Probe card and method for horizontal adjustment of probes of a probe card
By adding a differential adjustment module to the probe card, the problem of inconsistent probe tip level was solved, achieving precise parallelism between the probe tip and the wafer surface, thus improving testing yield and production efficiency.
Patent Information
- Application Number
- CN202610329229.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-18
- Publication Date
- 2026-05-29
Smart Images
Figure CN122109586A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of semiconductors, and specifically relates to a probe card and a method for horizontal adjustment of the probes on the probe card. Background Technology
[0002] Probe cards are indispensable core interface components in semiconductor wafer testing, acting as a "bridge" between the test equipment and the chips on the wafer. Ideal CP testing (Chip Probing) requires all probes to contact the chip pads simultaneously with the same pressure. However, due to the generally low levelness of the space converter and the inherent error in probe length, regional inconsistencies in probe tip level can occur. This can lead to over-contact on one side and under-contact on the other, resulting in open circuits or unstable signals.
[0003] Precise leveling can prevent such situations from occurring, improving test yield and result reliability. Currently, in probe card assembly, leveling often relies on operators using tools such as dial indicators to perform multi-point measurements, and then manually adding or removing shims at different support points to achieve leveling. Since the shim thickness is an integer, typically 45-50 micrometers, it is impossible to adjust the probe tip level more precisely. Summary of the Invention
[0004] The purpose of this application is to overcome the shortcomings of the prior art and provide a probe card and a method for adjusting the level of the probes of the probe card, so that the probe tips are level and consistent, thereby ensuring that the probe tips are parallel to the surface of the wafer to be tested.
[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:
[0006] In a first aspect, a probe card includes a top block, a circuit board abutted by the top block, and a plurality of differential adjustment modules, each of the differential adjustment modules including an output component, the output component abutting the top block.
[0007] In some embodiments, the probe card includes a support base with a base through hole; the base through hole extends through the support base; the differential adjustment module passes through the base through hole, and the output component extends out of the base through hole and abuts against the top block.
[0008] In some embodiments, the differential adjustment module includes a differential member connected to the support base and movable relative to the support base to have a first displacement; the output member moves relative to the differential member to have a second displacement; and the actual displacement of the output member is the difference between the first displacement and the second displacement.
[0009] In some embodiments, the differential is threadedly connected to the wall of the through hole of the base; the output is inserted into the connecting hole of the differential and threadedly connected to the wall of the connecting hole.
[0010] In some embodiments, an anti-rotation structure is provided between the output member and the top block, or between the output member and the support base, so that the output member can move linearly.
[0011] In some embodiments, the probe card includes a locking member that is threadedly connected to the wall of the through hole of the base and abuts against the output member to keep the output member in the adjusted position.
[0012] In some embodiments, the differential adjustment module includes a differential hydraulic / cylinder, a differential inclined / wedge mechanism, a differential material telescopic mechanism, or a differential gear mechanism.
[0013] In some embodiments, the top block includes a plurality of spaced-apart support portions and abutment portions corresponding to and opposite to the support portions, with each output member abutting against the abutment portion.
[0014] In some implementations, the plurality of differential adjustment modules are evenly distributed.
[0015] Secondly, this application discloses a method for adjusting the level of a probe on a probe card. The probe card includes a top block that abuts against the circuit board. The method for adjusting the level of the probe on the probe card includes: abutting the output component of a differential adjustment module against the part to be adjusted, and adjusting the output value of the output component to achieve the level adjustment of the part to be adjusted.
[0016] This application has the following advantages compared with the prior art:
[0017] By adding a differential adjustment module to the existing probe card, the actual displacement S of the output component of the differential adjustment module is the result of the synthesis of two motions, S=AB. If A and B are very close, their difference S can be minimized. Therefore, after the output component of the differential adjustment module acts on the part to be adjusted on the top block, the force is transmitted to the circuit board through the top block, then to the space converter, and finally to the area to be adjusted on the probe card. Based on the above linkage relationship, it can be determined that the displacement of the output component directly determines the displacement of the area to be adjusted. Since the difference between A and B in the displacement of the output component can be minimized, the differential adjustment module can be used to adjust the probe tip level more precisely, ensuring that the probe tip is parallel to the surface of the wafer under test. In addition, compared with the method of adding or removing shims using tools such as dial indicators, the differential adjustment module can complete the adjustment in one go, without the need for repeated disassembly and reassembly of structural components to add or remove shims. The process is time-saving and labor-saving, and the adjustment accuracy is related to the difference between A and B, without the influence of human factors, resulting in high production efficiency. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of a probe card according to one embodiment of this application.
[0019] Figure 2 This is a top view of a probe card according to one embodiment of this application;
[0020] Figure 3 This is a schematic diagram of a probe card support base connected to a differential adjustment module and in a disassembled state with a locking component, according to one embodiment of this application.
[0021] Figure 4 This is a schematic diagram of an anti-rotation structure according to one embodiment of this application;
[0022] Figure 5 This is a schematic diagram of a probe card in related technologies. Detailed Implementation
[0023] To illustrate the technical content, structural features, achieved objectives, and effects of the invention in detail, the technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. In the following description, for illustrative purposes, numerous specific details are set forth to provide a detailed description of various exemplary embodiments or implementations of the invention. However, various exemplary embodiments can also be implemented independently without these specific details or in one or more equivalent arrangements. Furthermore, the various exemplary embodiments may differ, but are not necessarily exclusive. For example, without departing from the inventive concept, the specific shape, structure, and characteristics of the exemplary embodiments may be used or implemented in another exemplary embodiment.
[0024] See Figure 5 In related technologies, the probe card includes a circuit board (PCB) 1, a space converter (ST) 2, a probe head (PH) 3, a reinforcing plate 4, a top block 5, and a support base 6. The top block 5 and the space converter 2 are located on opposite sides of the PCB, and its protruding support portion 51 presses tightly against the back of the circuit board 1 to transmit force to the C4 Pad of the space converter 2, so that the space converter 2 and the probe tail form good contact.
[0025] right Figure 5 The probe card shown uses tools such as a dial indicator combined with shims to level the circuit board, which cannot precisely adjust the probe tip to the surface plane of the wafer under test. To solve the above problems, this application discloses another probe card. Here, it should be noted that although this application is a... Figure 5The improvement shown is an improvement to the vertical probe card; however, this improvement approach can also be applied to non-vertical probe cards. That is, the probe cards described below should not be limited to vertical probe cards.
[0026] See Figures 1 to 3 This application discloses a probe card. The probe card includes a top block 5, a circuit board 1 abutted by the top block 5, and multiple differential adjustment modules 7. The number of differential adjustment modules 7 can be determined according to the part to be adjusted, for example, Figure 2 Five differential adjustment modules 7 are shown. Each differential adjustment module 7 includes an output component 72, which abuts against the top block 5.
[0027] For the case where the differential thread module is installed on the probe card, please refer to [link / reference]. Figure 1 and Figure 2 and combined Figure 3 The differential adjustment module 7 is installed in a position corresponding to the pointer area of the probe card. When adjusting the probe tip level, the specific procedure is as follows: First, assess the current level based on the rangefinder or probe contact signal. Then, select the differential adjustment module 7 to be adjusted, causing the probe card to move up and down at the support point by a micrometer-level. After adjustment, repeat the above steps until the contact signals of all probes reach a uniform and consistent optimal state. By controlling each differential adjustment module 7 individually, the spatial attitude (pitch and tilt) of the probe card's bearing plane is essentially adjusted, thereby ensuring that the probe tip is parallel to the surface of the wafer under test.
[0028] As described above, by adding a differential adjustment module 7 to the existing probe card, the actual displacement S of the output component 72 of the differential adjustment module 7 is the result of the synthesis of two motions, S=AB. If A and B are very close, their difference S can be minimized. Therefore, the output component 72 of the differential adjustment module 7 acts on the part to be adjusted of the top block 5, and then the force is transmitted to the circuit board 1 through the top block 5, then to the space converter 2, and finally to the area to be adjusted of the probe card. Based on the above linkage relationship, it can be determined that the displacement of the output component 72 directly determines the displacement of the area to be adjusted. Since the difference between the displacement of the output component A and B can be minimized, the differential adjustment module 7 can be used to adjust the tip level more precisely (e.g., to achieve a level adjustment with an accuracy of 1 micrometer), ensuring that the probe tip is parallel to the surface of the wafer under test. Furthermore, compared to the method of adding or removing shims by using differential adjustment module 7 in conjunction with tools such as dial indicators, the adjustment can be completed in one go without the need to repeatedly disassemble and reassemble structural components to add or remove shims. The process is time-saving and labor-saving, and the adjustment accuracy is related to the difference between A and B. There are no human factors affecting it, resulting in high production efficiency.
[0029] Based on the function of the differential adjustment module 7, the structure of the differential adjustment module 7 is not limited to Figure 3The structure shown, for example, the differential adjustment module 7 includes a differential hydraulic cylinder / pneumatic cylinder, a differential inclined plane / wedge mechanism, a differential material telescopic mechanism, or a differential gear mechanism. The differential hydraulic cylinder / pneumatic cylinder achieves adjustment using a small flow / pressure difference. The differential inclined plane / wedge mechanism achieves adjustment using a difference in inclination. The differential material telescopic mechanism achieves adjustment using a combination of materials with different telescopic coefficients. The differential gear mechanism achieves adjustment using the rotational motion synthesis of different speeds and the difference in rotational speed.
[0030] See Figures 1 to 3 The probe card includes a support base 6, which includes a base through hole 61. The base through hole 61 extends through the support base 6. The differential adjustment module 7 passes through the base through hole 61; therefore, the shape of the base through hole 61 is not limited and is determined according to the structure of the differential adjustment module 7. The output component 72 extends out of the base through hole 61 and abuts against the top block 5.
[0031] As described above, the differential adjustment module 7 passes through the base through hole 61, and the output component 72 extends out of the base through hole 61. When adjusting the level of the probe tip, it is not necessary to disassemble the probe card components. The adjustment process is time-saving and labor-saving, resulting in high production efficiency.
[0032] See Figure 3 The differential adjustment module 7 includes a differential member 71 connected to the support base 6 and movable relative to the support base 6 to have a first displacement, such as A mentioned above. The mechanism by which the differential member 71 moves relative to the support base 6 is not limited. The output member 72 moves relative to the differential member 71 to have a second displacement, such as B mentioned above. The actual displacement of the output member 72 is the difference between the first displacement and the second displacement.
[0033] As described above, the differential adjustment module 7 includes a differential component 71 and an output component 72. Through the aforementioned connection relationship, the differential adjustment module 7 has a simple structure and is easy to assemble with the support base 6 (or the original probe card).
[0034] See Figure 3In some embodiments, the differential member 71 is threadedly connected to the through-hole wall 611 of the base through-hole 61; the output member 72 is inserted into the connecting hole 711 of the differential member 71 and threadedly connected to the connecting hole wall 7111 of the connecting hole 711. One embodiment of this differential adjustment module 7 is as follows: by rotating the differential member 71, the internal and external threads of the differential thread generate relative displacement, thereby converting a large angular displacement into a very small axial displacement, which directly acts on the top block 5, ultimately adjusting the level of the space converter 2. Assuming the external thread pitch P1 of the differential member 71 is 0.5mm and the internal thread pitch P2 is 0.45mm, then the differential pitch ΔP is 0.05mm. When the differential member 71 rotates one revolution, theoretically it should move axially by the pitch of its external thread. Due to the smaller internal thread pitch and the restricted rotation of the output member 72, the output member 72 ultimately moves axially by 0.05mm, which is the difference between A and B mentioned above. Combined with angle subdivision, an adjustment accuracy of 1 micrometer can be easily achieved.
[0035] As described above, the differential component 71 and the output component 72 constitute a differential thread mechanism. The differential adjustment module 7 has a simple structure and is easy to assemble with the support base 6. In addition, the threaded pair itself has good mechanical strength and self-locking characteristics, and with the locking structure, it has excellent vibration resistance.
[0036] See Figure 4 An anti-rotation structure is provided between the output component 72 and the top block 5 to ensure linear movement of the output component 72. Figure 4 In this design, the output component 72 includes a recess 720. The top block 5 includes a socket 50. A limiting portion 500 is provided within the socket 50, and the protrusion 500 is located within the recess 720, thus preventing the output component 72 from rotating. One function of the anti-rotation structure is to prevent the output component 72 from rotating; therefore, in some embodiments, the anti-rotation structure may also be provided between the output component 72 and the support base 6. For example, the output component 72 includes a recess 720, and the support base 6 includes a limiting portion 500. In still other embodiments, the positions of the limiting portion 500 and the recess 720 may be interchanged.
[0037] As described above, an anti-rotation structure is provided between the output component 72 and the top block 5, or between the output component 72 and the support base 6, to facilitate anti-rotation of the output component 72 and make it easier to implement.
[0038] See Figure 3 The probe card includes a locking member 73. The locking member 73 is threadedly connected to the through-hole wall 611 of the base through-hole 61 and abuts against the output member 72, so that the output member 72 is held in the adjusted position.
[0039] As described above, since the locking member 73 is threadedly connected to the through hole wall 611 and abuts against the output member 72, it can prevent the output member 72 and the differential member 71 from becoming loose. Furthermore, the output member 72 is kept in the adjusted position to ensure long-term position stability. Ultimately, it ensures that the probe tip and the surface of the wafer under test can remain parallel for a long time.
[0040] See Figure 1 The top block 5 includes a plurality of spaced-apart support portions 51 and opposing abutment portions 52 corresponding to each support portion 51. Each output member 72 abuts against the abutment portion 52. It should be noted that, typically, one output member 72 abuts against one abutment portion 52; that is, not all abutment portions 52 are abutted. Figure 2 As shown, the five abutment portions 52, namely the abutment portions 52 at the four corners and the abutment portion 52 at the intersection of the diagonals, are abutted together. In some other embodiments, the output member 72 may also abut against other parts of the top block 5 opposite to the surface of the circuit board 1, as long as the force can ultimately be transmitted through the circuit board 1 to the intermediate converter 2, ultimately ensuring that the probe tip is parallel to the surface of the wafer under test.
[0041] As described above, the output component 72 abuts against the abutment portion 52 opposite to the support portion 51, which makes it easier to adjust the level of the probe tip compared to abutting against other parts.
[0042] Combination Figure 2 The plurality of differential adjustment modules 7 are evenly distributed, for example, Figure 2 Differential adjustment modules 7 are distributed at five locations: the four corners of the top block 5 and the intersection of the diagonals of the corners. Of course, uniform distribution is not limited to this method; for example, it can be evenly distributed along the circumference of the top block 5.
[0043] As described above, by evenly distributing the differential adjustment modules 7, not only can the probe be leveled using fewer differential adjustment modules 7, but the top block 5 is also more likely to be subjected to uniform force, making it easier to level the probe.
[0044] Secondly, this application also discloses a method for horizontally adjusting the probes of a probe card. The probe card includes a top block that abuts against the circuit board. The method for horizontally adjusting the probes of the probe card includes: abutting the output component of a differential adjustment module against the part to be adjusted, and adjusting the output value of the output component to achieve horizontal adjustment of the part to be adjusted. In this case, the differential adjustment module used in the horizontal adjustment method is not limited to the differential adjustment module 7 disclosed in this application.
[0045] As described above, the probe is leveled via the differential adjustment module 7. Since the actual displacement of the differential adjustment module 7 is the difference between two displacements, as long as the difference is small enough, the probe tip level can be adjusted more precisely (e.g., achieving a level adjustment accuracy of 1 micrometer), ensuring that the probe tip is parallel to the surface of the wafer under test. Furthermore, compared to using tools such as dial indicators combined with adding or removing shims, the differential adjustment module 7 allows for a one-time adjustment, eliminating the need for repeated disassembly and reassembly of structural components to add or remove shims. This process is time-saving and labor-saving, and the adjustment accuracy is related to the difference between A and B, unaffected by human factors, resulting in high production efficiency.
[0046] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope. The scope of protection of the present invention is defined by the appended claims, specification, and their equivalents.
Claims
1. A probe card, characterized in that, The probe card includes a top block (5), a circuit board (1) abutted by the top block (5), and a plurality of differential adjustment modules (7), each of the differential adjustment modules (7) including an output element (72) abutting the top block (5).
2. The probe card according to claim 1, characterized in that, The probe card includes a support base (6), and the support base (6) includes a base through hole (61); the base through hole (61) penetrates the support base (6). The differential adjustment module (7) passes through the base through hole (61), and the output component (72) extends out of the base through hole (61) and abuts against the top block (5).
3. The probe card according to claim 2, characterized in that, The differential adjustment module (7) includes a differential element (71), which is connected to the support base (6) and moves relative to the support base (6) to have a first displacement; The output element (72) moves relative to the differential element (71) to have a second displacement; the actual displacement of the output element (72) is the difference between the first displacement and the second displacement.
4. The probe card according to claim 3, characterized in that, The differential (71) is threadedly connected to the through hole wall (611) of the base through hole (61); the output (72) is inserted into the connecting hole (711) of the differential (71) and threadedly connected to the connecting hole wall (7111) of the connecting hole (711).
5. The probe card according to claim 4, characterized in that, An anti-rotation structure is provided between the output component (72) and the top block (5), or between the output component (72) and the support base (6), so that the output component (72) can move linearly.
6. The probe card according to claim 2, characterized in that, The probe card includes a locking member (73), which is threadedly connected to the through hole wall (611) of the base through hole (61) and abuts against the output member (72) so that the output member (72) is held in the adjusted position.
7. The probe card according to claim 1, characterized in that, The differential adjustment module (7) includes a differential hydraulic / cylinder, a differential inclined / wedge mechanism, a differential material telescopic mechanism, or a differential gear mechanism.
8. The probe card according to claim 1, characterized in that, The top block (5) includes a plurality of spaced support portions (51) and abutment portions (52) that correspond one-to-one with and are opposite to the support portions (51), and each output member (72) abuts against the abutment portion (52).
9. The probe card according to claim 1, characterized in that, The multiple differential adjustment modules (7) are evenly distributed.
10. A method for adjusting the horizontal position of a probe on a probe card, characterized in that, The probe card includes a top block (5) that abuts against the circuit board (1). The method for adjusting the level of the probe of the probe card includes: abutting the output component (72) of the differential adjustment module (7) against the part to be adjusted, and adjusting the output value of the output component (72) to achieve the level adjustment of the part to be adjusted.