Adsorption apparatus, film formation apparatus, adsorption method, film formation method, and method for manufacturing electronic device

Abstract

The adsorption device is characterized by comprising: a support unit that supports the periphery of a first main surface of an adsorbed body, the adsorbed body having the first main surface and a second main surface opposite to the first main surface; an adsorption member that adsorbs the adsorbed body from the second main surface side of the adsorbed body; and a plurality of pressing members disposed on the adsorption member for pressing the adsorbed body from the second main surface side of the adsorbed body, the plurality of pressing members being respectively disposed at positions corresponding to at least two corners of a plurality of corners of the second main surface of the adsorbed body.

Description

Technical Field

[0001] This invention relates to adsorption devices, film-forming devices, adsorption methods, film-forming methods, and manufacturing methods of electronic devices. Background Technology

[0002] Patent Document 1 discloses a film-forming apparatus having a pressing member fixed to the upper sidewall of a vacuum container and extending downward. In this apparatus structure, as a substrate supported by a substrate support unit rises, the upper surface of the substrate comes into contact with the pressing member, and the substrate is pressed downward.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-141312 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, due to the deformation of the vacuum container caused by the formation of a vacuum, tilting may occur in electrostatic chucks and other components. Even if the protrusion of the pressing member is adjusted in the atmosphere, the protrusion of the pressing member located on the upper side wall of the vacuum container may change if the vacuum causes deformation. Therefore, when the results of adjusting the tilt of the substrate orientation in the atmosphere are applied to tilt adjustment in a vacuum environment, the protrusion of the pressing member will become unbalanced due to the tilt caused by the formation of a vacuum, which may become a major cause of poor adhesion.

[0008] The purpose of this invention is to provide a technology that is not affected by the deformation of the vacuum container caused by the formation of a vacuum and can effectively adsorb the adsorbed body onto the electrostatic chuck.

[0009] Methods for solving problems

[0010] An adsorption device according to one aspect of the present invention comprises:

[0011] A support unit supports the periphery of the first main surface of the adsorbed body, the adsorbed body having the first main surface and a second main surface on the side opposite to the first main surface;

[0012] An adsorption component, wherein the adsorption component adsorbs the adsorbed object from the second main surface side of the adsorbed object; and

[0013] A plurality of pressing members are disposed on the adsorption component for pressing the adsorbed object from the second main surface side of the adsorbed object.

[0014] The plurality of pressing members are respectively disposed at positions corresponding to at least two corners of the plurality of corners of the second main surface of the adsorbed body.

[0015] Another aspect of the adsorption device of the present invention includes:

[0016] A support unit supports the periphery of the first main surface of the adsorbed body, the adsorbed body having the first main surface and a second main surface on the side opposite to the first main surface;

[0017] An adsorption component, wherein the adsorption component adsorbs the adsorbed object from the second main surface side of the adsorbed object; and

[0018] A pressing member, disposed on the adsorption component, is used to press the adsorbed object from its second main surface side before the adsorption component adsorbs the object.

[0019] When viewed from a direction perpendicular to either the first or second main surface, the support area and the pressing area do not overlap. The support area is the region on the first main surface where the support unit supports the adsorbed body, and the pressing area is the region on the second main surface where the pressing member presses the adsorbed body.

[0020] The pressing member is positioned at a location corresponding to a corner of the second main surface of the adsorbed body.

[0021] Invention Effects

[0022] According to the present invention, it is not affected by the deformation of the vacuum container caused by the formation of a vacuum and can effectively adsorb the adsorbed body onto the electrostatic chuck. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a part of an electronic device manufacturing apparatus.

[0024] Figure 2 This is a schematic diagram of a film-forming apparatus according to one embodiment of the present invention.

[0025] Figure 3 This is a cross-sectional schematic diagram of an adsorption device according to an embodiment of the present invention.

[0026] Figure 4a This is a plan view of an adsorption device according to one embodiment of the present invention.

[0027] Figure 4b This is a plan view of an adsorption device according to one embodiment of the present invention.

[0028] Figure 5The accompanying drawing illustrates an adsorption method according to an embodiment of the present invention.

[0029] Figure 6 This is a schematic diagram illustrating an electronic device. Detailed Implementation

[0030] Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the accompanying drawings. However, the following embodiments and examples are merely illustrative of preferred structures of the present invention, and the scope of the present invention is not limited to these structures. Furthermore, unless otherwise specified, the hardware and software structures, processing flows, manufacturing conditions, dimensions, materials, shapes, etc., of the apparatus described below are not intended to limit the scope of the present invention.

[0031] The present invention can be applied, for example, to a film-forming apparatus for depositing various materials on the surface of a substrate to form a film, and can be preferably applied to an apparatus for forming a thin film (material layer) with a desired pattern by vacuum evaporation.

[0032] The substrate material can be any material such as glass, a thin film of polymer material, metal, or semiconductor (e.g., silicon). The substrate can also be, for example, a silicon wafer or a substrate on which a thin film of polyimide or the like is laminated. Furthermore, the film-forming material (sometimes called the vapor deposition material in the case of vapor deposition) can be any material such as organic materials or metallic materials (metals, metal oxides, etc.).

[0033] Furthermore, in the following description, a vapor deposition apparatus will be described as a film-forming apparatus, but the film-forming apparatus of the present invention is not limited to this, and may also be a sputtering apparatus or a CVD (Chemical Vapor Deposition) apparatus. Specifically, the technology of the present invention can be applied to manufacturing apparatuses for various electronic devices, such as semiconductor devices, magnetic devices, and electronic components, as well as optical components. Specific examples of electronic devices include light-emitting elements, photoelectric conversion elements, and touch panels. The present invention can also be preferably applied to manufacturing apparatuses for organic light-emitting elements such as OLEDs and organic photoelectric conversion elements such as organic thin-film solar cells. Furthermore, the electronic devices of the present invention also include display devices (e.g., organic EL display devices) equipped with light-emitting elements, lighting devices (e.g., organic EL lighting devices), and sensors (e.g., organic CMOS image sensors) equipped with photoelectric conversion elements.

[0034] <Electronic Equipment Manufacturing Apparatus>

[0035] Figure 1 It is a plan view schematically showing a part of the structure of an electronic device manufacturing apparatus.

[0036] Figure 1 Manufacturing apparatus, for example, is used for manufacturing display panels for organic EL display devices used in smartphones. In the case of display panels for smartphones, for example, after forming an organic EL element on a rectangular substrate of the 4.5 generation (G4.5) or a full-size (approximately 1500mm × approximately 900mm) or half-cut size (approximately 1500mm × approximately 1850mm) rectangular substrate of the 6th generation (G6), the substrate is cut to produce multiple small-sized panels.

[0037] Generally speaking, an electronic device manufacturing apparatus includes multiple cluster devices 1 and a relay device that connects the multiple cluster devices 1.

[0038] The cluster device 1 includes multiple film-forming devices 11 for processing (e.g., film formation) a substrate S, multiple mask storage devices 12 for storing masks M before and after use, and a transport chamber 13 disposed in its center. Figure 1 As shown, the conveying chamber 13 is connected to multiple film forming devices 11 and a mask storage device 12.

[0039] A transport robot 14 is disposed within the transport chamber 13, which transports a substrate S and a mask M. The transport robot 14 transports the substrate S from the path chamber 15 of the transfer device disposed upstream to the film forming apparatus 11. In addition, the transport robot 14 transports the mask M between the film forming apparatus 11 and the mask storage device 12. The transport robot 14 is, for example, a robot with a structure in which a manipulator holding the substrate S or the mask M is mounted on a multi-jointed arm.

[0040] In the film deposition apparatus 11 (also known as the vapor deposition apparatus), the vapor deposition material stored in the evaporation source is heated and evaporated by the heater, and then deposited onto the substrate S through the mask M. The film deposition apparatus 11 performs a series of film deposition processes, including the handover of the substrate S to the transport robot 14, the adjustment (alignment) of the relative position of the substrate S and the mask M, the fixing of the substrate S onto the mask M, and film deposition.

[0041] In the mask storage device 12, new masks used in the film-forming process performed by the film-forming device 11 and used masks are stored separately in two boxes. The transport robot 14 transports used masks from the film-forming device 11 to the boxes of the mask storage device 12, and transports new masks stored in other boxes of the mask storage device 12 to the film-forming device 11.

[0042] In the flow direction of the substrate S, transfer devices are connected to the upstream and downstream sides of the cluster device 1, respectively. Each transfer device has a buffer chamber 16, a rotation chamber 17, and a path chamber 15 sequentially from the upstream side to the downstream side. That is, in the cluster device 1, a path chamber 15 is connected to the upstream side, and a buffer chamber 16 is connected to the downstream side. In the flow direction of the substrate S, relative to the cluster device 1 and the upstream side ( Figure 1 The path chamber 15 (located on the left side) is the chamber that connects the substrate S from the upstream side to the cluster device 1. This is relative to the cluster device 1 and the downstream side (…). Figure 1 The buffer chamber 16 (connected to the right side of the cluster device 1) is the chamber where the substrate S, after film deposition in the cluster device 1, is transferred to other cluster devices downstream. The transport robot 14 of the transport chamber 13 receives the substrate S from the path chamber 15 on the upstream side and transports it to one of the film deposition devices 11 (e.g., film deposition device 11a) within the cluster device 1. In addition, the transport robot 14 receives the substrate S, after film deposition in the cluster device 1, from one of the multiple film deposition devices 11 (e.g., film deposition device 11b) and transports it to the buffer chamber 16 connected to the downstream side.

[0043] Alternatively, a rotary chamber 17 can be provided between the buffer chamber 16 and the path chamber 15 to change the orientation of the substrate. A conveying robot 18 is provided in the rotary chamber 17, which receives the substrate S from the buffer chamber 16 and rotates the substrate S 180° to convey it to the path chamber 15. Thus, the orientation of the substrate S is the same in both the upstream and downstream clustering devices, making substrate processing easier.

[0044] Path chamber 15, buffer chamber 16, and rotary chamber 17 are so-called transfer devices that connect cluster devices. Transfer devices located on the upstream and / or downstream side of cluster devices include at least one of path chamber, buffer chamber, and rotary chamber.

[0045] The film-forming apparatus 11, mask storage apparatus 12, transport chamber 13, buffer chamber 16, and rotary chamber 17 are maintained under high vacuum during the manufacturing process of organic light-emitting elements. The path chamber 15 is usually maintained under low vacuum, but can also be maintained under high vacuum as needed.

[0046] In this embodiment, refer to Figure 1The structure of the manufacturing apparatus for electronic devices has been described, but the present invention is not limited thereto. Other types of devices and chambers may be included, and the arrangement of the aforementioned devices and chambers may be changed. For example, the manufacturing apparatus for electronic devices may not be of the cluster type, but rather of the linear type. That is, it may have a structure in which a substrate and a mask are mounted on a carrier and transported within multiple film-forming devices arranged in a row while film formation is performed. Furthermore, it may have a structure combining the cluster type and the linear type. For example, the formation of the organic layer may be performed in a cluster-type manufacturing apparatus, while the sealing process and cutting process, starting from the film formation of the electrode layer (cathode layer), may be performed in a linear-type manufacturing apparatus.

[0047] The specific structure of the film-forming device 11 will be described below.

[0048] <Film Forming Device>

[0049] Figure 2 This is a schematic diagram showing the structure of the film deposition apparatus 11. In the following description, an XYZ orthogonal coordinate system is used, with the vertical direction set as the Z direction. When the rectangular substrate S is fixed parallel to the horizontal plane (XY plane) during film deposition, the direction of the short side of the substrate S (the direction parallel to the short side) is set as the X direction, and the direction of the long side (the direction parallel to the long side) is set as the Y direction. In addition, θ represents the rotation angle about the Z-axis.

[0050] The film forming apparatus 11 includes a vacuum container 21 (container) maintained in a vacuum atmosphere or an inactive gas atmosphere such as nitrogen, and a substrate support unit 22 (support unit), a mask support unit 23, an electrostatic chuck 24 (adsorption component), a magnetic plate 31, and an evaporation source 25 (film forming component) disposed inside the vacuum container 21.

[0051] The substrate support unit 22 is a component that receives and holds the substrate S conveyed by the conveying robot 14 disposed in the conveying chamber 13, and is also referred to as a substrate holder. In this embodiment, the substrate support unit 22 has a plurality of support portions 22a, which support the periphery of the first main surface (bottom surface in this case) of the rectangular substrate S. For example, the substrate support unit 22 supports two opposite sides (a pair of long sides or a pair of short sides in the case of a rectangular substrate) or four sides of the substrate S. Furthermore, the term "periphery" in this specification may not necessarily include the periphery end. For example, the plurality of support portions 22a of the substrate support unit 22 may also support the substrate S by contacting a portion near the center of the substrate S at a certain distance from the periphery end instead of contacting the periphery end of the bottom surface of the substrate S. In addition, the term "side" in this specification may also not necessarily include the side itself.

[0052] A mask support unit 23 is provided below the substrate support unit 22. The mask support unit 23 is a component that receives and holds the mask M conveyed by the conveying robot 14 provided in the conveying chamber 13, and is also called a mask holder. The mask support unit 23 is positioned such that the mask M supported by the mask support unit 23 is positioned between the substrate S supported by the substrate support unit 22 and the evaporation source 25, which is a film-forming component.

[0053] The mask M has an opening pattern corresponding to the thin film pattern formed on the substrate S and is mounted on the mask support unit 23. In particular, the mask used to manufacture organic EL elements for smartphones is a metal mask with a fine opening pattern, also known as an FMM (Fine Metal Mask).

[0054] An electrostatic chuck 24 is provided at a position facing the second main surface of the substrate S supported by the substrate support unit 22 (here, above the substrate support unit 22), serving as a substrate adsorption member or an adsorbed object adsorption member, for adsorbing and fixing the substrate S by electrostatic attraction. The electrostatic chuck 24 has a structure in which circuits such as metal electrodes are embedded in a dielectric (e.g., ceramic) substrate.

[0055] The electrostatic chuck 24 can be a Coulomb force type electrostatic chuck in which a dielectric with relatively high resistance is sandwiched between the electrode and the adsorption surface and the adsorption is performed by the Coulomb force between the electrode and the adsorbed object; it can also be a Johnson-Labeck force type electrostatic chuck in which a dielectric with relatively low resistance is sandwiched between the electrode and the adsorption surface and the adsorption is performed by the Johnson-Labeck force generated between the adsorption surface of the dielectric and the adsorbed object; or it can be a gradient force type electrostatic chuck in which a non-uniform electric field is used to adsorb the adsorbed object.

[0056] When the object being attracted is a conductor or semiconductor (silicon wafer), it is preferable to use an electrostatic chuck of the Coulomb force type or an electrostatic chuck of the Johnson-Labec force type. When the object being attracted is an insulator such as glass, it is preferable to use an electrostatic chuck of the gradient force type.

[0057] The electrostatic chuck 24 can be formed from a single plate or with multiple sub-plates. Furthermore, even when formed from a single plate, it can contain multiple circuits, allowing for control of the electrostatic attraction within the plate to vary depending on the location.

[0058] In this embodiment, an electrostatic chuck is mainly described as a substrate adsorption component, but the present invention is not limited thereto, and an adhesive chuck that adsorbs the substrate by adhesive force can also be used.

[0059] The film-forming apparatus 11 of this embodiment also includes a substrate pressing mechanism 300 (adsorbed body pressing mechanism) that drives the pressing member 30. The pressing member 30 is used to press the corner of the substrate S supported by the substrate support unit 22 from the upper surface side (second main surface side) of the substrate S. Therefore, it is also possible that a hole 24a (opening) is formed in the electrostatic chuck 24 through which the pressing member 30 can pass. The adsorption apparatus 110 including the pressing member 30 and the adsorption method based on the adsorption apparatus 110 will be described later. In addition, the corner of the substrate S may not be a "corner" in a strictly mathematical sense, for example, it may be a corner with rounded corners by rounding or other processes.

[0060] Although Figure 2 Although not illustrated, the structure can also be as follows: by providing a cooling mechanism (e.g., a cooling plate) on the side opposite to the adsorption surface of the electrostatic chuck 24 to suppress the temperature rise of the substrate S, the deterioration and degradation of the organic material accumulated on the substrate S can be suppressed.

[0061] A magnetic plate 31 is disposed above the electrostatic chuck 24. The magnetic plate 31 is used to apply magnetic force to the metal mask M, attracting the mask and making the mask M in close contact with the substrate S. The magnetic plate 31 has a permanent magnet or electromagnet and applies magnetic force to the mask M via the electrostatic chuck 24 and the substrate S. The magnetic plate 31 can also be divided into multiple modules arranged in a configuration when viewed from a direction perpendicular to the adsorption surface of the electrostatic chuck 24. Alternatively, the magnetic plate 31 can be integrally formed with the cooling plate described later.

[0062] The evaporation source 25 includes a crucible (not shown) for holding the vapor deposition material to be deposited on the substrate S, a heater (not shown) for heating the crucible, and a baffle (not shown) for preventing the vapor deposition material from scattering onto the substrate S until the evaporation rate from the evaporation source becomes constant. The evaporation source 25 can have various structures, such as a point evaporation source, a linear evaporation source, or a planar evaporation source, depending on the application.

[0063] Although Figure 2 Although not shown in the figure, the film deposition apparatus 11 includes a film thickness monitor (not shown) for measuring the thickness of the film deposited on the substrate S and a film thickness calculation unit (not shown). As the film thickness monitor, a crystal monitor containing a crystal oscillator can be used.

[0064] A distance adjustment unit 27 and a position adjustment mechanism 29 are provided on the upper outer side (atmospheric side) of the vacuum container 21. The distance adjustment unit 27 adjusts the distance between the electrostatic chuck 24 and the substrate support unit 22 and the mask support unit 23 by raising and lowering (moving in the Z direction), and makes the substrate S and the mask M approach and move away (separate) in the thickness direction (Z direction) of the substrate S. The distance adjustment unit 27 raises the substrate S (the object to be attracted) supported by the substrate support unit 22 toward the electrostatic chuck 24, and adjusts the distance between the substrate S (the object to be attracted) supported by the substrate support unit 22 and the electrostatic chuck 24. The distance adjustment unit 27 and the position adjustment mechanism 29 are, for example, composed of a motor and a ball screw or a motor and a linear guide, but the present invention is not limited to this, and other structures known in the industry may also be used. The pressing member 30 presses the upper surface (second main surface) of the substrate S (the object to be attracted) of the substrate S (the object to be attracted) that has been adjusted by the distance adjustment unit 27.

[0065] The position adjustment mechanism 29 is a drive component for aligning the electrostatic chuck 24. The position adjustment mechanism 29 causes the electrostatic chuck 24 to move in the X direction, move in the Y direction, and rotate in the θ direction relative to the substrate support unit 22 and the mask support unit 23. Furthermore, in this embodiment, by adjusting the position of the electrostatic chuck 24 in the X, Y, and θ directions while the substrate S is adsorbed, the relative position of the substrate S and the mask M is aligned.

[0066] In addition to the aforementioned driving mechanism, an alignment camera 20 may be provided on the outer upper surface of the vacuum container 21. The alignment camera 20 is used to photograph the alignment marks formed on the substrate S and the mask M through a transparent window provided on the upper surface of the vacuum container 21. In this embodiment, the alignment camera 20 may be positioned at two corners corresponding to the diagonals of the rectangular substrate S, the mask M, and the electrostatic chuck 24, or at the four corners of the rectangle, or at the center of two opposing sides.

[0067] The alignment camera 20 provided in the film deposition apparatus 11 of this embodiment is a fine alignment camera used to precisely adjust the relative position of the substrate S and the mask M. It is a camera with a narrow field of view but high resolution. Alternatively, in addition to the alignment camera 20 (fine alignment camera), the film deposition apparatus 11 may also have a coarse alignment camera with a relatively wide field of view but low resolution.

[0068] The position adjustment mechanism 29 performs alignment by moving the substrate S and the mask M relative to each other based on the position information of the substrate S and the mask M obtained by the alignment camera 20.

[0069] The film forming apparatus 11 includes a control device 32. The control device 32 has functions such as controlling the transport and alignment of the substrate S and the mask M (controlling each moving mechanism), controlling the evaporation source 25, and controlling the film forming.

[0070] In particular, the control device 32 of this embodiment functions as an adsorption control component, which controls the raising and lowering of the substrate support unit 22 and the electrostatic chuck 24, which are operated by the distance adjustment unit 27, during the adsorption action of the substrate S using the electrostatic chuck 24. The control device 32 can control the raising and lowering of the substrate S and the electrostatic chuck 24 during the pressing of the substrate S using the pressing member 30 and the adsorption process of the substrate S onto the electrostatic chuck 24. However, the present invention is not limited to this, and the adsorption control component may be independently of the control device of the film forming apparatus 11.

[0071] Furthermore, the control device 32 is capable of controlling the application of voltage to the electrostatic chuck 24; for this, please refer to [link / reference] below. Figure 3 To narrate.

[0072] The control device 32 can be configured, for example, as a computer having a processing unit 32b (processor), a storage unit 32c (memory, storage device), a communication interface 32a (communication IF), etc. In this case, the function of the control device 32 is realized by causing the processor to execute the program stored in the memory or storage device. As the computer, a general-purpose personal computer, an embedded computer, or a PLC (programmable logic controller) can be used. Alternatively, circuits such as ASICs or FPGAs can be used to constitute part or all of the function of the control device 32. In addition, the control device 32 can be provided for each film forming device 11, or a single control device 32 can be configured to control multiple film forming devices 11.

[0073] <Adsorption device>

[0074] Figure 3 This is a cross-sectional schematic diagram showing the structure of an adsorption device 110 according to an embodiment of the present invention. Hereinafter, the adsorption device of this embodiment will be described with reference to a rectangular substrate, but the present invention is not limited thereto. In this embodiment, an example of applying the adsorption device 110 to a film-forming apparatus 11 will be described, but the invention is not limited to this example. The structure of the adsorption device 110 can also be applied to an apparatus in a vacuum chamber (e.g., path chamber 15, buffer chamber 16) where a substrate S is adsorbed using an electrostatic chuck 24. For example, the adsorption device 110 of this embodiment can also be applied to an apparatus in which the film thickness of a film formed on a substrate S by the film-forming apparatus 11 is measured in a vacuum chamber downstream of the film-forming apparatus 11.

[0075] Reference Figure 3 The adsorption device 110 includes: a substrate support unit 22, the substrate support unit 22 including a support portion 22a; an electrostatic chuck 24 for adsorbing a substrate S; and a substrate pressing mechanism 300 (adsorbed object pressing mechanism), the substrate pressing mechanism 300 being disposed on the electrostatic chuck 24. Figure 3 In this electrostatic chuck 24, a holding member 303 is provided on the side 24b opposite to the adsorption surface 24c for holding the substrate pressing mechanism 300 on the electrostatic chuck 24. For example, a drive source 301, such as a vacuum motor, is mounted on the flange 303a of the holding member 303 to generate rotational driving force (rotation). The drive source 301 generates rotation to move the pressing member 30 along the Z direction (vertical direction).

[0076] The connecting component 302 can be, for example, a coupling, and the transmission mechanism 304 can be, for example, a ball screw. The connecting component 302 connects the rotation shaft of the drive source 301 to the shaft (screw shaft) of the transmission mechanism 304. The transmission mechanism 304 transmits the rotation generated by the drive source 301 to the conversion unit 30c.

[0077] The conversion part 30c connected to the transmission mechanism 304 is provided with a conversion mechanism (e.g., a nut) that converts the rotation (rotational motion) transmitted by the transmission mechanism 304 into translational movement (linear movement).

[0078] The pressing member 30 moves along the Z direction (vertical direction) based on the translational direction converted by the conversion unit 30c. By changing the rotation direction of the drive source 301, the pressing member 30 can be raised (moved vertically upward) or lowered (moved vertically downward).

[0079] For example, the drive source 301 generates a rotation in a first direction for moving the pressing member 30 vertically downward (downward in the Z-axis direction). The pressing member 30 moves vertically downward based on the rotation in the first direction transmitted by the transfer mechanism 304, thereby causing the end of the pressing member 30 to protrude from the adsorption surface 24c of the electrostatic chuck 24 that adsorbs the substrate S (the adsorbed object) from the second main surface side (e.g., Figure 3 (ST32).

[0080] Additionally, the drive source generates a second direction (opposite to the first direction) rotation for moving the pressing member 30 vertically upward (above the Z-axis direction). The pressing member 30 moves vertically upward based on this second-direction rotation transmitted by the transmission mechanism 304. Consequently, the end of the pressing member 30 protruding from the adsorption surface 24c of the electrostatic chuck 24 retracts in a manner that prevents it from protruding from the adsorption surface 24c of the electrostatic chuck 24 (e.g., Figure 3 (ST31).

[0081] To protect the substrate S, the pressing member 30 can be made of resin components such as Teflon (registered trademark), polyetheretherketone (PEEK), or polyimide. Alternatively, the pressing member 30 can be made primarily of a metal component such as stainless steel, and the surface of the metal component can be coated with a resin component such as Teflon (registered trademark), PEEK, polyimide, or DLC (diamond-like carbon). Furthermore, to suppress the generation of static electricity, a conductive coating can be applied to the surface of the resin component.

[0082] Furthermore, the electrostatic chuck 24 is provided with holes 24a (openings) through which the pressing member 30 can pass, so that the pressing member 30 can pass through the electrostatic chuck 24 and press the substrate S. To allow the pressing member 30 to pass through, the holes 24a are formed at positions corresponding to the pressing areas of the substrate S. Preferably, the number of holes 24a corresponds to the number of pressing members 30.

[0083] A detection sensor 30b is provided at the end of the pressing member 30. The detection sensor 30b can be composed of a contact sensor or a pressure sensor, etc. The detection sensor 30b detects the contact with the upper surface (second main surface) of the substrate S (the adsorbed object). The detection sensor 30b can transmit detection information wirelessly, and the detection information detected by the detection sensor 30b is input to the control device 32 via the communication interface 32a (communication IF). The communication interface 32a (communication IF) can receive information from various sensors installed in the film-forming device and the adsorption device.

[0084] The control device 32 controls the rotational speed and direction of rotation of the drive source 301 based on the detection information sent from the detection sensor 30b. By controlling the rotational speed of the drive source 301, the control device 32 controls the vertical movement of the pressing member 30; by controlling the rotational direction of the drive source 301, it controls the direction of movement of the pressing member 30. In other words, by controlling the rotational direction of the drive source 301, the control device 32 controls the vertical upward or downward movement of the pressing member 30.

[0085] By controlling the vertical movement of the pressing member 30, the amount of protrusion or pressing force of the pressing member 30 from the adsorption surface 24c of the electrostatic chuck 24 can be adjusted. The substrate pressing mechanism 300 moves the pressing member 30 along the Z direction (vertical direction) and presses the corner of the substrate S supported by the support portion 22a of the substrate support unit 22 from top to bottom. When multiple substrate pressing mechanisms 300 are provided on the electrostatic chuck 24, the control device 32 can adjust the protrusion amount or pressing force of each pressing member 30 by controlling the rotation speed and rotation direction of the drive source 301 of each substrate pressing mechanism 300.

[0086] Due to the deformation of the vacuum container 21 (chamber) caused by the formation of a vacuum, tilting may occur in the electrostatic chuck 24, etc. Therefore, when the result of adjusting the tilt of the substrate in the atmosphere is applied to the tilt adjustment in a vacuum environment, the protrusion of the pressing member 30 will become unbalanced due to the tilt caused by the formation of a vacuum, which may become a major cause of poor adhesion. The substrate pressing mechanism 300 according to this embodiment can adjust the tilt of the substrate S in a vacuum environment. Therefore, the tilt of the substrate S can be adjusted without being affected by the deformation of the vacuum container 21 caused by the formation of a vacuum.

[0087] The control device 32 changes the setting of the range (stroke) in which the pressing member 30 can move vertically according to the processing content. The stroke setting corresponding to the processing content can be stored in the storage unit 32c in advance. By changing the stroke according to the processing content, the substrate pressing mechanism 300 can be applied to various scenarios (processes).

[0088] When the substrate S (the object to be attracted) is attracted to the electrostatic chuck 24, the control device 32 moves the pressing member 30 in the vertical direction within a first movement range to adjust the tilt of the substrate S. Furthermore, in the event of a disengagement error, when the substrate S (the object to be attracted) is detached from the electrostatic chuck 24, the control device 32 moves the pressing member 30 in the vertical direction within a second movement range larger than the first movement range.

[0089] To adjust the tilt of the substrate S, a range of first movement (first stroke) is, for example, about 5 mm. Furthermore, in applications where a detachment error occurs and the substrate S is forcibly peeled from the electrostatic chuck 24, a range of second movement (second stroke) is, for example, about 50 mm.

[0090] exist Figure 3The example shown illustrates a structure in which a substrate pressing mechanism 300 is provided on the surface 24b opposite to the adsorption surface 24c of the electrostatic chuck 24, but this is not a limitation. For example, if the electrostatic chuck 24 has sufficient thickness, the substrate pressing mechanism 300 may also be disposed inside the electrostatic chuck 24.

[0091] The adsorption device 110 may further include a distance adjustment unit 27 for raising and lowering the substrate support unit 22 and the electrostatic chuck 24. Furthermore, the adsorption action of the electrostatic chuck 24 on the substrate S in the adsorption device 110 can be controlled by an adsorption control component. This adsorption control component can be implemented by a functional unit of the control device of the film forming apparatus 11, or it can be implemented by a separate control device.

[0092] The substrate support unit 22 is an example of an adsorbent support unit for supporting the substrate S, which is the adsorbed object. The first main surface of the substrate S (on Figure 3 The periphery of the bottom surface (with the middle part as the bottom surface) is supported by the support portion 22a of the substrate support unit 22.

[0093] The substrate S, whose bottom periphery is supported by the support portion 22a of the substrate support unit 22, flexes downward in the center due to its own weight, etc. As a result, the periphery of the substrate S is partially in contact with the upper surface of the support portion 22a and is supported, and as it approaches the periphery of the substrate S, it floats up from the upper surface of the support portion 22a and moves away.

[0094] An electrostatic chuck 24 is disposed on the upper side of the support portion 22a of the substrate support unit 22, and is a substrate adsorption member for adsorbing and fixing the substrate S using electrostatic attraction. A predetermined voltage is applied to the electrostatic chuck 24 to induce electrostatic attraction. According to this embodiment, the specific method of applying voltage to the electrostatic chuck 24 is not particularly limited. For example, voltage can be applied simultaneously to the entire electrostatic chuck 24, or voltage can be applied sequentially to multiple electrode portions or adsorption portions of the electrostatic chuck 24.

[0095] According to this embodiment, the electrostatic chuck 24 adsorbs the substrate S pressed by the pressing member 30 (described later) from the upper surface side (second main surface side) of the substrate S. In this embodiment, the pressing member 30 presses the substrate S before applying a predetermined voltage to the electrostatic chuck 24 for adsorbing the substrate S. This allows the central portion of the substrate S, which is bent downwards due to its own weight, to be lifted, and the substrate S can be adsorbed by the electrostatic chuck 24 while the degree of bending is reduced or removed. Therefore, not only is the adsorption time shortened, but wrinkles remaining on the substrate S adsorbed by the electrostatic chuck 24 are also suppressed. Furthermore, the voltage applied to the electrostatic chuck 24 can be reduced.

[0096] The pressing member 30 is used to press one end against the second main surface of the substrate S (on the second main surface of the substrate S). Figure 3 The upper surface of the pressing member 30 is pressed against the substrate S from above. In this embodiment, as an example, the area where the pressing member 30 presses against the upper surface of the substrate S, i.e., the pressing area, is located at the corner of the substrate S. Therefore, the pressing member 30 is provided at a position corresponding to the corner of the rectangular substrate S supported by the substrate support unit 22. More specifically, the pressing area of ​​the pressing member 30 is located at at least two of the four corners of the substrate S.

[0097] Figure 4a and Figure 4b These are schematic diagrams of the adsorption device 110 showing the position of the pressing area 30a of the pressing member 30.

[0098] like Figure 4a As shown, the pressing member 30 can also be positioned at one of the four corners of the rectangular substrate S, corresponding to a pair of corners on the diagonal. This allows for efficient pressing of the substrate S while minimizing the number of pressing members 30.

[0099] Or, such as Figure 4b As shown, the pressing member 30 can also be positioned at all four corners of the rectangular substrate S. In this way, by pressing two or four corners of the substrate S from above using the pressing member 30, the central portion of the deflected substrate S can be lifted, reducing the downward deflection or making it approximately flat. In particular, by pressing the corners that are far from the central portion where the deflection is most severe using the pressing member 30, the deflection of the central portion of the substrate S can be effectively reduced.

[0100] according to Figure 4a or Figure 4b In the embodiment of the present invention shown, since the pressing member 30 is provided at the corner of the substrate S, when viewed from the vertical direction (i.e., the direction perpendicular to the substrate surface), the pressing area (30a, for example, the corner) of the pressing member 30 does not overlap with the support area (for example, the edge) of the substrate S supported by the support portion 22a of the substrate support unit 22. Therefore, the substrate S can be sufficiently pressed using the pressing member 30 without being restricted by the support portion 22a.

[0101] The projection area obtained by vertically projecting the support area supported by the substrate support unit 22 onto the upper surface of the substrate S, and the pressing area 30a pressed by the pressing member 30, are along the imaginary line L (refer to...). Figure 4b The imaginary lines L are arranged in a manner similar to the outer periphery of the lower surface of the substrate S (e.g., a rectangle).

[0102] According to one aspect of this embodiment, a plurality of substrate pressing mechanisms 300 are provided on the electrostatic chuck 24, and the control device 32 can adjust the protrusion amount or pressing force of each pressing member 30 by controlling the rotational speed and rotational direction of the drive source 301 of each substrate pressing mechanism 300. The substrate pressing mechanism 300 according to this embodiment can adjust the tilt of the substrate S in a vacuum environment. Therefore, the tilt of the substrate S can be adjusted without being affected by the deformation of the vacuum container 21 caused by the formation of a vacuum.

[0103] [Adsorption Method]

[0104] Next, an adsorption method according to an embodiment of the present invention will be described. The adsorption method of this embodiment includes at least: (1) a supporting step in which a substrate S, which is the adsorbed object, is supported by a substrate support unit 22; (2) a pressing step in which the substrate S, which is the adsorbed object, is pressed by a pressing member 30; and (3) an adsorption step in which the substrate S, which is the adsorbed object, is adsorbed by an electrostatic chuck 24. Hereinafter, each step will be described in detail with reference to the accompanying drawings.

[0105] <Substrate Support Steps>

[0106] In this step, the peripheral portion of the first main surface (here, the film-forming surface) of the substrate S, which serves as the adsorbed object, is supported by the substrate support unit 22. In this embodiment, the substrate S is arranged with the film-forming surface facing downwards in the vertical direction, and the peripheral portion of the film-forming surface of the substrate S is supported from below by the substrate support unit 22. (Refer to...) Figure 5 ST51, the substrate S, which is the object to be adsorbed, is placed into the film forming apparatus 11 and supported in the support area by the support portion 22a of the substrate support unit 22. At this time, the pressing member 30, the electrostatic chuck 24, and the substrate S are separated. As shown, the central portion of the substrate S flexes downward due to its own weight. In addition, in order to press the pressing area on the upper surface of the substrate S with the pressing member 30 before adsorbing the substrate S with the electrostatic chuck 24, the distance adjustment unit 27 raises the substrate S (the object to be adsorbed) supported by the substrate support unit 22 toward the electrostatic chuck 24 and adjusts the distance between the substrate S (the object to be adsorbed) supported by the support portion 22a of the substrate support unit 22 and the electrostatic chuck 24.

[0107] <Pressing Steps>

[0108] In this step, the pressing member 30 presses the substrate S, which is the object to be adsorbed, against the second main surface (in this case, the side opposite to the film-forming surface). The pressing member 30 is moved vertically downwards by the substrate pressing mechanism 300, and it passes through the hole 24a of the electrostatic chuck 24. The end of the pressing member 30 protrudes from the adsorption surface 24c of the electrostatic chuck 24. As the substrate support unit 22 continues to rise due to the action of the distance adjustment unit 27, the upper surface (second main surface) of the substrate S comes into contact with the pressing member 30. Figure 5 (ST52).

[0109] In each of the plurality of substrate pressing mechanisms 300, each detection sensor 30b detects contact with the upper surface (second main surface) of the substrate S. The detection information from each detection sensor 30b is sent to the control device 32. The detection information sent by the detection sensor 30b includes an identification signal for identifying whether contact has occurred. For example, when the detection sensor 30b is not in contact with the upper surface (second main surface) of the substrate S (non-contact state), detection information containing the identification signal "0" is sent. For example, when the detection sensor 30b is in contact with the upper surface (second main surface) of the substrate S (contact state), detection information containing the identification signal "1" is sent.

[0110] The control device 32 determines the contact and non-contact areas between the detection sensors 30b and the upper surface (second main surface) of the substrate S based on the detection information sent from each detection sensor 30b. If the identification signals of the detection information sent from all detection sensors 30b indicate a contact state, the control device 32 determines that the substrate S (the adsorbed body) supported by the substrate support unit 22 is supported in a non-tilted state.

[0111] On the other hand, if the detection information sent from multiple detection sensors 30b includes both a detection signal indicating a contact state and a detection signal indicating a non-contact state, the control device 32 determines that the substrate S (the adsorbed object) supported by the substrate support unit 22 is supported in an inclined state. The control device 32 identifies the detection sensor 30b that sent the detection signal indicating a non-contact state and adjusts the position of the substrate support unit 22 on the side of the identified detection sensor 30b. The control device 32 controls the distance adjustment unit 27 and raises the substrate support unit 22 to the position where the detection sensor 30b that sent the detection signal indicating a non-contact state sent the detection signal indicating a contact state.

[0112] With the upper surface of the substrate S in contact with the detection sensor 30b, i.e., with the substrate S (the adsorbed object) not tilted, the control device 32 controls the drive source 301 of each substrate pressing mechanism 300 to move the pressing member 30 vertically downward and press the corners of the upper surface (second main surface) of the substrate S. In this step, at least two of the four corners of the rectangular substrate S are pressed, preferably the two opposite corners or all four corners are pressed. As a result, the central portion of the flexed substrate S is lifted, which reduces flexing.

[0113] <Adsorption Step>

[0114] In this step, the substrate S (the object to be adsorbed) is adsorbed from the upper surface (second main surface) side of the substrate S (the object to be adsorbed) pressed by the pressing member 30. As described above, by pressing the substrate S with the pressing member 30 in the pressing step, the bending of the substrate S is reduced by the pressing member 30. While maintaining the state of pressing the substrate S with the pressing member 30, the control device 32 controls the drive source 301 of the substrate pressing mechanism and the distance adjustment unit 27 to raise the pressing member 30 and the substrate support unit 22, so that the substrate S approaches the electrostatic chuck 24. In this state, as shown in ST53, a predetermined voltage ΔV is applied to the electrostatic chuck 24 and the substrate S pressed by the pressing member 30 is adsorbed by the electrostatic chuck 24.

[0115] Furthermore, the substrate S can be brought close to the electrostatic chuck 24 after a predetermined voltage is applied to the electrostatic chuck 24. Alternatively, the adsorption step (ST53) can be started before the pressing step (ST52) is completed.

[0116] According to this embodiment, by pressing with the pressing member 30 and adsorbing with the electrostatic chuck 24 to reduce the deflection of the substrate S, the adsorption time can be shortened, thereby reducing the process time. Furthermore, since adsorption is performed in a state where the deflection caused by the weight of the substrate S is reduced, wrinkles remaining on the substrate S after adsorption by the electrostatic chuck 24 can be suppressed (i.e., the substrate S is adsorbed onto the electrostatic chuck over a larger area), thus suppressing a decrease in the precision of the film deposition process. Additionally, the magnitude of the voltage ΔV applied to the electrostatic chuck 24 can be reduced. In particular, by pressing the corner portion, which is farther from the center of the substrate S, the deflection of the central portion can be reduced more effectively.

[0117] [Film Forming Process]

[0118] The following describes the film-forming method using the adsorption method of this embodiment.

[0119] With the mask M placed in the mask support unit 23 inside the vacuum container 21, the substrate S is moved into the vacuum container 21 of the film forming apparatus 11 by the transport robot 14 in the transport chamber 13.

[0120] The hand of the transport robot 14, which enters the vacuum container 21, places the substrate S on the support portion 22a of the substrate support unit 22 (substrate support step). In order to press the pressing area on the upper surface of the substrate S by the pressing member 30 before adsorbing the substrate S by the electrostatic chuck 24, the distance adjustment unit 27 raises the substrate S (the adsorbed object) supported by the substrate support unit 22 toward the electrostatic chuck 24 and adjusts the distance between the substrate S (the adsorbed object) supported by the support portion 22a of the substrate support unit 22 and the electrostatic chuck 24.

[0121] Next, the substrate support unit 22 is raised and the corner of the substrate S is pressed using the pressing member 30 (pressing step). The control device 32 adjusts the tilt of the substrate S (the adsorbed object) based on the detection information from the detection sensor 30b. When the upper surface of the substrate S is in contact with the detection sensor 30b, that is, when the substrate S (the adsorbed object) is not tilted, the control device 32 controls the drive source 301 of each substrate pressing mechanism 300 to move the pressing member 30 vertically downward and press the corner of the upper surface (second main surface) of the substrate S.

[0122] Next, while maintaining the state of pressing the substrate S with the pressing member 30, the control device 32 controls the drive source 301 of the substrate pressing mechanism and the distance adjustment unit 27 to raise the pressing member 30 and the substrate support unit 22, so that the substrate S approaches the electrostatic chuck 24. In this state, a predetermined voltage ΔV is applied to the electrostatic chuck 24 and the substrate S pressed by the pressing member 30 is attracted by the electrostatic chuck 24.

[0123] In order to measure the relative positional offset of the substrate S with respect to the mask M while the substrate S is adsorbed on the electrostatic chuck 24, the control device 32 causes the electrostatic chuck 24 with the substrate S adsorbed to descend.

[0124] When the substrate S descends to the alignment measurement position, the alignment camera 20 is used to photograph the alignment marks formed on the substrate S and the mask M, and the relative positional offset between the substrate S and the mask M is measured.

[0125] If the measurement results indicate that the relative positional offset of the substrate S relative to the mask M exceeds a threshold, the position adjustment mechanism 29 moves the substrate S, which is attached to the electrostatic chuck 24, in the horizontal direction (XYθ direction) to adjust (align) the position of the substrate S relative to the mask M. This relative positional adjustment process of the substrate S relative to the mask M can be repeated until the relative positional offset converges within the threshold.

[0126] When the relative positional offset between the substrate S and the mask M converges within a predetermined threshold, the electrostatic chuck 24 is lowered toward the mask M to bring the substrate S and the mask M into close contact (close contact step). At this time, in order to bring the substrate S and the mask M into close contact, a voltage that can attract the mask M through the substrate S can be applied to the electrostatic chuck 24, or the magnet plate 31 can be lowered onto the upper surface of the electrostatic chuck 24 to attract the metal mask M onto the substrate S.

[0127] Next, the baffle of the evaporation source 25 is opened, allowing the vapor deposition material to be deposited onto the substrate S via the mask M (film formation step). Furthermore, while the method of evaporating or sublimating the vapor deposition material and depositing it onto the substrate S has been described here, it is not limited to this method; for example, other film formation methods such as sputtering can also be used.

[0128] After the desired thickness is achieved by vapor deposition, the substrate S is separated from the mask M.

[0129] The hand of the transport robot 14 enters the vacuum container 21 of the film deposition apparatus 11 and applies a voltage of zero (0) or opposite polarity to the electrode portion of the electrostatic chuck 24, causing the electrostatic chuck 24 to separate from the substrate S and rise. Afterward, the transport robot 14 removes the substrate S from the vacuum container 21 after the vapor deposition is completed.

[0130] Furthermore, in the above description, the film-forming apparatus 11 is a structure for so-called upward evaporation (upward deposition) in which the film-forming surface of the substrate S is facing downward in the vertical direction. However, it is not limited to this and may also be a structure in which the substrate S is arranged vertically on the side of the vacuum container 21 and the film-forming surface of the substrate S is parallel to the direction of gravity.

[0131] <Methods for Manufacturing Electronic Devices>

[0132] Next, an example of a method for manufacturing an electronic device using the film-forming apparatus of this embodiment will be described. Hereinafter, as an example of an electronic device, the structure and manufacturing method of an organic EL display device will be illustrated.

[0133] First, the organic EL display device to be manufactured will be explained. Figure 6 6a is an overall view of the organic EL display device 60. Figure 6 The 6b represents the cross-sectional structure of a pixel.

[0134] like Figure 6As shown in Figure 6a, in the display area 61 of the organic EL display device 60, a plurality of pixels 62, each having a plurality of light-emitting elements, are arranged in a matrix. Details will be described later, but each light-emitting element has a structure comprising an organic layer sandwiched between a pair of electrodes. Furthermore, a pixel, as used herein, refers to the smallest unit capable of displaying a desired color in the display area 61. In the case of the organic EL display device of this embodiment, the pixel 62 is constructed by showing a combination of a first light-emitting element 62R, a second light-emitting element 62G, and a third light-emitting element 62B, each emitting a different color. Pixels 62 are often composed of a combination of red, green, and blue light-emitting elements, but combinations of yellow, cyan, and white light-emitting elements are also possible, as long as at least one color is used; there is no particular limitation. Additionally, each light-emitting element may be constructed by stacking multiple light-emitting layers.

[0135] Alternatively, pixel 62 can be constructed using multiple light-emitting elements that exhibit the same light emission, and a color filter can be used to pattern multiple different color conversion elements arranged in a manner corresponding to each light-emitting element, thereby enabling a pixel to display the desired color in display area 61. For example, pixel 62 can be constructed using at least three white light-emitting elements, and a color filter can be used to arrange red, green, and blue color conversion elements in a manner corresponding to each light-emitting element. Alternatively, pixel 62 can be constructed using at least three blue light-emitting elements, and a color filter can be used to arrange red, green, and colorless color conversion elements in a manner corresponding to each light-emitting element. In the latter case, by using a quantum dot color filter (QD-CF) that uses quantum dot (QD) material as the material for constructing the color filter, the display color gamut can be expanded compared to conventional organic EL display devices that do not use quantum dot color filters.

[0136] Figure 6 6b is Figure 6 A partial cross-sectional view of line AB of pixel 6a is shown. Pixel 62 has an organic EL element on substrate S, which includes an anode 64, a hole transport layer 65, any one of light-emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a cathode 68. The hole transport layer 65, light-emitting layers 66R, 66G, 66B, and electron transport layer 67 correspond to organic layers. Furthermore, in this embodiment, the light-emitting layer 66R is an organic EL layer that emits red light, the light-emitting layer 66G is an organic EL layer that emits green light, and the light-emitting layer 66B is an organic EL layer that emits blue light. In addition, when using a color filter or a quantum dot color filter as described above, the color filter or quantum dot color filter is positioned on the light-emitting side of each light-emitting layer. Figure 6 The upper or lower part of 6b, but the illustration is omitted.

[0137] The light-emitting layers 66R, 66G, and 66B are respectively formed into patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light. Furthermore, the anode 64 is formed separately for each light-emitting element. The hole transport layer 65, electron transport layer 67, and cathode 68 can be formed either in a manner shared by multiple light-emitting elements 62R, 62G, and 62B, or formed for each light-emitting element. In addition, to prevent short circuits between the anode 64 and cathode 68 due to foreign matter, an insulating layer 69 is provided between the anode 64. Moreover, since organic EL layers are susceptible to degradation due to moisture and oxygen, a protective layer 70 is provided to protect the organic EL element from the effects of moisture and oxygen.

[0138] exist Figure 6 In 6b, the hole transport layer 65 and the electron transport layer 67 are shown as a single layer, but depending on the structure of the organic EL display element, they can also be formed by multiple layers, including a hole blocking layer and an electron blocking layer. Alternatively, a hole injection layer with a band structure that allows for smooth injection of holes from the anode 64 to the hole transport layer 65 can be formed between the anode 64 and the hole transport layer 65. Similarly, an electron injection layer can be formed between the cathode 68 and the electron transport layer 67.

[0139] Next, we will give a specific example of how to manufacture an organic EL display device.

[0140] First, a substrate S is prepared, which has a circuit (not shown) for driving an organic EL display device and an anode 64.

[0141] Acrylic resin is spin-coated onto a substrate S on which the anode 64 is formed. The acrylic resin is then patterned using photolithography to create an opening in the area where the anode 64 is formed, and an insulating layer 69 is formed. This opening corresponds to the light-emitting area where the light-emitting element actually emits light.

[0142] A substrate S, with the insulating layer 69 patterned, is placed into a first organic material film-forming apparatus and held using an electrostatic chuck. The hole transport layer 65 is formed as a shared layer on the anode 64 of the display area. The hole transport layer 65 is formed by vacuum evaporation. Since the hole transport layer 65 is actually formed to a size larger than the display area 61, a high-precision mask M is not required.

[0143] Next, the substrate S, to which the hole transport layer 65 is formed, is moved into the second organic material film-forming apparatus and held using an electrostatic chuck. After aligning the substrate S with the mask M and making the substrate S and mask M in close contact, a red light-emitting layer 66R is formed on the portion of the substrate S where the red light-emitting element is arranged.

[0144] Similar to the deposition of the light-emitting layer 66R, a green light-emitting layer 66G is deposited using a third organic material deposition apparatus, and a blue light-emitting layer 66B is deposited using a fourth organic material deposition apparatus. After the deposition of the light-emitting layers 66R, 66G, and 66B is completed, an electron transport layer 67 is deposited over the entire display area 61 using a fifth deposition apparatus. The electron transport layer 67 is formed as a common layer on the three color light-emitting layers 66R, 66G, and 66B.

[0145] The substrate forming the electron transport layer 67 is moved in the metallic vapor deposition material film forming apparatus, and a film is formed on the cathode 68.

[0146] According to the present invention, before the substrate is adsorbed and held by the electrostatic chuck 24, the corner of the upper surface of the substrate S is pressed by the pressing member 30 to reduce the deflection of the central part of the substrate S.

[0147] Afterwards, it is moved to a plasma CVD device and a protective layer 70 is formed to complete the organic EL display device 60.

[0148] From the moment the substrate S, to which the insulating layer 69 has been patterned, is moved into the film-forming apparatus until the protective layer 70 is formed, the light-emitting layer made of organic EL material may deteriorate due to moisture and oxygen exposure if exposed to an atmosphere containing moisture and oxygen. Therefore, in this example, the moving of the substrate between the film-forming apparatuses is performed in a vacuum atmosphere or an inactive gas atmosphere.

[0149] The above embodiments illustrate one example of the present invention, but the present invention is not limited to the structure of the above embodiments, and can be appropriately modified within the scope of its technical concept.

[0150] This application claims priority based on Japanese Patent Application No. 2023-202138, filed on November 29, 2023, the entire contents of which are incorporated herein by reference.

[0151] Explanation of reference numerals in the attached figures

[0152] 11: Film forming device; 21: Vacuum container; 22: Substrate support unit; 23: Mask support unit; 24: Electrostatic chuck; 24a: Hole; 24b: Block component; 27: Distance adjustment unit; 30: Pressing component; 31: Magnet plate; 32: Control device; 110: Adsorption device; 300: Substrate pressing mechanism.

Claims

1. An adsorption device, characterized by, The adsorption device has the following features: A support unit supports the periphery of the first main surface of the adsorbed body, the adsorbed body having the first main surface and a second main surface on the side opposite to the first main surface; An adsorption component that adsorbs the adsorbed object from the second main surface side of the adsorbed object; as well as A plurality of pressing members are disposed on the adsorption component for pressing the adsorbed object from the second main surface side of the adsorbed object. The plurality of pressing members are respectively disposed at positions corresponding to at least two corners of the plurality of corners of the second main surface of the adsorbed body.

2. An adsorption device, characterized by The adsorption device has the following features: A support unit supports the periphery of the first main surface of the adsorbed body, the adsorbed body having the first main surface and a second main surface on the side opposite to the first main surface; An adsorption component that adsorbs the adsorbed object from the second main surface side of the adsorbed object; as well as A pressing member, disposed on the adsorption component, is used to press the adsorbed object from its second main surface side before the adsorption component adsorbs the object. When viewed from a direction perpendicular to either the first or second main surface, the support area and the pressing area do not overlap. The support area is the region on the first main surface where the support unit supports the adsorbed body, and the pressing area is the region on the second main surface where the pressing member presses the adsorbed body. The pressing member is positioned at a location corresponding to a corner of the second main surface of the adsorbed body.

3. The adsorption device according to claim 1 or 2, characterized in that, The adsorption component includes an adsorbed body pressing mechanism, which comprises: a drive source that generates rotation for moving the pressing member in a vertical direction; a transmission mechanism that transmits the rotation; a conversion unit that converts the rotation transmitted by the transmission mechanism into translational movement; and the pressing member. The pressing member moves along the vertical direction based on the translational direction converted by the conversion part.

4. The adsorption device according to claim 3, characterized in that, The drive source generates rotation in a first direction to move the pressing member vertically downward. The pressing member moves vertically downward based on the rotation in the first direction transmitted by the transmission mechanism, thereby protruding the end of the pressing member from the adsorption surface of the adsorption component on the second main surface side of the adsorption object.

5. The adsorption device according to claim 4, characterized in that, The drive source generates rotation in a second direction to move the pressing member vertically upward. The pressing member moves vertically upward based on the rotation in the second direction transmitted by the transmission mechanism, thereby causing the end of the pressing member protruding from the adsorption surface of the adsorption member to retract from the adsorption surface of the adsorption member.

6. The adsorption device according to claim 3, characterized in that, The adsorption device also includes: A detection component is disposed at the end of the pressing member to detect the contact with the second main surface of the adsorbed body; as well as A control unit that controls the rotational speed and direction of rotation of the drive source based on detection information detected by the detection unit. The control component controls the vertical movement of the pressing member by controlling the rotational speed. The control component controls the movement of the pressing member vertically upward or downward by controlling the rotation direction.

7. The adsorption device according to claim 1 or 2, characterized in that, The adsorption device also includes a distance adjustment component, which adjusts the distance between the adsorbed object supported by the support unit and the adsorption component as the object rises towards the adsorption component. The pressing member presses against the second main surface of the adsorbed body, which has been adjusted by the distance adjustment component.

8. The adsorption device according to claim 6, characterized in that, When the object to be adsorbed is adsorbed onto the adsorption component, the control component causes the pressing member to move along the vertical direction within a first movement range. When the adsorbed object is detached from the adsorption component, the control component causes the pressing member to move along the vertical direction within a second movement range that is larger than the first movement range.

9. The adsorption device according to claim 1 or 2, characterized in that, The pressing member is positioned at all positions corresponding to the corners of the adsorbed body.

10. The adsorption device according to claim 1 or 2, characterized in that, The adsorbed body is rectangular in shape.

11. The adsorption device according to claim 1, characterized in that, When viewed from a direction perpendicular to the first main surface or the second main surface, the support area and the pressing area do not overlap. The support area is the area on the first main surface where the support unit supports the adsorbed body, and the pressing area is the area on the second main surface where the pressing member presses the adsorbed body.

12. The adsorption device according to claim 1 or 2, characterized in that, The adsorption component has a hole formed at a position corresponding to the position of the pressing component.

13. A film forming apparatus characterized by comprising: The film-forming apparatus includes: The adsorption device according to claim 1 or 2; as well as A film-forming component, wherein the film-forming component forms a film on the first main surface of the adsorbed body adsorbed onto the adsorption component.

14. An adsorption method, which is an adsorption method in an adsorption apparatus, characterized by, The adsorption method has the following characteristics: The process of supporting the peripheral portion of the first main surface of the adsorbed body by the supporting unit, wherein the adsorbed body has the first main surface and a second main surface on the side opposite to the first main surface; The process of adsorbing the adsorbent from the second main surface side of the adsorbent; as well as The process of arranging multiple pressing members on the adsorption component and pressing the adsorbed object from the second main surface side of the adsorbed object. The plurality of pressing members are respectively disposed at positions corresponding to at least two corners of the plurality of corners of the second main surface of the adsorbed body.

15. An adsorption method, which is an adsorption method in an adsorption apparatus, characterized by, The adsorption method has the following characteristics: The process of supporting the peripheral portion of the first main surface of the adsorbed body by the supporting unit, wherein the adsorbed body has the first main surface and a second main surface on the side opposite to the first main surface; The process of adsorbing the adsorbent from the second main surface side of the adsorbent; as well as The process of placing a pressing member on the adsorption component and pressing the adsorbed object from the second main surface side of the adsorbed object before the adsorption component adsorbs the adsorbed object. When viewed from a direction perpendicular to either the first or second main surface, the support area and the pressing area do not overlap. The support area is the region on the first main surface where the support unit supports the adsorbed body, and the pressing area is the region on the second main surface where the pressing member presses the adsorbed body. The pressing member is positioned at a location corresponding to a corner of the second main surface of the adsorbed body.

16. A film forming method characterized by, The film-forming method has the following characteristics: The steps of performing the adsorption method according to claim 14 or 15; and A film-forming process is performed on the first main surface of the adsorbed object adsorbed onto the adsorption component.

17. A method for manufacturing an electronic device, characterized in that, Electronic devices are manufactured using the film-forming method of claim 16.

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