Display module, display device and preparation method of display module

Abstract

The application relates to a display module, a display device and a preparation method of the display module. The display module comprises a dam area, and the display module comprises a substrate, a first insulating layer and a second insulating layer. The first insulating layer is arranged on one side of the substrate, and the second insulating layer is arranged on the side, away from the substrate, of the first insulating layer. At least one first blocking opening is arranged on the first insulating layer in the dam area, and at least one second blocking opening is arranged on the second insulating layer in the dam area. The at least one second blocking opening and the at least one first blocking opening are arranged in correspondence, and the second blocking opening and the corresponding first blocking opening are communicated. By arranging the first blocking opening on the first insulating layer and the second blocking opening on the second insulating layer, and by making the first blocking opening and the second blocking opening communicated, the overflowed ink during the subsequent preparation of an MLP structure can be effectively blocked, the blocking effect of the ink overflow is improved, and the problem of the appearance white spot is solved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module, a display device, and a method for manufacturing the display module. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are widely used in display panel design due to their advantages such as lightweight, wide viewing angle, and high luminous efficiency. Improving the light extraction efficiency of OLEDs is beneficial for further reducing overall power consumption and extending screen lifespan. Currently, the goal of improving OLED light extraction efficiency is achieved by incorporating a microlens pattern (MLP) structure within the OLED screen and using this MLP structure to focus the relatively divergent light emitted by the OLED screen towards the top of the screen.

[0003] Currently, inkjet printing (IJP) is typically used to fabricate MLP structures during the screen manufacturing process. However, screens fabricated using this method suffer from white spot defects. Summary of the Invention

[0004] Therefore, it is necessary to provide a display module, a display device, and a method for manufacturing the display module to address the aforementioned technical problems, aiming to solve the problem of metal wire breakage when the display module is bent.

[0005] In a first aspect, this application provides a display module including a dam area; the display module includes: a substrate, a first insulating layer, and a second insulating layer, the first insulating layer being disposed on one side of the substrate, and the second insulating layer being disposed on the side of the first insulating layer opposite to the substrate. At least one first blocking opening is provided on the first insulating layer located in the dam area, and at least one second blocking opening is provided on the second insulating layer located in the dam area. The at least one second blocking opening and the at least one first blocking opening are correspondingly arranged, and the second blocking opening and the corresponding first blocking opening are in communication.

[0006] In one embodiment, the first insulating layer includes multiple sub-insulating layers stacked along the thickness direction of the substrate, and the first blocking opening penetrates the surface of the first insulating layer facing the second insulating layer and penetrates at least a portion of the sub-insulating layers.

[0007] Preferably, the multilayer sub-insulating layer includes a first sub-insulating layer, which is disposed on the side of the second insulating layer facing the substrate. The first blocking opening includes a first sub-blocking opening disposed on the first sub-insulating layer, and the second blocking opening is connected to the first sub-blocking opening of the corresponding first blocking opening.

[0008] Preferably, the multilayer sub-insulating layer includes a second sub-insulating layer, the second sub-insulating layer is disposed on the side of the first sub-insulating layer facing the substrate, and the first blocking opening includes a second sub-blocking opening disposed on the second sub-insulating layer, the first sub-blocking opening and the second sub-blocking opening are connected.

[0009] Preferably, the multilayer sub-insulating layer includes a third sub-insulating layer, which is disposed on the side of the second sub-insulating layer facing the substrate, and the first blocking opening includes a third sub-blocking opening disposed on the third sub-insulating layer, and the second sub-blocking opening and the third sub-blocking opening are connected.

[0010] Preferably, the multilayer sub-insulating layer includes a fourth sub-insulating layer, which is disposed on the side of the third sub-insulating layer facing the substrate, and the first blocking opening includes a fourth sub-blocking opening disposed on the fourth sub-insulating layer, and the third sub-blocking opening and the fourth sub-blocking opening are connected.

[0011] Preferably, the multilayer sub-insulating layer includes a fifth sub-insulating layer, which is disposed on the side of the fourth sub-insulating layer facing the substrate, and the first blocking opening includes a fifth sub-blocking opening disposed on the fifth sub-insulating layer, and the fourth sub-blocking opening and the fifth sub-blocking opening are connected.

[0012] Preferably, the multilayer sub-insulating layer includes a sixth sub-insulating layer, which is disposed on the side of the fifth sub-insulating layer facing the substrate, and the first blocking opening includes a sixth sub-blocking opening disposed on the sixth sub-insulating layer, and the fifth sub-blocking opening and the sixth sub-blocking opening are connected.

[0013] Preferably, the display module includes a first touch conductive layer and a second touch conductive layer stacked together, and a first sub-insulating layer is disposed between the first touch conductive layer and the second touch conductive layer;

[0014] Preferably, the second sub-insulating layer is configured as the first inorganic encapsulation layer;

[0015] Preferably, the third sub-insulating layer is configured as an organic encapsulation layer;

[0016] Preferably, the fourth sub-insulating layer is configured as the second inorganic encapsulation layer;

[0017] Preferably, the fifth sub-insulating layer is configured as a pixel-defining layer;

[0018] Preferably, the sixth sub-insulating layer is configured as a planarization layer.

[0019] In one embodiment, there are multiple first blocking openings, which are arranged along a first direction to form a first blocking opening group. There are multiple first blocking opening groups, which are arranged along a second direction. The first direction and the second direction intersect each other and intersect in the thickness direction of the substrate.

[0020] Preferably, the first blocking opening group consists of two;

[0021] Preferably, the display module includes a display area, a dam area is located at least on one side of the display area along the second direction, and at least one first blocking opening penetrates the first insulating layer along the first direction and is located on the side of all the first blocking opening groups away from the display area.

[0022] Preferably, the shape of the orthographic projection of the opening on the substrate includes a circle, a heart shape, a rhombus shape, an ellipse, or a rectangle.

[0023] In one embodiment, the display module includes a light extraction layer disposed on the side of the second insulating layer away from the substrate and in contact with the second insulating layer, wherein the refractive index of the light extraction layer is greater than the refractive index of the second insulating layer;

[0024] Preferably, the material of the light extraction layer is an organic material;

[0025] Preferably, the refractive index of the light extraction layer is greater than or equal to 1.65.

[0026] In one embodiment, the sum of the dimensions of the second blocking opening and the first blocking opening along the thickness direction of the substrate ranges from 2 μm to 10 μm.

[0027] Preferably, the second blocking opening has a dimension of 2 μm along the thickness direction of the substrate;

[0028] Preferably, at least one of the first sub-blocking opening, the second sub-blocking opening, the third sub-blocking opening, and the fourth sub-blocking opening has a dimension of 1μm-1.5μm along the thickness direction of the substrate;

[0029] Preferably, the fifth sub-blocking opening has a dimension of 1.5 μm along the thickness direction of the substrate;

[0030] Preferably, the size of the sixth sub-blocking opening along the thickness direction of the substrate is 4μm-5μm.

[0031] In one embodiment, the display module includes at least one signal trace, the signal trace being located at least in the dam area, and the orthographic projection of the signal trace on the substrate does not overlap with the orthographic projection of the first blocking opening of the first insulating layer on the substrate.

[0032] Preferably, at least one signal trace includes a first power line, the first power line is located on the side of the sixth sub-insulator facing the substrate, and the orthographic projection of the first power line on the substrate is located within the orthographic projection of the sixth sub-insulator.

[0033] Preferably, there are multiple signal traces, and the multiple signal traces also include a second power line. The voltages of the first power line and the second power line are different, and the orthographic projection of the second power line on the substrate is located within the orthographic projection of the sixth sub-insulating layer.

[0034] Preferably, the orthographic projections of the first touch conductive layer and the second touch conductive layer on the substrate do not overlap with the orthographic projection of the first blocking opening on the substrate.

[0035] The display module provided in this application embodiment, by providing a first blocking opening in the first insulating layer and a second blocking opening in the second insulating layer, and the first blocking opening and the second blocking opening are connected, can effectively block the ink overflowing when the MLP structure is prepared by inkjet printing on the side of the second insulating layer away from the substrate, thereby improving the blocking effect of ink overflow and solving the problems of white spots on the appearance and improving the problem of metal breakage in the bending area.

[0036] Secondly, this application also provides a display device, which includes the display module provided in the first aspect. Preferably, the display device includes a privacy screen structure.

[0037] The display device provided in this application embodiment, by providing a first blocking opening in the first insulating layer and a second blocking opening in the second insulating layer, and the first blocking opening and the second blocking opening are connected, can effectively block the ink overflowing when preparing the MLP structure by inkjet printing on the side of the second insulating layer away from the substrate, thereby improving the blocking effect of ink overflow and solving the problems of white spots on the appearance and improving the problem of metal breakage in the bending area.

[0038] Thirdly, this application also provides a method for manufacturing a display module, the method comprising:

[0039] Provide substrate;

[0040] A first insulating layer is formed on one side of the substrate;

[0041] A second insulating layer is formed on the side of the first insulating layer that faces away from the substrate;

[0042] The first insulating layer located in the dam area has at least one first blocking opening, and the second insulating layer located in the dam area has at least one second blocking opening. The at least one second blocking opening and the at least one first blocking opening are correspondingly arranged, and the second blocking opening and the corresponding first blocking opening are connected.

[0043] The method for manufacturing a display module provided in this application provides a first blocking opening in the first insulating layer and a second blocking opening in the second insulating layer, wherein the first blocking opening and the second blocking opening are connected. This method can effectively block ink overflow during the subsequent fabrication of the MLP structure on the side of the second insulating layer away from the substrate using inkjet printing, thereby improving the blocking effect of ink overflow and solving the problems of white spots on the appearance and improving the problem of metal breakage in the bending area. Attached Figure Description

[0044] Figure 1 This is a top view of the display module provided in an embodiment of this application.

[0045] Figure 2 for Figure 1 A schematic diagram of a partial cross-sectional structure along the A-A' direction.

[0046] Figure 3 This is an enlarged view of the first insulating layer in an embodiment of this application.

[0047] Figure 4 Another top view of the display module provided in the embodiment of this application.

[0048] Figure 5 for Figure 1 Another partial cross-sectional structural diagram along the A-A' direction.

[0049] Figure 6 This is a schematic diagram of the manufacturing process of the display module in an embodiment of this application.

[0050] Explanation of reference numerals in the attached figures:

[0051] 100, Display module; 100a, Display area; 100b, Dam area; 100c, Bending area; 10, Substrate; 20, First insulating layer; 30, Second insulating layer; 110, First blocking opening; 210, Second blocking opening; 401, Recess; 207, First touch conductive layer; 208, Second touch conductive layer; 201, First sub-insulating layer; 2011, First sub-blocking opening; 202, Second sub-insulating layer; 2021, Second sub-blocking opening; 203, Third sub-insulating layer; 2031, Third sub-blocking opening; 204, Fourth sub-insulating layer; 2041, Fourth sub-blocking opening; 205, Fifth sub-insulating layer; 2051, Fifth sub-blocking opening; 206, Sixth sub-insulating layer; 2061, Sixth sub-blocking opening; 21, First blocking opening group. Detailed Implementation

[0052] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0054] When describing positional relationships, unless otherwise specified, when an element, such as a layer, film, or substrate, is referred to as being "on" another element, it may be directly on the other element or there may be intermediate elements present. Furthermore, when a layer is referred to as being "below" another layer, it may be directly below it or there may be one or more intermediate elements present. It is also understood that when a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or there may be one or more intermediate elements present.

[0055] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0056] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0057] It should also be understood that, in interpreting an element, although not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of a particular value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0058] Furthermore, in the instruction manual, the phrase "planar distribution diagram" refers to the diagram when the target part is viewed from above, and the phrase "cross-sectional diagram" refers to the diagram when the target part is viewed from the side as a cross-section taken by vertically cutting the target part.

[0059] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0060] As described in the background section, organic light-emitting diodes (OLEDs) are widely used in display panel design due to their advantages such as lightweight, wide viewing angle, and high luminous efficiency. Improving the light extraction efficiency of OLEDs is beneficial for further reducing overall power consumption and extending screen lifespan. Currently, the light extraction efficiency of OLEDs is improved by setting a micro-lens pattern (MLP) structure within the OLED screen and using this MLP structure to focus the relatively divergent light emitted by the OLED screen towards the top of the screen.

[0061] Currently, inkjet printing (IJP) is typically used to fabricate MLP structures during the screen manufacturing process. However, ink overflow can occur after inkjet printing, resulting in uneven ink distribution on the screen bezel and causing white spots on the screen. Furthermore, the ink may overflow into the bending area, causing stress concentration at this location and posing a risk of metal wire breakage when the display panel is bent.

[0062] This application provides a display module, a display device, and a method for manufacturing the display module, aiming to solve the aforementioned technical problems. The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0063] In combination with appendix Figure 1-6 The display module 100 and display device provided in the embodiments of this application will be described.

[0064] In some embodiments, the display module 100 may include an organic light-emitting diode (OLED) display module 100, a quantum dot light-emitting diode (QLED) display module 100, a mini light-emitting diode display (Mini LED) display, or a micro light-emitting diode display (MicroLED), etc. This application uses an OLED display module 100 as an example for illustration.

[0065] The following describes the display module 100 provided in the embodiments of this application.

[0066] In some embodiments, a display module 100 is provided, such as Figure 1 The diagram shows a top view of a display module 100, which includes a dam display area 100a, a dam area 100b, and a bend area 100c. (See diagram for reference.) Figure 2 As shown, Figure 2 for Figure 1 A partial cross-sectional view along the A-A' direction shows that the display module 100 includes a substrate 10, a first insulating layer 20, and a second insulating layer 30. The first insulating layer 20 is disposed on one side of the substrate 10, and the second insulating layer 30 is disposed on the side of the first insulating layer 20 facing away from the substrate 10. At least one first blocking opening 110 is provided on the first insulating layer 20 located in the dam area 100b. Figure 2 The first blocking opening 110 is included (in practical applications, there can be multiple openings), and at least one second blocking opening 210 is provided on the second insulating layer 30 located in the dam area 100b. Figure 2 There is one second blocking opening 210 (in actual applications, there can be multiple openings). At least one second blocking opening 210 and at least one first blocking opening 110 are correspondingly set, and the second blocking opening 210 and the corresponding first blocking opening 110 are connected.

[0067] Both the display area 100a and the dam area 100b are provided with a substrate 10, a first insulating layer 20, and a second insulating layer 30. The substrate 10 provides support for the first insulating layer 20, the second insulating layer 30, and other subsequently disposed film layers. The first insulating layer 20 may include one sub-insulating layer or multiple sub-insulating layers, and the sub-insulating layer may specifically include at least one of an inorganic encapsulation layer, an organic encapsulation layer, a pixel defining layer, and a planarization layer. The second insulating layer 30 may include one sub-insulating layer or multiple sub-insulating layers, and the sub-insulating layer may specifically include an inorganic encapsulation layer and / or an organic encapsulation layer.

[0068] In this embodiment, the material of the second insulating layer 30 can be a transparent optical adhesive.

[0069] The number of first blocking openings 110 can be one or more, specifically two, three, four, or more than four. The shape of the first blocking opening 110 can include one or more of the following: circle, heart, rhombus, ellipse, and rectangle; it can also be a polygon, circle, or other irregular shape. The first blocking openings 110 can be spaced apart or connected. The shape of the first blocking opening 110 can be a concave shape. Similarly, the number of second blocking openings 210 can be one or more, specifically two, three, four, or more than four. The shape of the second blocking opening 210 can include one or more of the following: circle, heart, rhombus, ellipse, and rectangle; it can also be a polygon, circle, or other irregular shape. The second blocking openings 210 can be spaced apart or connected. The shape of the second blocking opening 210 can be a concave shape.

[0070] The first blocking opening 110 and the second blocking opening 210 are both located in the dam area 100b. The second blocking opening 210 and the first blocking opening 110 are correspondingly arranged and are connected. For example, the shape of the first blocking opening 110 and the shape of the second blocking opening 210 at the same location are the same. The second insulating layer 20 where the second blocking opening 210 is located and the first insulating layer 10 where the first blocking opening 110 is located together constitute... Figure 2 The recess 401 in the dam area 100b is used to block ink overflow during the fabrication of the MLP structure using inkjet printing. One or more recesses 401 may be included in the dam area 100b. Preferably, the sum of the dimensions of the second blocking opening 210 and the first blocking opening 110 along the thickness direction of the substrate 10 ranges from 2 μm to 10 μm, i.e., the height of the recess 401 is 2 μm to 10 μm. Preferably, the dimension of the second blocking opening 210 along the thickness direction of the substrate 10 is 2 μm, i.e., the height of the second blocking opening 210 is 2 μm.

[0071] In this application, a first insulating layer 20 can be formed on one side of the substrate 10 (i.e. above the substrate 10), and at least one first blocking opening 110 can be provided on the first insulating layer 20 in the dam area 100b. After the first blocking opening 110 is provided, a second insulating layer 30 can be formed on the side of the first insulating layer 20 away from the substrate 10 (i.e. above the first insulating layer 20), and then a second blocking opening 210 is provided in connection with the position corresponding to the first blocking opening 110.

[0072] The display module 100 described in this application, by providing a first blocking opening 110 in the first insulating layer 20 and a second blocking opening 210 in the second insulating layer 30, and with the first blocking opening 110 and the second blocking opening 210 connected, can effectively block ink overflowing from the side of the second insulating layer 30 away from the substrate 10 when preparing the MLP structure by inkjet printing, thereby improving the ink overflow blocking effect and solving the problems of white spots and metal line breaks in the bending area.

[0073] The first insulating layer 20 provided in the embodiments of this application will be described below.

[0074] In some embodiments, the first insulating layer 20 includes multiple sub-insulating layers stacked along the thickness direction of the substrate 10. The first blocking opening 110 penetrates the surface of the first insulating layer 20 facing the second insulating layer 30 and penetrates at least a portion of the sub-insulating layers. By providing multiple sub-insulating layers, the first blocking opening 110 can be deeper, effectively mitigating ink overflow.

[0075] Among them, at least a portion of the sub-insulating layers can be all the sub-insulating layers in the first insulating layer 20, or a portion of the sub-insulating layers in the first insulating layer 20. The portion can specifically be any number of 1, 2, 3, 4 or more than 4.

[0076] In this application, multiple sub-insulating layers can be stacked along the direction of the substrate 10 toward the second insulating layer 30, and penetrate the surface of the first insulating layer 20 toward the side of the second insulating layer 30, and penetrate some or all of the sub-insulating layers to form the first blocking opening 110.

[0077] In some embodiments, such as Figure 3The enlarged view of the first insulating layer 20 shown includes two first blocking openings 110. The first insulating layer 20 comprises multiple sub-insulating layers, including a first sub-insulating layer 201 disposed on the side of the second insulating layer 30 facing the substrate 10. Each first blocking opening 110 includes a first sub-blocking opening 2011 disposed on the first sub-insulating layer 201. A second blocking opening 210 communicates with the corresponding first sub-blocking opening 2011 of the first blocking opening 110. The display module 100 includes a first touch conductive layer 207 and a first touch conductive layer 208 stacked together. The first sub-insulating layer 201 is disposed between the first touch conductive layer 207 and the first touch conductive layer 208. Therefore, when setting the first blocking opening 110, the opening position of the first blocking opening 110 needs to avoid the positions of the first touch conductive layer 207 and the first touch conductive layer 208. The display module includes a first touch conductive layer 207 and a second touch conductive layer 208 stacked together, with a first sub-insulating layer 201 disposed between the first touch conductive layer 207 and the second touch conductive layer 208. The number and shape of the first sub-blocking openings 2011 can be the same as the number and shape of the first blocking openings 110. When the first insulating layer 20 includes the first sub-insulating layer 201, the corresponding first blocking opening 110 may include the first sub-blocking opening 2011 disposed on the first sub-insulating layer 201, and the second blocking opening 210 communicates with the first sub-blocking opening 2011 of the corresponding first blocking opening 110.

[0078] In some embodiments, the multilayer sub-insulating layer includes a second sub-insulating layer 202, which is disposed on the side of the first sub-insulating layer 201 facing the substrate 10. The first blocking opening 110 includes a second sub-blocking opening 2021 disposed on the second sub-insulating layer 202, and the first sub-blocking opening 2011 and the second sub-blocking opening 2021 communicate with each other. The second sub-insulating layer 202 can be configured as a first inorganic encapsulation layer. The number and shape of the second sub-blocking openings 2021 can be the same as the number and shape of the first blocking openings 110. When the first insulating layer 20 includes the second sub-insulating layer 202, the corresponding first blocking opening 110 may include the second sub-blocking opening 2021 disposed on the second sub-insulating layer 202, and the second blocking opening 210 and the corresponding second sub-blocking opening 2021 of the first blocking opening 110 communicate with each other.

[0079] In some embodiments, the multilayer sub-insulating layer includes a third sub-insulating layer 203, which is disposed on the side of the second sub-insulating layer 202 facing the substrate 10. The first blocking opening 110 includes a third sub-blocking opening 2031 disposed on the third sub-insulating layer 203, and the second sub-blocking opening 2021 and the third sub-blocking opening 2031 are connected. The third sub-insulating layer 203 can be configured as an organic encapsulation layer. The number and shape of the third sub-blocking openings 2031 can be the same as the number and shape of the first blocking openings 110. When the first insulating layer 20 includes the third sub-insulating layer 203, the corresponding first blocking opening 110 may include the third sub-blocking opening 2031 disposed on the third sub-insulating layer 203, and the second blocking opening 210 is connected to the third sub-blocking opening 2031 of the corresponding first blocking opening 110.

[0080] In some embodiments, the multilayer sub-insulating layer includes a fourth sub-insulating layer 204, which is disposed on the side of the third sub-insulating layer 203 facing the substrate 10. The first blocking opening 110 includes a fourth sub-blocking opening 2041 disposed on the fourth sub-insulating layer 204, and the third sub-blocking opening 2031 and the fourth sub-blocking opening 2041 are connected. The fourth sub-insulating layer 204 can be configured as a second inorganic encapsulation layer. The number and shape of the fourth sub-blocking openings 2041 can be the same as the number and shape of the first blocking openings 110. When the first insulating layer 20 includes the fourth sub-insulating layer 204, the corresponding first blocking opening 110 may include the fourth sub-blocking opening 2041 disposed on the fourth sub-insulating layer 204, and the second blocking opening 210 is connected to the fourth sub-blocking opening 2041 of the corresponding first blocking opening 110.

[0081] In some embodiments, the multilayer sub-insulating layer includes a fifth sub-insulating layer 205, which is disposed on the side of the fourth sub-insulating layer 204 facing the substrate 10. The first blocking opening 110 includes a fifth sub-blocking opening 2051 disposed on the fifth sub-insulating layer 205, and the fourth sub-blocking opening 2041 and the fifth sub-blocking opening 2051 are connected. The fifth sub-insulating layer 205 can be configured as a pixel defining layer. The number and shape of the fifth sub-blocking openings 2051 can be the same as the number and shape of the first blocking openings 110. When the first insulating layer 20 includes the fifth sub-insulating layer 205, the corresponding first blocking opening 110 may include the fifth sub-blocking opening 2051 disposed on the fifth sub-insulating layer 205, and the second blocking opening 210 is connected to the fifth sub-blocking opening 2051 of the corresponding first blocking opening 110.

[0082] In some embodiments, the multilayer sub-insulating layer includes a sixth sub-insulating layer 206, which is disposed on the side of the fifth sub-insulating layer 205 facing the substrate 10. The first blocking opening 110 includes a sixth sub-blocking opening 2061 disposed on the sixth sub-insulating layer 206, and the fifth sub-blocking opening 2051 and the sixth sub-blocking opening 2061 are connected. The sixth sub-insulating layer 206 can be configured as a planarization layer. The number and shape of the sixth sub-blocking openings 2061 can be the same as the number and shape of the first blocking openings 110. When the first insulating layer 20 includes the sixth sub-insulating layer 206, the corresponding first blocking opening 110 may include the sixth sub-blocking opening 2061 disposed on the sixth sub-insulating layer 206, and the second blocking opening 210 is connected to the sixth sub-blocking opening 2061 of the corresponding first blocking opening 110.

[0083] For example, at least one of the first sub-blocking opening 2011, the second sub-blocking opening 2021, the third sub-blocking opening 2031, and the fourth sub-blocking opening has a dimension of 1μm-1.5μm along the thickness direction of the substrate 10, that is, the sum of the heights of at least one of the first sub-blocking opening 2011, the second sub-blocking opening 2021, the third sub-blocking opening 2031, and the fourth sub-blocking opening is 1μm-1.5μm. For example, the dimensions of the first sub-blocking opening 2011 and the second sub-blocking opening 2021 along the thickness direction of the substrate 10 are 1μm-1.5μm. The dimension of the fifth sub-blocking opening 2051 along the thickness direction of the substrate 10 is 1.5μm, that is, the height of the fifth sub-blocking opening 2051 is 1.5μm. The dimension of the sixth sub-blocking opening 2061 along the thickness direction of the substrate 10 is 4μm-5μm, that is, the height of the sixth sub-blocking opening 2061 is 4μm-5μm.

[0084] The display module 100 described in this application has a first blocking opening 110 provided on at least a portion of the first sub-insulating layer 201, the second sub-insulating layer 202, the third sub-insulating layer 203, the fourth sub-insulating layer 204, the fifth sub-insulating layer 205, and the sixth sub-insulating layer 206. This allows the first blocking opening 110 to have a sufficiently large depth, thereby achieving a better overflow blocking effect.

[0085] In some embodiments, such as Figure 4 The top view of the display module 100 shown shows that there are multiple first blocking openings 110. The multiple first blocking openings 110 are arranged along a first direction and form a first blocking opening group 21. There are multiple first blocking opening groups 21. The multiple first blocking opening groups 21 are arranged along a second direction. The first direction and the second direction intersect and intersect in the thickness direction of the substrate 10.

[0086] Taking coordinate axes as an example, the first direction can be the X-axis / Y-axis direction, the second direction can be the Y-axis / X-axis direction, and the depth direction of the first blocking opening 110, the depth direction of the second blocking opening 210, the depth direction of the pit 401, and the thickness direction of the substrate 10 are the Z-axis direction. Preferably, the shape of the orthographic projection of the first blocking opening 110 and the second blocking opening 210 on the substrate 10 can be a circle, heart, rhombus, ellipse, or rectangle, or it can be a polygon, circle, or other irregular shape.

[0087] In this application, multiple first blocking openings 110 can be arranged at intervals along a first direction to form a first blocking opening group 21, and multiple first blocking opening groups 21 can be arranged at intervals along a second direction. For example... Figure 4 In the two first blocking opening groups 21 shown near the display area 100a, the first blocking opening group 21 and the first blocking opening group 21 are composed of squares arranged at intervals. Within the same first blocking opening group 21, there is a gap between adjacent first blocking openings 110. In adjacent first blocking opening groups 21, the first blocking opening 110 of one first blocking opening group 21 and the gap between the first blocking openings 110 of the other first blocking opening group 21 are arranged opposite each other along a second direction. Optionally, the first blocking opening groups 21 may also be composed of other shapes arranged at intervals. Optionally, in adjacent first blocking opening groups 21, the first blocking openings 110 of one first blocking opening group 21 and the first blocking openings 110 of the other first blocking opening group 21 are arranged opposite each other along a second direction. Optionally, the shapes of the first blocking openings 110 arranged at intervals in the first blocking opening groups 21 may be the same or different. Optionally, the shapes and numbers of the first blocking openings 110 in different first blocking opening groups 21 may be the same or different. Preferably, there are two first blocking opening groups 21.

[0088] Preferably, the display module 100 includes a display area 100a, a dam area 100b located at least on one side of the display area 100a along a second direction, and at least one first blocking opening 110 penetrating the first insulating layer 20 along a first direction and located on the side of all first blocking opening groups 21 opposite to the display area 100a. That is, the first blocking opening group 21 is in the shape of a through slot and is located on the side of the dam area 100b furthest from the display area 100a.

[0089] In some embodiments, such as Figure 5 As shown, the above-mentioned display module 100 includes a light extraction layer 40. The light extraction layer is disposed on the side of the second insulating layer 30 away from the substrate 10 and is in contact with the second insulating layer 30. The refractive index of the light extraction layer is greater than the refractive index of the second insulating layer 30, which is beneficial to improving the light extraction efficiency.

[0090] Preferably, the light extraction layer is made of an organic material, specifically an MLA layer. Preferably, the refractive index of the light extraction layer is greater than or equal to 1.65.

[0091] In this application, when the light extraction layer is prepared by inkjet printing, the ink that overflows can flow to the dam area 100b or be blocked by the dam area 100b to prevent it from flowing into the bending area 100c. The display module 100 includes the bending area 100c, which is located on the side of the dam area 100b away from the display area 100a.

[0092] In some embodiments, the above includes at least one signal trace located at least in the dam area 100b, and the orthographic projection of the signal trace on the substrate 10 does not overlap with the orthographic projection of the first blocking opening 110 of the first insulating layer 20 on the substrate 10.

[0093] Preferably, at least one signal trace includes a first power line, which is located on the side of the sixth sub-insulating layer 206 facing the substrate 10, and the orthographic projection of the first power line on the substrate 10 is located within the orthographic projection of the sixth sub-insulating layer 206.

[0094] Preferably, there are multiple signal traces, and the multiple signal traces also include a second power line. The voltages of the first power line and the second power line are different, and the orthographic projection of the second power line on the substrate is located within the orthographic projection of the sixth sub-insulating layer 206.

[0095] Preferably, the orthographic projections of the first touch conductive layer 207 and the first touch conductive layer 208 on the substrate 10 do not overlap with the orthographic projection of the first blocking opening 110 of the first insulating layer 20 on the substrate 10.

[0096] The signal traces are metal traces of the display module 100. The first power line can be a high-level power line, and the second power line can be a low-level power line. Metal traces also exist in the first touch conductive layer 207 and the first touch conductive layer 208.

[0097] In this embodiment of the application, when setting the pit 401, it is necessary to avoid the metal wiring. That is, the pit 401 is set in the place where the metal wiring is located, and the pit 401 is dug out in other places to facilitate the storage of more overflowing colloid.

[0098] In some embodiments, a display device is also provided, which includes the display module 100 in any of the above embodiments. Therefore, this display device also has the beneficial effects of the display module 100 in the above embodiments. The similarities can be understood with reference to the explanation of the display module 100 above, and will not be repeated here.

[0099] For example, the display device can be a mobile phone or any electronic product with display function, including but not limited to the following categories: television, laptop, desktop monitor, tablet computer, digital camera, smart bracelet, smart glasses, vehicle display, industrial control equipment, medical display screen, touch interactive terminal, etc. The embodiments of this application do not make any special limitations on this.

[0100] For example, the display device includes a privacy screen structure. In the privacy screen structure, the thickness of the display module 100 is much greater than that of the display module 100 in a conventional structure. For instance, the thickness of the first insulating layer 20 in the privacy screen structure is greater than that in a conventional structure. Therefore, when fabricating the display module 100 in the privacy screen structure, the risk of ink overflow from the MLA layer is reduced, and the pit 401 formed using the method in this embodiment has a more significant blocking effect.

[0101] It should be noted that this embodiment only uses a display module 100 including a first insulating layer 20 and a second insulating layer 30. In this example, the recess 401 serves to prevent overflow of the display module 100 including the first insulating layer 20 and the second insulating layer 30 during inkjet printing. In practical applications, if the insulating layer to be inkjet printed in the display module 100 is higher, for example, if the display module 100 includes a first insulating layer 20, a second insulating layer 30, and a third insulating layer sequentially along the thickness direction of the substrate 10, and inkjet printing is required on the third insulating layer in the direction away from the thickness of the substrate 10, then a recess 401 can be provided that penetrates the first insulating layer 20, the second insulating layer 30, and the third insulating layer. That is, the size of the recess 401 along the thickness direction of the substrate 10 is determined by the inkjet requirements and the size of the insulating layer along the thickness direction of the substrate 10.

[0102] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0103] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

[0104] In some embodiments, such as Figure 6As shown, a method for manufacturing a display module 100 is also provided, the method comprising:

[0105] S601 provides a substrate.

[0106] S602, a first insulating layer is formed on one side of the substrate.

[0107] S603, a second insulating layer is formed on the side of the first insulating layer away from the substrate; wherein, at least one first blocking opening is provided on the first insulating layer located in the dam area, and at least one second blocking opening is provided on the second insulating layer located in the dam area, and at least one second blocking opening and at least one first blocking opening are correspondingly provided, and the second blocking opening and the corresponding first blocking opening are connected.

[0108] In this embodiment, the method for preparing the display module 100 also has the beneficial effects of the display module 100 in the above embodiments. The similarities can be understood by referring to the explanation of the display module 100 above, and will not be repeated here.

[0109] In some embodiments, the step S602 described above, "forming a first insulating layer 20 on one side of the substrate 10," includes:

[0110] S701, a multilayer sub-insulating layer is formed on one side of the substrate 10.

[0111] The multilayer sub-insulating layers are stacked along the thickness direction of the substrate 10. The first blocking opening 110 penetrates the surface of the first insulating layer 20 facing the second insulating layer 30 and penetrates at least a portion of the sub-insulating layers. Preferably, forming a multilayer sub-insulating layer on one side of the substrate 10 includes forming a sixth sub-insulating layer 206 on one side of the substrate 10, and forming a sixth sub-blocking opening 2061 in the sixth sub-insulating layer 206.

[0112] S702, a fifth sub-insulating layer 205 is formed on the side of the sixth sub-insulating layer 206 away from the substrate 10, and a fifth sub-blocking opening 2051 is formed in the fifth sub-insulating layer 205.

[0113] S703, a fourth sub-insulating layer 204 is sequentially formed on the side of the fifth sub-insulating layer 205 away from the substrate 10, and a fourth sub-blocking opening 2041 is formed in the fourth sub-insulating layer 204.

[0114] In some embodiments, the step S703 described above, "forming a fourth sub-insulating layer 204 sequentially on the side of the fifth sub-insulating layer 205 away from the substrate 10, and forming a fourth sub-blocking opening 2041 in the fourth sub-insulating layer 204," includes:

[0115] S801, a third sub-insulating layer 203 is formed on the side of the fourth sub-insulating layer 204 away from the substrate 10.

[0116] S802, a second sub-insulating layer 202 is formed on the side of the third sub-insulating layer 203 away from the substrate 10.

[0117] S803, a first sub-insulating layer 201 is formed on the side of the second sub-insulating layer 202 away from the substrate 10.

[0118] The process of forming the fourth sub-blocking opening 2041 in the fourth sub-insulating layer 204 also includes: forming the third sub-blocking opening 2031 in the third sub-insulating layer 203, forming the second sub-blocking opening 2021 in the second sub-insulating layer 202, and forming the first sub-blocking opening 2011 in the first sub-insulating layer 201.

[0119] Preferably, after forming the third sub-insulating layer 203, the second sub-insulating layer 202, and the first sub-insulating layer 201, the process includes:

[0120] S804, the fourth sub-insulating layer 204, the third sub-insulating layer 203, the second sub-insulating layer 202 and the first sub-insulating layer 201 are patterned to form a third sub-blocking opening 2031 in the third sub-insulating layer 203, a second sub-blocking opening 2021 in the second sub-insulating layer 202, and a first sub-blocking opening 2011 in the first sub-insulating layer 201.

[0121] The methods described in each of the above steps have been described in the foregoing embodiments. For details, please refer to the foregoing descriptions. They will not be repeated here.

[0122] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

Claims

1. A display module, characterized in that, The display module includes a dam area; the display module includes: substrate; A first insulating layer is disposed on one side of the substrate; A second insulating layer is disposed on the side of the first insulating layer away from the substrate; The first insulating layer located in the dam area is provided with at least one first blocking opening, and the second insulating layer located in the dam area is provided with at least one second blocking opening. The at least one second blocking opening and the at least one first blocking opening are correspondingly arranged, and the second blocking opening and the corresponding first blocking opening are connected.

2. The display module according to claim 1, characterized in that, The first insulating layer includes multiple sub-insulating layers, which are stacked along the thickness direction of the substrate. The first blocking opening penetrates the surface of the first insulating layer facing the second insulating layer and penetrates at least a portion of the sub-insulating layers. Preferably, the multilayer sub-insulating layer includes a first sub-insulating layer, the first sub-insulating layer is disposed on the side of the second insulating layer facing the substrate, the first blocking opening includes a first sub-blocking opening disposed on the first sub-insulating layer, and the second blocking opening communicates with the first sub-blocking opening of the corresponding first blocking opening; Preferably, the multilayer sub-insulating layer includes a second sub-insulating layer, the second sub-insulating layer is disposed on the side of the first sub-insulating layer facing the substrate, and the first blocking opening includes a second sub-blocking opening disposed on the second sub-insulating layer, the first sub-blocking opening and the second sub-blocking opening are in communication; Preferably, the multilayer sub-insulating layer includes a third sub-insulating layer, the third sub-insulating layer is disposed on the side of the second sub-insulating layer facing the substrate, and the first blocking opening includes a third sub-blocking opening disposed on the third sub-insulating layer, and the second sub-blocking opening and the third sub-blocking opening are in communication; Preferably, the multilayer sub-insulating layer includes a fourth sub-insulating layer, the fourth sub-insulating layer is disposed on the side of the third sub-insulating layer facing the substrate, and the first blocking opening includes a fourth sub-blocking opening disposed on the fourth sub-insulating layer, and the third sub-blocking opening and the fourth sub-blocking opening are in communication. Preferably, the multilayer sub-insulating layer includes a fifth sub-insulating layer, the fifth sub-insulating layer is disposed on the side of the fourth sub-insulating layer facing the substrate, and the first blocking opening includes a fifth sub-blocking opening disposed on the fifth sub-insulating layer, and the fourth sub-blocking opening and the fifth sub-blocking opening are in communication; Preferably, the multilayer sub-insulating layer includes a sixth sub-insulating layer, the sixth sub-insulating layer is disposed on the side of the fifth sub-insulating layer facing the substrate, and the first blocking opening includes a sixth sub-blocking opening disposed on the sixth sub-insulating layer, and the fifth sub-blocking opening and the sixth sub-blocking opening are in communication; Preferably, the display module includes a first touch conductive layer and a second touch conductive layer stacked together, and the first sub-insulating layer is disposed between the first touch conductive layer and the second touch conductive layer; Preferably, the second sub-insulating layer is configured as the first inorganic encapsulation layer; Preferably, the third sub-insulating layer is configured as an organic encapsulation layer; Preferably, the fourth sub-insulating layer is configured as a second inorganic encapsulation layer; Preferably, the fifth sub-insulating layer is configured as a pixel defining layer; Preferably, the sixth sub-insulating layer is configured as a planarization layer.

3. The display module according to claim 1, characterized in that, The number of the first blocking openings is multiple, the multiple first blocking openings are arranged along a first direction and form a first blocking opening group, the first blocking opening group is multiple, the multiple first blocking opening groups are arranged along a second direction, the first direction and the second direction intersect, and intersect at the thickness direction of the substrate; Preferably, there are two first blocking opening groups; Preferably, the display module includes a display area, the dam area is located at least on one side of the display area along the second direction, and at least one of the first blocking openings penetrates the first insulating layer along the first direction and is located on the side of all the first blocking opening groups opposite to the display area; Preferably, the shape of the orthographic projection of the opening on the substrate includes a circle, a heart shape, a rhombus shape, an ellipse, or a rectangle.

4. The display module according to any one of claims 1-3, characterized in that, The display module includes a light extraction layer, which is disposed on the side of the second insulating layer away from the substrate and in contact with the second insulating layer. The refractive index of the light extraction layer is greater than that of the second insulating layer. Preferably, the material of the light extraction layer is an organic material; Preferably, the refractive index of the light extraction layer is greater than or equal to 1.

65.

5. The display module according to claim 2, characterized in that, The sum of the dimensions of the second blocking opening and the first blocking opening along the thickness direction of the substrate ranges from 2μm to 10μm; Preferably, the second blocking opening has a dimension of 2 μm along the thickness direction of the substrate; Preferably, at least one of the first sub-blocking opening, the second sub-blocking opening, the third sub-blocking opening, and the fourth sub-blocking opening has a dimension of 1μm-1.5μm along the thickness direction of the substrate; Preferably, the fifth sub-blocking opening has a dimension of 1.5 μm along the thickness direction of the substrate; Preferably, the sixth sub-blocking opening has a size of 4μm-5μm along the thickness direction of the substrate.

6. The display module according to claim 2, characterized in that, The display module includes at least one signal trace, the signal trace being located at least in the dam area, and the orthographic projection of the signal trace on the substrate does not overlap with the orthographic projection of the first blocking opening of the first insulating layer on the substrate. Preferably, the at least one signal trace includes a first power line, the first power line is located on the side of the sixth sub-insulator facing the substrate, and the orthographic projection of the first power line on the substrate is located within the orthographic projection of the sixth sub-insulator. Preferably, there are multiple signal traces, and the multiple signal traces also include a second power line. The voltages of the first power line and the second power line are different, and the orthographic projection of the second power line on the substrate is located within the orthographic projection of the sixth sub-insulating layer. Preferably, the orthographic projections of the first touch conductive layer and the second touch conductive layer on the substrate do not overlap with the orthographic projection of the first blocking opening on the substrate.

7. A display device, characterized in that, The display device includes a display module according to any one of claims 1-6; Preferably, the display device includes a privacy screen display device.

8. A method for manufacturing a display module, characterized in that, The display module includes a dam area; the method for manufacturing the display module includes: Provide substrate; A first insulating layer is formed on one side of the substrate; A second insulating layer is formed on the side of the first insulating layer that is opposite to the substrate; The first insulating layer located in the dam area is provided with at least one first blocking opening, and the second insulating layer located in the dam area is provided with at least one second blocking opening. The at least one second blocking opening and the at least one first blocking opening are correspondingly arranged, and the second blocking opening and the corresponding first blocking opening are connected.

9. The method for preparing a display module according to claim 8, characterized in that, The formation of a first insulating layer on one side of the substrate includes: A multilayer sub-insulating layer is formed on one side of the substrate; the multilayer sub-insulating layer is stacked along the thickness direction of the substrate, and the first blocking opening penetrates the surface of the first insulating layer facing the second insulating layer and penetrates at least a portion of the sub-insulating layers; Preferably, forming a multilayer sub-insulating layer on one side of the substrate includes: forming a sixth sub-insulating layer on one side of the substrate, and forming a sixth sub-blocking opening in the sixth sub-insulating layer; A fifth sub-insulating layer is formed on the side of the sixth sub-insulating layer opposite to the substrate, and a fifth sub-blocking opening is formed in the fifth sub-insulating layer; A fourth sub-insulating layer is formed on the side of the fifth sub-insulating layer opposite to the substrate, and a fourth sub-blocking opening is formed in the fourth sub-insulating layer.

10. The method for preparing a display module according to claim 9, characterized in that, After forming the fourth sub-insulating layer on the side of the fifth sub-insulating layer opposite to the substrate, the process includes: A third sub-insulating layer is formed on the side of the fourth sub-insulating layer that is opposite to the substrate; A second sub-insulating layer is formed on the side of the third sub-insulating layer that is opposite to the substrate; A first sub-insulating layer is formed on the side of the second sub-insulating layer that is opposite to the substrate; The process of forming the fourth sub-blocking opening in the fourth sub-insulating layer further includes: forming a third sub-blocking opening in the third sub-insulating layer, forming a second sub-blocking opening in the second sub-insulating layer, and forming a first sub-blocking opening in the first sub-insulating layer.

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