A cleaning agent for precision electronics with precisely controlled evaporation rate and a method for its preparation

Abstract

The present application relates to the field of electronic equipment maintenance, in particular to a cleaning agent for precise electronic equipment with precise control of evaporation rate and a preparation method thereof, which is a high adaptability cleaning agent with controllable evaporation rate for cleaning precise electronic equipment. The cleaning agent is prepared by mixing two components in a certain proportion, which can accurately adjust the proportion of the two components according to the temperature of the construction environment and the pollution situation of the equipment on site. It can not only effectively remove various polar and non-polar pollutants on the surface of the circuit board, but also realize precise control of the evaporation rate, so as to complete the effective removal of all pollutants in the optimal "contact-dissolution-peeling-evaporation" kinetic window, thereby ensuring the safe and stable operation of the electronic equipment.

Description

Technical Field

[0001] This invention relates to the field of maintenance and repair of precision electronic equipment, and specifically to a highly adaptable cleaning agent for precision electronics with precise control of evaporation rate and its preparation method. Background Technology

[0002] Existing cleaning agents for cleaning precision electronic equipment typically use low-boiling-point hydrocarbons, dichlorofluoroethane (HCFC-141b), n-propane bromide, etc., either alone or in mixtures. They are generally single-function and cannot meet the cleaning requirements under complex operating conditions, mainly exhibiting the following problems:

[0003] 1. Poor cleaning effect: Common non-polar contaminants in existing electronic devices include grease, rosin, silicone-based mold release agents, and packaging residues. Common polar contaminants include small molecule organic acids and salts (such as Na+ and NH4). + Currently mainstream cleaning agents, such as those containing Cl-, metal ions, etc., suffer from a single-function problem. Their cleaning characteristics targeting single-contaminant structures contradict the complex compound pollution conditions in reality, making it impossible to remove contaminants of different polarities in a single process.

[0004] 2. Uncontrollable Evaporation Rate: The cleaning environment is complex. A cleaning agent with a fixed evaporation rate may only be suitable for a specific temperature, workpiece material, or production rhythm. Once conditions change (such as changing product lines, adjusting production rhythm, or fluctuations in ambient temperature and humidity), its performance may become incompatible. Users are forced to stock multiple cleaning agents for different applications, resulting in high inventory costs and complex management. For example, a cleaning agent may evaporate quickly at high temperatures, resulting in a short residence time on the equipment surface and difficulty in penetrating the tiny pores and gaps in the circuit board, leading to insufficient penetration and incomplete cleaning. In high humidity or low temperature environments, the evaporation rate of the cleaning agent will decrease, resulting in more cleaning agent residue on the cleaned equipment surface, which in turn requires a longer waiting time, affecting the subsequent process rhythm and reducing production efficiency.

[0005] 3. Existing cleaning agents rarely contain antistatic components. Even if they do, they are mostly ionic quaternary ammonium salt antistatic agents. These antistatic agents have poor thermal stability, and some components are corrosive to equipment, producing odors, thereby reducing insulation performance and easily causing surface discharge on the circuit board.

[0006] 4. Poor environmental friendliness: Some cleaning agents contain volatile organic compounds (VOCs), which are harmful to the environment and human health, or have the potential to damage the ozone layer. Summary of the Invention

[0007] In view of this, the present invention discloses a precision electronic cleaning agent with precisely controlled evaporation rate and its preparation method. This is a highly adaptable cleaning agent with a controllable evaporation rate for cleaning precision electronic equipment. The cleaning agent is composed of two components mixed in a specific ratio. The ratio of components A and B can be precisely adjusted according to the ambient temperature and contaminant levels at the site of equipment operation. This not only effectively removes various polar and non-polar contaminants from the surface of circuit boards but also achieves precise control of the evaporation rate. Thus, it effectively removes all contaminants within the optimal "contact-dissolve-peel-evaporation" kinetic window, thereby ensuring the safe and stable operation of electronic equipment.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: The first technical objective of this invention is to provide a precision electronic cleaning agent with accurately controlled evaporation rate, wherein the cleaning agent mainly consists of two components, A and B, in weight percentage (w / w): Component A: Hexafluoroisopropyl methyl ether 80-95%, fluorocarbon surfactant FC-4432 0.5-8.0%, non-conductive antistatic agent FC-4400 0.3-5.5%.

[0009] Specifically, component A and its weight percentage (W / W) can be: 90% hexafluoroisopropyl methyl ether, 8% fluorocarbon surfactant FC-4432, and FC-44002 non-conductive antistatic agent.

[0010] Component B: Hexafluoroisopropylpropyl ether 75-85%, fluorocarbon surfactant FC-4432 3.7-25%, non-conductive antistatic agent FC-4400 3.9-11%.

[0011] Specifically, component B and its weight percentage (W / W) can be: 75% hexafluoroisopropylpropyl ether, 15% fluorocarbon surfactant FC-4432, and 10% non-conductive antistatic agent FC-440010.

[0012] It should be noted that when using the cleaning agent of the present invention, the components A and B can be mixed in a certain proportion according to the on-site construction environment or the polarity characteristics of the pollutants, and stirred evenly at a uniform speed by an electric stirrer. This ensures that the cleaning agent has good cleaning effect and antistatic properties, while also taking into account safety and environmental protection. The cleaning agent has a moderate evaporation rate, will not cause condensation, and has a low VOC content.

[0013] It should be further explained that the relationship between the mixing ratio of components A and B and the on-site construction temperature is calculated using the following empirical formula: According to Raoult's law, the vapor pressure of the solution after mixing A and B is P. mix In ideal circumstances, P mix =X a ·P a +(1-X a )·P b Since the evaporation rate is directly proportional to the vapor pressure, and to ensure cleaning effectiveness, the ideal cleaning process requires the evaporation rate to be adjusted inversely with ambient temperature: at low temperatures, evaporation needs to be accelerated to prevent condensation and water stains; at high temperatures, the evaporation rate needs to be controlled to ensure effective cleaning contact time and uniform drying. The mixing ratio of components A and B shows a certain relationship with the application temperature; therefore, the relationship between the mixing ratio of components A and B and temperature can be summarized as follows: ; in, The allocation ratio for groups A and B. This is the saturated vapor pressure of component A. This is the saturated vapor pressure of component B. Let α be the saturated vapor pressure of the mixture of A and B, T be the temperature at the construction site, and α be a constant.

[0014] Furthermore, the ratio of A to B can be flexibly adjusted according to the type of pollutants on site: When the pollutants at the site are non-polar substances such as long-chain oils, the proportion of component B should be appropriately increased and the proportion of component A decreased. The ratio of component A to component B can be selected as follows: =0.5; When the pollutants at the site are polar ionic pollutants such as salts, small-molecule organic acids, and metal ions, the proportion of component A should be appropriately increased, and the ratio of A to B can be selected as follows: =2.5; When there are multiple types of pollutants at the site, the ratio of component A to component B should be appropriate, and the ratio of A to B can be selected as follows: =1.

[0015] It should be noted that this invention employs a blend of hexafluoroisopropyl methyl ether and hexafluoroisopropyl propyl ether. Due to the difference in their alkyl structures, they differ in evaporation rate and solubility. Hexafluoroisopropyl methyl ether has a low boiling point (~45-60℃), a fast evaporation rate, and strong solubility for polar contaminants, making it suitable for scenarios requiring efficient drying but with strict condensation control requirements. Hexafluoroisopropyl propyl ether, on the other hand, has a high boiling point (~70-85℃), slow evaporation, providing a wider process window and a gentler drying process, completely avoiding condensation risks. It is more suitable for cleaning components with complex structures, heat sensitivity, or requiring long contact times. Its longer alkyl chain gives it stronger hydrophobicity and good solubility for non-polar substances (such as heavy oil and wax). Both possess the excellent properties of fluorinated ethers, such as non-flammability and no residue. Their blend allows for precise control of the evaporation rate and cleaning effect of the cleaning agent based on the process environment and contaminant characteristics.

[0016] Furthermore, the fluorocarbon-modified non-conductive antistatic agent FC-4400 differs from traditional ionic antistatic agents. FC-4400 forms a monomolecular protective film on the insulating surface through molecular self-assembly. This film can adsorb trace amounts of moisture from the environment, forming proton conductive channels (H). + (Migration via hydrogen bonding network) thus dissipates static charge. In a dry environment (RH < 30%), the surface resistivity of the equipment remains ≥ 10¹² Ω·cm. The fluorocarbon surfactant FC-4432 reduces the surface tension of the cleaning agent, improving its wettability and penetrability, allowing it to penetrate into the tiny pores and gaps of the circuit board, thereby enhancing the cleaning effect. It also helps FC-4400 adhere to the cleaned surface.

[0017] The second technical objective of this invention is to provide a method for preparing a precision electronic cleaning agent with precisely controlled evaporation rate as described above, comprising the following steps: 1. Catalyst Preparation: Weigh 25.6 g Mg(NO3)2·6H2O and 112.5 g Al(NO3)3·9H2O, dissolve them in 500 mL distilled water, and stir for 1 hour. Then, slowly add 5% ammonia water to the solution at room temperature while continuously stirring until the pH reaches 9.5. Collect the resulting suspension by vacuum filtration, wash with distilled water, and then dry at 120 °C for 12 hours. Calcine the resulting solid in a muffle furnace at 400 °C for 4 hours, and then at 500 °C for 4 hours. Collect the final product and store it in a desiccator for later use.

[0018] 2. Preparation of hexafluoroisopropyl methyl ether: Weigh 200g of the prepared catalyst, heat to 240℃, and purge with nitrogen for 4 hours. Weigh 3360.1g of 1,1,1,3,3,3-hexafluoroisopropanol and 900.1g of dimethyl carbonate, and add them separately to a downflow reactor. Slowly heat to 240℃, add 200g of catalyst, maintain for 30 minutes, and then cool the mixed solution to room temperature. Separate the hexafluoroisopropyl methyl ether by filtration and distillation for later use. The specific reaction formula is as follows:

[0019] 3. Preparation of hexafluoroisopropylpropyl ether: Weigh 250g of the prepared catalyst, heat to 240℃, and purge with nitrogen for 4 hours. Weigh 3360.1g of 1,1,1,3,3,3-hexafluoroisopropanol and 1416.8g of dipropyl carbonate, and add them separately to a downflow reactor. Slowly heat to 240℃, add 250g of catalyst, maintain for 30 minutes, and then cool the mixed solution to room temperature. Separate the hexafluoroisopropylpropyl ether by filtration and distillation for later use. The specific reaction formula is as follows:

[0020] 4. Preparation of Component A: Measured weights of fluorocarbon surfactant (FC-4432) and non-conductive antistatic agent FC-4400 were added to measured weights of hexafluoroisopropyl methyl ether. The mixture was stirred at medium speed at 32-33°C for 45 minutes to ensure complete dissolution and dispersion, yielding Component A. The stirring speed was 200-300 rpm. The mixture was filtered through a 0.2 μm filter to remove any possible small particulate impurities, ensuring the purity of the cleaning agent. Stainless steel reactors and stirrers were used in the above preparation process to avoid corrosion.

[0021] 5. Preparation of Component B: The measured weights of fluorocarbon surfactant (FC-4432) and non-conductive antistatic agent FC-4400 were added to the measured weight of hexafluoroisopropylpropyl ether. The mixture was stirred at medium speed at 32-33°C for 45 minutes to ensure complete dissolution and dispersion, yielding Component B. The stirring speed was 200-300 rpm. The mixture was filtered using a 0.2 μm filter to remove any possible small particulate impurities, ensuring the purity of the cleaning agent. Stainless steel reactors and stirrers were used in the above preparation process to avoid corrosion.

[0022] 6. Preparation of cleaning agent: Before use, according to the different on-site construction environment temperature or the different types of on-site pollutants, the two components A and B are prepared according to the component ratio and stirred evenly to form a stable cleaning agent, which is the finished product.

[0023] During the mixing process, excessively high temperatures may cause some components to decompose or volatilize, affecting product quality; and the stirring speed should be 200-300 rpm.

[0024] Furthermore, the relationship between the mixing ratio of components A and B and the on-site construction temperature is as follows: ; in, The allocation ratio for groups A and B. This is the saturated vapor pressure of component A. Let α be the saturated vapor pressure of component B, T be the temperature at the construction site, and α be a constant. Furthermore, the allocation ratio of Group A to Group B Relationship with the type of pollutants on site: When the type of pollutant at the scene is a non-polar pollutant. =0.5; when the type of pollutant at the site is a polar ionic pollutant, =2.5; when the on-site pollutants are of multiple types, =1.

[0025] Furthermore, this invention employs a fluorocarbon-modified non-conductive antistatic agent component, FC-4400 (a non-conductive antistatic agent), which forms a monomolecular protective film on the insulating surface of the cleaned circuit board and components through molecular self-assembly. This film can adsorb trace amounts of moisture from the environment, forming proton conductive channels (H). + This antistatic agent dissipates static charge through hydrogen bond network migration. Unlike ionic antistatic agents, this antistatic agent dissipates charge through electronic transitions of polar molecular groups and proton conduction of adsorbed moisture, thus avoiding damage to insulation.

[0026] Furthermore, the residual FC-4400 molecular layer forms a molecular film (approximately 1-2 nm) on the equipment surface. Even in a dry environment (RH < 30%), the surface resistivity remains ≥ 10¹² Ω·cm. Because its conductivity depends on the adsorption of moisture from the air, it automatically returns to a high-resistivity state upon drying. Hexafluoroisopropyl methyl ether, hexafluoroisopropyl propyl ether, and the fluorocarbon surfactant (FC-4432) exhibit good compatibility with FC-4400 and can be uniformly mixed. By adjusting the ratio of components A and B, the dielectric constant and evaporation rate of the mixed solution can be adjusted, achieving precise control of the evaporation rate and effective removal of contaminants of different polarities, with an overall stain removal rate > 97%.

[0027] Furthermore, the components of the formulation of this invention possess extremely low surface tension and dynamic wetting effect, with the contact angle decreasing from 120° to 15° within 0.5 seconds and a spreading speed of 15 mm / s. This allows it to penetrate into the tiny pores and gaps of the circuit board and also exhibits a high density (>1.1 g / cm³). 3This can drive out the moisture and dampness, preventing electrical malfunctions.

[0028] The circuit board cleaning agent provided by this invention is mainly used for cleaning circuit boards and components of precision electronic equipment, and is especially suitable for the following scenarios: 5G communication equipment, medical electronic equipment, aerospace launch equipment, servers, public measurement and control cabinets, UPS power supply cabinets, disk array cabinets, dispatch data network cabinets, remote communication cabinets, video surveillance cabinets, gateway metering cabinets, etc.

[0029] It should be noted that the product formulated in this invention has good volume resistivity, surface resistivity, and polar stain removal rate. It has passed antistatic verification, insulation reliability verification, and compatibility testing. It also has no flash point, a suitable evaporation rate (complete evaporation in 30 minutes), does not cause condensation, has a VOC content of <10g / L, and no ozone layer depletion potential (ODP=0). It is suitable for cleaning circuit boards of precision electronic equipment such as 5G communication, medical electronics, and aerospace launch.

[0030] Compared with the prior art, the beneficial effects of the present invention are: This invention employs a mixture of components A and B. By utilizing the different properties of components A and B, different ratios can be selected based on the ambient temperature and characteristics of pollutants at the construction site. This allows for precise control of the evaporation rate and solubility of the cleaning agent, effectively improving its comprehensive removal capabilities for oil stains and polar contaminants. It not only solves the problems of traditional cleaning agents having limited functionality and poor adaptability, but also takes into account the discharge phenomenon caused by static electricity accumulation in electronic equipment, reducing the risk of component damage. It also solves the problems of equipment temperature rise, thermal interference, and soft faults caused by static electricity adsorption of dust.

[0031] Specifically, the advantages of this invention are as follows: 1. Using Mg-Al mixed oxides as catalysts, oxygen atoms in 1,1,1,3,3,3-hexafluoroisopropanol attack methoxy carbon atoms in dimethyl carbonate or propoxy carbon atoms in dipropyl carbonate to prepare hexafluoroisopropylmethyl ether and hexafluoroisopropylpropyl ether.

[0032] 2. A two-component cleaning agent is used. By utilizing the characteristics of components A and B, the ratio of components A and B is adjusted according to the on-site temperature environment to achieve precise control of the evaporation rate of the cleaning agent. It can meet the cleaning needs of different temperature and humidity environments and complex types of pollutants. The cleaning agent has good adaptability and can remove oil stains and polar dirt at the same time, resulting in a comprehensive cleaning effect.

[0033] 3. High-efficiency anti-static: It adopts the method of proton conduction to quickly and effectively eliminate static electricity without affecting the insulation performance of the circuit board.

[0034] 4. Strong penetration: It can penetrate into the tiny holes and gaps in the circuit board for thorough cleaning.

[0035] 5. Safe and environmentally friendly: No flash point, moderate evaporation rate, low VOC content, no potential for ozone layer depletion, safe and environmentally friendly.

[0036] 6. Wide range of applications: Suitable for cleaning circuit boards of various precision electronic devices.

[0037] Verified as effective: It has passed anti-static verification, insulation reliability verification, and compatibility testing, and has achieved good results in practical applications. Detailed Implementation

[0038] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0039] The term "embodiment" used herein, as an example, is not necessarily to be construed as superior to or better than other embodiments. Performance testing in the embodiments of this application, unless otherwise specified, employs conventional testing methods in the art. It should be understood that the terminology used in this application is merely for describing particular implementations and is not intended to limit the scope of this disclosure.

[0040] Unless otherwise stated, the technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; other experimental methods and technical means not specifically mentioned herein refer to experimental methods and technical means commonly used by one of ordinary skill in the art.

[0041] To better illustrate the content of this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In the embodiments, some methods, means, instruments, and devices well-known to those skilled in the art are not described in detail in order to highlight the main points of this application.

[0042] Without conflict, the technical features disclosed in the embodiments of this application can be combined arbitrarily, and the resulting technical solution belongs to the content disclosed in the embodiments of this application.

[0043] This invention discloses a precision electronic cleaning agent with a precisely adjustable evaporation rate and its preparation method.

[0044] 1. Catalyst Preparation: Weigh 25.6 g Mg(NO3)2·6H2O and 112.5 g Al(NO3)3·9H2O, dissolve them in 500 mL distilled water, and stir for 1 hour. Then, slowly add 5% ammonia water to the solution at room temperature while continuously stirring until the pH reaches 9.5. Collect the resulting suspension by vacuum filtration, wash with distilled water, and then dry at 120 °C for 12 hours. Calcine the resulting solid in a muffle furnace at 400 °C for 4 hours, and then at 500 °C for 4 hours. Collect the final product and store it in a desiccator for later use.

[0045] 2. Preparation of hexafluoroisopropyl methyl ether: Weigh 200g of the prepared catalyst, heat to 240℃, and purge with nitrogen for 4 hours. Weigh 3360.1g of 1,1,1,3,3,3-hexafluoroisopropanol and 900.1g of dimethyl carbonate, and add them separately to a downflow reactor. Slowly heat to 240℃, add 200g of catalyst, maintain for 30 minutes, and then cool the mixed solution to room temperature. Separate the hexafluoroisopropyl methyl ether by filtration and distillation for later use. The specific reaction formula is as follows:

[0046] 3. Preparation of hexafluoroisopropylpropyl ether: Weigh 250g of the prepared catalyst, heat to 240℃, and purge with nitrogen for 4 hours. Weigh 3360.1g of 1,1,1,3,3,3-hexafluoroisopropanol and 1416.8g of dipropyl carbonate, and add them separately to a downflow reactor. Slowly heat to 240℃, add 250g of catalyst, maintain for 30 minutes, and then cool the mixed solution to room temperature. Separate the hexafluoroisopropylpropyl ether by filtration and distillation for later use. The specific reaction formula is as follows:

[0047] To better understand the present invention, the following embodiments are provided for further detailed description of the present invention, but they should not be construed as limiting the present invention. Any non-essential improvements and adjustments made by those skilled in the art based on the above-described invention are also considered to fall within the protection scope of the present invention.

[0048] Example 1 A precision electronic cleaning agent with precisely controlled evaporation rate is mainly composed of the following components, expressed as a percentage by weight (w / w): (1) Component A: 85% hexafluoroisopropyl methyl ether, 10% fluorocarbon surfactant (FC-4432), and 5% non-conductive antistatic agent (FC-4400); (2) Component B: 80% hexafluoroisopropylpropyl ether, 15% fluorocarbon surfactant (FC-4432), and 5% non-conductive antistatic agent (FC-4400); (3) The relationship between the ratio of A and B and temperature is as follows:

[0049] in, The distribution ratio (mass ratio) of group A and group B. This is the saturated vapor pressure of component A. Let T be the saturated vapor pressure of component B, T be the temperature at the construction site, and α be a constant (valued at 8.381 × 10⁻⁶). 6 Pa·k).

[0050] When the ambient temperature is 0℃ (273K) and the standard atmospheric pressure is 10kPa, the saturated vapor pressure of component A is approximately 3kPa, and the saturated vapor pressure of component B is approximately 3kPa. Based on the formula, the ratio of component A to component B is calculated as follows: =3.96, at which point the temperature is low and the proportion of component A is high, effectively reducing the evaporation rate of the mixed solution; When the ambient temperature is 20℃ (293K) and the standard atmospheric pressure is 12kPa, the saturated vapor pressure of component A is approximately 30kPa, and the saturated vapor pressure of component B is approximately 12kPa. Based on the formula, the ratio of component A to component B is calculated as follows: =0.92, at which point the ratio of components A and B is appropriate, and the evaporation rate of the mixed solution is within a suitable range; When the ambient temperature is 25℃ (298K) and the standard atmospheric pressure is 15kPa, the saturated vapor pressure of component A is approximately 35kPa, and the saturated vapor pressure of component B is approximately 15kPa. Based on the formula, the ratio of A to B is calculated as follows: =0.66, at which point the temperature is relatively high and the proportion of component B is relatively high, which can effectively control the volatilization of the cleaning agent.

[0051] Example 2 A precision electronic cleaning agent with precisely controlled evaporation rate is mainly composed of the following components, expressed as a percentage by weight (w / w): (1) Component A: 80% hexafluoroisopropyl methyl ether, 15% fluorocarbon surfactant (FC-4432), and 5% non-conductive antistatic agent (FC-4400); (2) Component B: 85% hexafluoroisopropylpropyl ether, 10% fluorocarbon surfactant (FC-4432), and 5% non-conductive antistatic agent (FC-4400); (3) The ratio of A to B can be flexibly adjusted according to the type of pollutants on site: When the pollutants at the site are non-polar substances such as long-chain oils, the proportion of component B should be appropriately increased and the proportion of component A decreased. The ratio of component A to component B can be selected as follows: =0.5; When the pollutants at the site are polar ionic pollutants such as salts, small-molecule organic acids, and metal ions, the proportion of component A should be appropriately increased, and the ratio of A to B can be selected as follows: =2.5; When there are multiple types of pollutants at the site, the ratio of component A to component B should be appropriate, and the ratio of A to B can be selected as follows: =1.

[0052] To further demonstrate the beneficial effects of the present invention and to better understand it, the following experimental examples further illustrate the technical features disclosed in the present invention, but should not be construed as limiting the present invention. Other improvements made by those skilled in the art based on the above-described invention, without inventive effort, are also considered to fall within the protection scope of the present invention.

[0053] 1. Key performance indicator test results (Example 2): Reference standard: IEC60664-1, normal conditions (25℃, 50%RH). =1

[0054] 2. Practical application effect (1) Server of a fire brigade in Shijiazhuang After cleaning, the machine operated normally. After 116 days, the electrostatic voltage was tested at 42V, and there was no dust accumulation.

[0055] (2) Public measurement and control cabinet and UPS power supply cabinet of a coking plant in Linfen, Shanxi Province 137 days after cleaning, the electrostatic voltage was measured at 47V and 52V, with slight floating dust (due to gravity settling), and the equipment was operating normally.

[0056] (3) Disk array cabinet and scheduling data network cabinet of a chemical fiber company in Jilin Province 105 days after cleaning, the equipment's electrostatic voltage was 51V and 39V, it was clean and dust-free, and it was operating normally.

[0057] (4) Remote communication cabinet and UPS power supply cabinet of a hotel in Zhongshan District, Dalian 193 days after cleaning, the electrostatic voltage was tested at 51V and 59V, indicating that the equipment was operating normally and was clean without any floating dust.

[0058] (5) Public measurement and control cabinets, gate metering cabinets, video monitoring cabinets, and UPS power supply cabinets of a power plant of a steel company in Xining Before cleaning, there was a lot of floating dust, and the average electrostatic voltage was 358V. After 127 days of cleaning, the average electrostatic voltage was 67V, with a slight amount of floating dust. The equipment was operating normally.

[0059] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A precision electronic cleaning agent with precisely controlled evaporation rate, characterized in that, The cleaning agent mainly consists of two components, A and B, expressed as a percentage by weight (w / w): Component A: Hexafluoroisopropyl methyl ether 80-95%, fluorocarbon surfactant FC-4432 0.5-8.0%, non-conductive antistatic agent FC-4400 0.3-5.5%; Component B: 75-85% hexafluoroisopropylpropyl ether, 3.7-25% fluorocarbon surfactant FC-4432, and 3.9-11% non-conductive antistatic agent FC-4400.

2. The precision electronic cleaning agent with precisely controlled evaporation rate according to claim 1, characterized in that, The cleaning agent mainly consists of two components, A and B, expressed as a percentage by weight (w / w): Component A: 90% hexafluoroisopropyl methyl ether, 8% fluorocarbon surfactant FC-4432, 2% non-conductive antistatic agent FC-4400; Component B: 75% hexafluoroisopropylpropyl ether, 15% fluorocarbon surfactant FC-4432, and 10% non-conductive antistatic agent FC-4400.

3. The precision electronic cleaning agent with precisely controlled evaporation rate according to claim 1, characterized in that, The relationship between the mixing ratio of components A and B and the on-site construction temperature is as follows: ; in, The allocation ratio for groups A and B. This is the saturated vapor pressure of component A. Let α be the saturated vapor pressure of component B, T be the temperature at the construction site, and α be a constant.

4. The precision electronic cleaning agent with precisely controlled evaporation rate according to claim 1, characterized in that, Distribution ratio of Group A and Group B Relationship with the type of pollutants on site: When the type of pollutant at the scene is a non-polar pollutant. =0.5; when the type of pollutant at the site is a polar ionic pollutant, =2.5; when the on-site pollutants are of multiple types, =1.

5. A method for preparing a precision electronic cleaning agent with precisely controlled evaporation rate as described in claim 1 or 2, characterized in that, Includes the following steps: 1) Catalyst preparation: Weigh 25.6g Mg(NO3)2·6H2O and 112.5g Al(NO3)3·9H2O, dissolve them in 500 mL distilled water and stir for 1 hour. Then, slowly add 5% ammonia water to the solution at room temperature while stirring continuously until the pH reaches 9.

5. Collect the resulting suspension by vacuum filtration, wash it with distilled water, and then dry it at 120℃ for 12 hours. Calcine the resulting solid in a muffle furnace at 400℃ for 4 hours, and then at 500℃ for 4 hours. Collect the final product and place it in a desiccator for later use. 2) Preparation of hexafluoroisopropyl methyl ether: Weigh 200g of the catalyst prepared in step 1), heat to 240℃, and purge with nitrogen for 4h for later use; weigh 3360.1g of 1,1,1,3,3,3-hexafluoroisopropanol and 900.1g of dimethyl carbonate, add them to the downflow reactor, heat slowly to 240℃, add 200g of catalyst, maintain for 30min, cool the mixed solution to room temperature, and separate hexafluoroisopropyl methyl ether by filtration and distillation for later use; 3) Preparation of hexafluoroisopropylpropyl ether: Weigh 250g of the catalyst prepared in step 1), heat to 240℃, and purge with nitrogen for 4h for later use; weigh 3360.1g of 1,1,1,3,3,3-hexafluoroisopropanol and 1416.8g of dipropyl carbonate, add them to the downflow reactor, heat slowly to 240℃, add 250g of catalyst, maintain for 30min, cool the mixed solution to room temperature, and separate hexafluoroisopropylpropyl ether by filtration and distillation for later use; 4) Preparation of component A: Add the measured weight of fluorocarbon surfactant FC-4432 and non-conductive antistatic agent FC-4400 to the measured weight of hexafluoroisopropyl methyl ether, stir at medium speed at 32-33℃ for 45 minutes to ensure complete dissolution and dispersion, and obtain component A. The stirring speed is 200-300 rpm, and the mixture is filtered using a 0.2μm filter. 5) Preparation of component B: Add the measured weight of fluorocarbon surfactant FC-4432 and non-conductive antistatic agent FC-4400 to the measured weight of hexafluoroisopropylpropyl ether, stir at medium speed at 32-33℃ for 45 minutes to ensure complete dissolution and dispersion, and obtain component B. The stirring speed is 200-300 rpm, and the mixture is filtered using a 0.2μm filter. 6) Preparation of cleaning agent: Before use, according to the different on-site construction environment temperature or different types of on-site pollutants, the two components A and B are prepared according to the component ratio and stirred evenly to form a stable cleaning agent, which is the finished product.

6. The method for preparing a precision electronic cleaning agent with precisely controlled evaporation rate according to claim 5, characterized in that, During the mixing process, the stirring speed is 200-300 rpm.

7. The method for preparing a precision electronic cleaning agent with precisely controlled evaporation rate according to claim 5, characterized in that, The relationship between the mixing ratio of components A and B and the on-site construction temperature is as follows: ; in, The allocation ratio for groups A and B. This is the saturated vapor pressure of component A. α is the saturated vapor pressure of component B, T is the temperature at the construction site, and α is a constant. Distribution ratio of Group A and Group B Relationship with the type of pollutants on site: When the type of pollutant at the scene is a non-polar pollutant. =0.5; when the type of pollutant at the site is a polar ionic pollutant, =2.5; when the on-site pollutants are of multiple types, =1.

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