Hybrid cooling device

Abstract

This document discloses a hybrid cooling device, comprising a first coolant, a radiator, a cold plate including a hollow body to receive the first coolant, a closed-loop piping connecting the radiator and the cold plate to circulate the first coolant therebetween, and a main heat sink. The main heat sink is thermally coupled to the outer surface of the cold plate to absorb heat from the cold plate and dissipate it into the ambient air. The hybrid cooling device also includes an auxiliary heat sink, a plurality of heat pipes extending from the cold plate to the auxiliary heat sink, and a second coolant. The second coolant is sealed within each of the plurality of heat pipes to transfer heat from a first end section to a second end section of the heat pipe via phase change heat transfer.

Description

Technical Field

[0001] This application relates to a hybrid cooling device and a computing device equipped with a hybrid cooling device. Background Technology

[0002] Modern electronic devices, especially high-performance computing systems, generate significant amounts of heat during operation. If this heat is not adequately managed, it can degrade performance, reduce reliability, and ultimately lead to hardware failure. Therefore, efficient thermal management is crucial for maintaining optimal performance, preventing thermal throttling, and extending the lifespan of electronic components. Consequently, a cooling solution capable of efficiently removing heat from these electronic components is needed. Summary of the Invention

[0003] In one aspect of this disclosure, a hybrid cooling device is provided. The hybrid cooling device includes a first coolant, a heat sink configured to lower the temperature of the first coolant, a cold plate including a hollow body to receive the first coolant, a closed-loop conduit including a supply pipe and a return pipe to connect the heat sink and the cold plate for circulating the first coolant therebetween, and a main heat sink thermally coupled to the outer surface of the cold plate. The cold plate is thermally coupled to an electronic component to absorb heat from the electronic component and transfer the heat to the first coolant within the hollow body. The supply pipe is arranged to deliver the lower-temperature first coolant from the heat sink to the hollow body of the cold plate, and the return pipe is arranged to return the higher-temperature first coolant to the heat sink for cooling, thereby providing a liquid-based cooling mechanism to remove heat from the electronic component. The main heat sink is configured to absorb heat from the cold plate and dissipate the heat to the ambient air, thereby providing a first air-based cooling mechanism to remove heat from the electronic component.

[0004] In some embodiments, the hybrid cooling device further includes an auxiliary heat sink located near a cold plate, a plurality of heat pipes extending from the cold plate to the auxiliary heat sink, and a second coolant sealed within each of the plurality of heat pipes. Each of the plurality of heat pipes includes a first end section disposed within a hollow body of the cold plate to absorb heat from the first coolant, and a second end section disposed within the auxiliary heat sink and in thermal contact with the auxiliary heat sink. The second coolant is configured to transfer heat from the first end section to the second end section via phase change heat transfer, so that heat can be released to the auxiliary heat sink and dissipated into the ambient air, thereby providing a second air-based cooling mechanism to remove heat from the electronic components.

[0005] In another aspect of this disclosure, a computing device is provided. The computing device includes a motherboard, electronic components mounted on the motherboard, a first coolant, a heat sink configured to lower the temperature of the first coolant, a cold plate including a hollow body to receive the first coolant, a closed-loop conduit, and a main heat sink thermally coupled to the outer surface of the cold plate. The closed-loop conduit includes a fluid actuator in fluid communication with a supply pipe and a return pipe, the closed-loop conduit connecting the heat sink and the cold plate to circulate the first coolant therebetween. The cold plate is thermally coupled to the electronic components to absorb heat from the electronic components and transfer the heat to the first coolant within the hollow body. The supply pipe is a flexible thermally insulating pipe arranged to deliver the lower-temperature first coolant from the heat sink to the hollow body of the cold plate, and the return pipe is a flexible thermally insulating pipe arranged to return the higher-temperature first coolant to the heat sink for cooling, thereby providing a liquid-based cooling mechanism to remove heat from the electronic components. The main heat sink is configured to absorb heat from the cold plate and dissipate the heat to ambient air, thereby providing a first air-based cooling mechanism to remove heat from the electronic components.

[0006] In some embodiments, the computing device further includes an auxiliary heat sink located near a cold plate, a plurality of heat pipes extending from the cold plate to the auxiliary heat sink, and a second coolant sealed within each of the plurality of heat pipes. Each of the plurality of heat pipes includes a first end section disposed within a hollow body of the cold plate to absorb heat from the first coolant, and a second end section disposed within the auxiliary heat sink and in thermal contact with the auxiliary heat sink. The second coolant is configured to transfer heat from the first end section to the second end section via phase change heat transfer, so that heat can be released to the auxiliary heat sink and dissipated into the ambient air, thereby providing a second air-based cooling mechanism to remove heat from the electronic components. Attached Figure Description

[0007] Various embodiments of this disclosure will now be described in conjunction with the following accompanying drawings: Figure 1 A perspective view of a hybrid cooling apparatus according to an embodiment of the present disclosure is shown; Figure 2 A perspective view of a hybrid cooling apparatus according to another embodiment of the present disclosure is shown; Figure 3 Show Figure 2 The diagram shows a perspective view of a hybrid cooling device, which includes multiple heat pipes connected to a cold plate and an auxiliary heat sink. Figure 4 A perspective view of a computing device according to an embodiment of the present disclosure is shown; and Figure 5 Show Figure 4 The diagram shows a three-dimensional view of the computing device, which includes multiple heat pipes connected to the cold plate and auxiliary heat sink. Detailed Implementation

[0008] The following detailed description, with reference to the accompanying drawings, illustrates the details and embodiments of this disclosure. Features described in the context of a particular embodiment may be applied to the same or similar features in other embodiments, even if not explicitly described in the context of those other embodiments. Similarly, additions, substitutions, or combinations described for features of one embodiment may be applied to corresponding features in other embodiments.

[0009] Throughout this specification, references to "one embodiment," "another embodiment," or "embodiment" (or similar expressions) indicate that at least one embodiment includes a specific feature, structure, or characteristic described in relation to that embodiment. Therefore, the above expressions appearing in different places throughout this specification do not necessarily refer to the same embodiment.

[0010] In the context of this application, when the articles “a,” “an,” and “the” are used to refer to a feature or element, they include a reference to one or more of that feature or element. The term “and / or” includes any and all combinations of one or more of the associated listed items. The term “comprising” means including, but not limited to, the contents listed thereafter. Furthermore, the terms “top,” “bottom,” “upper,” and “lower” can be used to describe the relative orientation and position of multiple components of the cooling device.

[0011] This application discloses a hybrid cooling device configured to provide efficient thermal management for electronic components mounted on the motherboard of a computing device. This device is particularly suitable for high-performance computing environments where electronic components such as central processing units (CPUs), graphics processing units (GPUs), and high-power field-programmable gate arrays (FPGAs) require continuous cooling to maintain optimal performance and prevent thermal throttling or hardware degradation. The hybrid cooling device combines a liquid-based cooling loop with two distinct air-based cooling paths (facilitated by thermally isolated heat sink structures), which operate simultaneously to enhance heat dissipation and thermal reliability. In this context, the cooling device employs multi-path heat dissipation technology, particularly integrating multiple independent air-based cooling channels to improve overall thermal performance.

[0012] Figure 1A hybrid cooling apparatus 100 according to one embodiment of the present disclosure is shown. The hybrid cooling apparatus 100 includes a radiator 110, a cold plate 120, a closed-loop piping 130, a first coolant circulating between the radiator 110 and the cold plate 120, and a main heat sink 140 thermally coupled to the cold plate 120. The closed-loop piping 130 includes at least one supply pipe 131 and at least one return pipe 133 for connecting the radiator 110 and the cold plate 120. Figure 2 As shown, the hybrid cooling device 100 may further include an auxiliary heat sink 150 located near the cold plate 120 and the main heat sink 140, and a plurality of heat pipes 160 extending between the cold plate 120 and the auxiliary heat sink 150. The materials of the cold plate 120, the heat sinks 140 / 150 and the heat pipes 160 may be thermally conductive metals, such as copper, aluminum or their alloys, and may be optionally coated or plated to improve corrosion resistance and surface durability.

[0013] The cold plate 120 includes a hollow body 121 configured to receive and contain the first coolant when it is supplied. The cold plate 120 is thermally coupled to electronic components (e.g., a central processing unit) mounted on a motherboard, allowing heat generated by the electronic components to be transferred to the first coolant within the hollow body 121. One or more fasteners 122 can be used to secure the cold plate 120 to the electronic components. To enhance heat transfer from the walls of the cold plate 120 to the first coolant, multiple internal fins or microchannels extending from the inner wall of the hollow body 121 into the flow path of the first coolant can be integrated within the hollow body 121. These internal fins promote liquid turbulence and increase the surface area in contact with the first coolant, thereby improving convective heat transfer efficiency. The cold plate 120 includes an inlet port 123 and an outlet port 125 for connection to the supply pipe 131 and return pipe 133 of a closed-loop conduit 130. Ports 123 and 125 can be integrated with threaded fittings or quick-connect fittings to achieve leak-free operation.

[0014] The primary coolant is preferably a water-based coolant, comprising a mixture of approximately 75% water and 25% propylene glycol (referred to as PG25). This specific formulation strikes a balance between thermal performance and operational reliability. Water has excellent thermal conductivity, while propylene glycol, as an antifreeze agent, raises the boiling point of the coolant mixture and reduces corrosion within the cooling circuit. This PG25 mixture keeps the primary coolant in a liquid phase throughout operation, thus enabling single-phase sensible heat transfer as it absorbs heat from the heat source and releases it through radiator 110.

[0015] During operation, a first coolant circulates between the radiator 110 and the cold plate 120 via a closed-loop conduit 130. The supply pipe 131 and return pipe 133 of the closed-loop conduit 130 are preferably made of flexible or semi-rigid thermally insulated tubing. The supply pipe 131 delivers cooled first coolant from the radiator 110 to the cold plate 120, while the return pipe 133 carries heated first coolant back from the cold plate 120 to the radiator 110 for cooling, thereby providing a liquid-based cooling mechanism to remove heat from the electronic device. The radiator 110 may include a thermal management unit and a fan or other active airflow device to enhance convective heat dissipation to the surrounding air as the first coolant circulates through the radiator 110. In various configurations, the closed-loop conduit 130 may also include a fluid actuator (not shown). The fluid actuator may be in fluid communication with the supply pipe 131 and the return pipe 133. The fluid actuator can be configured to drive or circulate the first coolant through the supply pipe 131 and return pipe 133 of the closed-loop conduit 130 of the device 100. In one example, the fluid actuator can be a pressurized fluid supply device in fluid communication with the closed-loop conduit 130. In another example, the fluid actuator can be a differential pressure source, a positive pressure source, or a negative pressure source in fluid communication with the closed-loop conduit 130. In yet another example, the fluid actuator can be a pump arranged in series in the fluid loop or integrated with the radiator 110 to drive the first coolant through the device 100.

[0016] In addition to the liquid-based cooling mechanism, device 100 also provides a first air-based cooling mechanism facilitated by a main heat sink 140. The main heat sink 140 is thermally coupled or bonded to the outer surface of the cold plate 120, enabling it to absorb heat conducted through the walls of the cold plate 120 and dissipate that heat into the ambient air, thereby providing a first air-based cooling mechanism to remove heat from the electronic device. In some embodiments, the main heat sink 140 includes a substrate 141 for thermal contact with the cold plate 120, a top plate 143 directly opposite the substrate 141, and a plurality of fins 145 extending between the substrate 141 and the top plate 143. These fins 145 are spaced apart from each other and oriented in alignment with the intended direction of the ambient airflow, thereby increasing the effective surface area exposed to the airflow and enhancing heat dissipation in the first air-based cooling mechanism. The airflow may be naturally formed or generated by a fan placed around the main heat sink 140. The plurality of fins 145 may be arranged vertically or at an angle (e.g., diagonally) relative to the substrate 141. This configuration of the main heat sink 140 allows residual heat that was not absorbed by the first coolant to be further discharged and dissipated.

[0017] To further enhance thermal management, device 100 also provides a second air-based cooling mechanism facilitated by a remote auxiliary heat sink 150. The auxiliary heat sink 150 utilizes multiple heat pipes 160 (e.g., Figure 2 The four heat pipes 160 shown are thermally connected to the cold plate 120. Each heat pipe 160 contains a sealed second coolant, which is pure water under reduced internal pressure (i.e., vacuum). Under vacuum conditions, the boiling point of water is significantly reduced (e.g., about 30 to 50 degrees Celsius, depending on the pressure level), thus allowing phase change heat transfer to occur efficiently at typical central processing unit operating temperatures.

[0018] Each of the heat pipes 160 includes a first end section 161 and a second end section 163, such as Figure 3 As shown. A first end section 161 of each heat pipe 160 is placed within the hollow body 121 of the cold plate 120 and is in direct contact with the first coolant. The first end section 161 of the heat pipe 160 absorbs heat from the first coolant or from the wall of the cold plate 120 in contact with the first end section 161. A second end section 163 of each heat pipe 160 extends into an auxiliary heat sink 150. The auxiliary heat sink 150 is configured to receive the heat energy carried by the second coolant from the first end section 161 to the second end section 163 and dissipate this heat into the ambient air. In a preferred embodiment, the auxiliary heat sink 150 includes a first auxiliary heat sink 156 and a second auxiliary heat sink 157, spaced apart to form a gap 158 therebetween, into which the second end section 163 of the heat pipe 160 is inserted. The second end section 163 may be fixed to the first auxiliary heat sink 156 and the second auxiliary heat sink 157 by welding or other bonding methods. The second end section 163 extends horizontally between the first auxiliary heat sink 156 and the second auxiliary heat sink 157 and along the length direction of the first auxiliary heat sink 156 and the second auxiliary heat sink 157 to maximize the contact surface area and heat transfer surface area. The two heat sinks 156 and 157 may be identical or asymmetrical and may be fixed together by clamping members (not shown) to ensure a stable thermal contact with the second end section 163. The auxiliary heat sink 150 may also include one or more fixing elements 159 to fix the auxiliary heat sink 150 to the motherboard or substrate.

[0019] Similar to the primary heat sink 140, each of the first auxiliary heat sink 156 and the second auxiliary heat sink 157 may include a base plate 151, a top plate 153, and a plurality of fins 155 extending between the base plate 151 and the top plate 153. These fins 155 are spaced apart from each other and oriented to align with the intended direction of ambient airflow, thereby increasing the effective surface area exposed to the airflow and enhancing heat dissipation in the second air-based cooling mechanism. The geometry and density of the fins in both the primary heat sink 140 and the auxiliary heat sink 150, including fin spacing, height, thickness, and orientation, can be customized for specific airflow conditions. In a forced convection environment, the fins can be oriented to align with the airflow generated by a fan, while in a passive convection environment, the fin structure can focus on maximizing natural airflow. Furthermore, the orientation of the auxiliary heat sink 150 can be optimized for layout flexibility; for example, it can be placed horizontally (as shown) or vertically relative to the motherboard within the chassis. The supplemental cooling provided by the main heat sink 140 and the auxiliary heat sink 150 is particularly useful in transient power events or in the event of partial failure of the liquid-based cooling circuit.

[0020] During operation, the water vaporizes when the second coolant (vacuum water) located in the first end section 161 of the heat pipe 160 absorbs heat from the first coolant or from the wall of the cold plate 120. The vapor then moves through the heat pipe 160 to the cooler second end section 163 located in the auxiliary heat sink 150. Upon reaching the cooler end (second end section 163), the vapor condenses and releases latent heat to the first auxiliary heat sink 156 and the second auxiliary heat sink 157, which then dissipate the heat into the ambient air, thus providing a second air-based cooling mechanism to remove heat from electronic equipment. The condensed water can flow back to the hotter end (first end section 161) by gravity through capillary action of the capillary wick or with appropriate pipe orientation. This two-phase heat transfer process enables rapid and efficient heat transfer over a distance with minimal temperature gradient. This mechanism enhances the overall heat dissipation capacity and provides greater spatial flexibility in system design by transferring heat energy from the cold plate 120 to the spatially distant auxiliary heat sink 150, thus supplementing the single-phase liquid-based cooling circuit.

[0021] The dual heat sink setup described above provides two independent and simultaneously operating air-based cooling paths: a first path where heat is dissipated directly from the cold plate 120 through the main heat sink 140, and a second path where heat is transferred from the first coolant in the cold plate 120 to the auxiliary heat sink 150 via heat pipes 160. These independent cooling paths allow for more efficient and distributed thermal load management, particularly beneficial for systems with limited airflow or asymmetrical thermal loads. Furthermore, the dual heat sink setup offers modularity and scalability. For example, multiple auxiliary heat sinks 150 and associated heat pipes 160 can be added to increase cooling capacity or more effectively distribute heat throughout the chassis, thereby enhancing overall system thermal management and enabling flexible component layout in space-constrained systems. Further embodiments of this disclosure may include integration with a thermal monitoring system. For example, thermal sensors can be integrated into the cold plate 120 or the heat sinks 140 / 150 to dynamically adjust cooling performance based on temperature readings.

[0022] In this disclosure, the hybrid cooling device 100 utilizes both single-phase and two-phase cooling technologies. A first coolant (a PG25 mixture) circulates in a liquid-based cooling loop to provide steady-state heat transfer using its high heat capacity, while a second coolant (vacuum water within heat pipe 160) facilitates rapid redistribution of transient heat loads through phase-change heat transfer. This combination of single-phase and two-phase cooling technologies achieves high-performance cooling and improves space utilization and thermal efficiency, making it particularly suitable for compact high-performance computing devices.

[0023] According to another aspect, such as Figure 4 and Figure 5 As shown, this disclosure provides a computing device 200, which includes a hybrid cooling system (as discussed above) for thermal management of the electronic components inside the computing device 200. The computing device 200 includes a motherboard 202, electronic components 204 mounted on the motherboard 202, a first coolant, a heat sink 210 configured to cool the first coolant during circulation, a cold plate 220 including a hollow body 221 to receive the first coolant, a closed-loop conduit 230 connecting the heat sink 210 and the cold plate 220 to circulate the first coolant therebetween, and a main heat sink 240 thermally coupled to the outer surface of the cold plate 220.

[0024] The first coolant is preferably a water-based mixture comprising approximately 75% water and 25% propylene glycol (referred to as PG25). The cold plate 220 is thermally coupled to the electronic component 204 to absorb heat from the electronic component 204 and transfer the heat to the first coolant within the hollow body 221. The closed-loop conduit 230 includes at least one supply pipe 231 and at least one return pipe 233. The supply pipe 231 is arranged to deliver the cooler first coolant from the radiator 210 to the hollow body 221 of the cold plate 220, and the return pipe 233 is arranged to return the hotter first coolant from the cold plate 220 to the radiator 210 for cooling, thereby providing a liquid-based cooling mechanism to remove heat from the electronic component 204. The main heat sink 240 is configured to absorb heat from the cold plate 220 and dissipate the heat into the ambient air, thereby providing a first air-based cooling mechanism to remove heat from the electronic component 204.

[0025] The computing device 200 also includes an auxiliary heat sink 250 located near a cold plate 220, a plurality of heat pipes 260 extending from the cold plate 220 to the auxiliary heat sink 250, and a second coolant sealed within each of the plurality of heat pipes 260. Each heat pipe 260 includes a first end section 261 disposed within a hollow body 221 of the cold plate 220 to absorb heat from the first coolant or the wall of the cold plate 220, and a second end section 263 disposed within the auxiliary heat sink 250 and in thermal contact with the auxiliary heat sink 250. The second coolant is preferably vacuum water and is configured to transfer heat from the first end section 261 to the second end section 263 via phase change heat transfer, so that heat can be released to the auxiliary heat sink 250 and dissipated into the ambient air, thereby providing a second air-based cooling mechanism to remove heat from the electronic components 204.

[0026] The auxiliary heat sink 250 includes a first auxiliary heat sink 256 and a second auxiliary heat sink 257, which are spaced apart to define a gap 258. A second end section 263 is received in the gap 258 and extends along the opposing surfaces of the first auxiliary heat sink 256 and the second auxiliary heat sink 257 between them, such that the second end section 263 is in thermal contact with both the first auxiliary heat sink 256 and the second auxiliary heat sink 257.

[0027] In some embodiments, each of the main heat sink 240, the first auxiliary heat sink 256, and the second auxiliary heat sink 257 includes a substrate, a top plate, and a plurality of fins extending between the substrate and the top plate. The plurality of fins are spaced apart and oriented in alignment with the direction of the ambient airflow to increase the effective surface area exposed to the airflow, thereby enhancing heat dissipation in both the first and second air-based cooling mechanisms.

[0028] In some embodiments, the cold plate 220 may include a plurality of internal fins extending from the inner wall of the hollow body 221 into the first coolant to enhance heat transfer in the liquid-based cooling mechanism.

[0029] The computing device 200 may also include various additional and / or alternative features of the hybrid cooling device 100 described above, thereby forming a corresponding technical solution for the computing device in a further embodiment of this application.

[0030] Those skilled in the art can identify many other changes, substitutions, variations, and modifications, and this application is intended to cover all such changes, substitutions, variations, and modifications that fall within the scope of the appended claims.

Claims

1. A hybrid cooling device, comprising: First coolant; A radiator configured to reduce the temperature of the first coolant; A cold plate, the cold plate comprising a hollow body to receive the first coolant, the cold plate being thermally coupled to an electronic component to absorb heat from the electronic component and transfer the heat to the first coolant within the hollow body; A closed-loop piping system includes a fluid actuator in fluid communication with a supply pipe and a return pipe. The closed-loop piping system connects the heat sink to the cold plate to circulate the first coolant therebetween. The supply pipe is a flexible thermally insulating pipe arranged to deliver the first coolant at a lower temperature from the heat sink to the hollow body of the cold plate, and the return pipe is a flexible thermally insulating pipe arranged to return the first coolant at a higher temperature to the heat sink for cooling, thereby providing a liquid-based cooling mechanism to remove heat from the electronic components. as well as A primary heat sink, thermally coupled to the outer surface of the cold plate, is configured to absorb heat from the cold plate and dissipate the heat into the ambient air, thereby providing a first air-based cooling mechanism to remove heat from the electronic components.

2. The hybrid cooling apparatus of claim 1, wherein the main heat sink comprises a substrate, a top plate, and a plurality of fins extending between the substrate and the top plate, the plurality of fins being spaced apart and oriented in alignment with the direction of the ambient airflow to increase the effective surface area exposed to the ambient airflow, thereby enhancing heat dissipation in the first air-based cooling mechanism.

3. The hybrid cooling device according to claim 1, further comprising: An auxiliary heat sink is located near the cold plate; A plurality of heat pipes extending from the cold plate to the auxiliary heat sink, wherein each of the plurality of heat pipes includes a first end section and a second end section, the first end section being disposed within the hollow body of the cold plate to absorb heat from the first coolant, and the second end section being disposed within the auxiliary heat sink and in thermal contact with the auxiliary heat sink. as well as A second coolant, sealed within each of the plurality of heat pipes, is used to transfer heat from the first end section to the second end section via phase change heat transfer, so that the heat can be released to the auxiliary heat sink and dissipated into the ambient air, thereby providing a second air-based cooling mechanism to remove heat from the electronic components.

4. The hybrid cooling apparatus of claim 3, wherein the auxiliary heat sink comprises a first auxiliary heat sink and a second auxiliary heat sink, the first auxiliary heat sink and the second auxiliary heat sink being spaced apart from each other to define a gap, the second end segment being received in the gap and extending along the opposing surfaces of the first auxiliary heat sink and the second auxiliary heat sink between the opposing surfaces of the first auxiliary heat sink and the second auxiliary heat sink, such that the second end segment is in thermal contact with both the first auxiliary heat sink and the second auxiliary heat sink.

5. The hybrid cooling apparatus of claim 4, wherein each of the first auxiliary heat sink and the second auxiliary heat sink comprises a substrate, a top plate, and a plurality of fins extending between the substrate and the top plate, the plurality of fins being spaced apart and oriented in alignment with the direction of the ambient airflow to increase the effective surface area exposed to the ambient airflow, thereby enhancing heat dissipation in the second air-based cooling mechanism.

6. The hybrid cooling device of claim 1, wherein the cold plate further comprises a plurality of internal fins extending from the inner wall of the hollow body into the first coolant to enhance heat transfer in the liquid-based cooling mechanism.

7. A computing device, comprising: Motherboard; Electronic components mounted on the motherboard; First coolant; A radiator configured to reduce the temperature of the first coolant; A cold plate, the cold plate including a hollow body to receive the first coolant, wherein the cold plate is thermally coupled to the electronic component to absorb heat from the electronic component and transfer the heat to the first coolant within the hollow body; A closed-loop piping system, comprising a supply pipe and a return pipe, the supply pipe and the return pipe connecting the heat sink and the cold plate to circulate the first coolant therebetween, wherein the supply pipe is arranged to deliver the first coolant at a lower temperature from the heat sink to the hollow body of the cold plate, and the return pipe is arranged to return the first coolant at a higher temperature to the heat sink for cooling, thereby providing a liquid-based cooling mechanism to remove heat from the electronic components; as well as A primary heat sink, thermally coupled to the outer surface of the cold plate, is configured to absorb heat from the cold plate and dissipate the heat into the ambient air, thereby providing a first air-based cooling mechanism to remove heat from the electronic components.

8. The computing device of claim 7, wherein the main heat sink comprises a substrate, a top plate, and a plurality of fins extending between the substrate and the top plate, the plurality of fins being spaced apart and oriented in alignment with the direction of ambient airflow to increase the effective surface area exposed to the ambient airflow, thereby enhancing heat dissipation in the first air-based cooling mechanism.

9. The computing device according to claim 7, further comprising: An auxiliary heat sink is located near the cold plate; A plurality of heat pipes extending from the cold plate to the auxiliary heat sink, wherein each of the plurality of heat pipes includes a first end section and a second end section, the first end section being disposed within the hollow body of the cold plate to absorb heat from the first coolant, and the second end section being disposed within the auxiliary heat sink and in thermal contact with the auxiliary heat sink. as well as A second coolant, sealed within each of the plurality of heat pipes, is used to transfer heat from the first end section to the second end section via phase change heat transfer, so that the heat can be released to the auxiliary heat sink and dissipated into the ambient air, thereby providing a second air-based cooling mechanism to remove heat from the electronic components.

10. The computing device of claim 9, wherein the auxiliary heat sink includes a first auxiliary heat sink and a second auxiliary heat sink, the first auxiliary heat sink and the second auxiliary heat sink being spaced apart from each other to define a gap, the second end segment being received in the gap and extending along the opposing surfaces of the first auxiliary heat sink and the second auxiliary heat sink between opposing surfaces, such that the second end segment is in thermal contact with both the first auxiliary heat sink and the second auxiliary heat sink.

11. The computing device of claim 10, wherein each of the first auxiliary heat sink and the second auxiliary heat sink includes a substrate, a top plate, and a plurality of fins extending between the substrate and the top plate, the plurality of fins being spaced apart and oriented in alignment with the direction of ambient airflow to increase the effective surface area exposed to the ambient airflow, thereby enhancing heat dissipation in the second air-based cooling mechanism.

12. The computing device of claim 7, wherein the cold plate further comprises a plurality of internal fins extending from the inner wall of the hollow body into the first coolant to enhance heat transfer in the liquid-based cooling mechanism.

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