Water removal device

Abstract

The utility model relates to the technical field of semiconductor testing, and provides a water removal device. The water removal device comprises a carrier, a first water removal plate and a second water removal plate, the carrier is provided with a through hole penetrating in the thickness direction of the carrier, the first water removal plate is arranged on the side, in the axial direction of the through hole, of the carrier, and the second water removal plate is arranged on the other side, in the axial direction of the through hole, of the carrier. Wherein one of the first water removal plate and the second water removal plate is supported on the carrier, and the other one of the first water removal plate and the second water removal plate can move relative to the carrier in the axial direction of the through hole. The first water removal plate and the second water removal plate are each provided with an air drying window, and the air drying windows face the through holes and are used for blowing air to the power semiconductors located at the through holes. According to the water removal device, the water removal range is enlarged, the water removal performance is improved, and the test safety is effectively guaranteed.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a water removal device. Background Art

[0002] During the reactive power test of power semiconductors, it is necessary to simulate the temperature environment in which they are located in actual applications. During the reactive power test, power semiconductors will generate a large amount of heat, which far exceeds the required simulated temperature range. This requires cooling them down while preventing them from being damaged by overheating. In related technologies, water cooling is usually used, which results in water stains remaining on the bottom of the power semiconductor. In order to ensure safety during the test, a specific device needs to be set up to remove water from the power semiconductor.

[0003] With the development of technology, the current and voltage during power semiconductor testing will gradually increase, resulting in an increase in the amount of heat generated, and the requirements for heat dissipation and cooling performance will also gradually increase. Therefore, in order to meet the greater cooling requirements, it is necessary to increase the contact area with the water-cooled heat dissipation structure, which will increase the amount of residual water stains on the power semiconductor, and then the water removal performance requirements of the water removal device will be higher.

[0004] However, the existing commonly used water removal devices still have some water stains after water removal, and the water removal is not thorough, which can easily lead to damage to the safety of the test. Utility Model Content

[0005] Based on this, it is necessary to provide a water removal device to increase the water removal range, improve the water removal performance, and effectively ensure the safety of the test.

[0006] A dewatering device comprises a carrier, a first dewatering plate and a second dewatering plate;

[0007] The carrier is structured with a through hole penetrating along the thickness direction of the carrier;

[0008] A first water removal plate is disposed on one side of the carrier along the axial direction of the through hole;

[0009] A second water removal plate is disposed on the other side of the carrier along the axial direction of the through hole;

[0010] Among them, one of the first dewatering plate and the second dewatering plate is supported on the carrier, and the other can move relative to the carrier along the axial direction of the through hole; the first dewatering plate and the second dewatering plate are both constructed with air drying windows, and the air drying windows are arranged toward the through hole for blowing air to the power semiconductor located at the through hole.

[0011] It can be understood that the carrier is used to support the power semiconductor. It is precisely because of the setting of the through hole on the carrier that when the power semiconductor is supported at the through hole of the carrier, the lower surface of the power semiconductor can be exposed to the dewatering range of a dewatering plate located at the bottom through the through hole, and the other dewatering plate can act on the upper surface of the power semiconductor. In this way, it can be ensured that there is a dewatering range on both sides of the power semiconductor along its own thickness direction, thereby increasing the dewatering range so as to remove water as thoroughly as possible to ensure the safety of the test; and, due to the setting of the air-drying windows on the first dewatering plate and the second dewatering plate, the air-drying mode formed by airflow blowing can meet the dewatering requirements, and the safety is better. At the same time, since one of the first dewatering plate and the second dewatering plate is located on the upper surface of the power semiconductor, it can be moved relative to the carrier to get closer or farther away, which is convenient for the power semiconductor to be taken and placed relative to the carrier and reduce interference; and, such a setting can also adjust different dewatering ranges, which is suitable for a variety of dewatering scenarios.

[0012] In some embodiments, the first dewatering plate corresponds to the first air-drying window, and the first dewatering plate is supported on the carrier; the first dewatering plate is provided with a dewatering protrusion to define the first air-drying window, and the dewatering protrusion is inserted into the through hole, and the dewatering protrusion is constructed with a first air groove, and the notch of the first air groove is arranged at one end of the dewatering protrusion inserted into the through hole.

[0013] That is, the dewatering protrusion is inserted into the through hole to reduce the distance between the notch of the first gas groove and the power semiconductor, so that the gas acts on the power semiconductor in time, thereby improving the dewatering efficiency.

[0014] In some embodiments, the water-removing protrusion includes an inner ring side plate and an outer ring side plate arranged around the outer side of the inner ring side plate, and there is a first gap between the inner ring side plate and the outer ring side plate, the first gap forms the first air groove, and the protrusion height of the inner ring side plate is different from the protrusion height of the outer ring side plate.

[0015] Such an arrangement ensures that a space for gas circulation is formed between the lower protrusion and the power semiconductor, so that the gas can fully act on the power semiconductor.

[0016] In some embodiments, the inner ring side plate is surrounded by a flow hole, and the flow hole passes through the first water removal plate, the protrusion height of the inner ring side plate is smaller than the protrusion height of the outer ring side plate, and the first air groove is connected to the flow hole.

[0017] In this way, after the gas flowing through the first gas groove blows away the moisture on the power semiconductor, it can flow downward along the flow hole to collect the moisture, thereby preventing the residual moisture from being blown to other locations and causing an impact; and such a setting satisfies the gas circulation, ensures pressure balance, and prevents the gas from blowing up the power semiconductor.

[0018] In some embodiments, the second dewatering plate corresponds to the second air-drying window; a side wall of the second dewatering plate facing the first dewatering plate is recessed with a flow groove to define the second air-drying window, a second air groove is constructed at the bottom of the flow groove, and a notch of the second air groove is arranged toward the first dewatering plate.

[0019] That is to say, the setting of the circulation groove provides a space for the gas to flow and act between the second water removal plate and the power semiconductor, so as to ensure that the gas can fully contact the power semiconductor; and such a setting enables the gas to directly act on the power semiconductor after flowing out through the second gas groove, thereby ensuring the timeliness of water blowing.

[0020] In some embodiments, the second air groove includes an air inlet groove and an air outlet groove, the air inlet groove and the air outlet groove are arranged opposite to each other and at intervals, and are both connected to the circulation groove; the second dewatering plate is constructed with an air inlet duct and an air outlet duct, the air inlet duct is connected to the air inlet groove, the air outlet duct is connected to the air outlet groove, and the air inlet duct and the air outlet duct are arranged at intervals.

[0021] In this way, the air inlet passage, the air inlet groove, the flow groove, the air outlet groove and the air outlet passage together constitute a flow path for gas circulation, so as to use the gas to blow away the moisture on the power semiconductor and discharge the moisture.

[0022] In some embodiments, a sealing groove is constructed on one side wall of the second water removal plate facing the first water removal plate, and the sealing groove is surrounded by the outer side of the circulation groove. An annular enclosure is provided between the sealing groove and the circulation groove, and the annular enclosure separates the circulation groove and the sealing groove; a sealing ring is installed in the sealing groove, and the sealing ring can be pressed between the groove wall of the sealing groove and the power semiconductor.

[0023] It can be understood that the sealing groove is used to install a sealing ring, and when the second water removal plate is pressed onto the power semiconductor, the sealing ring can be pressed between the second water removal plate and the power semiconductor for sealing to avoid air leakage during air blowing and water removal as much as possible.

[0024] In some embodiments, a plurality of through holes are provided, and the plurality of through holes are arranged at intervals on the carrier, and each of the through holes corresponds to a first air-drying window and a second air-drying window; the first dewatering plate is configured with a first air supply duct, and the first air supply duct is connected to the first air groove corresponding to each of the first air-drying windows; the second dewatering plate is configured with a second air supply duct, and the second air supply duct is connected to the second air groove corresponding to each of the second air-drying windows.

[0025] In this way, the water removal operation on the upper and lower surfaces of multiple power semiconductors can be simultaneously satisfied, thereby improving the water removal efficiency.

[0026] In some embodiments, the dewatering protrusion is configured with a flow hole on the inner side of the first air groove, and the flow hole is arranged through the first dewatering plate; the dewatering device also includes a water collecting box and at least a pair of fixed components connected to the water collecting box, two fixed components in a pair are respectively arranged on two opposite side walls of the water collecting box, the water collecting box is supported on the first dewatering plate, the water collecting box is configured with a water collecting port, and the water collecting port is connected to the flow hole; each of the fixed components includes a fixing frame and a plunger, the fixing frame is connected to the water collecting box, and the fixing frame is configured with an assembly hole, the plunger is arranged through the assembly hole, and the plunger can move along its own axial direction to press against or prevent loosening relative to the first dewatering plate.

[0027] It can be understood that the provision of a water collecting box facilitates the collection of the water flowing out with the gas through the flow holes; and the provision of a fixing assembly can satisfy the disassembly and assembly of the first water removal plate relative to the water collecting box.

[0028] In some of the embodiments, the carrier is provided with a plurality of spaced-apart positioning blocks on a side facing away from the first water removal plate, and the plurality of positioning blocks together enclose a positioning space, the positioning space is connected to the through hole, and the carrier is constructed with a receiving groove connected to the positioning space, and the receiving groove is used to accommodate the terminals of the power semiconductor.

[0029] It is understandable that the multiple positioning blocks are used to position and limit the power semiconductor, ensuring that the power semiconductor does not shake on the carrier. At the same time, the arrangement of the receiving groove can ensure that the terminals of the power semiconductor do not protrude and affect the press fit with the first dewatering plate and the second dewatering plate; and such an arrangement also protects the terminals of the power semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 A first schematic diagram of a water removal device provided by the present application having a power semiconductor placed therein;

[0032] Figure 2 for Figure 1 A partial enlarged view of the middle A;

[0033] Figure 3 A second schematic diagram of the water removal device provided in the present application;

[0034] Figure 4 An exploded view of the water removal device provided for this application;

[0035] Figure 5 A partial cross-sectional view of a water removal device provided for the present application with a power semiconductor placed therein;

[0036] Figure 6 A cross-sectional view of a first water removal plate in the water removal device provided in the present application;

[0037] Figure 7 A cross-sectional view of the cooperation between the second water removal plate and the fixed plate in the water removal device provided in the present application;

[0038] Figure 8 This is a cross-sectional view of the second water removal plate in the water removal device provided in this application.

[0039] Reference numerals: 100, water removal device; 200, power semiconductor; 10, carrier; 11, positioning block; 20, first water removal plate; 21, water removal protrusion; 22, first gas transmission channel; 23, positioning pin; 30, second water removal plate; 33, second gas transmission channel; 40, water collecting box; 41, water outlet interface; 50, fixing assembly; 51, fixing frame; 52, plunger; 60, column; 70, power source; 80, fixing plate; 101, through hole; 102, receiving groove; 103, positioning space; 211, inner ring side plate; 212, outer ring side plate; 231, air-drying window; 301, circulation slot; 302, sealing slot; 303, fixing hole; 311, second air slot; 312, annular enclosure; 331, air inlet duct; 332, air outlet duct; 801, circular hole; 2101, first air slot; 2102, circulation hole; 2311, first air-drying window; 2312, second air-drying window; 3111, air inlet slot; 3112, air outlet slot. DETAILED DESCRIPTION

[0040] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0041] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0042] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0043] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0044] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0045] See also Figure 1 , Figure 3 and Figure 4In one embodiment of the present application, a dewatering device 100 is provided, which includes a carrier 10, a first dewatering plate 20 and a second dewatering plate 30. The carrier 10 is provided with a through hole 101 penetrating along its thickness direction. The first dewatering plate 20 is arranged on one side of the carrier 10 along the axial direction of the through hole 101, and the second dewatering plate 30 is arranged on the other side of the carrier 10 along the axial direction of the through hole 101. One of the first dewatering plate 20 and the second dewatering plate 30 is supported on the carrier 10, and the other can move relative to the carrier 10 along the axial direction of the through hole 101. Both the first dewatering plate 20 and the second dewatering plate 30 are provided with an air-drying window 231, which is arranged toward the through hole 101 and is used to blow air to the power semiconductor 200 located at the through hole 101.

[0046] For ease of description, taking the carrier 10 placed horizontally as an example, the thickness direction of the carrier 10 and the axial direction of the through hole 101 are both vertical directions, that is, Figure 1 The first dewatering plate 20 is supported by the carrier 10 , that is, located at the bottom of the carrier 10 , and the second dewatering plate 30 is located above the carrier 10 and moves relative to the carrier 10 .

[0047] The first dewatering plate 20 corresponds to the first air-drying window 2311 , and the second dewatering plate 30 corresponds to the second air-drying window 2312 . The first air-drying window 2311 and the second air-drying window 2312 define the dewatering ranges of the first dewatering plate 20 and the second dewatering plate 30 , respectively.

[0048] It is understandable that the purpose of the carrier 10 is to place and position the power semiconductor 200 to ensure that the power semiconductor 200 will not easily shift or shake during dewatering. Since the through hole 101 is set on the carrier 10, the lower surface of the power semiconductor 200 can be exposed to the first air-drying window 2311 of the first dewatering plate 20 located at the bottom through the through hole 101, and the second dewatering plate 30 can be close to the carrier 10 so that the second air-drying window 2312 acts on the upper surface of the power semiconductor 200. In this way, it can be ensured that both sides of the power semiconductor 200 along its own thickness direction correspond to the dewatering range, thereby increasing the dewatering range, satisfying the dewatering of both sides of the power semiconductor 200 along its own thickness direction, so as to facilitate as thorough and sufficient dewatering as possible, ensure the safety of the test, ensure that there is no water stain on the surface of the power semiconductor 200 after the test, and avoid the power semiconductor 200 from rusting, poor contact and other problems due to residual water stains. At the same time, due to the arrangement of the air-drying windows 231 on the first dewatering plate 20 and the second dewatering plate 30, the dewatering operation can be performed in an air-drying mode formed by airflow, which is safer. In addition, it is precisely because the second dewatering plate 30 can be moved closer to or farther away from the carrier 10 in the vertical direction to achieve distance adjustment, which not only facilitates the placement and placement of the power semiconductor 200 relative to the carrier 10 and reduces interference, but also can adjust different dewatering ranges, which is suitable for a variety of dewatering scenarios.

[0049] In an alternative embodiment, the second dewatering plate 30 is disposed at the bottom of the carrier 10 to support the carrier 10, and the first dewatering plate 20 is disposed above the carrier 10. It is sufficient as long as the dewatering range can be ensured and the dewatering performance can be improved.

[0050] In the following, the structures of the first dewatering plate 20 and the second dewatering plate 30 are described respectively, assuming that the first dewatering plate 20 is at the bottom and the second dewatering plate 30 is at the top.

[0051] Please combine Figure 1 , Figure 2 , Figure 5 and Figure 6 As shown, exemplarily, the first dewatering plate 20 is correspondingly configured with a first air-drying window 2311. Specifically, the first dewatering plate 20 is convexly provided with a dewatering protrusion 21 to define the first air-drying window 2311, the dewatering protrusion 21 is inserted into the through hole 101, the dewatering protrusion 21 is configured with a first air groove 2101, and the notch of the first air groove 2101 is arranged at an end face of the dewatering protrusion 21 inserted into the through hole 101. It can be understood that the arrangement of the dewatering protrusion 21 facilitates the insertion into the through hole 101 to reduce the spacing of the notch of the first air groove 2101 relative to the power semiconductor 200. Therefore, the gas flowing through the first air groove 2101 can act on the power semiconductor 200 in time to achieve the removal of residual water. Among them, the first air groove 2101 can be arranged in an annular manner around the circumference of the through hole 101 to ensure that there is airflow around the axis of the through hole 101 to act on the power semiconductor 200, thereby increasing the dewatering range and improving the dewatering efficiency.

[0052] In actual use, the first dewatering plate 20 is also constructed with a first gas supply channel 22, one end of which is connected to the first gas groove 2101, and the other end is used to connect to a pneumatic source (referred to as a first pneumatic source). The first gas supply channel 22 can be set as one or more; when there are multiple first gas supply channels 22, the multiple first gas supply channels 22 are arranged at intervals and are all connected to the first gas groove 2101 to achieve gas flow. In some specific embodiments, a hole structure can be opened on the first dewatering plate 20 as the first gas supply channel 22.

[0053] Please continue to combine Figure 1 , Figure 2 , Figure 5 and Figure 6As shown, in an optional embodiment, the water-removing protrusion 21 includes an inner ring side plate 211 and an outer ring side plate 212 arranged outside the inner ring side plate 211, and a first gap is provided between the inner ring side plate 211 and the outer ring side plate 212, and the first gap forms a first air groove 2101. In this way, the convex end faces of the inner ring side plate 211 and the outer ring side plate 212 respectively serve as the notch edges of the first notch. Since the protrusion height of the inner ring side plate 211 and the protrusion height of the outer ring side plate 212 are different, when the inner ring side plate 211 and the outer ring side plate 212 are jointly arranged to form the first air groove 2101, the notch edges on both sides of the notch of the first air groove 2101 are not flush, and one side notch edge is higher than the other side notch edge. In this way, a notch connected to the first gas groove 2101 is formed on the side of the water-removing protrusion 21 facing the power semiconductor 200 , and the gas flowing through the first gas groove 2101 can easily flow out from the lower side of the notch edge and act on the power semiconductor 200 .

[0054] Among them, the width of the first gap is between 1mm-2mm, that is, the width of the first air groove 2101 is between 1mm-2mm. Due to the width of the first air groove 2101, the fluidity of the gas, such as flow rate and flow rate, will be affected. Therefore, if the width of the first air groove 2101 is larger, although it can accommodate more gas, the flow rate will be reduced; and if the first air groove 2101 is too wide, the structural strength of the water removal protrusion 21 will be weakened. Of course, if the width of the first air groove 2101 is smaller, it will affect the gas flow rate. In some specific embodiments, the width of the first air groove 2101 is 1mm, 1.5mm or 2mm.

[0055] Further, take the case where the protrusion height h2 of the outer ring side plate 212 is greater than the protrusion height h1 of the inner ring side plate 211. In some specific embodiments, when the power semiconductor 200 is placed on the carrier 10, the middle of the power semiconductor 200 is exposed to the position corresponding to the water removal protrusion 21 through the through hole 101, and the power semiconductor 200 will contact the protruding end surface of the outer ring side plate 212. At this time, it is precisely because the protrusion height of the inner ring side plate 211 is smaller that a space for gas circulation can be formed between the inner ring side plate 211 and the power semiconductor 200, which is convenient for removing residual moisture on the power semiconductor 200.

[0056] Among them, the height difference between the protrusion height h2 of the outer ring side plate 212 and the protrusion height h1 of the inner ring side plate 211 is between 0.2mm-0.4mm, for example, it can be 0.2mm, 0.3mm or 0.4mm. It can be understood that the height difference between the outer ring side plate 212 and the inner ring side plate 211 determines the distance between the protruding end face of the inner ring side plate 211 and the power semiconductor 200, which is convenient. Specifically, if the distance is large, the flow path of the gas is extended, which is not conducive to timely flow to the power semiconductor 200; if the distance is small, it will lead to insufficient space for gas flow, weakening the water blowing effect. Therefore, by limiting the height difference between the outer ring side plate 212 and the inner ring side plate 211, it is ensured that the gas flowing out of the first gas groove 2101 can act on the power semiconductor 200 in a timely and sufficient manner.

[0057] Please continue to combine Figure 2 , Figure 5 and Figure 6 As shown, in some embodiments, the outer ring side plate 212 and the inner ring side plate 211 are both arranged in an annular structure, and the first gap between the two is also annular, and the corresponding first air groove 2101 is arranged in an annular shape. The inner ring side plate 211 is surrounded by a flow hole 2102, and the flow hole 2102 is arranged through the first dewatering plate 20. When in use, when the gas flows between the inner ring side plate 211 and the power semiconductor 200, it can flow downward through the flow hole 2102. In this way, not only the gas flow is satisfied, the internal and external pressure balance is ensured, and the gas is prevented from blowing up the power semiconductor 200; but also, the moisture can be caused to flow out with the gas, so as to meet the requirements of moisture removal and collection. In other words, the first gas transmission duct 22, the first air groove 2101 and the flow hole 2102 together constitute a flow path for gas flow. As shown Figure 6 As shown, the arrows indicate the gas flow path.

[0058] In some specific embodiments, the convex end face of the outer ring side plate 212 is flush with the side face of the carrier 10 away from the first dewatering plate 20. When the power semiconductor 200 is placed on the carrier 10, the portion of the power semiconductor 200 exposed to the through hole 101 is pressed and sealed with the convex end face of the outer ring side plate 212 to prevent gas leakage. Under the action of the first pneumatic source, the gas flows to the first gas groove 2101 through the first gas delivery channel 22, flows upward along the first gas groove 2101, and flows out from the notch at the inner ring side plate 211 to act on the power semiconductor 200 and blow away the moisture on it; then, the gas carries the moisture and flows downward along the flow hole 2102 to collect the moisture. Among them, the gas after collecting the moisture can be dried and recycled to achieve energy saving; of course, it can also be discharged after treatment.

[0059] Among them, since the first gas groove 2101 is arranged in a ring shape around the axis of the through hole 101, two first gas delivery channels 22 can be provided, both for inputting gas into the first gas groove 2101. The two first gas delivery channels 22 are arranged on both sides of the water removal protrusion 21 along the Y-axis direction to improve the air delivery rate and water blowing efficiency. Among them, the length of the first gas delivery channel 22 extends along the X-axis direction and is located on the side of the first gas groove 2101 away from the notch. It should be noted that the Y-axis direction can be the width direction of the carrier 10, and the X-axis direction can be the length direction of the carrier 10.

[0060] In a replaceable embodiment, the flow hole 2102 surrounded by the inner ring side plate 211 is a blind hole, that is, it is not arranged to penetrate the first dewatering plate 20 along the Z-axis direction. In this case, the flow hole 2102 can be used to collect moisture. At this time, the first dewatering plate 20 is provided with a flow channel connected to the flow hole 2102, so as to extract the moisture collected in the flow hole 2102. Among them, the flow channel can also serve as a channel for gas outflow. Then, the first gas supply channel 22, the first gas groove 2101, the flow hole 2102 and the flow channel together constitute a flow path for gas flow. The first gas supply channel 22 is used to input gas into the first gas groove 2101, and the flow channel is used to lead out the gas after dewatering.

[0061] In another alternative embodiment, the height of the inner ring side plate 211 may be greater than the height of the outer ring side plate 212. In this case, the gas flows through the first gas groove 2101 and radially blows the moisture on the power semiconductor 200 outward. The inner ring side plate 211 and the outer ring side plate 212 are a group, and multiple groups may be provided as long as they can remove water.

[0062] It should be added that the water-removing protrusion 21 protrudes upward from the upper surface of the first water-removing plate 20 along the Z-axis direction, and the end face of the water-removing protrusion 21 extending along its own protruding direction is the convex end face. Therefore, the convex end face of the outer ring side plate 212 is the extended end face of the protrusion relative to the first water-removing plate 20, and the convex end face of the inner ring side plate 211 is the same.

[0063] See also Figure 1 , Figure 3 and Figure 7, illustratively, the second dewatering plate 30 is correspondingly configured with a second air-drying window 2312; a side wall of the second dewatering plate 30 facing the first dewatering plate 20 is recessed with a flow groove 301 to define the second air-drying window 2312, and a second air groove 311 is configured at the bottom of the flow groove 301, and the notch of the second air groove 311 is arranged toward the first dewatering plate 20. It can be understood that when the second dewatering plate 30 is close to and pressed against the power semiconductor 200 relative to the carrier 10, the arrangement of the flow groove 301 is equivalent to providing a space for gas to flow and act between the second dewatering plate 30 and the power semiconductor 200, so as to ensure that the gas can fully contact the upper surface of the power semiconductor 200; and, since the second air groove 311 is arranged at the bottom of the flow groove 301, the gas directly acts on the power semiconductor 200 after flowing out through the second air groove 311, so as to ensure the timeliness of water blowing.

[0064] Furthermore, the second gas groove 311 includes an air inlet groove 3111 and an air outlet groove 3112. The air inlet groove 3111 and the air outlet groove 3112 can be arranged opposite to each other and spaced apart along the Y-axis direction, and both are connected to the flow groove 301 through corresponding notches. In this way, the gas can flow into the flow groove 301 through the air inlet groove 3111 to act on the power semiconductor 200 exposed in the flow groove 301, and then flow out through the air outlet groove 3112 carrying the blown-away moisture.

[0065] like Figure 1 , Figure 7 and Figure 8 As shown, in actual use, the second dewatering plate 30 is constructed with a second gas delivery channel 33, one end of the second gas delivery channel 33 is connected to the second gas groove 311, and the other end is connected to the corresponding pneumatic source (referred to as the second pneumatic source). Among them, the second gas delivery channel 33 includes an air inlet channel 331 and an air outlet channel 332, the air inlet channel 331 and the air outlet channel 332 are arranged oppositely and spaced along the Y-axis direction, the air inlet channel 331 is connected to the air inlet groove 3111, and the air outlet channel 332 is connected to the air outlet groove 3112. In this way, the air inlet channel 331, the air inlet groove 3111, the circulation groove 301, the air outlet groove 3112 and the air outlet channel 332 together constitute a flow path for gas circulation.

[0066] The inlet groove 3111 and the outlet groove 3112 are both linear grooves, and the gas flows from the inlet groove 3111 to the outlet groove 3112 along the Y-axis in the flow groove 301. At the same time, the inlet airway 331 and the outlet airway 332 can be formed by the hole structure opened by the second dewatering plate 30.

[0067] In an alternative embodiment, the second gas groove 311 is not only used for gas to flow into the flow groove 301, but also for extracting gas from the flow groove 301. Specifically, the gas flows into the flow groove 301 along the second gas groove 311 to blow away the moisture on the power semiconductor 200, and the moisture falls into the flow groove 301; after blowing for a certain period of time, the gas and moisture in the flow groove 301 can be extracted through the second gas groove 311 by suction. At this time, a pressure relief hole can be set at the bottom of the flow groove 301 to ensure the balance of air pressure in the flow groove 301.

[0068] See also Figure 3 and Figure 7 In an optional embodiment, the second dewatering plate 30 is also configured with a sealing groove 302, and the sealing groove 302 is arranged outside the circulation groove 301, so that an annular ring enclosure 312 is formed on the second dewatering plate 30, and the annular enclosure 312 separates the circulation groove 301 and the sealing groove 302, and the annular enclosure 312 is arranged to form the circulation groove 301, and the second gas groove 311 is located on the inner side of the annular enclosure 312. It can be understood that the setting of the sealing groove 302 is used to install a sealing ring, and then when the second dewatering plate 30 is pressed on the power semiconductor 200, the sealing ring can be pressed between the second dewatering plate 30 and the power semiconductor 200 to seal and avoid air leakage during air blowing and dewatering as much as possible. Among them, the groove depth of the sealing groove 302 can be greater than the groove depth of the circulation groove 301, which not only improves the installation reliability of the sealing ring, but also facilitates the gas to be blown to the power semiconductor 200 in time through the second notch.

[0069] Furthermore, since the second dewatering plate 30 can be raised and lowered relative to the carrier 10 along the Z-axis direction, the dewatering device 100 also includes a power source 70, which is connected to the second dewatering plate 30 to drive the second dewatering plate 30 to be raised and lowered. The dewatering device 100 also includes a column 60, which is used to support the power source 70 and raise the power source 70. The power source 70 can be a cylinder or other linear modules; and a fixing plate 80 is connected to the side of the second dewatering plate 30 away from the carrier 10, and the fixing plate 80 is connected to the driving end of the power source 70 to avoid the second dewatering plate 30 being directly connected to the power source 70 and weakening the structural strength of the second dewatering plate 30. Among them, the second dewatering plate 30 is constructed with a plurality of fixing holes 303 arranged at intervals along the X-axis direction, and the fixing plate 80 is correspondingly provided with a plurality of circular holes 801 arranged at intervals along the X-axis direction, one fixing hole 303 corresponds to one circular hole 801, so that the second dewatering plate 30 and the fixing plate 80 can be fixed by fastening with screws or the like.

[0070] like Figure 1As shown, in some embodiments, the carrier 10 is provided with a plurality of positioning blocks 11 arranged at intervals on the side away from the first dewatering plate 20, and the plurality of positioning blocks 11 are collectively arranged to form a positioning space 103, the positioning space 103 is connected to the through hole 101, and the carrier 10 is configured with a receiving groove 102 connected to the positioning space 103, and the receiving groove 102 is used to accommodate the terminal of the power semiconductor 200. It can be understood that the setting of the plurality of positioning blocks 11 can play a role in positioning and limiting the power semiconductor 200, ensuring that the power semiconductor 200 will not shake on the carrier 10. At the same time, the setting of the receiving groove 102 can ensure that the terminal of the power semiconductor 200 will not protrude and affect the press-fitting with the first dewatering plate 20 and the second dewatering plate 30; and such a setting also protects the terminal of the power semiconductor 200.

[0071] Furthermore, considering the assembly stability and alignment between the carrier 10 and the first dewatering plate 20, a plurality of locating pins 23 arranged at intervals are provided on the first dewatering plate 20, and a plurality of locating holes arranged at intervals are correspondingly provided on the carrier 10, and each locating pin 23 is plugged into a locating hole. The end of the locating pin 23 is provided with a conical surface to facilitate plugging and alignment.

[0072] See also Figure 1 , Figure 3 and Figure 4 , illustratively, there are multiple through holes 101, and the multiple through holes 101 are arranged at intervals on the carrier 10, and each through hole 101 corresponds to a first air-drying window 2311 and a second air-drying window 2312. It can be understood that by using the arrangement of multiple through holes 101, multiple power semiconductors 200 can be placed accordingly to ensure that the lower surface of each power semiconductor 200 is exposed to the dehydration range of the corresponding first air-drying window 2311 through the corresponding through hole 101. In this way, the dehydration operation of the upper and lower surfaces of multiple power semiconductors 200 can be satisfied at the same time.

[0073] Furthermore, the plurality of through holes 101, the plurality of first air drying windows 2311 and the plurality of second air drying windows 2312 are arranged at intervals along the X-axis direction. At this time, the first air supply channel 22 and the second air supply channel 33 extend along the X-axis direction to connect the first air groove 2101 and the second air groove 311 corresponding to each first air drying window 2311 and each second air drying window 2312, respectively, so as to meet the requirements of simultaneous dehydration of each first air drying window 2311 and simultaneous dehydration of each second air drying window 2312. Figure 8As shown, the arrows indicate the flow direction of the gas in the second dewatering plate 30 in the air inlet duct 331 and the air outlet duct 332. Of course, each first air drying window 2311 and each second air drying window 2312 may correspond to a first air supply duct 22 and a second air supply duct 33, so as to facilitate separate control.

[0074] See also Figure 1 , Figure 3 , Figure 4 and Figure 5 In an optional embodiment, the water removal device 100 further includes a water collecting box 40, which is configured with a water collecting port, which is connected to the flow hole 2102 on the first water removal plate 20, so as to collect the water flowing through the flow hole 2102. The water collecting box 40 is installed at the bottom of the first water removal plate 20, and the first water removal plate 20 is covered at the water collecting port of the water collecting box 40. Furthermore, the bottom of the water collecting box 40 is connected with a water outlet interface 41, so as to send the water collected in the water collecting box 40 out through the water outlet interface 41. The water outlet interface 41 is connected to the delivery pipe to realize water flow delivery.

[0075] In actual use, the water removal device 100 also includes at least one pair of fixing components 50 connected to the water collecting box 40. The two fixing components 50 in a pair are respectively arranged on two opposite side walls of the water collecting box 40. The fixing components 50 are used to fix the first water removal plate 20 relative to the water collecting box 40.

[0076] like Figure 1 , Figure 3 and Figure 4 As shown, specifically, each fixing assembly 50 includes a fixing frame 51 and a plunger 52. The fixing frame 51 is connected to the water collecting box 40, and the fixing frame 51 is configured with an assembly hole. The plunger 52 is inserted into the assembly hole. The plunger 52 can move along its own axial direction to abut or prevent loosening relative to the first dewatering plate 20. In actual use, the plunger 52 is threadedly connected to the fixing frame 51, that is, the assembly hole is a threaded hole. By tightening or loosening the plunger 52 relative to the fixing frame 51, the plunger 52 can be moved along its own axial direction to act on the side wall of the first dewatering plate 20, so as to realize the disassembly and assembly of the first dewatering plate 20 relative to the water collecting box 40. For example, when the plunger 52 is tightened clockwise relative to the fixing frame 51, the length of the plunger 52 between the fixing frame 51 and the first dewatering plate 20 is increased, and the plunger 52 abuts against the first dewatering plate 20; in this way, the two plungers 52 are clamped together to achieve fixation. When the first dewatering plate 20 needs to be removed and loosened, the plunger 52 can be loosened counterclockwise.

[0077] In other embodiments, the first dewatering plate 20 may be pressed against the first dewatering plate 20 by rotating counterclockwise, and loosened relative to the first dewatering plate 20 by rotating clockwise. As long as the first dewatering plate 20 is assembled and disassembled relative to the water collecting box 40, it will be fine.

[0078] In an alternative embodiment, the first water removal plate 20 may also be assembled relative to the water collecting box 40 by utilizing the cooperation of a protrusion and a groove.

[0079] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0080] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A water removal device, characterized in that: The dewatering device (100) comprises: The carrier (10) is structured with a through hole (101) penetrating along the thickness direction of the carrier; A first dewatering plate (20) is disposed on one side of the carrier (10) along the axial direction of the through hole (101); A second dewatering plate (30) is disposed on the other side of the carrier (10) along the axial direction of the through hole (101); One of the first dewatering plate (20) and the second dewatering plate (30) is supported on the carrier (10), and the other is movable relative to the carrier (10) along the axial direction of the through hole (101); the first dewatering plate (20) and the second dewatering plate (30) are both configured with an air-drying window (231), and the air-drying window (231) is arranged toward the through hole (101) and is used for blowing air toward the power semiconductor (200) located at the through hole (101).

2. The water removal device according to claim 1, characterized in that: The first dewatering plate (20) corresponds to the first air-drying window (2311), and the first dewatering plate (20) is supported on the carrier (10); The first dewatering plate (20) is provided with a dewatering protrusion (21) to define the first air-drying window (2311); the dewatering protrusion (21) is inserted into the through hole (101); the dewatering protrusion (21) is configured with a first air groove (2101); and the notch of the first air groove (2101) is provided at one end of the dewatering protrusion (21) inserted into the through hole (101).

3. The water removal device according to claim 2, characterized in that: The water removal protrusion (21) comprises: Inner ring side plate (211), An outer ring side plate (212) is arranged around the outer side of the inner ring side plate (211); There is a first gap between the inner ring side plate (211) and the outer ring side plate (212), the first gap forms the first air groove (2101), and the protrusion height of the inner ring side plate (211) is different from the protrusion height of the outer ring side plate (212).

4. The water removal device according to claim 3, characterized in that: The inner ring side plate (211) is surrounded by a circulation hole (2102), and the circulation hole (2102) is arranged through the first dewatering plate (20), the protrusion height of the inner ring side plate (211) is smaller than the protrusion height of the outer ring side plate (212), and the first air groove (2101) is connected to the circulation hole (2102).

5. The water removal device according to claim 2, characterized in that: The second dewatering plate (30) corresponds to the second air-drying window (2312); A circulation groove (301) is recessed on a side wall of the second dewatering plate (30) facing the first dewatering plate (20) to define the second air-drying window (2312); a second air groove (311) is configured at the bottom of the circulation groove (301), and a notch of the second air groove (311) is arranged toward the first dewatering plate (20).

6. The water removal device according to claim 5, characterized in that: The second air groove (311) comprises an air inlet groove (3111) and an air outlet groove (3112), wherein the air inlet groove (3111) and the air outlet groove (3112) are arranged opposite to each other and spaced apart, and are both connected to the circulation groove (301); The second dewatering plate (30) is constructed with an air inlet duct (331) and an air outlet duct (332), wherein the air inlet duct (331) is connected to the air inlet groove (3111), and the air outlet duct (332) is connected to the air outlet groove (3112), and the air inlet duct (331) and the air outlet duct (332) are arranged opposite to each other and at intervals.

7. The water removal device according to claim 5, characterized in that: A sealing groove (302) is configured on one side wall of the second dewatering plate (30) facing the first dewatering plate (20); the sealing groove (302) is arranged outside the circulation groove (301); an annular enclosure (312) is arranged between the sealing groove (302) and the circulation groove (301); the annular enclosure (312) separates the circulation groove (301) and the sealing groove (302); A sealing ring is installed in the sealing groove (302), and the sealing ring can be pressed between the groove wall of the sealing groove (302) and the power semiconductor (200).

8. The water removal device according to claim 5, characterized in that: A plurality of through holes (101) are provided, and the plurality of through holes (101) are arranged at intervals on the carrier (10), and each of the through holes (101) corresponds to one of the first air-drying windows (2311) and one of the second air-drying windows (2312); The first dewatering plate (20) is configured with a first air supply duct (22), and the first air supply duct (22) is connected to the first air groove (2101) corresponding to each of the first air-drying windows (2311); the second dewatering plate (30) is configured with a second air supply duct (33), and the second air supply duct (33) is connected to the second air groove (311) corresponding to each of the second air-drying windows (2312).

9. The water removal device according to claim 2, characterized in that: The dewatering protrusion (21) is provided with a flow hole (2102) on the inner side of the first air groove (2101), and the flow hole (2102) is arranged through the first dewatering plate (20); The dewatering device (100) further comprises a water collecting box (40) and at least one pair of fixing components (50) connected to the water collecting box (40), wherein two fixing components (50) in the pair are respectively arranged on two opposite side walls of the water collecting box (40), the water collecting box (40) is supported on the first dewatering plate (20), and the water collecting box (40) is configured with a water collecting port, and the water collecting port is communicated with the flow hole (2102); Each of the fixing components (50) comprises a fixing frame (51) and a plunger plug (52); the fixing frame (51) is connected to the water collecting box (40), and the fixing frame (51) is provided with an assembly hole, the plunger plug (52) is passed through the assembly hole, and the plunger plug (52) can move along its own axial direction to tighten or loosen relative to the first dewatering plate (20).

10. The water removal device according to claim 1, characterized in that: The carrier (10) is provided with a plurality of spaced positioning blocks (11) on a side facing away from the first dewatering plate (20), the plurality of positioning blocks (11) together enclose a positioning space (103), the positioning space (103) is connected to the through hole (101), and the carrier (10) is configured with a receiving groove (102) connected to the positioning space (103), the receiving groove (102) being used to accommodate a terminal of the power semiconductor (200).

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