Covering materials and packaging materials

Abstract

A lid material 30 for sealing a containing portion 21 of a containing container 20, the lid material including: a base layer 35; a circuit pattern 32 provided on the base layer 35 and having a wiring path configured to be broken when the containing portion is opened; a resin layer 37 covering the circuit pattern 32 from a side opposite the base layer; and a heat adhesive layer 31 configured to be heat-adhered to the containing container 20. The wiring path is provided with a terminal portion configured to be connected to an external device 40 for detecting the breakage. The resin layer 37 is divided into a first region 37A1 covering the terminal portion and a second region 37A2 covering a portion other than the terminal portion. A thickness T2 of the second region 37A2 of the resin layer 37 is greater than a thickness T1 of the first region.

Description

Technical Field

[0001] This technology relates to a cover material and a packaging material. Background Technology

[0002] In related art, a technique for detecting the opening of a containment portion in packaging material (e.g., puncture-proof packaging (PTP)) is known, the packaging material including a containment portion for containing tablets, etc., and an example of this is disclosed in Patent Document 1. The packaging material disclosed in Patent Document 1 includes a containment sheet (an embodiment of a containment container) having multiple containment portions, and an opening detection sheet having a circuit pattern formed thereon. When the contained item is removed from the containment portion, the circuit pattern of the opening detection sheet is broken. This breakage is detected by an external opening detector, thus detecting the opening of the containment portion.

[0003] The circuit pattern of the open-pack detection chip is divided into areas covered by a resin layer and areas not covered by a resin layer. The uncovered areas serve as connection points to the terminals of the open-pack detector.

[0004] Reference List Patent documents Patent Document 1: JP2020-189636A (Technical issues) The opening detection sheet can then be attached to the cover material of the receiving sheet, but it is convenient if the opening detection sheet can be pre-bonded to the receiving sheet as a cover material. If the opening detection sheet is used as a cover material, the opening detection function can be provided to existing PTP without increasing the number of manufacturing steps.

[0005] However, there is a concern that the connection portions of the circuit pattern in the opening detection sheet disclosed in Patent Document 1 may be damaged during thermoforming. For example, in the PTP manufacturing process, thermoforming between the cover material and the receiving sheet is performed by applying a pressure of about 0.2 MPa to 0.4 MPa within a temperature range of about 200°C to 300°C. The connection portions of the circuit pattern disclosed in Patent Document 1 are not covered by a resin layer, and there is a concern that the connection portions may peel off from the substrate under such high temperature and pressure. Summary of the Invention

[0006] This technology is based on the above situation, and the purpose of this technology is to realize a cover material with opening detection function and stable heat sealing, as well as packaging material including the cover material.

[0007] (Solution to the problem) The cover material according to the technology described in this application is a cover material for sealing the receiving portion of a receiving container, the cover material comprising: a base layer; a circuit pattern disposed on the base layer and having wiring paths configured to be broken when the receiving portion is opened; a resin layer covering the circuit pattern from a side opposite to the base layer; and a thermal adhesive layer configured to be thermally bonded to the receiving container, wherein the wiring paths are provided with terminal portions configured to be connected to an external device for detecting damage, the resin layer is divided into a first region covering the terminal portions and a second region covering the portion excluding the terminal portions, and the thickness of the second region of the resin layer is greater than the thickness of the first region.

[0008] In the cover material having the above configuration, the resin layer may include a first resin layer disposed on the first region and the second region, and a second resin layer disposed in the second region but not disposed in the first region.

[0009] In the cover material having the above configuration, the dry weight per unit area in the second region of the resin layer can be more than 3.0 g / m² and less than 5.0 g / m².

[0010] In the cover material having the above configuration, the dry weight per unit area in the first region of the resin layer can be more than 0.6 g / m² and less than 2.5 g / m².

[0011] In the cover material having the above configuration, the terminal portion can be configured to conduct through contact with a tapered contact element included in an external device.

[0012] In the cover material with the above configuration, the heat-adhesive layer can be sealed to the receiving part by heat pressing at a heating temperature of 220°C to 240°C.

[0013] Packaging materials according to the technology described in this application include: a cover having the above-described configuration; and a receiving container having a receiving portion sealed by the cover, wherein the contents contained in the receiving portion can be removed by pressing and breaking the cover.

[0014] In packaging materials with the above configuration, the wiring path can be shaped such that, in a plan view, it passes through an overlapping portion that overlaps with the receiving portion, folds back, and passes through the overlapping portion again.

[0015] (Advantages of the invention) According to this technology, it is possible to realize a cap material with opening detection function and stable heat sealing, as well as packaging material including the cap material. Attached Figure Description

[0016] [ Figure 1 ] Figure 1This is a 3D view of the PTP attached to the open-seal detector.

[0017] [ Figure 2 ] Figure 2 This is a 3D view of the opening detector with the second cover shifted upwards.

[0018] [ Figure 3 ] Figure 3 This is a three-dimensional exploded view of PTP.

[0019] [ Figure 4 ] Figure 4 This is a cross-sectional view showing the state of the opening inspection sheet being thermally bonded to the sheet container by a hot roller.

[0020] [ Figure 5 ] Figure 5 This is a top view of the PTP.

[0021] [ Figure 6 ] Figure 6 It is along Figure 5 The sectional view taken from line II in the diagram.

[0022] [ Figure 7 ] Figure 7 yes Figure 6 An enlarged cross-sectional view of the area near the second region of the resin layer.

[0023] [ Figure 8 ] Figure 8 This is a table showing the results of evaluating Experiment 1.

[0024] [ Figure 9 ] Figure 9 This is a top view of a PTP according to another embodiment. Detailed Implementation

[0025] <Implementation Method 1> Reference Figures 1 to 8 Embodiment 1 will be described. In this embodiment, an opening detection sheet (an embodiment of a cap material having an opening detection function) 30 and a PTP (an embodiment of a puncture-proof package or packaging material) 10 to which the opening detection sheet 30 is thermally bonded are illustrated. In some of the figures, the X-axis, Y-axis, and Z-axis are shown, and the directions of each axis are drawn as common directions in all the figures.

[0026] like Figure 1 As shown, PTP 10 is attached to the open-seal detector 40, which is an external device, to detect the open state. The open-seal detection method and the output method of the open-seal detection result of the open-seal detector 40 are not limited, and will be referred to below. Figure 1 and Figure 2An embodiment of the unpacking detector 40 is described. The unpacking detector 40 includes at least a plurality of (12 in this embodiment) contact elements 41B, a communication module 42, and a housing 50. The housing 50 houses the units and also serves as an attachment for removably clamping and holding the PTP 10.

[0027] The housing 50 of the open-box detector 40 is made of resin material and includes a first housing 51 and a second housing 52. The first housing 51 occupies most of the housing 50 and has a recessed upper front portion. The second housing 52 is a cover that covers the recess in the upper front portion of the first housing 51. The second housing 52 is pressed in the vertical direction (Z-axis direction) and displaced toward the first housing 51. Therefore, the PTP 10 is clamped and held between the first housing 51 and the second housing 52. In this way, the PTP 10 is attached to the open-box detector 40.

[0028] The contact element 41B of the open-box detector 40 protrudes from the surface of the first housing 51 that holds the PTP 10 and has a tapered shape. At least the protruding end of the contact element 41B is conductive. When the PTP 10 is attached to the open-box detector 40 ( Figure 1 Contact element 41B contacts and conducts with the corresponding terminal portions 32Z1 and 32A1 to 32J1 of the circuit pattern 32 of PTP 10, which will be described later.

[0029] The communication module 42 of the unsealing detector 40 includes a control unit (detection unit) and a communication unit. The control unit allows current to flow through the contact element 41B and detects the voltage generated in the circuit pattern 32 of the PTP 10. The control unit 44 then compares the detected voltage value with a predetermined threshold. If the detected voltage value is equal to or less than the threshold, it determines that the circuit pattern 32 is intact and in a sealed state. If the detected voltage value is greater than the threshold, it determines that the circuit pattern 32 is damaged and in an unsealed state. The communication unit sends and outputs the determined unsealing detection information to a management server or information processing terminal.

[0030] Next, PTP 10 will be described in detail. For example... Figure 3 As shown, PTP 10 includes a sheet container 20 and an opening detection sheet 30 to be heat-pressed onto the sheet container 20. The sheet container 20 includes a receiving portion 21 for a container M, such as a tablet. For example, as... Figure 4As shown, the opening detection sheet 30 is thermally bonded to the sheet container 20 by a hot roller HR provided in the filling machine. When the opening detection sheet 30 is thermally bonded to the sheet container 20, the opening detection sheet 30 covers the opening 21A of the receiving portion 21 and seals the receiving portion 21. The planar shape and planar dimensions of the opening detection sheet 30 are formed to cover the entire main surface of the sheet container 20, and in this embodiment, they are substantially the same as the planar shape and planar dimensions of the sheet container 20.

[0031] The sheet container 20 includes a plurality of receiving portions 21 protruding toward a side opposite to the opening detection sheet 30. Each receiving portion 21 has an internal space on its inner side for receiving an object M, and its boundary with the opening detection sheet 30 is an opening 21A. The receiving portions 21 are formed to follow the shape of the object M in a plan view. Materials known as PTP sheet containers are suitably used for the sheet container 20. The sheet container 20 is, for example, a resin container obtained by processing a resin sheet with a thickness of approximately 60 μm to 400 μm.

[0032] In this embodiment, each of the receiving portions 21 has a circular shape in plan view, and a total of ten receiving portions 21 are formed as follows: five receiving portions 21 are formed at predetermined intervals in the longitudinal direction (Y-axis direction), and two receiving portions 21 are formed at predetermined intervals in the short direction (X-axis direction). Furthermore, the five receiving portions 21 arranged in the longitudinal direction are formed near one short side 20A of the sheet-like container 20. Therefore, a blank area 20S, wider than that between one short side 20A and the receiving portion 21, is formed between the other short side 20B of the sheet-like container 20. The blank area 20S is the area overlapping in plan view with the first region 37A1 of the resin layer 37 of the opening detection sheet 30, which will be described later.

[0033] The opening detection sheet 30 is a composite material with a sheet-like shape that can be pressed through. The portion of the opening detection sheet 30, except for the part covering the opening 21A of the receiving portion 21, is thermally bonded to the sheet-like container 20. For example... Figure 6 As shown, the opening test sheet 30 is an aluminum laminate in which the thermal adhesive layer 31, the base layer 35 (aluminum foil 33 and insulating layer 34), the circuit pattern 32, and the resin layer (outer coating and protective layer) 37 are stacked in this order from the bottom side (sheet container 20 side).

[0034] The thermal adhesive layer 31 is configured to be thermally bonded to the sheet container 20 and cover the receiving portion 21. The sealing performance of the receiving portion 21 is appropriately designed according to the application of PTP 10, but the receiving portion 21 does not need to be airtight to the point of being completely leak-proof of gas, and can be airtight to the point of being at least leak-proof of solids. Known thermal adhesives for PTP can be used for the thermal adhesive layer 31. The thermal adhesive layer 31 is formed, for example, by a thermal adhesive such as polyester adhesives, polypropylene adhesives, vinyl chloride adhesives, or vinyl chloride-vinyl acetate copolymer adhesives (vinyl chloride-vinyl acetate adhesives).

[0035] The temperature at which the heat-adhesive layer 31 is heat-pressed, i.e., the heating temperature performed by the hot roller HR, is appropriately selected according to the type of PTP 10, and is typically in the range of 220°C to 260°C or in the range of 200°C to 300°C. In this embodiment, since the second region 37A2 of the resin layer 37 is formed as a thick film as described later, it is preferable that the heat-adhesive layer 31 is formed of a material with a low melting point so that even when heated by the hot roller HR via the thick resin layer 37, reliable heat bonding can be achieved in a short time, as in the related art. The heat-adhesive layer 31 is, for example, a heat-adhesive such as polyester adhesives, polypropylene adhesives, vinyl chloride adhesives, or vinyl chloride-vinyl acetate copolymer adhesives (vinyl chloride-vinyl acetate adhesives).

[0036] The substrate 35 includes an aluminum foil 33 and an insulating layer 34. By using the aluminum foil 33 in the substrate 35, moisture resistance can be particularly enhanced compared to resin or paper. The insulating layer 34 is disposed between the aluminum foil 33 and the circuit pattern 32 to ensure insulation between them. For example, to facilitate reading of barcodes or two-dimensional barcodes printed as needed, white ink can be applied to the entire surface of the main surface of the aluminum foil 33 on the insulating layer 34 side.

[0037] Circuit pattern 32 is disposed on the main surface 34A of the insulating layer 34 on the side opposite to the aluminum foil 33. Circuit pattern 32 includes multiple wiring patterns formed by printing conductive ink or the like on the insulating layer 34. Circuit pattern 32 is formed, for example, by supplying conductive ink in a predetermined pattern shape to the surface of the insulating layer 34 and then curing the conductive ink. Conductive ink is a conductive composition in which conductive particles are dispersed in a carrier containing a binder, and various particles made of materials exhibiting good electrical conductivity, such as gold, silver, copper, platinum, aluminum, their alloys, and carbon black, are used. As a method of supplying conductive ink, various printing methods, such as supplying via a dispenser, gravure printing, and inkjet printing, can be used. As a method of curing the conductive composition, depending on the type of conductive ink to be used, a drying curing method, a heat curing method, or the like is used.

[0038] like Figure 5 As shown, the circuit pattern 32 according to this embodiment includes the same number of wiring paths as the number of receiving portions 21, and more specifically, includes ten wiring paths 32A, 32B, 32C, 32D, 32E, 32F, 32G, 32H, 32I, and 32J (hereinafter referred to as 32A to 32J). Each of the wiring paths 32A to 32J is disposed in each of the receiving portions 21 such that the wiring path is different for each of the receiving portions 21.

[0039] Each of the wiring paths 32A to 32J has two ends located on one short side 10A of the PTP 10. Each of the wiring paths 32A to 32J has two ends provided with terminal portions to be contacted and connected to the contact element 41B of the opening detector 40. More specifically, a first terminal portion 32Z1 is located on one end side of each of the wiring paths 32A to 32J, and second terminal portions 32A1, 32B1, 32C1, 32D1, 32E1, 32F1, 32G1, 32H1, 32I1, and 32J1 (hereinafter referred to as 32A1 to 32J1) are located on the other end side.

[0040] The first terminal portion 32Z1 is located at the same position for all wiring paths 32A to 32J and is a common terminal for all wiring paths 32A to 32J. The first terminal portion 32Z1 is connected to one of the contact elements 41B and a predetermined reference potential (specifically, GND potential) is supplied from the contact element 41B. The second terminal portions 32A1 to 32J1 are located at different positions for the corresponding wiring paths 32A to 32J. Each of the second terminal portions 32A1 to 32J1 is connected to any one of the contact elements 41B and a predetermined potential is supplied from the contact element 41B. When a predetermined potential difference (applied voltage) is generated between the first terminal portion 32Z1 and the second terminal portions 32A1 to 32J1, current flows through each of the wiring paths 32A to 32J.

[0041] The corresponding wiring paths 32A to 32J are formed to connect the first terminal portion 32Z1 and the second terminal portions 32A1 to 32J1. The lengths of the wiring paths 32A to 32J are formed such that the wiring paths 32A to 32J located in the receiving portion 21, which is further away from the terminal portions 32Z1 and 32A1 to 32J1, are longer. Furthermore, the corresponding wiring paths 32A to 32J have overlapping portions 32A2 to 32J2 that overlap with the receiving portion 21 in a plan view. When the receiving portion 21 is opened, the overlapping portions 32A2 to 32J2 of the wiring paths 32A to 32J are destroyed.

[0042] Regarding wiring paths 32A to 32J, as follows Figure 5As shown in the embodiment, wiring paths 32A and 32J can be configured to fold back in a generally U-shape through overlapping portions 32A2 and 32J2, and then fold back again through overlapping portions 32A2 and 32J2. In this way, the receiving portion 21 is more reliably destroyed when opened.

[0043] When PTP 10 is attached to the open-seal detector 40 ( Figure 1 Terminal portions 32Z1 and 32A1 to 32J1 are connected to contact element 41B of the unsealing detector 40. When the PTP 10 is clamped between the first housing 51 and the second housing 52 of the unsealing detector 40, contact element 41B is pressed toward the opposing terminal portions 32Z1 and 32A1 to 32J1. As described above, contact element 41B has a tapered shape and is configured to be connected to terminal portions 32Z1 and 32A1 to 32J1 when pressed.

[0044] A resin layer 37 is formed as the outermost layer of the open-pack test sheet 30 across its entire surface, covering and protecting the other layers of the open-pack test sheet 30. The resin layer 37 is printed and coated onto the entire main surface 34A of the insulating layer 34, covering the entire circuit pattern 32. The material of the resin layer 37 is not particularly limited, as long as it is a resin material, such as an epoxy resin, and is formed by a printed coating (MOP, Mat Over Print). The resin layer 37 protects the open-pack test sheet 30 from heating and pressurization by the hot roller HR during manufacturing and from damage caused by external forces during transportation. Therefore, the resin layer 37 preferably has heat and pressure resistance to heating by the hot roller HR, and adhesive strength (adhesion) that makes the resin layer 37 difficult to peel off by external forces.

[0045] like Figures 5 to 7 As shown, the planar surface of the resin layer 37 is divided into a first region 37A1 covering the terminal portions 32Z1 and 32A1 to 32J1 of the circuit pattern 32, and a second region 37A2 covering most of the circuit pattern 32 except for the terminal portions 32Z1 and 32A1 to 32J1. The first region 37A1 is the region on one of the short sides 10A of the PTP 10 (see...). Figure 5 ), and is the area that overlaps with the blank area 20S of the sheet container 20 in the plan view.

[0046] The resin layer 37 has a laminated structure of a first resin layer 38 and a second resin layer 39 in the layer thickness direction. The first resin layer 38 is coated across the first region 37A1 and the second region 37A2. The second resin layer 39 is coated on the second region 37A2 but not on the first region 37A1. Therefore, as Figure 7As shown, the thickness T2 of the second region 37A2 of the resin layer 37 is greater than the thickness T1 of the first region.

[0047] In this way, the portion of the circuit pattern 32 that is attached to the open-pack detector 40 in the plane of the open-pack detection sheet 30, namely, the terminals 32Z1 and 32A1 to 32J1, can be conductive to the open-pack detector 40 while being protected by the first region 37A1 of the resin layer 37. More specifically, by adjusting the thickness T1 of the first region 37A1 of the resin layer 37 to be sufficiently small, the terminals 32Z1 and 32A1 to 32J1 can be conductive to the contact element 41B of the open-pack detector 40 via the first region 37A1 of the thin film. In this embodiment, the contact element 41B has a tapered shape, and when pressed, the contact element 41B is easily conductive to the terminals 32Z1 and 32A1 to 32J1 via the first region 37A1 of the resin layer 37. Depending on the thickness T1 of the first region 37A1 of the resin layer 37, the contact element 41B penetrates the first region 37A1 of the resin layer 37 and contacts the terminals 32Z1 and 32A1 to 32J1. In this way, the contact element 41B of the opening detector 40 and the terminals 32Z1 and 32A1 to 32J1 of the opening detection sheet 30 can be reliably connected. On the other hand, since most of the sheet surface of the opening detection sheet 30 is covered by the second region 37A2 of the resin layer 37 with a large film thickness T2, insulation performance is ensured. As a result, the opening detection sheet 30 can be stably heat-pressed to the sheet container 20, and the PTP 10 can be manufactured using a container filling machine in the related art.

[0048] The coating amount of such resin layer 37 is preferably such that the dry weight per unit area in the first region 37A1 of resin layer 37 is 0.6 g / m² or more and 2.5 g / m² or less. When the dry weight is less than 0.6 g / m², the thickness T1 of the first region 37A1 of resin layer 37 becomes small, and the terminals 32Z1 and 32A1 to 32J1 cannot be protected from heating by the hot roller HR, and heat resistance and pressure resistance cannot be ensured. Furthermore, when the dry weight is greater than 2.5 g / m², the thickness T1 of the first region 37A1 of resin layer 37 becomes too large, and the terminals 32Z1 and 32A1 to 32J1 cannot be connected to the contact element 41B of the unsealing detector 40.

[0049] The coating amount of resin layer 37 is preferably such that the dry weight per unit area of ​​the second region 37A2 of resin layer 37 is 3.0 g / m² or more and 5.0 g / m² or less. When the dry weight is less than 3.0 g / m², the thickness T2 of the second region 37A2 of resin layer 37 becomes smaller, and the insulation performance of the circuit pattern 32 covered by the second region 37A2 of resin layer 37 cannot be guaranteed. Furthermore, when the dry weight is greater than 5.0 g / m², the thickness T2 of the second region 37A2 of resin layer 37 increases, and the insulation performance improves. However, since the increase in thickness exceeds the necessary level, the amount of resin used increases, and more coating times are required, thereby increasing the manufacturing cost.

[0050] <Evaluation Experiment 1> To evaluate the performance of the PTP 10 described above, Evaluation Experiment 1 was conducted. In Evaluation Experiment 1, the sealing performance of the receiving portion 21 and the conductivity of the circuit pattern 32 were evaluated using evaluation samples of the PTP 10 (Examples 1 to 6). The results of the evaluation experiment are shown below. Figure 8 In the table.

[0051] <Conditions> Heat-adhesive layer 31: Type 1 (rigid vinyl chloride heat-adhesive sheet) or Type 2 (rigid vinyl chloride heat-adhesive sheet with a melting point higher than that of Type 1) Resin layer 37: Epoxy resin material Aluminum foil 33: In Examples 1 and 2, white ink is applied to the entire surface of the main surface on the side of the insulating layer 34, while in Examples 3 to 6, no such application is performed. The conditions for heat-pressing the sheet container 20 are: temperatures of 180°C, 200°C, 220°C, 240°C, and 260°C, with a constant pressure of 0.3 MPa. <Evaluation Methods> In the sealing performance test (leakage test), the evaluation sample is evacuated at 0.07 MPa for 1 minute to assess for the presence of air leakage. The sealing performance test is evaluated on a two-tiered scale, A and C, with no air leakage rated as A (Good) and the presence of air leakage rated as C (Unacceptable). In the conductivity test (device operation verification), PTP 10 is attached to the open-seal detector 40 and continuity is confirmed. The conductivity test is evaluated on a two-tiered scale, A and C, with confirmed continuity rated as A (Good) and no confirmed continuity rated as C (Unacceptable).

[0052] <Evaluation Results> like Figure 8As shown, in Examples 1 to 4 where a type 1 heat-adhesive sheet is used for the heat-adhesive layer 31, regarding sealing performance, when the opening test sheet 30 is bonded to the sheet container 20 by heat pressing at a heating temperature of 220°C or higher, good results are obtained (evaluation A). On the other hand, when heat-pressed at a heating temperature of 200°C or lower, the sealing performance is insufficient (evaluation C). Furthermore, in Examples 5 and 6 where a type 2 heat-adhesive sheet is used for the heat-adhesive layer 31, good results are obtained in heat pressing at a heating temperature of 260°C (evaluation A), but the sealing performance is insufficient in heat pressing at a heating temperature of 240°C or lower (evaluation C). Regarding sealing performance, it is confirmed that by using a type 1 heat-adhesive sheet with a low melting point, the temperature during heat pressing is easily reduced.

[0053] Regarding conductivity, in all Examples 1 to 6, good results were obtained in hot pressing at heating temperatures above 220°C (evaluation A). On the other hand, in hot pressing at heating temperatures below 200°C, conductivity testing was not performed due to poor results in the previous sealing performance test (evaluation C). Figure 8 (In the table, it is represented by "-").

[0054] <Other Implementation Methods> The present invention is not limited to the embodiments described with reference to the above description and drawings, and for example, the following embodiments are also included within the technical scope of the present invention.

[0055] (1) The shape of the circuit pattern 32 of the opening detection chip 30 is an example, and can be appropriately changed. For example, wiring paths 132A to 132J can be formed as follows: Figure 9 The PTP 100 shown has an opening detection piece 130. Wiring paths 132A to 132J can be configured to fold back in a generally U-shape through overlapping portions 132A2 to 132J2, and then fold back again through overlapping portions 132A2 to 132J2. In this way, all wiring paths 132A to 132J are more reliably destroyed when the receiving portion 21 is opened.

[0056] (2) The configuration of the base layer 35 of the opening test sheet 30 can be appropriately changed according to the purpose. For example, the aluminum foil 33 in the base layer 35 is not limited to a single layer, and two aluminum foils can be bonded together by an intermediate layer made of resin.

[0057] (3) The size and shape of the sheet container 20, the number and spacing of the receiving parts 21 in the attached figure are embodiments and can be changed appropriately.

[0058] List of reference numerals 10: PTP (Packaging Material) 20: Sheet-shaped containers (containers) 21: Reception Department 21A: Opening 30, 130: Opening test sheet (cap material) 31: Thermal adhesive layer 32: Circuit diagram 32A, 32B, 32C, 32D, 32E, 32F, 32G, 32H, 32I, 32J: Wiring paths 32A1, 32B1, 32C1, 32D1, 32E1, 32F1, 32G1, 32H1, 32I1, 32J1: Second terminal section 32Z1: First terminal section 33: Aluminum foil 34: Insulation layer 35: Basal layer 37: Resin layer 37A1: Area 1 37A2: Second Zone 38: First resin layer 39: Second resin layer 40: Opening detector (external device) 41B: Contact element M: The object being contained.

Claims

1. A cover material for sealing a receiving portion of a receiving container, the cover material comprising: basal layer; A circuit pattern disposed on the substrate and having wiring paths configured to be destroyed when the receiving portion is opened; A resin layer that covers the circuit pattern from the side opposite to the substrate layer; as well as A thermal adhesive layer, the thermal adhesive layer being configured to thermally bond to the receiving container, wherein The wiring path is provided with a terminal section, which is configured to connect to an external device for detecting the damage. The resin layer is divided into a first region covering the terminal portion and a second region covering the portion other than the terminal portion, and The thickness of the second region of the resin layer is greater than the thickness of the first region.

2. The cover material according to claim 1, wherein... The resin layer comprises: A first resin layer disposed on the first region and the second region, and a second resin layer disposed in the second region but not in the first region.

3. The cover material according to claim 1 or 2, wherein The dry weight per unit area of ​​the second region of the resin layer is more than 3.0 g / m² and less than 5.0 g / m².

4. The cover material according to claim 1 or 2, wherein The dry weight per unit area of ​​the first region of the resin layer is more than 0.6 g / m² and less than 2.5 g / m².

5. The cover material according to claim 1 or 2, wherein The terminal portion is configured to conduct through contact with a tapered contact element included in the external device.

6. The cover material according to claim 1 or 2, wherein The heat-adhesive layer can seal the receiving portion by heat pressing at a heating temperature of 220°C to 240°C.

7. A packaging material, comprising: The cover material according to claim 1 or 2; as well as A receiving container having a receiving portion sealed by the lid material, wherein... The contents contained in the receiving section can be removed by pressing and breaking the cover material.

8. The packaging material according to claim 7, wherein... The wiring path is shaped such that in a plan view it passes through an overlapping portion that overlaps with the receiving portion, folds back, and passes through the overlapping portion again.

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