High-performance vitrified microsphere composite polystyrene particle heat-insulation board and preparation method thereof

By combining premixed hydrophobic vitrified microspheres with expanded graphite polystyrene particles and mechanically activated solid waste powder, along with high-speed stirring and fiber reinforcement, a high-performance vitrified microsphere composite polystyrene particle insulation board was prepared. This solved the problems of microscopic interface compatibility and industrial solid waste utilization in composite insulation boards, achieving high strength, low thermal conductivity, and Class A fire resistance.

CN122277176APending Publication Date: 2026-06-26CHINA RAILWAY TENTH GRP CONSTR ENG CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHINA RAILWAY TENTH GRP CONSTR ENG CO LTD
Filing Date
2026-03-10
Publication Date
2026-06-26

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Abstract

This invention discloses a high-performance vitrified microsphere composite polystyrene particle insulation board and its preparation method, comprising the following steps: premixing hydrophobic vitrified microspheres and expandable polystyrene particles coated with expanded graphite at a mass ratio of (2.5~4):1 to obtain composite lightweight aggregate. The insulation board prepared by this invention, with a dry density of only 184-193 kg / m³, exhibits a compressive strength as high as 0.275-0.302 MPa, significantly superior to traditional inorganic insulation boards (0.15-0.25 MPa) and organic insulation boards (0.10-0.15 MPa); its thermal conductivity is as low as 0.034-0.041 W / (m·K), and its insulation efficiency is more than 40% higher than that of traditional inorganic materials, while also possessing Class A fire safety performance; furthermore, the process is simple and controllable, with an industrial solid waste utilization rate of up to 70%, demonstrating significant economic benefits and environmental value, and possessing broad prospects for widespread application.
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