Sealed heat dissipation type control mainboard

Abstract

According to the scheme, the sealed heat dissipation type control mainboard comprises a sealed shell formed by a metal top cover and a metal bottom cover, a first equal-height column and a second equal-height column are arranged in the sealed shell and used for fixing and lifting the control mainboard, and a heat dissipation gap is reserved between the mainboard and the bottom cover. Second equal-height columns are installed around the control mainboard chip and make close contact with the control mainboard chip through a heat dissipation base, the top of the heat dissipation base is flush with the top cover, and the sealing performance is guaranteed through a sealing convex ring and a groove. The heat dissipation base is made of pure copper and is subjected to electroplating treatment, the heat dissipation tooth blocks are made of graphene reinforced composite aluminum-based materials, the top cover and the bottom cover are made of aluminum alloy and magnesium alloy, and honeycomb-shaped grooves are formed in the surface of the top cover to enhance the heat dissipation effect. In addition, a temperature sensor is arranged in the heat dissipation base, a fan installation position is reserved, and efficient and intelligent heat dissipation is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board heat dissipation, and in particular to a sealed heat dissipation control mainboard. Background Art

[0002] Currently, there is a circuit board heat dissipation device on the market, which uses epoxy resin potting glue to wrap the circuit board and pot it in the heat dissipation box to achieve the functions of heat dissipation and dust and water resistance. However, this technical solution has several problems: First, the thermal conductivity of epoxy resin potting glue is relatively low, and the heat dissipation performance is limited, which may not meet the efficient heat dissipation requirements of high-power or high-density integrated electronic components. Secondly, once the potting is completed, the maintainability and replaceability of the circuit board are greatly reduced, which increases the maintenance cost and difficulty.

[0003] Therefore, there is an urgent need for a sealed heat dissipation control mainboard which can ensure sealing performance and has high maintainability. Utility Model Content

[0004] The purpose of this application is to provide a sealed heat dissipation control mainboard to address the above-mentioned problems existing in the prior art.

[0005] In order to achieve the above application purpose, the present application adopts the following technical solution: A sealed heat dissipation control mainboard includes:

[0006] The metal top cover is provided with a positioning opening, and a sealing convex ring is provided at the edge of the positioning opening;

[0007] The metal bottom cover is detachably connected to the edge of the metal top cover to form a sealed shell with a cavity inside;

[0008] The first equal height column is installed on the top of the metal bottom cover and is used to install the control main board, so that there is a gap between the control main board and the surface of the metal bottom cover;

[0009] A control main board is fixed to a plurality of first equal-height columns through connecting pieces, and the control main board is also provided with a plurality of mounting holes for mounting second equal-height columns;

[0010] The second equal height columns are installed in the installation holes and are located around the chip of the control mainboard. The bottom of each second equal height column is connected to the metal bottom cover, and the top protrudes from the control mainboard.

[0011] The heat sink, the bottom of which is fixed on a plurality of second equal-height columns through a connector, and abuts against the top of the chip of the control mainboard, and the chip is coated with thermal grease or covered with a phase-change thermal conductive sheet; the top of the heat sink is matched with the positioning opening and is provided with a sealing groove matched with a sealing convex ring, and when the heat sink is matched with the positioning opening, the top of the heat sink is flush with the top of the metal top cover;

[0012] The heat dissipation tooth block is installed on the top surface of the metal top cover and can completely cover the top of the heat dissipation seat, and a thermal pad or thermal grease is also provided at the bottom of the heat dissipation tooth block.

[0013] Furthermore, the heat sink is made of pure copper and the surface is electroplated. After the surface electroplating treatment, the pure copper heat sink not only strengthens its basic heat dissipation performance, but also significantly improves durability, appearance quality, corrosion resistance and other aspects, and is suitable for use in occasions with high requirements for heat dissipation performance and long-term stability.

[0014] Furthermore, the metal bottom cover is provided with a connection groove for inserting the edge of the metal top cover, and the size of the connection groove gradually decreases from top to bottom, so that the top area of ​​the connection groove and the edge of the metal top cover have a gap for glue injection, and the bottom area and the edge of the metal top cover have an interference fit. This design cleverly combines mechanical connection and sealant injection, which not only improves the overall sealing, heat dissipation efficiency and structural stability of the control motherboard, but also optimizes the production process, and has strong practicality and innovation.

[0015] Furthermore, the heat dissipation tooth block is made of graphene-reinforced composite aluminum-based material. Graphene has extremely high thermal conductivity. Adding it to aluminum-based materials as a reinforcing agent can greatly improve the thermal diffusion capacity and heat transfer efficiency of the composite material. Therefore, the heat dissipation tooth block can absorb and dissipate the heat of the heating element more quickly, effectively reduce the operating temperature of the control motherboard, and ensure the stable and efficient operation of the electronic equipment. It can achieve a significant improvement in heat dissipation efficiency while taking into account the requirements of lightweight and mechanical performance, and is suitable for electronic equipment with high requirements for heat dissipation performance.

[0016] Furthermore, the metal top cover and the metal bottom cover are both made of aluminum alloy or magnesium alloy. The use of aluminum alloy and magnesium alloy as the metal top cover and the metal bottom cover of the control mainboard aims to pursue lightweight structure, high strength, good heat dissipation performance and electromagnetic compatibility, thereby comprehensively improving the comprehensive performance and service life of the control mainboard.

[0017] Furthermore, the surface outside the top surface of the metal top cover is provided with honeycomb grooves, which is beneficial to improving the heat dissipation performance and also helps to optimize other performance indicators of the product, such as lightweight, and is a technical means in engineering design that combines practicality and aesthetic value.

[0018] Furthermore, a temperature sensor is embedded in the heat dissipation gear block, and a fan installation hole is reserved on the heat dissipation gear block. The reserved fan installation hole means that the heat dissipation gear block and the fan are integrated into the design, and the fan can be easily installed and replaced to enhance the heat dissipation efficiency. This design simplifies the installation process, while also ensuring the best coordination between the heat dissipation system and the control motherboard, making the entire heat dissipation solution more compact and efficient. Moreover, this design makes the heat dissipation system more intelligent and efficient, and can better adapt to various working environments and load conditions, ensuring that the control motherboard and other important electronic components are always in an ideal working temperature environment.

[0019] Compared with the prior art, this application has the following beneficial effects:

[0020] 1. The control motherboard is installed on the metal bottom cover through the first equi-height column, so that there is a certain gap between the motherboard and the bottom cover, which is convenient for avoiding the components or wiring harness at the bottom of the control motherboard. The key heating element on the control motherboard, the chip, is surrounded by the second equi-height column. Through these equi-height columns, the heat sink can be accurately installed and in close contact with the chip, and the heat generated by the chip is quickly transferred to the heat sink through thermal grease or phase change thermal conductive sheet. The heat sink and the metal top cover are precisely matched through positioning holes and sealing grooves. When the assembly is completed, the top of the heat sink is flush with the top of the metal top cover, forming a compact sealing structure, while ensuring effective contact between the heat sink and the heat sink tooth block. The heat sink tooth block is made of high-efficiency thermal conductive materials, such as graphene-enhanced composite aluminum-based materials, which can further expand the heat dissipation area, and through its own thermal pad or thermal grease, it is closely combined with the heat sink to quickly dissipate the absorbed heat to the outside world, and the metal top cover and metal bottom cover can also help dissipate heat. The sealing convex ring cooperates with the sealing groove on the heat sink to form a sealing barrier that isolates the internal and external environments, effectively preventing the influence of dust, moisture, etc. on the control motherboard and improving the working stability of the equipment in harsh environments.

[0021] 2. This application uses a unique design of multiple equal-height columns to not only effectively support the control motherboard, but also create a channel that is conducive to heat dissipation, thereby improving heat dissipation efficiency. The heat dissipation system that combines a heat sink and a heat dissipation tooth block uses high-efficiency thermal conductive materials and structural design to greatly improve the heat dissipation conditions of the chip, reduce the risk of chip overheating, and thus extend the service life of the control motherboard. By using precise positioning openings and sealing structure design, this application achieves sealed protection for the control motherboard, improves the dustproof, waterproof and corrosion-resistant capabilities of the overall device, and is suitable for harsh industrial environments and outdoor environments. The structural design is simple and reasonable, and it is easy to assemble and maintain. The detachable connection method allows components to be independently replaced or repaired when necessary, reducing maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the structure of this application;

[0023] Figure 2 It is a schematic diagram of the heat sink installed on the metal top cover;

[0024] Figure 3 yes Figure 1 A is an enlarged view of the middle image.

[0025] In the figure, 1. Metal top cover; 2. Metal bottom cover; 3. First level column; 4. Second level column; 5. Control main board; 6. Heat sink; 7. Heat sink tooth block; 8. Thermal pad; 9. Temperature sensor; 10. Connector; 11. Positioning opening; 12. Sealing convex ring; 21. Connecting groove; 51. Chip; 71. Fan installation hole. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0027] Those skilled in the art should understand that, in the disclosure of the present application, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present application.

[0028] like Figure 1-3 As shown, the utility model relates to a sealed heat dissipation control motherboard, which integrates a high-efficiency heat dissipation structure and a sealing design to improve heat dissipation efficiency, structural stability and extend service life. The specific components include:

[0029] Metal top cover and metal bottom cover, the metal top cover is provided with a positioning opening in the center, and a sealing convex ring is provided on its edge to ensure the sealing effect; the metal bottom cover and the edge of the metal top cover are detachably connected to form a sealed shell with an internal cavity, and the metal bottom cover is provided with a special connecting groove, which gradually shrinks from top to bottom to form a glue filling gap in the top area, and the bottom area is interference fit with the edge of the metal top cover to achieve dual protection of mechanical connection and sealant filling, thereby enhancing sealing, heat dissipation efficiency and structural stability.

[0030] In the mainboard mounting structure, a first column of equal height is provided and fixed on the top of the metal bottom cover. The control mainboard is mounted on the first column of equal height through a connector, and a certain gap is kept with the surface of the metal bottom cover to facilitate the layout of the underlying components and wiring harness. The control mainboard is also preset with a plurality of mounting holes for installing the second column of equal height. The second column of equal height is arranged around the chip on the control mainboard, one end of which is connected to the metal bottom cover, and the other end is higher than the surface of the control mainboard.

[0031] The heat sink is made of pure copper material and is surface-plated to enhance heat dissipation, durability, appearance quality and corrosion resistance. The bottom of the heat sink is fixed on the second-high column through a connector, directly in contact with the top of the chip, and coated with thermal grease or covered with a phase-change thermal conductive sheet to improve heat conduction efficiency. The top of the heat sink is precisely matched with the positioning opening of the metal top cover, and is provided with a sealing groove that matches the sealing convex ring. After assembly, the top of the heat sink is flush with the top of the metal top cover to form a sealed structure.

[0032] The heat dissipation tooth block is made of graphene-reinforced composite aluminum-based material, installed on the top surface of the metal top cover, fully covering the top of the heat sink, and set a thermal pad or thermal grease at its bottom to further expand the heat dissipation area and accelerate heat dissipation. The metal top cover is equipped with a honeycomb groove design on all surfaces except the top surface. This design improves heat dissipation performance while achieving lightweight and aesthetic design.

[0033] In addition, the heat sink block is embedded with a temperature sensor and has reserved holes for fan installation, which facilitates the installation and replacement of fans, enhances the heat dissipation efficiency, ensures that the heat dissipation system can be intelligently adjusted according to real-time temperature conditions, and ensures that the control motherboard and its important electronic components are maintained in an ideal working temperature environment under various working environments and load conditions.

[0034] The parts not described in detail in this application are prior art, so this application does not describe them in detail.

[0035] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0036] Although this article uses more terms such as metal top cover, metal bottom cover, first equal height column, second equal height column, control mainboard, heat sink, heat dissipation tooth block, thermal pad, temperature sensor, connector, positioning hole, sealing convex ring, connecting groove, chip, fan installation hole, etc., it does not exclude the possibility of using other terms. These terms are used only to more conveniently describe and explain the essence of this application; interpreting them as any additional restrictions is contrary to the spirit of this application.

[0037] The present application is not limited to the above-mentioned optimal implementation mode. Anyone can derive other forms of products under the inspiration of this application. However, no matter what changes are made in the shape or structure, all technical solutions that are the same or similar to those of the present application fall within the protection scope of the present application.

Claims

1. A sealed heat dissipation control mainboard, characterized in that: include: The metal top cover is provided with a positioning opening, and a sealing convex ring is provided at the edge of the positioning opening; A metal bottom cover is detachably connected to the edge of the metal top cover to form a sealed housing with a cavity inside; A first equal height column is installed on the top of the metal bottom cover and is used to install a control main board so that there is a gap between the control main board and the surface of the metal bottom cover; A control main board is fixed to the plurality of the first equal-height columns through a connecting piece, and the control main board is also provided with a plurality of mounting holes for mounting the second equal-height columns; Second equal-height columns are installed in the installation holes and are located around the chip of the control mainboard. The bottom of each of the second equal-height columns is connected to the metal bottom cover, and the top protrudes from the control mainboard; A heat sink, the bottom of which is fixed to the plurality of the second-height columns through a connector and abuts against the top of the chip of the control mainboard, and the chip is coated with thermal grease or covered with a phase-change thermal conductive sheet; the top of the heat sink is matched with the positioning opening and is provided with a sealing groove matched with the sealing convex ring, and when the heat sink is matched with the positioning opening, the top of the heat sink is flush with the top of the metal top cover; The heat dissipation tooth block is installed on the top surface of the metal top cover and can completely cover the top of the heat dissipation seat, and a thermal pad or thermal grease is also provided at the bottom of the heat dissipation tooth block.

2. A sealed heat dissipation control mainboard according to claim 1, characterized in that: The heat sink is made of pure copper and is electroplated on the surface.

3. The sealed heat dissipation control mainboard according to claim 1, characterized in that: The metal bottom cover is provided with a connecting groove for inserting the edge of the metal top cover, and the size of the connecting groove gradually decreases from top to bottom, so that the top area of ​​the connecting groove and the edge of the metal top cover have a gap for glue injection, and the bottom area has an interference fit with the edge of the metal top cover.

4. The sealed heat dissipation control mainboard according to claim 1, characterized in that: The heat dissipation tooth block is made of graphene-reinforced composite aluminum-based material.

5. The sealed heat dissipation control mainboard according to claim 1, characterized in that: The metal top cover and the metal bottom cover are both made of aluminum alloy or magnesium alloy.

6. The sealed heat dissipation control mainboard according to claim 1, characterized in that: The surface outside the top surface of the metal top cover is provided with honeycomb grooves.

7. A sealed heat dissipation control mainboard according to any one of claims 1 to 6, characterized in that: The heat dissipation tooth block is embedded with a temperature sensor, and a fan installation hole is reserved on the heat dissipation tooth block.

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