Encapsulation structure of optoelectronic module, optoelectronic module assembly, and optoelectronic module

Abstract

This invention provides a packaging structure for an optoelectronic module, including a rigid-flex board (1) and a housing (2). The rigid-flex board (1) includes a DC flexible board (12) with a DC interface, an RF flexible board (14) with an RF interface, and a rigid board (16). The tails of the DC flexible board (12) and the RF flexible board (14) are connected by pressing together with the rigid board (16). The rigid-flex board bonding area at the tail of the rigid-flex board (1) is welded and fixed to the housing (2). The tail of the rigid-flex board (1) enters the interior of the housing (2). A gold wire bonding area (19) is provided on the rigid-flex board (1) inside the housing (2). This invention also provides an optoelectronic module assembly using the above-mentioned packaging structure and an optoelectronic module. This invention designs a rigid-flex board for signal transmission and directly connects the rigid-flex board to the housing to participate in gold wire bonding, which not only meets the multi-channel, small-size requirements of the optoelectronic module assembly but also solves the problem of poor isolation between channels in the original transition substrate.

Description

Technical Field

[0001] This invention relates to the fields of quantum communication, quantum computing, lidar, etc., specifically to a packaging structure for an optoelectronic module, an optoelectronic module assembly, and an optoelectronic module. Background Technology

[0002] In existing optoelectronic modules, the function of the optical transmitting unit (TOSA) is to convert electrical signals into optical signals and transmit them through optical fiber, while the function of the optical receiving unit (ROSA) is to receive the optical signals transmitted through the optical fiber and convert them back into electrical signals. Both TOSA and ROSA modules are generally packaged in TO, BOX, or butterfly packages, with one end being an electrical interface and the other an optical interface. To meet the requirements of higher transmission speeds, the form of the electrical interface is constantly being improved. However, existing electrical interfaces are all built into the housing to achieve both the hermeticity of the housing and the transfer of electrical signals.

[0003] To ensure high bandwidth and high isolation, the electrical interface uses an RF connector integrated with the housing. However, in multi-channel optoelectronic module assembly schemes, the overall size of the optoelectronic module is difficult to reduce due to the size limitations of the RF connector. Therefore, to reduce the overall size, existing solutions use a transition substrate to connect the electrical signals inside and outside the cavity in applications where isolation requirements are not high, such as... Figure 1 and Figure 2 As shown, this ensures the requirements for multi-channel packaging and small size.

[0004] To simultaneously meet the technical requirements of small size and high transmission frequency, existing multi-channel optoelectronic module packages utilize a transition substrate sintered with the housing to provide a microstrip line interface. The electrical signal connection between the packaged optoelectronic module and the PCB board is achieved through an FPC board (…). Figure 1 Or gold wire bonding ( Figure 2 Connect using the following method:

[0005] Impedance discontinuities exist at the connection points between the FPC board and the casing, as well as between the FPC board and the PCB board, leading to bandwidth reduction in high-frequency signal processing. Furthermore, these connections are primarily achieved through soldering, raising reliability concerns. Additionally, conventional methods at these connections cannot achieve complete isolation of the transmission lines, limiting isolation to a maximum of 30dB@10G bandwidth. While gold wire bonding uses only one connection point on each surface, the exposed gold wires in the casing result in poor reliability in practical applications unless overall potting is performed, which increases process complexity. Moreover, the need for gold wire bonding exposes the transmission lines on both the PCB and the casing's transition substrate, indirectly hindering the achievement of high isolation levels for the optoelectronic module assembly. Summary of the Invention

[0006] The technical problem to be solved by this invention is how to improve the isolation between channels of a multi-channel optoelectronic module.

[0007] The present invention solves the above-mentioned technical problems through the following technical means: a packaging structure for an optoelectronic module, including a rigid-flex board (1) and a housing (2). The rigid-flex board (1) includes a DC flexible board (12) containing a DC interface, an RF flexible board (14) containing an RF interface, and a rigid board (16). The tails of the DC flexible board (12) and the RF flexible board (14) are pressed together by the rigid board (16). The rigid-flex board bonding area at the tail of the rigid-flex board (1) is welded and fixed to the housing (2). The tail of the rigid-flex board (1) enters the interior of the housing (2). A gold wire bonding area (19) is provided on the rigid-flex board (1) inside the housing (2).

[0008] As a further optimized technical solution, the contact surface between the flexible and rigid plate bonding area at the tail of the flexible and rigid plate (1) and the shell (2) is metallized to form a metallized area (18), and the flexible and rigid plate (1) is welded to the shell (2) through the metallized area (18).

[0009] As a further optimized technical solution, the tube shell (2) is provided with an installation groove (21) inside, and an optical fiber through hole (22) is opened at the rear of the tube shell (2).

[0010] As a further optimized technical solution, the DC flexible board (12) and the RF flexible board (14) are arranged vertically, and except for the tail pressing area, the other parts between the DC flexible board (12) and the RF flexible board (14) are suspended in the middle.

[0011] As a further optimized technical solution, the gold wire binding area (19) is set in a stepped shape, with the upper layer of the stepped shape being the signal connection area of ​​the DC flexible board (12) and the lower layer of the stepped shape being the signal connection area of ​​the RF flexible board (14).

[0012] As a further optimized technical solution, the signal wiring of the RF flexible board (14) is set as a three-layer board, with the top and bottom layers being ground planes and the middle layer being the signal line.

[0013] As a further optimized technical solution, the intermediate layer signal of the RF flexible board (14) is routed in the manner of coplanar waveguide GSG, and the signal lines are shielded by vias.

[0014] As a further optimized technical solution, in the RF flexible board (14) and DC flexible board (12), the signal lines of the front thermoforming area (13) are routed on the upper surface of the RF flexible board (14) and DC flexible board (12), and the pads on the upper surface of the RF flexible board (14) and DC flexible board (12) are wrapped with a ground plane.

[0015] As a further optimized technical solution, the DC flexible board (12) and the RF flexible board (14) have different lengths.

[0016] The present invention also provides an optoelectronic module assembly with an optoelectronic module packaging structure using any of the above-described schemes, including a rigid-flex board (1), a housing (2), and a multi-channel optical transmitting or receiving component group placed inside the housing (2). The optical transmitting or receiving component group is electrically connected to the gold wire bonding area (19) at the tail of the rigid-flex board (1) by gold wire bonding. The optical transmitting or receiving component group is optically connected through an optical fiber via (22) opened at the rear of the housing (2).

[0017] The present invention also provides an optoelectronic module, including a multi-channel optical transmitting component and a multi-channel optical receiving component using the packaging structure of an optoelectronic module as described in any of the above-described schemes;

[0018] The optical transmission assembly includes a rigid-flex board (1), a housing (2), and an optical transmission component group placed inside the housing (2). The optical transmission component group is electrically connected to the gold wire bonding area (19) at the tail of the rigid-flex board (1) through gold wire bonding. The optical transmission component group is connected to the optical fiber through the optical fiber via (22) opened at the rear of the housing (2).

[0019] The optical receiving assembly includes a rigid-flex PCB (1), a housing (2), and an optical receiving component group placed inside the housing (2). The optical receiving component group is electrically connected to the gold wire bonding area (19) at the tail of the rigid-flex PCB (1) through gold wire bonding. The optical receiving component group is connected to the optical fiber through the optical fiber via (22) opened at the rear of the housing (2).

[0020] The advantages of this invention are:

[0021] 1) This invention designs a rigid-flex board for signal transmission and directly connects the rigid-flex board to the housing to participate in gold wire bonding. This not only ensures the multi-channel, small-size requirements of the optoelectronic module assembly, but also solves the problem of poor isolation between channels in the original transition substrate.

[0022] 2) In this invention, the contact position between the rigid-flex board and the housing is metallized to ensure the airtightness of the optoelectronic module, which is suitable for optical transmitting components and optical receiving components.

[0023] 3) The external electrical interface of the rigid-flex board is designed with a two-layer structure, namely a DC interface flexible board and an RF interface flexible board, which are of different lengths to facilitate external installation.

[0024] 4) This invention also proposes a multi-channel high-isolation optical transmitting component and an optical receiving component. The DC flexible board and RF flexible board of the rigid-flex board participate in the signal connection inside the housing, respectively. Ground planes are designed on the top and bottom layers of the ceramic substrate and connected by vias to further improve the isolation between channels. Attached Figure Description

[0025] Figure 1 This is a structural diagram of an existing optoelectronic module assembly that uses a transition substrate packaging method and an FPC board for electrical connection.

[0026] Figure 2 This is a structural diagram of an existing optoelectronic module assembly that uses a transition substrate packaging method and gold wire bonding for electrical connection.

[0027] Figure 3 This is an overall cross-sectional view of the rigid-flex PCB encapsulation method used in this embodiment of the invention;

[0028] Figure 4 This is a structural diagram of the rigid-flex plate in an embodiment of the present invention;

[0029] Figure 5 This is a structural diagram of the TOSA component in an embodiment of the present invention;

[0030] Figure 6 This is an internal cross-sectional view of the TOSA component in an embodiment of the present invention;

[0031] Figure 7This is a layout diagram of the components in each channel of the TOSA component in an embodiment of the present invention;

[0032] Figure 8 This is a structural diagram of the ROSA component in an embodiment of the present invention;

[0033] Figure 9 This is an internal cross-sectional view of the ROSA component in an embodiment of the present invention;

[0034] Figure 10 This is a layout diagram of the components in each channel of the ROSA component in an embodiment of the present invention;

[0035] Figure 11 This is a connection diagram of the optoelectronic module assembly and PCB using a rigid-flex PCB packaging in an embodiment of the present invention. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] It should be noted that, unless otherwise specified, the following embodiments and features can be combined with each other. Furthermore, the illustrations provided in the following embodiments are merely schematic representations of the basic concept of the invention. The illustrations only show components relevant to the invention and are not drawn according to the actual number, shape, and size of the components in implementation. In actual implementation, the form, quantity, and proportion of each component can be arbitrarily changed, and the component layout may be more complex.

[0038] It should be noted that the directional terms mentioned in the embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings and are not intended to limit the scope of protection of this disclosure. Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or constructions will be omitted where they may cause confusion in understanding this disclosure.

[0039] The use of ordinal numbers such as "first," "second," "third," etc., in the specification and claims to modify the corresponding elements does not imply that the element has any ordinal number, nor does it represent the order of one element with another element, or the order of manufacturing methods. The use of these ordinal numbers is only to enable a named element to be clearly distinguished from another element with the same name.

[0040] Example 1

[0041] This embodiment proposes a multi-channel optoelectronic module assembly with an integrated FPC flexible board and housing packaging method, suitable for packaging multi-channel array optical transmitting and receiving components. For high-speed transceiver components, their external electrical interfaces are divided into DC interfaces and RF (radio frequency) interfaces. In this embodiment, the DC interface and RF interface are respectively fabricated on two FPC flexible boards. The two FPC flexible boards are laminated together at the rear middle by a rigid board (such as FR4, the material of the rigid board is not limited), such as... Figure 3 and Figure 4 As shown, a rigid-flex board 1 containing both DC and RF interfaces is formed. A metallized area 18 is formed at the contact surface between the rigid-flex board 1 and the housing 2 at the rear of the rigid-flex board 1, facilitating welding between the rigid-flex board 1 and the housing 2 and ensuring airtightness. The rear of the rigid-flex board 1 enters the housing 2, where it participates in gold wire bonding. A mounting slot 21 is provided inside the housing 2 to accommodate transceiver components, and a fiber optic via 22 is provided at the rear of the housing 2 for fiber optic connection.

[0042] The rigid-flex board 1 includes a DC flexible board 12, an RF flexible board 14, and a rigid board 16 arranged vertically. The DC flexible board 12 and the RF flexible board 14 are pressed together at their ends by the rigid board 16, while the rest of the DC flexible board 12 and the RF flexible board 14 are suspended in the middle. The rigid board 16 mainly provides support for the two flexible boards and can participate in the encapsulation of the housing 2. Metallization is performed around the pressing area of ​​the rigid-flex board 1 to form a metallized area 18, which facilitates welding with the housing 2 and ensures the airtightness of the housing 2.

[0043] A gold wire bonding area 19 is provided at the tail of the rigid-flex board 1 inside the housing 2. The gold wire bonding area 19 is stepped. The upper layer of the stepped area is the signal connection area of ​​the DC flexible board 12, which can realize the signal connection of DC bias signal, thermoelectric cooler (TEC) drive signal, thermistor, and backlight detector. Only the connectivity and current carrying capacity need to be ensured. The lower layer of the stepped area is the connection area of ​​the RF flexible board 14 for radio frequency signals. The signal wiring of the RF flexible board 14 is set as a three-layer board. The top and bottom layers are ground planes, and the middle layer is for signal lines. The signals in the middle layer are routed in the manner of coplanar waveguide GSG. The signal lines are shielded by vias to ensure the isolation between signals inside the RF flexible board 14. In the RF flexible board 14 and DC flexible board 12, the signal lines of the front thermoforming area 13 will be routed on the upper surface of the RF flexible board 14 and DC flexible board 12. Therefore, in order to avoid the risk of signal leakage when connected to the user's PCB board, the pads on the upper surface of the RF flexible board 14 and DC flexible board 12 are also wrapped with a ground plane.

[0044] Example 2

[0045] This embodiment provides a TOSA component employing the rigid-flex PCB 1 structure and the rigid-flex PCB 1 and housing 2 encapsulation structure described in Embodiment 1, which can achieve a modulation bandwidth of up to 10 GHz.

[0046] like Figure 5 and Figure 6 As shown, the TOSA assembly includes a rigid-flex board 1, a housing 2, and an optical transmitting component group placed inside the mounting slot 21 of the housing 2. The optical transmitting component group is electrically connected to the gold wire bonding area 19 at the tail of the rigid-flex board 1 through gold wire bonding. The optical transmitting component group is connected to the optical fiber through the optical fiber via 22 opened at the rear of the housing 2.

[0047] The optical transmission component assembly includes a multi-channel RF signal modulation component, a ceramic substrate 32, a TEC module 33, and a thermistor 34. Each channel of the multi-channel RF signal modulation component can achieve independent RF signal modulation. Taking an 8-channel RF signal modulation component as an example, each channel includes an independent DFB (Distributed Feedback Semiconductor Laser) chip 312, a backlight detector 314, a lens 316, an isolator 317, an FA fiber (optical fiber array) 318, and an independent transmission line. The lens 316, isolator 317, and FA fiber 318 are sequentially arranged along the optical path behind the DFB chip 312. The DFB chip 312, backlight detector 314, and thermistor 34 are all mounted on the ceramic substrate 32, as shown in the specific layout. Figure 7 As shown, during the design process, the light-emitting area of ​​the DFB chip 312 is coaxial with the optical path at the rear end to ensure maximum optical coupling efficiency. Furthermore, the ceramic substrate 32, lens 316, isolator 317, and FA fiber 318 are all mounted on the TEC module 33, which is installed at the bottom of the mounting slot 21 in the housing 2. The entire optical transmission component group uses a single TEC module 33 and a thermistor 34 to achieve the internal temperature control requirements of the cavity.

[0048] The connection description of DC flexible board 12 and RF flexible board 14 of the rigid-flex board 1 in the TOSA assembly to the optical transmission component group inside the housing 2 is as follows:

[0049] Connection structure between DC flexible board 12 and optical transmitting component group:

[0050] 1) The DC flexible board 12 is connected to the backlight detector 314 by gold wire bonding to transmit the detection current signal of the backlight detector 314.

[0051] 2) Connect the DC flexible board 12 to the positive and negative terminals of the TEC module 33 by gold wire bonding to provide the drive current for the TEC module 33;

[0052] 3) The DC flexible board 12 is connected to the thermistor 34 by gold wire bonding to realize the temperature detection inside the tube shell 2.

[0053] Connection structure between RF flexible board 14 and optical transmitting component group:

[0054] The RF flexible board 14 is connected to the ceramic substrate 32 by gold wire bonding. The ceramic substrate 32 is connected to the DFB chip 312. The radio frequency signal drives the DFB chip 312 through the RF flexible board 14 and the ceramic substrate 32. After the DFB chip 312 converts the input radio frequency signal into an optical signal, the optical signal is output from the fiber optic via 22 through the lens 316, the isolator 317 and the FA optical fiber 318.

[0055] In this invention, the ceramic substrate 32 serves as the carrier of the DFB chip 312 and the transmission device for radio frequency signals. To reduce crosstalk between radio frequency signals in each channel, improve the stability of the ground plane on the ceramic substrate 32, and reduce the impact of ground plane fluctuations on the isolation of radio frequency signal S transmission, the TOP layer (top layer) is designed in the form of a coplanar waveguide GSG. A ground plane G is laid on the BOTTOM layer (bottom layer), and the ground planes of the TOP layer and the BOTTOM layer are connected by vias. At the same time, the sides of the ceramic substrate 32 are metallized to connect the ground planes of the TOP layer and the BOTTOM layer, further improving the isolation between module channels.

[0056] Compared to traditional solutions, the TOSA component proposed in this invention does not have a transition substrate design on the casing. Instead, the rigid-flex board 1 is directly connected to the inside of the casing 2, participating in gold wire bonding and hermetic encapsulation. This maximizes the low transmission loss of RF signals while also facilitating the design of isolation, achieving a high level of isolation.

[0057] The assembly of the TOSA component includes the following steps:

[0058] 1) The rigid-flexible bonding plate 1 is connected to the tube shell 2 by welding;

[0059] 2) Weld (or bond) the bottom surface of the internal TEC module 33 to the shell 2, ensuring the thermal conductivity is adequate;

[0060] 3) The ceramic substrate 32 is mounted on the upper surface of the TEC module 33 and close to the rigid-flex board 1, and is kept horizontal with the RF flexible board 14 of the rigid-flex board 1, in order to reduce the length of the gold wire bonding leads and ensure radio frequency performance.

[0061] 4) Install DFB chip 312 and thermistor 34 on ceramic substrate 32 respectively (by means of bonding with conductive adhesive or eutectic bonding);

[0062] 5) The corresponding signals are connected by gold wire bonding, including the ceramic substrate 32 being connected to the RF flexible board 14 of the rigid-flex board 1, the DC flexible board 12 of the rigid-flex board 1 being connected to the TEC module 33 and the thermistor 34, and the ceramic substrate 32 being connected to the DFB chip 312.

[0063] 6) Power is supplied to the DFB chip 312 through the RF board 14 of the rigid-flex board 1, causing the DFB chip 312 to emit light. Optical path coupling calibration is performed on the subsequent optical path using a coupling alignment frame. The optical power value after coupling is observed using an optical power meter. When the optical power is at its maximum, coupling is complete. Then, the lens 316, isolator 317, and FA fiber 318 are fixed to the upper surface of the TEC module 33 with adhesive. The FA fiber 318 extends to the outside of the cavity through the fiber optic via 22, which is then sealed with adhesive. Alternatively, if the FA fiber 318 is metallized, the fiber optic via can also be sealed with solder.

[0064] 7) Install the backlight detector 314 and complete the electrical signal connection through gold wire bonding;

[0065] 8) Install the top cover to complete product assembly.

[0066] Example 3

[0067] This embodiment provides a ROSA assembly employing the rigid-flex PCB 1 structure and the rigid-flex PCB 1 and housing 2 encapsulation structure described in Embodiment 1.

[0068] like Figure 8 and Figure 9 As shown, the ROSA assembly includes a rigid-flex board 1, a housing 2, and an optical receiving component group placed inside the mounting slot 21 of the housing 2. The optical receiving component group is electrically connected to the gold wire bonding area 19 at the tail of the rigid-flex board 1 through gold wire bonding. The optical receiving component group is connected to the optical fiber through the optical fiber via 22 opened at the rear of the housing 2.

[0069] The optical receiving component assembly includes multiple signal transmission channels, a ceramic substrate 42, a TEC module 43, and a thermistor 44. Taking an 8-channel signal transmission channel as an example, each channel includes a PD (photodetector) chip 412, an integrated resistor-capacitor circuit 413, an FA fiber (optical fiber array) 414, and an independent transmission line. The PD chip 412, the integrated resistor-capacitor circuit 413, and the thermistor 44 are all mounted on the ceramic substrate 42, as shown in the specific layout. Figure 10As shown, the ceramic substrate 42 and the FA optical fiber 414 are both mounted on the TEC module 43, which is mounted at the bottom of the mounting slot 21 of the housing 2. The entire optical receiving component group uses a TEC module 43 and a thermistor 44 to achieve the internal temperature control requirements of the cavity. The externally input optical signal is directly coupled to the photosensitive surface of the PD chip 412 through the FA optical fiber 414. After receiving the optical signal, the PD chip 412 converts it into an electrical signal, which is then output through the ceramic substrate 42 and the RF flexible board 14.

[0070] The PD chip 412 can be made of InGaAs / InP material and coplanar GS electrodes. This chip is suitable for optical receiver applications, with an operating data rate of up to 10Gbps, and can transmit optical signals with wavelengths from 920nm to 1650nm in single-mode optical fiber. The integrated RC circuit 413 includes a resistor and a capacitor connected in series.

[0071] The connection between the DC flexible board 12 and RF flexible board 14 of the rigid-flex board 1 in the ROSA assembly and the optical transmitting component group inside the housing 2 is described as follows:

[0072] Connection structure between DC flexible board 12 and optical transmitting component group:

[0073] 1) The DC flexible board 12 is connected to the resistor terminal of the integrated RC circuit 413 by gold wire bonding. The capacitor terminal of the integrated RC circuit 413 is grounded. The node between the resistor and the capacitor is connected to the negative terminal of the PD chip 412 by gold wire bonding to provide a DC bias signal.

[0074] 2) Connect the DC flexible board 12 to the positive and negative terminals of the TEC module 43 by gold wire bonding to provide the drive current for the TEC module 43;

[0075] 3) The DC flexible board 12 is connected to the thermistor 44 by gold wire bonding to realize the temperature detection inside the tube shell 2.

[0076] Connection structure between RF flexible board 14 and optical transmitting component group:

[0077] The RF flexible board 14 is connected to the ceramic substrate 42 by gold wire bonding, and the ceramic substrate 42 is connected to the positive terminal of the PD chip 412 by gold wire bonding. After the external optical signal is coupled to the PD chip 412 through the FA optical fiber 414, it is converted into an electrical signal, and then the electrical signal is output through the ceramic substrate 42 and the RF flexible board 14.

[0078] Compared to traditional solutions, the ROSA component packaging proposed in this invention does not use a transition substrate on the casing. Instead, the rigid-flex board 1 is directly integrated into the casing 2 to participate in gold wire bonding and hermetic encapsulation. This maximizes the low transmission loss of RF signals while also facilitating isolation design, achieving a high level of isolation.

[0079] The assembly method of the ROSA component is basically the same as that of the TOSA component. The main difference is that the DFB chip 312 is replaced with the PD chip 412, and there is only FA fiber 414 in the subsequent optical path. There is no backlight detector 314 on the ceramic substrate 42. The assembly method of the ROSA component includes the following steps:

[0080] 1) The rigid-flexible bonding plate 1 is connected to the tube shell 2 by welding;

[0081] 2) Weld the internal TEC module 43 to the shell 2 (or bond it, as long as the thermal conductivity is guaranteed);

[0082] 3) The ceramic substrate 42 is mounted on the upper surface of the TEC module 43, close to the rigid-flex board 1, and kept horizontal with the RF flexible board 14 of the rigid-flex board 1, in order to reduce the length of the gold wire bonding leads and ensure radio frequency performance.

[0083] 4) Install the PD chip 412 and the thermistor 44 on the ceramic substrate 42 at the specified positions (by means of bonding with conductive adhesive or eutectic bonding);

[0084] 5) The corresponding signals are connected by gold wire bonding, mainly including the connection of the ceramic substrate 42 to the RF flexible board 14 of the rigid-flex board 1, the connection of the DC flexible board 12 of the rigid-flex board 1 to the TEC module 43, the thermistor 44, and the integrated RC circuit 413, the connection of the ceramic substrate 42 to the PD chip 412, and the connection of the PD chip 412 to the integrated RC circuit 413.

[0085] 6) Apply a bias voltage to the PD chip 412 via the DC board 12 of the rigid-flex board 1 for coupling calibration. In this invention, a source meter is used to apply pressure, and the photocurrent of the PD chip 412 can be observed simultaneously to ensure the PD chip 412 is in working condition. Input a test optical signal through the tail flange of the FA fiber 414, and perform optical path coupling calibration by moving the FA fiber 414 via the coupling adjustment frame. Observe the photocurrent value of the source meter. When the photocurrent value is the maximum, it indicates that the coupling is complete. Then, use glue to fix the FA fiber 414 to the upper surface of the TEC module 43. The FA fiber 414 extends to the outside of the cavity through the fiber optic via 22, and then the fiber optic via 22 is sealed with glue. Alternatively, if the FA fiber 414 is metallized, the fiber optic via 22 can also be sealed with solder.

[0086] 7) Install the top cover to complete product assembly.

[0087] Example 4

[0088] This embodiment provides an application of an optoelectronic module assembly. ROSA and TOSA components are formed using the packaging methods proposed in Embodiments 2 and 3, thereby assembling an optoelectronic module assembly. The external electrical interface of the optoelectronic module assembly is a microstrip line radio frequency interface designed according to its characteristic impedance, such as… Figure 11 As shown, it needs to be connected to the user's PCB board 100 by direct soldering, for example, using a thermoforming process. Furthermore, the DC flexible board 12 and RF flexible board 14 on the optoelectronic module assembly are soldered to the front and back sides of the PCB board 100, respectively.

[0089] The DC flexible board 12 and RF flexible board 14 of the rigid-flex board 1 have different lengths because it is designed so that users can use through-hole technology in the soldering area when designing the PCB board 100. Otherwise, since there are pads on both sides of the PCB board 100, through-holes cannot be designed when routing high-density traces, and only buried blind holes can be used, which will increase the manufacturing process of the PCB board 100.

[0090] In addition, the external signal line interface on the RF flexible board 14 adopts the method of the signal line being wrapped by the external ground plane. In this way, after the RF flexible board 14 is soldered to the PCB board 100, the signal line will be included in the ground plane, forming effective signal isolation.

[0091] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A packaging structure for an optoelectronic module, characterized in that, The device includes a rigid-flex board (1) and a housing (2). The rigid-flex board (1) includes a DC flexible board (12) with a DC interface, an RF flexible board (14) with an RF interface, and a rigid board (16). The tail ends of the DC flexible board (12) and the RF flexible board (14) are pressed together by the rigid board (16). The rigid-flex board bonding area at the tail end of the rigid-flex board (1) is welded and fixed to the housing (2). The tail end of the rigid-flex board (1) enters the interior of the housing (2). A gold wire bonding area (19) is provided on the rigid-flex board (1) inside the housing (2).

2. The packaging structure of an optoelectronic module as described in claim 1, characterized in that, The contact surface between the flexible and rigid plate bonding area at the tail of the flexible and rigid plate (1) and the shell (2) is metallized to form a metallized area (18), and the flexible and rigid plate (1) is welded to the shell (2) through the metallized area (18).

3. The packaging structure of an optoelectronic module as described in claim 1, characterized in that, The tube shell (2) is provided with an installation groove (21) inside, and an optical fiber through hole (22) is provided at the rear of the tube shell (2).

4. The packaging structure of an optoelectronic module as described in claim 1, characterized in that, The DC flexible board (12) and the RF flexible board (14) are arranged vertically, and except for the tail pressing area, the other parts between the DC flexible board (12) and the RF flexible board (14) are suspended in the middle.

5. The packaging structure of an optoelectronic module as described in claim 4, characterized in that, The gold wire binding area (19) is set in a stepped shape, with the upper layer of the stepped shape being the signal connection area of ​​the DC flexible board (12) and the lower layer of the stepped shape being the radio frequency signal connection area of ​​the RF flexible board (14).

6. The packaging structure of an optoelectronic module as described in claim 1, characterized in that, The signal wiring of the RF flexible board (14) is configured as a three-layer board, with the top and bottom layers being ground planes and the middle layer being the signal line.

7. The packaging structure of an optoelectronic module as described in claim 6, characterized in that, The intermediate layer signal of the RF flexible board (14) is routed in the manner of coplanar waveguide GSG, and the signal lines are shielded by vias.

8. The packaging structure of an optoelectronic module as described in claim 1, characterized in that, In the RF flexible board (14) and DC flexible board (12), the signal lines of the front thermoforming area (13) are routed on the upper surface of the RF flexible board (14) and DC flexible board (12), and the pads on the upper surface of the RF flexible board (14) and DC flexible board (12) are surrounded by a ground plane.

9. The packaging structure of an optoelectronic module as described in claim 1, characterized in that, The DC flexible board (12) and the RF flexible board (14) have different lengths.

10. A photoelectric module assembly employing the packaging structure of a photoelectric module according to any one of claims 1 to 9, characterized in that, It includes a rigid-flex board (1), a housing (2), and a multi-channel optical transmitting or receiving component group placed inside the housing (2). The optical transmitting or receiving component group is electrically connected to the gold wire bonding area (19) at the tail of the rigid-flex board (1) through gold wire bonding. The optical transmitting or receiving component group is connected to the optical fiber through the optical fiber via (22) opened at the rear of the housing (2).

11. A photoelectric module, characterized in that, It includes a multi-channel optical transmitting component and a multi-channel optical receiving component employing the packaging structure of an optoelectronic module according to any one of claims 1 to 9; The optical transmission assembly includes a rigid-flex board (1), a housing (2), and an optical transmission component group placed inside the housing (2). The optical transmission component group is electrically connected to the gold wire bonding area (19) at the tail of the rigid-flex board (1) through gold wire bonding. The optical transmission component group is connected to the optical fiber through the optical fiber via (22) opened at the rear of the housing (2). The optical receiving assembly includes a rigid-flex PCB (1), a housing (2), and an optical receiving component group placed inside the housing (2). The optical receiving component group is electrically connected to the gold wire bonding area (19) at the tail of the rigid-flex PCB (1) through gold wire bonding. The optical receiving component group is connected to the optical fiber through the optical fiber via (22) opened at the rear of the housing (2).

Images