or stop heating the medium based on the detection value of the temperature sensor.

7. The connector for connecting the probe head and the PCB board according to claim 6, characterized in that, The temperature sensors are evenly distributed along the circumference of the connector body.

8. The connector for connecting the probe head and the PCB board according to claim 6, characterized in that, There is one heating element, which is arranged around the main body of the connector, or there are multiple heating elements, which are evenly distributed around the circumference of the main body of the connector.

9. A probe card, characterized in that, The probe card includes a connector for connecting the probe head and the PCB board as described in any one of claims 1 to 8, the probe head and the PCB board, wherein the main body of the connector is connected to the PCB board and the probe head.

10. The probe card according to claim 9, characterized in that, The probe head includes a support member, and the edge of the connector body overlaps with the edge of the support member to form a plurality of overlapping portions. The plurality of overlapping portions are distributed at intervals around the connector body, and at least some of the overlapping portions are dot-shaped or line-shaped.

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