Camera module, manufacturing method thereof and electronic device

Abstract

This application relates to a camera module, its manufacturing method, and an electronic device. The camera module includes: an optical path reversing component; a lens assembly disposed on the optical path reversing component; a photosensitive component disposed on the optical path reversing component, with the photosensitive component and the lens assembly located on the same side of the optical path reversing component; a spacer disposed on the optical path reversing component, with a portion of the spacer located between the optical path reversing component and the lens assembly, and a portion located between the optical path reversing component and the photosensitive component; and a light-shielding layer located between the lens assembly and the photosensitive component, the light-shielding layer sealing the gap between the lens assembly and the photosensitive component and abutting against the spacer. This application isolates the light-incident space and the light-exit space through the spacer and the light-shielding layer, preventing blemishes from moving from the light-incident space into the light-exit space, thereby reducing the probability of blemish imaging in the camera module.

Description

Technical Field

[0001] This application relates to the field of camera equipment, and more particularly to a camera module, its manufacturing method, and an electronic device. Background Technology

[0002] Periscope camera modules can fold the optical path to reduce their size. Conventional periscope camera modules use a combination of a prism and a lens; the incident light is folded once by the prism, achieving one optical path fold, before passing through the lens to reach the image sensor. However, the effect of optical path folding in conventional periscope camera modules is not significant, making it difficult to achieve ultra-telephoto shooting.

[0003] A telephoto camera module employing an irregularly shaped prism utilizes the prism to repeatedly fold the light path, enhancing the folding effect and achieving ultra-telephoto shooting. In this prism-based module, the lens assembly and the photosensitive assembly are positioned on the same side of the prism, creating a gap between them and causing light leakage. To resolve this issue, the gap between the lens assembly and the photosensitive assembly needs to be sealed. Figure 1 As shown, after the gap between the lens assembly and the photosensitive assembly is sealed, the light-incident space A between the lens assembly 2' and the prism 1' and the light-exit space B between the prism 1' and the photosensitive assembly 3' are interconnected. Stains inside the camera module can easily migrate; for example, a stain in the light-incident space A can migrate to the light-exit space B, forming a smudge image on the photosensitive assembly and affecting the imaging effect of the camera module. Summary of the Invention

[0004] Based on the above problems, this application provides a camera module, its manufacturing method, and an electronic device that isolates the light-incident space and the light-outcident space, reducing the possibility of blemish imaging.

[0005] In a first aspect, embodiments of this application provide a camera module, comprising:

[0006] Optical path deflection component;

[0007] The lens assembly is disposed on the optical path deflection assembly;

[0008] A photosensitive component is disposed on the optical path deflection component, and the photosensitive component and the lens component are located on the same side of the optical path deflection component;

[0009] An isolation sheet is disposed in the optical path deflection assembly, with a portion of the isolation sheet located between the optical path deflection assembly and the lens assembly, and a portion of the isolation sheet located between the optical path deflection assembly and the photosensitive assembly;

[0010] A light-shielding layer is located between the lens assembly and the photosensitive assembly. The light-shielding layer seals the gap between the lens assembly and the photosensitive assembly and abuts against the isolation sheet.

[0011] According to some embodiments of this application, the optical path switching component includes:

[0012] The housing has a receiving cavity, and both the lens assembly and the photosensitive assembly are disposed on the housing;

[0013] An optical path reversing element is disposed in the receiving cavity, and the isolation sheet is disposed in the optical path reversing element.

[0014] According to some embodiments of this application, the surface of the optical path deflection element that abuts the isolation sheet has a reflective surface, and the isolation sheet corresponds to the reflective surface.

[0015] According to some embodiments of this application, the surface of the isolation sheet that abuts the optical path deflection component is a frosted surface, and the roughness VDI of the frosted surface is ≥24.

[0016] According to some embodiments of this application, an air layer is provided between the insulating sheet and the surface of the optical path deflection component.

[0017] According to some embodiments of this application, the surface roughness VDI of the isolator away from the optical path deflection component is <6.

[0018] According to some embodiments of this application, both the lens assembly and the photosensitive assembly are bonded to the spacer.

[0019] According to some embodiments of this application, the light-shielding layer extends to the surface of the photosensitive component away from the light path deflection component.

[0020] According to some embodiments of this application, the two ends of the light-shielding layer respectively abut against the optical path deflection component.

[0021] According to some embodiments of this application, the sidewall of the lens assembly is provided with a first chamfer, the sidewall of the photosensitive assembly is provided with a second chamfer, and the light-shielding layer covers at least a portion of the first chamfer and a portion of the second chamfer.

[0022] Secondly, embodiments of this application provide a method for preparing a camera module as described above, comprising:

[0023] The isolation sheet is disposed on the optical path deflection component;

[0024] A first adhesive layer is coated on the isolation sheet and the optical path deflection assembly, and the lens assembly is disposed on the first adhesive layer;

[0025] A second adhesive layer is coated on the isolation sheet and the optical path deflection assembly, and the photosensitive assembly is disposed on the second adhesive layer;

[0026] The light-shielding layer is disposed between the lens assembly and the photosensitive assembly, and the light-shielding layer seals the gap between the lens assembly and the photosensitive assembly.

[0027] According to some embodiments of this application, there is a gap between the first adhesive layer and the second adhesive layer, and the light-shielding layer fills the gap between the first adhesive layer and the second adhesive layer.

[0028] According to some embodiments of this application, the provision of the light-shielding layer between the lens assembly and the photosensitive assembly includes:

[0029] The light-shielding layer covers a portion of the surface of the photosensitive component away from the light path deflection component.

[0030] According to some embodiments of this application, the provision of the light-shielding layer between the lens assembly and the photosensitive assembly includes:

[0031] Both ends of the light-shielding layer are in contact with the light path deflection component, the first adhesive layer, and the second adhesive layer.

[0032] Thirdly, embodiments of this application provide an electronic device, including:

[0033] The electronic device itself;

[0034] The camera module described above is disposed on the electronic device body.

[0035] This application sets an isolation plate on the optical path turning component and sets a light-shielding layer between the lens component and the photosensitive component. The light-shielding layer abuts against the isolation plate to isolate the light-inlet space and the light-outlet space, thereby preventing blemishes from moving from the light-inlet space into the light-outlet space and reducing the probability of blemish imaging in the camera module. Attached Figure Description

[0036] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without exceeding the scope of protection claimed by this application.

[0037] Figure 1 This is a schematic diagram of the light-incident space and light-outcrystal space in a camera module;

[0038] Figure 2 This is a schematic diagram of the camera module according to an embodiment of this application;

[0039] Figure 3 This is an exploded view of the camera module in an embodiment of this application;

[0040] Figure 4 This is a schematic diagram of the lens assembly according to an embodiment of this application;

[0041] Figure 5 This is an internal view of the camera module according to an embodiment of this application;

[0042] Figure 6 This is a schematic diagram of the isolation sheet in an embodiment of this application;

[0043] Figure 7 This is a schematic diagram showing the gap between the lens assembly and the photosensitive assembly in this application;

[0044] Figure 8 This is an exploded view of the optical path reversal component according to an embodiment of this application;

[0045] Figure 9 This is an exploded view of the photosensitive component according to an embodiment of this application;

[0046] Figure 10 This is a schematic diagram of the optical path switching element and the isolation sheet in an embodiment of this application;

[0047] Figure 11 This is a schematic diagram of the isolation sheet in an embodiment of this application;

[0048] Figure 12 This is a schematic diagram of the first adhesive layer and the second adhesive layer in an embodiment of this application;

[0049] Figure 13 This is a schematic diagram of the light-shielding layer in an embodiment of this application;

[0050] Figure 14 The following is a flowchart of the method for preparing the camera module according to an embodiment of this application. Figure 1 ;

[0051] Figure 15 The following is a flowchart of the method for preparing the camera module according to an embodiment of this application. Figure 2 ;

[0052] Figure 16A and Figure 16B A schematic diagram of an electronic device according to an example embodiment of this application is shown.

[0053] in,

[0054] A - Light-entry space, B - Light-exit space, 1' - Prism, 2' - Lens assembly, 3' - Photosensitive assembly;

[0055] 100-Camera Module;

[0056] 1-Optical path conversion assembly, 11-Housing shell, 12-Optical path conversion element, 111-Receiving cavity, 112-First bearing surface, 113-Second bearing surface, 121-Reflective surface, 122-Silicone printing;

[0057] 2-Lens assembly, 21-Driver, 22-Optical lens, 23-First chamfer;

[0058] 3-Photosensitive component, 31-Circuit board, 32-Base, 33-Photosensitive chip, 34-Color filter, 35-Second chamfer;

[0059] 4-Separation plate, 41-Overlapping area, 42-Overlapping area, 43-Gap, 44-Bottom surface of the separation plate, 45-Groove;

[0060] 5 - Light-shielding layer, 5a - First end, 5b - Second end;

[0061] 61 - First adhesive layer, 62 - Second adhesive layer;

[0062] 10-Gap. Detailed Implementation

[0063] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0064] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0065] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or connections that allow for communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0066] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0067] To simplify the disclosure of this application, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0068] The preferred embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit this application.

[0069] Figure 2 This is a schematic diagram of the camera module according to an embodiment of this application. Figure 3 This is an exploded view of the camera module in an embodiment of this application, such as... Figure 2 and Figure 3As shown, an embodiment of this application provides a camera module 100, which includes an optical path deflection assembly 1, a lens assembly 2, a photosensitive assembly 3, a spacer 4, and a light-shielding layer 5. The lens assembly 2, the photosensitive assembly 3, and the spacer 4 are all disposed on the optical path deflection assembly 1, and the light-shielding layer 5 is disposed between the lens assembly 2 and the photosensitive assembly 3. The lens assembly 2 and the photosensitive assembly 3 are disposed on the same side of the optical path deflection assembly 1, for example, both the lens assembly 2 and the photosensitive assembly 3 are disposed on the top of the optical path deflection assembly 1.

[0070] There is an incident light space between the lens assembly 2 and the light path reversing assembly 1. Light enters through the lens assembly 2 and, upon reaching the light path reversing assembly 1, is reflected by the light path reversing assembly 1 to revers the light path. There is an exit light space between the light path reversing assembly 1 and the photosensitive assembly 3. Light emitted from the light path reversing assembly 1 enters the photosensitive assembly 3, where the photosensitive assembly 3 converts the light signal into an electrical signal.

[0071] The light path deflection component 1 can reflect light. Optionally, the light path deflection component 1 reflects light multiple times to increase the focal length and total track length (TTL) of the camera module 100, so that the camera module 100 can achieve a larger focal length while miniaturizing the camera module 100.

[0072] Figure 4 This is a schematic diagram of the lens assembly according to an embodiment of this application, as shown below. Figure 4 As shown, lens assembly 2 is disposed on optical path deflection assembly 1. Lens assembly 2 includes driver 21 and optical lens 22. Optionally, driver 21 is a motor. Optical lens 22 includes at least one lens element. Optical lens 22 is disposed on driver 21, which drives optical lens 22 to move, thereby achieving optical image stabilization and / or autofocus of optical lens 22, facilitating clear image acquisition by camera module 100. Driver 21 is disposed on optical path deflection assembly 1, for example, on top of optical path deflection assembly 1. Optionally, driver 21 and optical path deflection assembly 1 are bonded together with adhesive. Light is incident from optical lens 22 onto optical path deflection assembly 1, and optical path deflection assembly 1 reflects the light to deflect the light path.

[0073] The photosensitive component 3 is disposed on the optical path reversing component 1. Optionally, the photosensitive component 3 is disposed on the top of the optical path reversing component 1, and the photosensitive component 3 and the lens assembly 2 are located on the same side of the optical path reversing component 1. The photosensitive component 3 and the optical path reversing component 1 are bonded together with adhesive.

[0074] Light enters the optical lens 22 of the lens assembly 2 and is incident on the light path reversal assembly 1. The light is reflected in the light path reversal assembly 1, and the light reflected from the light path reversal assembly 1 enters the photosensitive assembly 3. The photosensitive assembly 3 converts the light signal into an electrical signal.

[0075] By placing the photosensitive component 3 and the lens component 2 on the same side of the optical path deflection component 1, and ensuring that the optical axis of the lens component 2 is parallel to that of the photosensitive component 3, the number of optical path folds is increased, shortening the optical path and enabling longer focal length shooting. Positioning the photosensitive component 3 and the lens component 2 on the same side of the optical path deflection component 1 also avoids excessively increasing the height of the camera module 100 along the Z direction, while reducing the dimensions of the camera module 100 along the X and Y directions, facilitating miniaturization of the camera module 100. When the camera module 100 is installed in an electronic device, the Z direction corresponds to the thickness direction of the electronic device.

[0076] Figure 5 This is an internal view of the camera module according to an embodiment of this application, such as... Figure 5 As shown, the isolation plate 4 is disposed on the optical path reversing assembly 1, for example, on the top surface of the optical path reversing assembly 1. The projection of the lens assembly 2 along the optical axis partially overlaps with the isolation plate 4, such that a portion of the isolation plate 4 is located between the optical path reversing assembly 1 and the lens assembly 2, for example, the left side portion of the isolation plate 4 is located between the optical path reversing assembly 1 and the lens assembly 2. The projection of the photosensitive assembly 3 along the optical axis partially overlaps with the isolation plate 4, such that a portion of the isolation plate 4 is located between the optical path reversing assembly 1 and the photosensitive assembly 3, for example, the right side portion of the isolation plate 4 is located between the optical path reversing assembly 1 and the photosensitive assembly 3.

[0077] Figure 6 This is a schematic diagram of the isolation sheet in an embodiment of this application, as shown below. Figure 6 As shown, the isolation plate 4 includes a region 41 that overlaps with the lens assembly 2 and a region 42 that overlaps with the photosensitive assembly 3, with a gap 43 provided between the regions 41 and 42.

[0078] The material of the insulating sheet 4 is selected according to the requirements; for example, the insulating sheet 4 is made of Mylar film. The thickness of the insulating sheet 4 is 0.05 to 0.1 mm. For example, the thickness of the insulating sheet 4 is 0.06 mm.

[0079] Figure 7 This is a schematic diagram showing the gap between the lens assembly and the photosensitive assembly in this application, as shown. Figure 7 As shown, there is a gap 10 between the lens assembly 2 and the photosensitive assembly 3. External light or foreign objects may enter the interior of the camera module 100 through the gap 10. A light-shielding layer 5 is located between the lens assembly 2 and the photosensitive assembly 3, and the light-shielding layer 5 seals the gap 10 between the lens assembly 2 and the photosensitive assembly 3. The lower end of the light-shielding layer 5 extends to abut against the insulating sheet 4.

[0080] For example, the light-shielding layer 5 is formed by curing adhesive, and the adhesive used for the light-shielding layer 5 is an opaque adhesive. After assembling the lens assembly 2 and the photosensitive assembly 3 into the optical path reversing assembly 1, adhesive is applied between the lens assembly 2 and the photosensitive assembly 3 to seal the gap 10 between them, extending downwards to the isolation sheet 4. The isolation sheet 4 prevents the light-shielding layer 5 from contaminating the optical path reversing element of the optical path reversing assembly 1. The isolation sheet 4 and the light-shielding layer 5 together isolate the light-incident space and the light-outcident space of the camera module 100.

[0081] In this embodiment, an isolation plate 4 is provided on the optical path turning component 1, and a light-shielding layer 5 is provided between the lens component 2 and the photosensitive component 3. The light-shielding layer 5 abuts against the isolation plate 4 to isolate the light-inlet space and the light-outlet space, so as to prevent the smudges from moving from the light-inlet space into the light-outlet space and reduce the possibility of smudge imaging of the camera module 100.

[0082] Figure 8 This is an exploded view of the optical path switching component according to an embodiment of this application, as shown below. Figure 8 As shown, in some embodiments, the optical path reversing assembly 1 includes a housing 11 and an optical path reversing element 12.

[0083] The housing 11 has a receiving cavity 111 with an opening at its top, which is adapted to the optical path deflection element 12. Both the lens assembly 2 and the photosensitive assembly 3 are mounted on the housing 11, which provides support for them. Optionally, the top surface of the housing 11 includes a first bearing surface 112 and a second bearing surface 113. The lens assembly 2 is mounted on the first bearing surface 112, which has a first terminal electrically connected to the driver 21 of the lens assembly 2. The photosensitive assembly 3 is mounted on the second bearing surface 113, which has a second terminal electrically connected to it.

[0084] A light path deflection element 12 is disposed in the receiving cavity 111 and is used to reflect light. The light path deflection element 12 can be an existing light path refraction element, such as an irregularly shaped prism, capable of reflecting light multiple times. Light enters the light path deflection element 12 through the optical lens 22 and the light entrance space. The light path deflection element 12 can reflect the light multiple times, and the light emitted from the light path deflection element 12 enters the photosensitive component 3 through the light exit space. A separator 4 is disposed on the light path deflection element 12, for example, on the top surface of the light path deflection element 12.

[0085] Figure 9 This is an exploded view of the photosensitive component according to an embodiment of this application, as shown below. Figure 9 As shown, optionally, the photosensitive component 3 includes: a circuit board 31, a base 32, a photosensitive chip 33, and a color filter 34.

[0086] The circuit board 31 can be a rigid circuit board or a flexible circuit board. The end of the circuit board 31 away from the lens assembly 2 is connected to the electronic device body to conduct electricity between the camera module 100 and the electronic device body. The circuit board 31 is electrically connected to the second terminal of the optical path deflection assembly 1, the second terminal is electrically connected to the first terminal, and the first terminal is electrically connected to the lens assembly 2 to conduct electricity between the circuit board 31 and the lens assembly 2.

[0087] The base 32 is disposed on the optical path deflection assembly 1. For example, the base 32 is disposed on the second bearing surface 113, and the base 32 is bonded to the housing 11 with adhesive. The circuit board 31 is disposed on the base 32, for example, the circuit board 31 is located above the base 32. Optionally, the base 32 and the circuit board 31 are bonded with adhesive, and the base 32 can also be molded onto the circuit board 31 by molding. The base 32 covers at least a portion of the electronic components on the circuit board 31, providing protection for the electronic components.

[0088] The photosensitive chip 33 is disposed on the circuit board 31. For example, the photosensitive chip 33 is located on the surface of the circuit board 31 where the base 32 is located, or the photosensitive chip 33 is embedded in the circuit board 31. The photosensitive chip 33 is electrically connected to the circuit board 31, and one way to connect the photosensitive chip 33 to the circuit board 31 is through gold wire connection. The base 32 is provided with a light-transmitting hole 321. The light reflected by the light path deflection component 1 enters the photosensitive chip 33 through the light-transmitting hole 321, and the photosensitive chip 33 can convert the light signal into an electrical signal. Optionally, the base 32 covers part of the non-photosensitive area of ​​the photosensitive chip 33, which helps to reduce the size of the photosensitive component 3.

[0089] The color filter 34 is disposed on the base 32. For example, the color filter 34 is disposed on the surface of the base 32 away from the circuit board 31. The color filter 34 is located on the optical axis of the photosensitive chip 33 and is used to filter out stray light such as infrared light to improve the image quality of the camera module.

[0090] Figure 10 This is a schematic diagram of the optical path switching element and the isolation sheet in an embodiment of this application, as shown below. Figure 10 As shown, in some embodiments, the surface of the light path reversing element 12 that abuts against the isolation plate 4 has a reflective surface 121 to reflect light inside the light path reversing element 12. The isolation plate 4 corresponds to the reflective surface 121 and is located above the reflective surface 121. Optionally, the width D1 of the isolation plate 4 is equal to the width D2 of the reflective surface 121. If the width D1 of the isolation plate 4 is too large, it may affect the light entering the light path reversing element 12 or affect the light escaping from the light path reversing element 12. If the width D1 of the isolation plate 4 is too small, the adhesive on the isolation plate 4 may overflow the boundary of the isolation plate 4, affecting the reflection effect of the light path reversing element 12.

[0091] Figure 11 This is a schematic diagram of the isolation sheet in an embodiment of this application, as shown below. Figure 11 As shown, in some embodiments, the bottom surface 44 of the isolation plate 4 abuts against the optical path conversion element 12 of the optical path conversion assembly 1, and the bottom surface 44 of the isolation plate 4 is a frosted surface. If the bottom surface 44 of the isolation plate 4 is a smooth surface, the isolation plate 4's close contact with the optical path conversion element 12 may affect the total internal reflection of light by the optical path conversion element 12. Setting the bottom surface 44 of the isolation plate 4 as a frosted surface creates an air layer between the isolation plate 4 and the top surface of the optical path conversion element 12, thereby avoiding the influence of the isolation plate 4 on the total internal reflection of the optical path conversion element 12. Optionally, the roughness VDI of the frosted surface is ≥24.

[0092] In some embodiments, the top surface of the optical path reversing element 12 is provided with a silkscreen 122, and the isolation plate 4 abuts against the bottom surface 44 of the optical path reversing assembly 1 and is provided with a groove 45. The two ends of the isolation plate 4 abut against the silkscreen 122 respectively, so as to better avoid the influence of the isolation plate 4 on the total internal reflection of the optical path reversing element 12. The size of the groove 45 is set according to the requirements.

[0093] In some embodiments, the surface of the separator 4 away from the optical path deflection component 1 is a smooth surface with a roughness VDI < 6, which can reduce the overflow of adhesive from the separator 4.

[0094] Figure 12 This is a schematic diagram of the first and second adhesive layers in an embodiment of this application, as shown below. Figure 12 As shown, in some embodiments, a first adhesive layer 61 and a second adhesive layer 62 are provided on the housing 11 and the spacer 4. The first adhesive layer 61 is used to bond the lens assembly 2, and the second adhesive layer 62 is used to bond the photosensitive assembly 3. Both the lens assembly 2 and the photosensitive assembly 3 are bonded to the spacer 4, which helps to improve the bonding reliability of the lens assembly 2 and the photosensitive assembly 3.

[0095] Figure 13 This is a schematic diagram of the light-shielding layer in an embodiment of this application, as shown below. Figure 13 As shown, in some embodiments, the light-shielding layer 5 extends to the surface of the photosensitive component 3 away from the light path deflection component 1. For example, the light-shielding layer 5 covers part of the top surface of the circuit board 31 to improve the fixation reliability of the photosensitive component 3.

[0096] In some embodiments, the first end 5a and the second end 5b of the light-shielding layer 5 abut against the housing 11 of the light path deflection assembly 1, respectively. Furthermore, the first end 5a and the second end 5b of the light-shielding layer 5 are both connected to the first adhesive layer 61 and the second adhesive layer 62, forming an integral sealing adhesive layer, thereby improving the security of the camera module 100 and blocking external light from entering the camera module 100.

[0097] like Figure 7As shown, a first chamfer 23 is provided at the connection between adjacent sidewalls of the lens assembly 2, and a second chamfer 35 is provided at the connection between adjacent sidewalls of the photosensitive assembly 3. The light-shielding layer 5 covers at least a portion of the first chamfer 23 and a portion of the second chamfer 35. The space between the first chamfer 23 and the second chamfer 35 can accommodate a portion of the adhesive in the light-shielding layer 5, preventing the adhesive in the light-shielding layer 5 from overflowing, while increasing the bonding strength of the light-shielding layer 5.

[0098] Figure 14 The following is a flowchart of the method for preparing the camera module according to an embodiment of this application. Figure 1 , Figure 15 The following is a flowchart of the method for preparing the camera module according to an embodiment of this application. Figure 2 ,like Figure 14 and Figure 15 As shown, an embodiment of this application provides a method for manufacturing a camera module 100 as described above, the method comprising:

[0099] S1. The isolation plate 4 is disposed on the optical path conversion assembly 1. For example, the isolation plate 4 is disposed on the top surface of the optical path conversion element 12 of the optical path conversion assembly 1, and the isolation plate 4 corresponds to the reflective surface 121 of the optical path conversion element 12.

[0100] S2. Apply a first adhesive layer 61 to the isolation sheet 4 and the optical path deflection assembly 1, and place the lens assembly 2 on the first adhesive layer 61.

[0101] Adhesive is applied to the top surface of the outer casing 11 and the top surface of the insulating sheet 4 to form a first adhesive layer 61, the pattern of which is approximately rectangular. The driver 21 of the lens assembly 2 is placed on the first adhesive layer 61 to achieve bonding between the lens assembly 2 and the optical path deflection assembly 1 and the insulating sheet 4.

[0102] S3. Apply a second adhesive layer 62 to the isolation sheet 4 and the optical path turning component 1, and place the photosensitive component 3 on the second adhesive layer 62.

[0103] Adhesive is applied to the top surface of the outer casing 11 and the top surface of the insulating sheet 4 to form a second adhesive layer 62. The pattern of the second adhesive layer 62 is approximately rectangular. The base 32 of the photosensitive component 3 is placed on the second adhesive layer 62 to achieve bonding between the photosensitive component 3 and the optical path deflection component 1 and the insulating sheet 4.

[0104] S4. A light-shielding layer 5 is provided between the lens assembly 2 and the photosensitive assembly 3, and the light-shielding layer 5 seals the gap 10 between the lens assembly 2 and the photosensitive assembly 3.

[0105] The adhesive in the light-shielding layer 5 extends downwards onto the isolation sheet 4. After the adhesive cures, the isolation sheet 4 and the light-shielding layer 5 together isolate the light-incident space and the light-outcident space in the camera module 100, preventing blemishes from moving from the light-incident space into the light-outcident space and reducing the possibility of blemish imaging in the camera module 100.

[0106] In some embodiments, on the spacer 4, a first adhesive layer 61 corresponds to region 41, and a second adhesive layer 62 corresponds to region 42, with a gap 43 between the first adhesive layer 61 and the second adhesive layer 62. The adhesive of the light-shielding layer 5 fills the gap between the first adhesive layer 61 and the second adhesive layer 62, improving the adhesion between the spacer 4 and the lens assembly 2 and the photosensitive assembly 3.

[0107] In some embodiments, step S4, which involves providing a light-shielding layer 5 between the lens assembly 2 and the photosensitive assembly 3, includes covering a portion of the surface of the photosensitive assembly 3 away from the optical path deflection assembly 1 with the light-shielding layer 5. For example, the light-shielding layer 5 covers a portion of the top surface of the circuit board 31 to improve the fixation reliability of the photosensitive assembly 3.

[0108] In some embodiments, step S4, which involves setting a light-shielding layer 5 between the lens assembly 2 and the photosensitive assembly 3, includes: making both ends of the light-shielding layer 5 abut against the optical path deflection assembly 1, the first adhesive layer 61, and the second adhesive layer 62.

[0109] The first end 5a and the second end 5b of the light-shielding layer 5 abut against the outer shell 11 of the light path deflection assembly 1, respectively. Furthermore, the first end 5a and the second end 5b of the light-shielding layer 5 are both connected to the first adhesive layer 61 and the second adhesive layer 62, forming an integral sealing adhesive layer, which improves the security of the camera module 100 and blocks external light from entering the interior of the camera module 100.

[0110] Figure 16A and Figure 16B A schematic diagram of an electronic device illustrating an example embodiment of this application is shown. Figure 16A and Figure 16B As shown, according to another aspect of this application, an embodiment of this application provides an electronic device, wherein the electronic device includes an electronic device body 200 and at least one camera module 100 as described above. Each camera module 100 is respectively disposed on the electronic device body 200 for acquiring images. It is worth mentioning that the type of electronic device body 200 is not limited; for example, the electronic device body 200 can be a smartphone, tablet computer, laptop computer, e-reader, personal digital assistant, camera, or any electronic device that can be configured with a camera module 100. Those skilled in the art will understand that, although the appended... Figure 16A and attached Figure 16B The example of the electronic device body 200 being implemented as a smartphone is not intended to limit the content and scope of this application.

[0111] For example, such as Figure 16A As shown, the camera module 100 is disposed on the electronic device body 200 and faces the front of the electronic device body 200, so that the camera module 100 serves as a front-facing camera of the electronic device for capturing images of objects in the space in front of the electronic device body 200.

[0112] In addition, such as Figure 16B As shown, the camera module 100 is disposed on the electronic device body 200 and faces the rear side of the electronic device body 200, so that the camera module 100 serves as a rear camera of the electronic device for capturing images of objects in the space behind the electronic device body 200.

[0113] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the technical solutions and core ideas of this application. Therefore, any changes or modifications made by those skilled in the art based on the ideas of this application, and on the specific implementation methods and application scope of this application, are all within the scope of protection of this application. In summary, the content of this specification should not be construed as a limitation of this application.

Claims

1. A camera module, characterized in that, include: Optical path deflection component; The lens assembly is disposed on the optical path deflection assembly; A photosensitive component is disposed on the optical path deflection component, and the photosensitive component and the lens component are located on the same side of the optical path deflection component; An isolation sheet is disposed in the optical path deflection assembly, with a portion of the isolation sheet located between the optical path deflection assembly and the lens assembly, and a portion of the isolation sheet located between the optical path deflection assembly and the photosensitive assembly; A light-shielding layer is located between the lens assembly and the photosensitive assembly. The light-shielding layer seals the gap between the lens assembly and the photosensitive assembly and abuts against the isolation sheet.

2. The camera module according to claim 1, characterized in that, The optical path deflection component includes: The housing has a receiving cavity, and both the lens assembly and the photosensitive assembly are disposed on the housing; An optical path reversing element is disposed in the receiving cavity, and the isolation sheet is disposed in the optical path reversing element.

3. The camera module according to claim 2, characterized in that, The optical path deflection element has a reflective surface on the surface of the isolating sheet, and the isolating sheet corresponds to the reflective surface.

4. The camera module according to claim 1, characterized in that, The surface of the isolation sheet that abuts against the optical path deflection component is a frosted surface, and the roughness VDI of the frosted surface is ≥24.

5. The camera module according to claim 4, characterized in that, An air layer exists between the insulating sheet and the surface of the optical path deflection component.

6. The camera module according to claim 1, characterized in that, The surface roughness VDI of the isolator away from the optical path deflection component is <6.

7. The camera module according to claim 1, characterized in that, Both the lens assembly and the photosensitive assembly are bonded to the isolation sheet.

8. The camera module according to claim 1, characterized in that, The light-shielding layer extends to the surface of the photosensitive component away from the light path deflection component.

9. The camera module according to claim 1, characterized in that, The two ends of the light-shielding layer respectively abut against the light path deflection component.

10. The camera module according to any one of claims 1 to 9, characterized in that, The lens assembly has a first chamfer on its sidewall, the photosensitive assembly has a second chamfer on its sidewall, and the light-shielding layer covers at least a portion of the first chamfer and a portion of the second chamfer.

11. A method for manufacturing a camera module as described in claim 1, characterized in that, include: The isolation sheet is disposed on the optical path deflection component; A first adhesive layer is coated on the isolation sheet and the optical path deflection assembly, and the lens assembly is disposed on the first adhesive layer; A second adhesive layer is coated on the isolation sheet and the optical path deflection assembly, and the photosensitive assembly is disposed on the second adhesive layer; The light-shielding layer is disposed between the lens assembly and the photosensitive assembly, and the light-shielding layer seals the gap between the lens assembly and the photosensitive assembly.

12. The method according to claim 11, characterized in that, There is a gap between the first adhesive layer and the second adhesive layer, and the light-shielding layer fills the gap between the first adhesive layer and the second adhesive layer.

13. The method according to claim 11, characterized in that, The provision of the light-shielding layer between the lens assembly and the photosensitive assembly includes: The light-shielding layer covers a portion of the surface of the photosensitive component away from the light path deflection component.

14. The method according to claim 11, characterized in that, The provision of the light-shielding layer between the lens assembly and the photosensitive assembly includes: Both ends of the light-shielding layer are in contact with the light path deflection component, the first adhesive layer, and the second adhesive layer.

15. An electronic device, characterized in that, include: The electronic device itself; The camera module as described in any one of claims 1 to 10 is disposed on the electronic device body.

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