Support positioning assembly for laser processing equipment of printed circuit boards

Abstract

The present application relates to a kind of support positioning assembly for printed circuit board laser processing equipment to solve the problem of printed circuit board fracture caused by hard support pressing under high temperature condition, it relates to electric vehicle circuit board laser welding support technical field, including four groups of welding magnetic support column, welding magnetic support column includes in turn from top to bottom needle, upper fixed section, middle fixed section and magnetic component;Middle fixed section bottom side is equipped with fixed column and first spring, first spring is integrated compound spring structure;The present application can realize flexible damping, offset impact load in operation process, avoid rigid extrusion and lead to plate cracking, pad drop;First spring can be independently telescopic, adapt to workbench surface concave-convex and printed circuit board itself warping, ensure that four corners are uniformly stressed, simultaneously utilize high temperature deformation characteristics and realize high temperature automatic pressure release, printed circuit board is heated and expands, warping when actively retreat, solve the problem of printed circuit board fracture caused by hard support pressing under high temperature condition.

Description

Technical Field

[0001] This invention relates to the field of laser welding support technology for electric vehicle circuit boards, specifically a support and positioning component for laser processing equipment for printed circuit boards. Background Technology

[0002] As a core component of the vehicle's electronic control system, the demand for production, processing, and troubleshooting of printed circuit boards (PCBs) in electric vehicles continues to increase. Automotive PCBs are highly integrated, with intricate circuitry and densely packed surface-mount components. Furthermore, the boards themselves are relatively brittle, placing stringent requirements on the stability, flexible protection, and positioning accuracy of the supporting fixtures during laser welding, component disassembly and assembly, and resoldering operations.

[0003] Currently, the industry's support fixtures for laser welding of PCB boards are mostly traditional fixed rigid support seats, ordinary rubber support pads, or simple magnetic welding magnetic support columns. Existing technologies have many shortcomings:

[0004] 1. Rigid supports are prone to damaging the PCB board: Traditional rigid supports are rigid contacts without a buffer structure. During the soldering process, the instantaneous loads generated by the soldering iron pressing, component removal, and equipment vibration will directly act on the PCB board, which can easily cause the board to crack, the solder pads to fall off, and the circuit to break. At the same time, when the PCB board is subjected to high temperature during soldering and undergoes thermal expansion and local warping, the fixed rigidity support structure cannot adapt and yield, further aggravating the deformation and damage of the board.

[0005] 2. Blind spots and limited space: Most support fixtures use surface contact support, which will block the PCB board surface circuits, pads and small components, creating blind spots for operation and vision, which is not conducive to maintenance work; and there is no suspended space at the bottom, making it impossible to operate on the pins and components on the back of the PCB board.

[0006] In view of the above-mentioned shortcomings, the present invention aims to create a support and positioning component for laser processing equipment for printed circuit boards, so as to make it more industrially valuable. Summary of the Invention

[0007] To address the aforementioned technical problems, the present invention aims to provide a support and positioning component for laser processing equipment of printed circuit boards, which solves the problem of printed circuit board breakage caused by rigid support tightening under high-temperature conditions.

[0008] The present invention provides a support and positioning component for laser processing equipment of printed circuit boards, comprising four sets of welding magnetic support columns, which are distributed at the four corners below the printed circuit board. The four corners of the printed circuit board are provided with working holes. Each welding magnetic support column includes a pin, an upper fixing section, a middle fixing section and a magnetic component arranged sequentially from top to bottom. The pin is inserted into the working hole. The four sets of welded magnetic support columns are attached to the iron panel of the working platform of the laser processing equipment by the bottom magnetic components. The ejector pin extends upward to the working platform plane to pass through and support the printed circuit board, and maintains a preset safe working distance from the laser processing head. A column is mounted and fixed on the bottom side of the middle fixed section. A first spring is sleeved on the outer periphery of the column. The top end of the first spring abuts and is fixed to the inner top wall of the middle fixed section, and the bottom end is fixed to the outer wall of the column, forming an axial elastic telescopic structure. The magnetic component is provided with a shock-absorbing and heat-insulating layer, a neodymium iron boron magnetic attraction layer, and an anti-rotation damping micro-tooth structure layer from top to bottom; The first spring is an integrated composite spring structure, which is composed of a micro-pressure relief section and a rigid support section. The outer wall of the micro-pressure relief section is provided with a pressure relief opening groove in the circumferential direction.

[0009] Furthermore, the opening slot adopts a 0.3mm narrow slit structure, and all of them are arranged neatly in the same direction facing outwards; the micro-pressure relief section is provided with three spring coils, and the rigid support section is provided with two spring coils.

[0010] Furthermore, the column is rigidly connected to the magnetic assembly by screws; The pin, upper fixing section, middle fixing section, column, screw, and neodymium iron boron magnetic layer are sequentially connected to form a conductive path. The shock-absorbing and heat-insulating layer is a local heat-insulating structure that does not block the conductive path. The entire set of welded magnetic support columns conducts static electricity.

[0011] Furthermore, the end of the ejector pin is chamfered and blunted.

[0012] Furthermore, the outer surface of the middle fixed section is provided with friction texture.

[0013] Furthermore, an outer sleeve is movably fitted on the bottom outer side of the middle fixed section, and the lower end of the outer sleeve is fixedly connected to the magnetic component. The first spring is enclosed and accommodated in the area between the middle fixed section and the outer sleeve.

[0014] Furthermore, it also includes a base, on which a magnetic suction seat is fixed. The top of the magnetic suction seat has a circular groove, and the outer sleeve is placed eccentrically inside the circular groove. Two rubber pads are fixed to the inner wall of the circular groove, and the two rubber pads elastically press the outer sleeve to form a diagonal alignment structure.

[0015] Furthermore, an L-shaped baffle is fixed to the bottom surface inside the magnetic suction base, and a central positioning plate is fixed to the bottom surface of the outer sleeve; The central positioning plate is symmetrically equipped with second springs on both the left and right sides. Each second spring is equipped with a movable pressure plate at its outer end. The movable pressure plate is pressed against the side wall of the L-shaped baffle by the elastic pushing force of the second spring, so as to achieve circumferential anti-rotation and radial limiting constraint.

[0016] Furthermore, the neodymium iron boron magnetic layer is made of high-temperature resistant neodymium iron boron material with a temperature resistance of 180℃.

[0017] Furthermore, the anti-rotation damping micro-tooth structure layer is a fine annular damping tooth structure.

[0018] By means of the above-described solution, the present invention has at least the following advantages: The support and positioning component for laser processing equipment of printed circuit boards of the present invention adopts four sets of welded magnetic support columns in conjunction with the pins inserted into the working holes at the four corners of the printed circuit board. The small-area contact of the tip achieves suspended support, which will not obstruct the circuit, pads and surface mount components on the board. The board surface and bottom have sufficient operating space, which can smoothly complete the entire process of front welding, back desoldering, solder cleaning and other processes. In this invention, the welded magnetic support column has a built-in first spring, which is divided into a micro-pressure relief section and a rigid support section. It can achieve flexible shock absorption, offset the impact load during operation, and avoid rigid compression that causes the board to crack and the solder pads to fall off. The first spring can extend and retract independently, adapting to the concavity and convexity of the worktable and the warping of the printed circuit board itself, ensuring uniform force at the four corners. At the same time, the first spring has a narrow slot opening, which utilizes the high-temperature deformation characteristics to achieve automatic high-temperature pressure relief. When the printed circuit board expands and warps due to heat, it actively yields, achieving near-zero stress support and solving the problem of printed circuit board breakage caused by rigid support under high-temperature conditions.

[0019] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, the preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show a certain embodiment of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of the support and positioning component for laser processing equipment of printed circuit boards according to the present invention when used in conjunction with a printed circuit board; Figure 2 This is a schematic diagram of the support and positioning component structure for laser processing equipment for printed circuit boards in Embodiment 1 of the present invention; Figure 3 This is a front view of the support and positioning assembly for laser processing equipment of printed circuit boards in Embodiment 1 of the present invention; Figure 4This is a schematic diagram of the first spring structure in Embodiment 1 of the present invention; Figure 5 This is a schematic diagram of the support and positioning component structure for laser processing equipment of printed circuit boards in Embodiment 2 of the present invention; Figure 6 This is a front view of the support and positioning assembly for laser processing equipment of printed circuit boards in Embodiment 2 of the present invention; Figure 7 For the present invention Figure 6 Sectional view at point AA; Figure 8 This is a schematic diagram of the support and positioning component structure for laser processing equipment for printed circuit boards in Embodiment 3 of the present invention; Figure 9 This is a schematic diagram of the structure of the outer casing and magnetic holder of the present invention when used together; Figure 10 This is a schematic diagram of the magnetic suction base structure of the present invention; Figure 11 This is a schematic diagram of the outer casing structure of the present invention; Figure 12 This is a schematic diagram of the structure when the baffle and the movable pressure plate of the present invention are used together.

[0022] In the diagram: 1. Welded magnetic support column; 2. Printed circuit board; 3. Working hole; 4. Ejector pin; 5. Upper fixing section; 6. Middle fixing section; 7. Friction texture; 8. Magnetic component; 9. First spring; 10. Shock-absorbing and heat-insulating layer; 11. Neodymium iron boron magnetic attraction layer; 12. Anti-rotation damping micro-tooth structure layer; 13. Column; 14. Micro-pressure relief section; 15. Rigid support section; 16. Opening slot; 17. Outer jacket; 18. Base; 19. Magnetic suction seat; 20. Rubber pad; 21. Baffle; 22. Middle positioning plate; 23. Second spring; 24. Movable pressure plate. Detailed Implementation

[0023] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0024] Please refer to the instruction manual appendix. Figure 1-12 The present invention provides a technical solution: a support and positioning component for laser processing equipment for printed circuit boards, designed for repair welding and initial processing welding of printed circuit boards 2 of electric vehicles, which can achieve multi-point flexible support and avoid the phenomenon of the printed circuit board 2 being pulled, compressed, deformed and broken.

[0025] The laser processing equipment includes: a welding magnetic support column 1, with a pin 4 at the upper end of the welding magnetic support column 1. The welding magnetic support column 1 serves as a support and is used to support the printed circuit board 2. The printed circuit board 2 has working holes 3 at its four corners. There are four sets of welding magnetic support columns 1, which are distributed at the four corners below the printed circuit board 2. The pins 4 are inserted into the corresponding working holes 3 to achieve the suspended positioning of the printed circuit board 2. This facilitates the welding of the circuits on the surface of the printed circuit board 2 using the laser welding equipment. It is particularly suitable for initial welding and secondary welding during the repair process of the printed circuit board 2.

[0026] Example 1 refer to Figures 1 to 4 As shown, the welding magnetic support column 1 includes a pin 4, an upper fixing section 5, a middle fixing section 6, and a magnetic component 8 arranged sequentially from top to bottom. The pin 4 is installed on the top of the upper fixing section 5 and is used to insert into the corresponding working hole 3. The pin 4 is inserted by its tip instead of surface contact support, resulting in a very small contact area. This will not obstruct the surface lines, pads, or small surface mount components of the printed circuit board 2. All areas can be operated during maintenance, with no blind spots in vision or operation.

[0027] Furthermore, the pins 4 on the four sets of welding magnetic support pillars 1 cooperate with each other to position themselves at the four corners of the printed circuit board 2, achieving the purpose of four-point support positioning. The tips of the pins 4 are not easy to come out after being inserted into the working holes 3. During the welding process, external forces such as hand touch, soldering iron scraping, and component disassembly will not cause the printed circuit board 2 to separate from the welding magnetic support pillars 1, resulting in high positioning reliability. When the printed circuit board 2 is lifted off the table, the bottom of the printed circuit board 2 is suspended in the air. When welding pins, desoldering components on the back, and cleaning solder, hands, soldering irons, and desoldering pumps can pass through the bottom of the printed circuit board 2, providing ample operating space.

[0028] The end of the ejector pin 4 is chamfered and blunted to retain the insertion and positioning function, eliminate sharp edges, and avoid scratching the circuit and insulation layer when inserting or removing the printed circuit board 2.

[0029] The middle fixing section 6 is fixedly installed at the bottom of the upper fixing section 5. The middle fixing section 6 serves as the outer shell of the whole, and its outer surface has friction texture 7, which makes it convenient for personnel to hold and move it for operation.

[0030] The magnetic component 8 is located at the bottom of the welding magnetic support column 1 and the upper surface is fixedly connected to the column 13. The upper end of the column 13 is movably inserted into the interior of the middle fixed section 6. The outer ring of the column 13 is also fitted with a first spring 9. The lower end of the first spring 9 is fixed to the outer ring of the column 13, and the upper end of the first spring 9 is fixed to the inner top surface of the middle fixed section 6. The printed circuit board 2 is brittle. During soldering, pressing with the hand, applying pressure with the soldering iron, and removing components will generate instantaneous pressure and vibration. The first spring 9 has axial elasticity, which can be flexibly released, buffered and damped, avoiding the rigid compression of the hard support belt, and effectively preventing the printed circuit board 2 from cracking, the solder pads from falling off and being damaged.

[0031] In this invention, the setting based on the first spring 9 can also adapt to the height and flatness of the board surface. The repair table may have slight unevenness, and the printed circuit board 2 itself may also have slight warping. The first spring 9 can extend and retract independently, driving the ejector pin 4, the upper fixed section 5 and the middle fixed section 6 to adapt to the height difference of the board surface, ensuring that the four corners of the printed circuit board 2 are evenly stressed, and there will be no single point of suspension or single point of overload, resulting in more balanced stress.

[0032] refer to Figure 4 As shown, the first spring 9 includes a micro-pressure relief section 14 and a rigid support section 15 that are sequentially distributed and integrally connected. The micro-pressure relief section 14 has three coils, and the rigid support section 15 has two coils. An opening groove 16 is provided at the outer ring of the micro-pressure relief section 14. The opening groove 16 is a narrow slit of 0.3mm and is uniformly arranged facing outward.

[0033] At room temperature, the opening slot 16 is slightly closed, the elastic force of the first spring 9 is normal, and it stably supports the printed circuit board 2. During soldering, a local high temperature of 100-200℃ is generated at the solder joint area. The heat is transferred to the upper part of the first spring 9, and the opening slot 16 is slightly opened due to the heat. The elastic force of the micro-pressure relief section 14 automatically softens and releases pressure, and the rigid support section 15 has high stiffness. When the printed circuit board 2 expands and warps due to local heat, the first spring 9 actively yields and releases pressure, without hardening the printed circuit board 2. After the soldering is completed and the temperature drops, the opening slot 16 contracts and resets, and the elastic force of the first spring 9 automatically recovers. This achieves the goal of the higher the temperature, the softer the support and the automatic pressure relief, approaching zero stress and preventing warping. It replaces the traditional technology where the spring with fixed stiffness is more likely to break due to micro-vibration as the temperature increases and the metal becomes harder.

[0034] It should be noted that both the micro-pressure relief section 14 and the rigid support section 15 are integrally formed from 55CrSi spring steel. The micro-pressure relief section 14 undergoes low-temperature tempering treatment to retain its phase transformation potential. The opening groove 16 is cut along the circumferential tangent direction using a femtosecond laser, with a groove depth of 0.8-1.0 mm and a width of 0.3±0.02 mm. Within the 100-200℃ range, the metal at the groove edge undergoes a radial micro-expansion of 0.05-0.12 mm due to the difference in thermal expansion coefficients, resulting in a 25%-40% decrease in the equivalent stiffness of the micro-pressure relief section 14, thus achieving stepped pressure relief.

[0035] The magnetic component 8 includes, from top to bottom, a shock-absorbing and heat-insulating layer 10, a neodymium iron boron magnetic attraction layer 11, and an anti-rotation damping micro-tooth structure layer 12. These layers are sequentially and fixedly connected. The shock-absorbing and heat-insulating layer 10 blocks the heat radiation and airflow from the soldering iron, preventing the neodymium iron boron magnetic attraction layer 11 from demagnetizing at high temperatures and causing a decrease in attraction force. The neodymium iron boron magnetic attraction layer 11 is a high-temperature resistant neodymium iron boron magnetic attraction layer (temperature resistance up to 180℃). It can be adsorbed onto tabletops made of materials such as ordinary carbon steel, cold-rolled steel, hot-rolled steel, cast iron, cast steel, ferritic stainless steel (400 series), iron-based powder metallurgy, ferrite, and magnetic alloys to achieve the positioning of the welding magnetic support column 1; the anti-rotation damping micro-tooth structure layer 12 is a fine annular damping tooth, which can increase the friction between the magnetic component 8 and the tabletop, and prevent the magnetic component 8 from rotating in the circumference, thus avoiding the phenomenon of poor welding caused by slight rotational vibration during the welding process.

[0036] In summary, this invention not only solves the problems of high temperature resistance and anti-rotation of the magnetic component 8 base, but also makes it easy to adjust the position of the welded magnetic support column 1 based on the fixing method of the magnetic component 8, and can be applied to printed circuit boards 2 of different sizes. The column 13 is rigidly fixed to the magnetic component 8 by fastening screws, forming a continuous conductive path for the entire structure. The core support body of this equipment is made of metal. The bottom magnetic component 8 has a built-in neodymium iron boron magnetic layer 11 that can withstand 180℃. This magnetic layer is a metal alloy substrate with electroplating protection treatment, which has good electrical conductivity and static electricity dissipation properties. The middle column 13, connecting screws, middle fixing section 6, upper fixing section 5 and top pin 4 are all metal components. All components are tightly assembled and in contact with each other.

[0037] The magnetic component 8 is provided with a shock-absorbing and heat-insulating layer 10 on top. This heat-insulating layer is only a local heat-insulating and buffering structure and is not fully wrapped and insulated. The bottom of the column 13 is connected to the neodymium iron boron magnetic layer 11 below by screws. The metal conduction path is complete and uninterrupted. Therefore, the shock-absorbing and heat-insulating layer 10 will not block the conduction of static electricity and will not affect the overall static electricity conduction function at all.

[0038] During laser welding and circuit board desoldering operations, printed circuit boards 2 are prone to static electricity accumulation due to friction, laser irradiation, and high temperatures. This device, relying on a continuous metal conductive path, can quickly conduct the static electricity generated by printed circuit boards 2, ejector pins 4, and various metal support components to the magnetically conductive worktable below via the neodymium iron boron magnetic layer 11, achieving real-time static electricity discharge. This effectively prevents static electricity accumulation from damaging precision chips, surface mount components, circuits, and pads on the circuit board, eliminating static damage problems and significantly improving the safety and product yield of initial processing and repair welding of printed circuit boards for electric vehicles. At the same time, the entire support structure maintains stable conductivity and static electricity conduction performance under the conventional high-temperature welding environment of 180℃, and will not fail due to temperature changes.

[0039] Example 2 refer to Figures 5 to 7 As shown, in order to prevent solder from entering the vicinity of the first spring 9 and affecting the support stability and self-adaptation accuracy of the welding magnetic support column 1, an outer sleeve 17 is provided at the bottom of the middle fixed section 6. The upper end of the outer sleeve 17 is movably sleeved on the outer ring of the middle fixed section 6, and the lower end of the outer sleeve 17 is fixedly connected to the magnetic component 8. The first spring 9 is accommodated in the sealed area between the middle fixed section 6 and the outer sleeve 17 and does not come into contact with the solder.

[0040] Example 3 refer to Figures 8 to 12 As shown, to address the issues of easy rotation, offset, and misalignment of the four sets of welded magnetic support columns 1, this invention specifically provides a base 18. A magnetic suction seat 19 is fixedly attached to the upper surface of the base 18. A circular groove is provided above the magnetic suction seat 19, with the inner diameter of the circular groove being larger than the outer diameter of the outer sleeve 17. The outer sleeve 17 is placed eccentrically in the circular groove. Two rubber pads 20 are fixedly installed on the inner wall of the circular groove. The rubber pads 20 have elastic pressing properties. When the four sets of welded magnetic support columns 1 are arranged in an array, the corresponding two rubber pads 20 can elastically press the outer sleeve 17 against the inner wall of the circular groove on the opposite side, forming a quadrilateral adaptive diagonal calibration structure. This automatically allows the four sets of welded magnetic support columns 1 to form standard rectangular corner positions. Regardless of the size or warping of the printed circuit board 2, the four corner holes are automatically aligned, the force is relatively balanced, and the problems of offset and misalignment are not easily encountered. This solves the problems of the four sets of welded magnetic support columns 1 being completely free and unconnected, resulting in large deviations in manual placement, uneven force at the four corners, and easy cracking of the printed circuit board 2 due to welding thermal deformation.

[0041] Before soldering the printed circuit board 2, place the printed circuit board 2 on the upper surface of the base 18 and mark the upper surface of the base 18 with a marker pen from the working hole 3. There are four marks in total, and the four marks correspond to the four corners of the printed circuit board 2. Then, the four sets of magnetic support columns 1 are attached to the marked positions on the upper surface of the base 18. In the initial state, the rubber pad 20 is compressed and the outer sleeve 17 is pressed against the inner wall of the magnetic suction base 19 near the corner of the printed circuit board 2. At this time, the four sets of magnetic support columns 1 are in a state of slightly pulling the printed circuit board 2 towards the four corners to ensure the stability of the printed circuit board 2 when it is supported. During the soldering of the printed circuit board 2, if warping occurs due to pulling, pressing, or soldering vibration, the printed circuit board 2 will relatively tighten the magnetic support column 1, causing the magnetic support column 1 to further press the rubber pad 20 to buffer it. The relative positions of the four working holes 3 and the ejector pins 4 will also move closer to accommodate the warping of the printed circuit board 2, and there will be no situation where the printed circuit board 2 is pulled hard. After the stress from pulling, pressing, and welding vibrations disappears, the rubber pad 20 elastically resets, driving the magnetic support column 1 to reset. The printed circuit board 2 also returns from a warped state to a flat state. The positions of the working hole 3 and the ejector pin 4 can always be adaptively adjusted, achieving the purpose of automatic calibration during the welding process.

[0042] Furthermore, a baffle 21 is fixedly installed on the inner bottom surface of the magnetic suction base 19. The baffle 21 has an L-shaped structure, and the opening of the L-shaped structure faces away from the two rubber pads 20. A central positioning plate 22 is fixedly installed on the bottom surface of the outer sleeve 17. A second spring 23 is fixedly connected to both sides of the central positioning plate 22. A movable pressure plate 24 is fixedly connected to the end of the second spring 23. In the initial state of the second spring 23, the included angle between the two movable pressure plates 24 is greater than 90°. When the outer sleeve 17 is engaged in the magnetic suction base 19, the two second springs 23 respectively elastically press the corresponding movable pressure plates 24 against the side of the baffle 21 to achieve radial limiting. This avoids the phenomenon that the welded magnetic support column 1 is prone to rotation, and does not affect the automatic centering of the welded magnetic support column 1 as it moves adaptively with the outer sleeve 17.

[0043] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A support and positioning assembly for a laser processing equipment for printed circuit boards, comprising four sets of welding magnetic support columns (1), wherein the four sets of welding magnetic support columns (1) are distributed at the four corners below the printed circuit board (2), and the printed circuit board (2) has working holes (3) at the four corners, characterized in that: The welding magnetic support column (1) includes a top pin (4), an upper fixing section (5), a middle fixing section (6) and a magnetic component (8) arranged sequentially from top to bottom. The top pin (4) is inserted into the working hole (3). The four sets of welded magnetic support columns (1) are attached to the iron panel of the working platform of the laser processing equipment by the bottom magnetic components (8). The pin (4) extends upward to the working platform plane to pass through and support the printed circuit board (2) and maintains a preset safe working distance from the laser processing head. A column (13) is mounted and fixed on the bottom side of the middle fixed section (6). A first spring (9) is sleeved on the outer periphery of the column (13). The top end of the first spring (9) is fixed to the inner top wall of the middle fixed section (6), and the bottom end is fixed to the outer wall of the column (13), forming an axial elastic telescopic structure. The magnetic component (8) is provided with a shock-absorbing and heat-insulating layer (10), a neodymium iron boron magnetic attraction layer (11), and an anti-rotation damping micro-tooth structure layer (12) from top to bottom. The first spring (9) is an integral composite spring structure, which is composed of a micro-pressure relief section (14) and a rigid support section (15). The outer wall of the micro-pressure relief section (14) is provided with a pressure relief opening groove (16) in the circumferential direction.

2. The support and positioning assembly for laser processing equipment of printed circuit boards according to claim 1, characterized in that: The opening slot (16) adopts a 0.3mm narrow slit structure and is arranged in a regular outward direction; the micro-pressure relief section (14) is provided with three spring coils and the rigid support section (15) is provided with two spring coils.

3. The support and positioning assembly for laser processing equipment of printed circuit boards according to claim 1, characterized in that: The column (13) is rigidly connected to the magnetic component (8) by screws; The pin (4), upper fixing section (5), middle fixing section (6), column (13), screw, and neodymium iron boron magnetic layer (11) are sequentially connected to form a conductive path. The shock-absorbing and heat-insulating layer (10) is a local heat-insulating structure that does not block the conductive path. The entire set of welded magnetic support columns (1) conducts static electricity.

4. The support and positioning assembly for laser processing equipment of printed circuit boards according to claim 1, characterized in that: The end of the ejector pin (4) is chamfered and blunted.

5. The support and positioning assembly for laser processing equipment of printed circuit boards according to claim 1, characterized in that: The outer surface of the middle fixed section (6) is provided with friction texture (7).

6. The support and positioning assembly for laser processing equipment of printed circuit boards according to claim 1, characterized in that: The bottom outer side of the middle fixed section (6) is movably fitted with an outer sleeve (17), the lower end of the outer sleeve (17) is fixedly connected to the magnetic component (8), and the first spring (9) is enclosed and accommodated in the area between the middle fixed section (6) and the outer sleeve (17).

7. The support and positioning assembly for laser processing equipment of printed circuit boards according to claim 6, characterized in that: It also includes a base (18), on which a magnetic suction seat (19) is fixed. A circular groove is opened on the top of the magnetic suction seat (19), and the outer sleeve (17) is placed eccentrically inside the circular groove. Two rubber pads (20) are fixed on the inner wall of the circular groove, and the two rubber pads (20) elastically press the outer sleeve (17) to form a diagonal alignment structure.

8. The support and positioning assembly for laser processing equipment of printed circuit boards according to claim 7, characterized in that: The magnetic suction base (19) has an L-shaped baffle (21) fixed on its inner bottom surface, and the outer sleeve (17) has a central positioning plate (22) fixed on its bottom surface. The middle positioning plate (22) is symmetrically equipped with second springs (23) on the left and right sides. Each second spring (23) is equipped with a movable pressure plate (24) at its outer end. The movable pressure plate (24) is pressed against the side wall of the L-shaped baffle (21) by the elastic pushing force of the second spring (23) to achieve circumferential anti-rotation and radial limiting constraint.

9. The support and positioning assembly for laser processing equipment of printed circuit boards according to claim 1, characterized in that: The neodymium iron boron magnetic layer (11) is made of high-temperature neodymium iron boron material with a temperature resistance of 180℃.

10. The support and positioning assembly for laser processing equipment of printed circuit boards according to claim 1, characterized in that: The anti-rotation damping micro-tooth structure layer (12) is a fine annular damping tooth structure.

Images