SMT soldering flux distribution and spraying method based on regional solder joint density

Abstract

This invention discloses a flux application method for SMT soldering based on regional solder joint density, belonging to the field of surface mount technology. The method includes: S10: acquiring relevant information on the PCB board, including the arrangement of solder joints on the pads, and distinguishing them based on the arrangement, including distinguishing high-density solder joint areas and low-density solder joint areas on the PCB board; S20: collecting relevant data based on the distinction results, including the size of the hole positions corresponding to each solder joint in the high-density and low-density solder joint areas, and the spacing between adjacent hole positions. This invention, by distinguishing between high-density and low-density solder joint areas, dynamically simulates and adjusts the flux dosage for different hole positions, effectively avoiding bridging, cold solder joints, and contamination problems caused by improper flux dosage during the soldering process. It also improves production efficiency and product quality, achieving precise and efficient flux application.

Description

Technical Field

[0001] This invention relates to the field of surface mount technology, and in particular to a method for distributing and spraying SMT soldering flux based on regional solder joint density. Background Technology

[0002] In the SMT soldering process, flux mainly serves to clean / prevent oxidation, carry heat transfer, and reduce surface tension.

[0003] Regarding this research, application CN202410833720.X provides an artificial intelligence-based flux spray control method and medium for wave soldering. The technical solution includes: constructing a finite element model of the welding area based on image features of the welding area image; dividing the welding finite element model; extracting the welding center region of the regular-shaped finite element model; determining the initial geometric and operational properties of the flux spray based on the welding center region; using the initial geometric and operational properties to control the flux spray on the welding finite element model; and reconstructing the spray area image corresponding to the welding spray area. This technical solution can improve the accuracy of flux spray control.

[0004] Another application, CN202311410033.9, provides a method for testing the uniformity of flux spraying. This method includes the following steps: First, a test piece is placed in front of the flux nozzle, with its plane perpendicular to the spraying direction of the nozzle. A uniform layer of test liquid is applied to the surface of the test piece, which reacts with the flux to produce a color change. Second, the valve of the flux nozzle is opened, and flux is continuously sprayed onto the test paper. After spraying, the test piece is removed for observation. Because the flux reacts chemically with the test liquid on the test paper, a color change occurs where the flux is sprayed onto the test paper. By observing the distribution of the color change, the uniformity of flux spraying can be determined. This method provides a simple and intuitive way to determine whether the flux is sprayed uniformly.

[0005] In reality, SMT soldering is used for soldering high-density PCBs (printed circuit boards). However, the above-mentioned technical solutions lack the ability to perceive and dynamically adjust the distribution of solder joints in real time, which leads to a failure to consider the differences in solder joint density in different areas of the PCB. This results in insufficient flux in high-density areas (prone to cold solder joints) and excessive flux in low-density areas (prone to bridging and increased cleaning costs). This not only easily causes contamination but also leads to cost waste. Summary of the Invention

[0006] In view of the problems existing in the field of surface mount technology, the present invention is proposed.

[0007] Therefore, one of the objectives of this invention is to provide an SMT soldering flux distribution spraying method based on regional solder joint density. By distinguishing between high-density and low-density solder joint areas, it dynamically simulates and adjusts the flux dosage at different hole positions, effectively avoiding bridging, cold solder joints, and contamination problems caused by improper flux dosage during the soldering process. At the same time, it improves production efficiency and product quality, and achieves precision and efficiency in flux spraying.

[0008] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0009] This invention provides a method for distributing and spraying SMT soldering flux based on regional solder joint density, comprising the following steps:

[0010] S10: Obtain relevant information on the PCB board, including the arrangement of solder joints on the pads, and make corresponding distinctions based on the arrangement. The distinctions include distinguishing high-density solder joint areas and low-density solder joint areas on the PCB board.

[0011] S20: Collect relevant data based on the differentiation results. The relevant data includes the size of the hole corresponding to each solder joint in the high-density solder joint area and the low-density solder joint area, as well as the interval between adjacent hole positions.

[0012] S30: Simulate flux overflow based on the interval, the simulation steps including:

[0013] Target selection includes selecting two adjacent holes with the smallest interval in the high-density solder joint area, and using holes with the same diameter as reference holes;

[0014] The flux dosage is determined based on the diameter.

[0015] The flux corresponding to the set dosage is sprayed into the reference hole, and the overflow of flux in the reference hole is obtained;

[0016] Based on the overflow situation, relevant calculations are performed, including calculating the overall diameter formed by the flux after overflow;

[0017] S40: Compare based on the overall diameter, the comparison includes comparing the diameter difference between the overall diameter and the diameter, obtaining the edge spacing of the two fluxes based on the overall diameter, and setting a safety threshold for the edge spacing;

[0018] S50: Calculate the amount of flux overflow based on the diameter difference. If the edge spacing between two fluxes is less than the safety threshold due to the overflow amount, the set dose of flux is determined to be an appropriate dose; otherwise, the set dose of flux is determined to be an inappropriate dose.

[0019] S60: If the dosage is determined to be appropriate, when applying flux to a hole with the same diameter as the reference hole at a future time, the amount of flux used should be the same as the appropriate dosage.

[0020] In a preferred embodiment of the present invention, in step S30, the overall diameter formed by the overflowing flux is calculated according to the following formula:

[0021] ;

[0022] In the formula, Indicates the overall diameter formed by the overflowing flux;

[0023] This indicates the volume of flux sprayed into the reference hole.

[0024] This indicates the thickness formed on the surface of the reference hole after flux overflows.

[0025] In a preferred embodiment of the present invention, the following formula is also included:

[0026] ;

[0027] In the formula, Indicates the overall diameter formed by the overflowing flux;

[0028] Indicates the center distance between two reference holes;

[0029] This indicates the distance the flux diffuses outward from the edge of the reference hole.

[0030] In a preferred embodiment of the present invention, dynamic adjustment is performed based on the calculation results, and the steps of the dynamic adjustment are as follows:

[0031] Relevant statistics are performed in the high-density solder joint area, including statistics on holes with diameters greater than and less than the reference hole position;

[0032] Holes with a diameter larger than the reference hole are marked as Type I holes, and holes with a diameter smaller than the reference hole are marked as Type II holes. The diameters corresponding to the Type I and Type II holes are obtained.

[0033] Based on the diameter, a corresponding calculation is performed, which involves dynamically adjusting the amount of flux sprayed on the Type I and Type II holes with the overall diameter as a reference.

[0034] In a preferred embodiment of the present invention, the corresponding calculation is performed according to the following formula:

[0035] ;

[0036] In the formula, The adjustment factor represents the amount of flux applied to the type I hole.

[0037] Indicates the adjustment factor;

[0038] This indicates the diameter of the type I hole.

[0039] This indicates the diameter of the reference hole position;

[0040] ;

[0041] In the formula, The adjustment factor represents the flux dosage for the type II hole.

[0042] For adjustment factors;

[0043] Indicates the diameter of the type II hole;

[0044] This indicates the diameter of the reference hole.

[0045] In a preferred embodiment of the present invention, the flux dosage sprayed on the Type I and Type II holes is calculated based on the calculated dosage adjustment coefficient, as shown below:

[0046] ;

[0047] In the formula, This indicates the amount of flux sprayed onto the Type I hole.

[0048] The adjustment factor represents the amount of flux applied to the type I hole.

[0049] This indicates the amount of flux corresponding to the reference hole position;

[0050] ;

[0051] In the formula, This indicates the amount of flux sprayed onto the type II holes;

[0052] The adjustment factor represents the flux dosage for the type II hole.

[0053] This indicates the amount of flux corresponding to the reference hole position.

[0054] In a preferred embodiment of the present invention, according to the calculation results, when flux is sprayed on any two adjacent holes in the type I hole, if the overall diameter generated by the two adjacent holes causes the edge spacing between the flux of the two holes to exceed the safety threshold, the edge spacing of the two adjacent holes is recorded, and the flux dosage of the hole corresponding to the two adjacent holes is readjusted based on the edge spacing.

[0055] In a preferred embodiment of the present invention, the flux dosage for the holes corresponding to the two adjacent holes is readjusted based on this edge spacing, and calculated according to the following formula:

[0056] ;

[0057] ;

[0058] In the formula, , This indicates the amount of flux applied to holes A and B before adjustment.

[0059] , This indicates the dose at orifice A and orifice B after adjustment;

[0060] Indicates the current edge spacing;

[0061] This represents the security threshold;

[0062] This represents the adjustment factor, used to control the extent of dose reduction.

[0063] A terminal includes a processor, an input interface, an output interface, and a memory, which are interconnected. The memory stores a computer program, which includes program instructions. The processor is configured to invoke the program instructions to execute the method described above.

[0064] A computer-readable storage medium storing a computer program, the computer program including program instructions that, when executed by a processor, cause the processor to perform the method as described above.

[0065] Beneficial effects:

[0066] 1. By distinguishing between high-density and low-density solder joint areas on the PCB board, and simulating the diameter and spacing of holes in different areas (such as reference holes, Type I holes, and Type II holes), the flux dosage can be dynamically adjusted to match the flux requirements of holes of different sizes.

[0067] 2. This invention achieves precision, dynamism, and efficiency in flux spraying through a technical chain of "regional density differentiation - hole size adaptation - overflow simulation - safety threshold control," solving problems such as bridging, incomplete soldering, and contamination caused by improper dosage in traditional methods, while improving production efficiency and product quality. Attached Figure Description

[0068] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0069] Figure 1 This is a schematic diagram of the method flow according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the method flow for step S30 in an embodiment of the present invention. Detailed Implementation

[0070] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention are within the scope of protection of the present invention.

[0071] Because existing technologies lack the ability to perceive and dynamically adjust the distribution of solder joints in real time, they fail to consider the differences in solder joint density in different areas of the PCB board. This results in insufficient flux in high-density areas (prone to cold solder joints) and excessive flux in low-density areas (prone to bridging and increased cleaning costs), which not only easily causes contamination but also leads to cost waste.

[0072] Based on this, the present invention proposes an SMT soldering flux distribution and spraying method based on regional solder joint density. By distinguishing between high-density and low-density solder joint areas, it dynamically simulates and adjusts the flux dosage at different hole positions, effectively avoiding bridging, cold solder joints and contamination problems caused by improper flux dosage during the soldering process. At the same time, it improves production efficiency and product quality, and achieves precision and efficiency in flux spraying.

[0073] The present solution will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0074] Reference Figures 1 to 2 As one embodiment of the present invention, this embodiment provides an SMT soldering flux distribution spraying method based on regional solder joint density, comprising the following steps:

[0075] S10: Obtain relevant information from the PCB board, including the arrangement of solder points on the pads, and make corresponding distinctions based on the arrangement. The distinctions include distinguishing between high-density solder point areas and low-density solder point areas on the PCB board.

[0076] On a PCB board, there are areas of solder joints with different densities. This phenomenon is mainly determined by factors such as circuit design requirements, functional module distribution, and differences in component types.

[0077] S20: Collect relevant data based on the differentiation results. The relevant data includes the size of the hole corresponding to each solder joint in the high-density solder joint area and the low-density solder joint area, as well as the interval between adjacent hole positions.

[0078] S30: Simulation of flux overflow based on intervals. The simulation steps include:

[0079] S301: Select targets, including selecting two adjacent holes with the smallest interval in the high-density solder joint area and holes with the same diameter as reference holes;

[0080] S302: Flux dosage is set based on diameter;

[0081] S303: Apply flux corresponding to the set dosage to the reference hole and obtain the flux overflow situation at the reference hole.

[0082] S304: Perform relevant calculations based on the overflow situation, including calculating the overall diameter formed by the flux after overflow;

[0083] It should be noted that if too much flux is used during welding, it may cause flux overflow, which may have a negative impact on welding quality, equipment and product reliability.

[0084] In the soldering of high-density packaged chips such as BGA (Ball Grid Array) and QFN (Quad Flat No-Leader), the solder joint spacing may be only 0.4mm or even smaller. If too much flux is applied, the solvent in the flux will evaporate rapidly under the high temperature of reflow soldering (usually 240-260℃), causing the liquid flux to expand in volume. If the expansion pressure exceeds the capacity of the gap between the solder joints, the flux may overflow from the solder joints, forming a "bridging" or "climbing" phenomenon.

[0085] Therefore, simulating flux overflow based on intervals has practical significance;

[0086] By simulating flux overflow in specific reference holes in high-density solder joint areas, the overall diameter formed by the overflowing flux is calculated. This step is crucial for the proper distribution of flux, as different density solder joint areas have different flux requirements. Simulating overflow allows for more precise control of the amount of flux used, avoiding negative impacts on soldering quality due to excessive or insufficient flux.

[0087] S40: Compare based on the overall diameter. The comparison includes comparing the overall diameter with the diameter difference between the two fluxes, obtaining the edge spacing of the two fluxes based on the overall diameter, and setting a safety threshold for the edge spacing.

[0088] S50: Calculate the amount of flux overflow based on the diameter difference. If the edge spacing between two fluxes is less than the safety threshold due to the overflow amount, the set flux dosage is determined to be an appropriate dosage; otherwise, the set flux dosage is determined to be an inappropriate dosage.

[0089] S60: If the amount of flux is determined to be appropriate, when applying flux to a hole with the same diameter as the reference hole at a future time, the amount of flux applied shall be the same as the appropriate amount.

[0090] In S30, the overall diameter formed by the overflowing flux is calculated using the following formula:

[0091] ;

[0092] In the formula, Indicates the overall diameter formed by the overflowing flux;

[0093] This indicates the volume of flux sprayed into the reference hole (this volume is calculated based on the flux dosage set in step S30).

[0094] This indicates the thickness formed on the surface of the reference hole after flux overflows.

[0095] In addition to the above, it also includes calculations based on the following formula:

[0096] ;

[0097] In the formula, Indicates the overall diameter formed by the overflowing flux;

[0098] This indicates the center distance between two reference boreholes (this data can be obtained from the interval information of adjacent boreholes collected in step S20).

[0099] This indicates the distance the flux diffuses outward from the edge of the reference hole.

[0100] This distance can be determined experimentally or estimated using empirical formulas. For example, assuming the flux diffusion capability is related to the diameter of the hole... (The size of the hole corresponding to the solder joint collected in step S20) and the viscosity of the flux. A simple empirical formula can be established. ,in, It is an empirical coefficient and needs to be calibrated through experiments;

[0101] Of the two calculation formulas mentioned above, the first formula provides a theoretical benchmark, estimating the ideal diffusion diameter of a single pore site using volume and thickness.

[0102] The second calculation formula introduces practical corrections. When there are adjacent holes, the theoretical value is adjusted by the spacing diffusion distance to reflect the superposition effect in the actual process. Both calculation formulas are used to quantify the flux diffusion range.

[0103] The dynamic adjustment is performed based on the calculation results. The steps for dynamic adjustment are as follows:

[0104] Relevant statistics were performed in the high-density solder joint area, including the number of holes with diameters greater than and smaller than the reference hole.

[0105] Mark holes with diameters larger than the reference hole as Type I holes, and mark holes with diameters smaller than the reference hole as Type II holes, and obtain the diameters corresponding to Type I and Type II holes;

[0106] The corresponding calculation is based on the diameter. The corresponding calculation is to dynamically adjust the amount of flux sprayed on the Type I and Type II holes with the overall diameter as a reference.

[0107] Based on the difference in diameter between different types of holes and the reference hole, the amount of flux sprayed on type I and type II holes is dynamically adjusted to ensure welding quality.

[0108] The corresponding calculation is obtained according to the following formula:

[0109] ;

[0110] In the formula, The adjustment factor for the flux dosage in type I holes;

[0111] This represents the adjustment factor (an empirical value, typically ranging from 0.1 to 0.5), used to control the magnitude of dosage adjustment. Its specific value can be determined experimentally based on actual welding process requirements, flux characteristics, and other factors. For example, if a relatively conservative dosage adjustment is desired, then... A smaller value can be chosen; if more flexibility is desired to adapt to changes in the hole diameter, then... (A larger value can be taken).

[0112] The diameter of the Type I hole is indicated (obtained by statistically analyzing the holes with a diameter larger than the reference hole diameter in the high-density solder joint area).

[0113] Indicates the diameter of the reference hole position;

[0114] ;

[0115] In the formula, The adjustment factor for the flux dosage in type II holes;

[0116] An adjustment factor (its value typically ranges from 0.1 to 0.5, and is determined experimentally based on actual welding conditions) is used. Its function is similar to... Similarly, it is used to control the range of flux dosage adjustment for Type II holes.

[0117] Indicates the diameter of the type II hole;

[0118] Indicates the diameter of the reference hole position.

[0119] Based on the calculated dosage adjustment factor, calculate the flux dosage sprayed on Type I and Type II holes, as shown below:

[0120] ;

[0121] In the formula, This indicates the amount of flux applied to the Type I holes;

[0122] The adjustment factor for the flux dosage in type I holes;

[0123] Indicates the amount of flux corresponding to the reference hole position;

[0124] ;

[0125] In the formula, This indicates the amount of flux applied to the type II holes;

[0126] The adjustment factor for the flux dosage in type II holes;

[0127] This indicates the amount of flux corresponding to the reference hole position.

[0128] According to the calculation results, when applying flux to any two adjacent holes in Type I holes, if the overall diameter of these two adjacent holes causes the edge spacing between the flux in the two holes to exceed the safety threshold, then the edge spacing between these two adjacent holes is recorded, and the flux dosage of the holes corresponding to these two adjacent holes is readjusted based on this edge spacing.

[0129] During the flux spraying process for PCB solder holes, if the flux edge spacing between adjacent holes exceeds the safety threshold, the dosage needs to be dynamically adjusted using a mathematical model to ensure that the spacing complies with regulations.

[0130] Based on this edge spacing, the flux dosage for the holes corresponding to the two adjacent holes is readjusted and calculated according to the following formula:

[0131] ;

[0132] ;

[0133] In the formula, , This indicates the amount of flux applied to holes A and B before adjustment.

[0134] , This indicates the dose at orifice A and orifice B after adjustment;

[0135] Indicates the current edge spacing;

[0136] Indicates the safety threshold;

[0137] This represents the adjustment factor, used to control the extent of dose reduction;

[0138] when > When the dosage is reduced, the reduction amount is proportional to the percentage of over-limit. Proportional;

[0139] and This is used to balance and adjust speed and stability, and to avoid poor welding caused by a sudden decrease in dosage.

[0140] A terminal includes a processor, an input interface, an output interface, and a memory, which are interconnected. The memory stores a computer program, which includes program instructions. The processor is configured to invoke the program instructions to execute the method described above.

[0141] A computer-readable storage medium storing a computer program, the computer program including program instructions that, when executed by a processor, cause the processor to perform the method as described above.

[0142] In summary, by distinguishing between high-density and low-density solder joint areas and dynamically simulating and adjusting the flux dosage at different hole positions, this invention effectively avoids bridging, incomplete soldering, and contamination problems caused by improper flux dosage during the soldering process. At the same time, it improves production efficiency and product quality, achieving precision and efficiency in flux spraying.

[0143] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A method for distributing and spraying SMT soldering flux based on regional solder joint density, characterized in that, Includes the following steps: S10: Obtain relevant information on the PCB board, including the arrangement of solder joints on the pads, and make corresponding distinctions based on the arrangement. The distinctions include distinguishing high-density solder joint areas and low-density solder joint areas on the PCB board. S20: Collect relevant data based on the differentiation results. The relevant data includes the size of the hole corresponding to each solder joint in the high-density solder joint area and the low-density solder joint area, as well as the interval between adjacent hole positions. S30: Simulate flux overflow based on the interval, the simulation steps including: Target selection includes selecting two adjacent holes with the smallest interval in the high-density solder joint area, and using holes with the same diameter as reference holes; The flux dosage is determined based on the diameter. The flux corresponding to the set dosage is sprayed into the reference hole, and the overflow of flux in the reference hole is obtained; Based on the overflow situation, relevant calculations are performed, including calculating the overall diameter formed by the flux after overflow; S40: Compare based on the overall diameter, the comparison includes comparing the diameter difference between the overall diameter and the diameter, obtaining the edge spacing of the two fluxes based on the overall diameter, and setting a safety threshold for the edge spacing; S50: Calculate the amount of flux overflow based on the diameter difference. If the edge spacing between two fluxes is less than the safety threshold due to the overflow amount, the set dose of flux is determined to be an appropriate dose; otherwise, the set dose of flux is determined to be an inappropriate dose. S60: If the dosage is determined to be appropriate, when applying flux to a hole with the same diameter as the reference hole at a future time, the amount of flux used should be the same as the appropriate dosage.

2. The SMT soldering flux distribution and spraying method based on regional solder joint density as described in claim 1, characterized in that, In step S30, the overall diameter formed by the overflowing flux is calculated using the following formula: ； In the formula, Indicates the overall diameter formed by the overflowing flux; This indicates the volume of flux sprayed into the reference hole. This indicates the thickness formed on the surface of the reference hole after flux overflows.

3. The SMT soldering flux distribution and spraying method based on regional solder joint density as described in claim 2, characterized in that, It also includes calculations based on the following formula: ； In the formula, Indicates the overall diameter formed by the overflowing flux; Indicates the center distance between two reference holes; This indicates the distance the flux diffuses outward from the edge of the reference hole.

4. The SMT soldering flux distribution and spraying method based on regional solder joint density as described in any one of claims 2 to 3, characterized in that, The dynamic adjustment is performed based on the calculation results, and the steps of the dynamic adjustment are as follows: Relevant statistics are performed in the high-density solder joint area, including statistics on holes with diameters greater than and less than the reference hole position; Holes with a diameter larger than the reference hole are marked as Type I holes, and holes with a diameter smaller than the reference hole are marked as Type II holes. The diameters corresponding to the Type I and Type II holes are obtained. Based on the diameter, a corresponding calculation is performed, which involves dynamically adjusting the amount of flux sprayed on the Type I and Type II holes with the overall diameter as a reference.

5. The SMT soldering flux distribution and spraying method based on regional solder joint density as described in claim 4, characterized in that, The corresponding calculation is obtained according to the following formula: ； In the formula, The adjustment factor represents the flux dosage for the type I hole. Indicates the adjustment factor; This indicates the diameter of the type I hole. This indicates the diameter of the reference hole position; ； In the formula, The adjustment factor represents the flux dosage for the type II hole. For adjustment factors; Indicates the diameter of the type II hole; This indicates the diameter of the reference hole.

6. The SMT soldering flux distribution and spraying method based on regional solder joint density as described in claim 5, characterized in that, Based on the calculated dosage adjustment factor, the dosage of flux sprayed on the Type I and Type II holes is calculated as follows: ； In the formula, This indicates the amount of flux sprayed onto the Type I hole. The adjustment factor represents the flux dosage for the type I hole. This indicates the amount of flux corresponding to the reference hole position; ； In the formula, This indicates the amount of flux sprayed onto the type II holes; The adjustment factor represents the flux dosage for the type II hole. This indicates the amount of flux corresponding to the reference hole position.

7. The SMT soldering flux distribution and spraying method based on regional solder joint density as described in claim 6, characterized in that, Based on the calculation results, when applying flux to any two adjacent holes in the Type I hole, if the overall diameter of these two adjacent holes causes the edge spacing between the flux in the two holes to exceed the safety threshold, then the edge spacing between these two adjacent holes is recorded, and the flux dosage for the holes corresponding to these two adjacent holes is readjusted based on this edge spacing.

8. The SMT soldering flux distribution and spraying method based on regional solder joint density as described in claim 7, characterized in that, Based on this edge spacing, the flux dosage for the holes corresponding to the two adjacent holes is readjusted and calculated according to the following formula: ； ； In the formula, , This indicates the amount of flux applied to holes A and B before adjustment. , This indicates the dose at orifice A and orifice B after adjustment; Indicates the current edge spacing; This represents the security threshold; This represents the adjustment factor, used to control the extent of dose reduction.

9. A terminal, characterized in that, The system includes a processor, an input interface, an output interface, and a memory, which are interconnected. The memory is used to store a computer program, which includes program instructions. The processor is configured to invoke the program instructions to execute the method as described in any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, the computer program including program instructions that, when executed by a processor, cause the processor to perform the method as described in any one of claims 1 to 8.

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