Novel radiator for power supply

Abstract

The utility model discloses a novel radiator for a power supply, which comprises a power supply shell, two sides of the top end of the inner wall of the power supply shell are provided with mounting strips, and one side of the bottom end of each mounting strip is fixedly provided with a plurality of telescopic rods and a plurality of buffer springs. According to the radiator, the semiconductor chilling plate is powered on to cool air on the refrigeration face of the semiconductor chilling plate, so that the interior of the power source shell is cooled, the contact area between the heat dissipation face of the semiconductor chilling plate and the air can be increased through the arrangement of the multiple heat dissipation fins and the multiple heat dissipation holes, and therefore the heat dissipation efficiency is improved; hot air generated by the heat dissipation surface of the semiconductor chilling plate is quickly led out through the heat dissipation fan, and the plurality of telescopic rods, the plurality of buffer springs and the two dampers are arranged between the heat dissipation device and the power supply shell, so that vibration generated when the heat dissipation device works can be relieved, and the working noise of the heat dissipation device is further reduced.

Description

Technical Field

[0001] The utility model relates to the field of power supply radiators, in particular to a new type of radiator used for power supply. Background Art

[0002] A power supply is a device that provides power to electronic devices. It is also called a power supply. It provides the electrical energy required by all components in a computer. The components in the power supply will generate a lot of heat when running at high speed. The components may be damaged if they are exposed to high temperatures for a long time. Therefore, a corresponding heat sink is installed on the power supply to dissipate heat. However, the existing heat sink is usually directly fixed to the power supply by bolts, which makes it impossible to reduce the vibration generated by the heat sink during operation, which easily generates noise.

[0003] In order to solve the above problems, a new type of heat sink for power supply is proposed. Utility Model Content

[0004] The purpose of the utility model is to provide a new type of heat sink used in a power supply to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a new type of heat sink used in a power supply, comprising a power supply shell, mounting bars are arranged on both sides of the top of the inner wall of the power supply shell, a plurality of telescopic rods and a plurality of buffer springs are fixedly arranged on one side of the bottom end of the two mounting bars, the plurality of buffer springs are respectively sleeved on the surface of the plurality of telescopic rods, a connecting bar is fixedly arranged on the bottom between the plurality of telescopic rods and the plurality of buffer springs on the same side, a semiconductor refrigeration plate is fixedly arranged between the two connecting bars, mounting frames are fixedly arranged on both sides of the top of the semiconductor refrigeration plate, a cooling fan is fixedly arranged on the top between the two mounting frames, a first support rod is fixedly arranged on one side of the top of the two connecting bars, a damper is fixedly connected to the top of the two first support rods, a second support rod is fixedly connected to the top of the two dampers, and the two second support rods are respectively fixedly connected to the two mounting bars.

[0006] The radiator cools the air on the cooling surface of the semiconductor refrigeration plate by energizing the semiconductor refrigeration plate, thereby cooling the inside of the power supply housing. The provision of a plurality of heat dissipation fins and a plurality of heat dissipation holes can increase the contact area between the heat dissipation surface of the semiconductor refrigeration plate and the air, thereby improving the heat dissipation efficiency. The hot air generated by the heat dissipation surface of the semiconductor refrigeration plate is quickly discharged by the heat dissipation fan. By providing a plurality of telescopic rods, a plurality of buffer springs and two dampers between the radiator and the power supply housing, the vibration generated by the radiator during operation can be slowed down, thereby reducing the working noise of the radiator.

[0007] Preferably, the heat dissipation surface of the semiconductor refrigeration plate is fixedly provided with a plurality of evenly distributed heat dissipation fins, and a plurality of heat dissipation holes are opened at the top of the plurality of heat dissipation fins. The arrangement of the plurality of heat dissipation fins and the plurality of heat dissipation holes can increase the contact area between the heat dissipation surface of the semiconductor refrigeration plate and the air, thereby improving the heat dissipation efficiency.

[0008] Preferably, the heat dissipation fan is arranged corresponding to the heat dissipation surface of the semiconductor refrigeration plate, and the hot air generated by the heat dissipation surface of the semiconductor refrigeration plate is quickly discharged through the heat dissipation fan.

[0009] Preferably, a ventilation window is provided on one side of the power supply housing, and a dust screen is fixedly provided inside the ventilation window. The provision of the ventilation window facilitates ventilation and heat dissipation inside the power supply housing.

[0010] Preferably, a heat dissipation window is provided at the top of the power supply housing, and a dustproof net is fixedly provided inside the heat dissipation window, so that the hot air can be quickly discharged through the provision of the heat dissipation window.

[0011] Preferably, a socket is fixedly provided on the top of the front side of the power supply housing, and a plurality of plug interfaces are provided on the surface of the socket, so that various plugs can be plugged in conveniently through the provision of the socket.

[0012] Preferably, a plurality of first threaded holes are provided in the middle of the bottom ends of the two mounting bars, and fixing bolts are threadedly arranged inside the plurality of first threaded holes. A plurality of second threaded holes are provided at the connection between the power supply housing and the two mounting bars, and the plurality of fixing bolts are respectively threadedly connected to the plurality of second threaded holes. By loosening the plurality of fixing bolts, they can be separated from the plurality of second threaded holes, thereby facilitating disassembly and maintenance of the radiator structure.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows: the radiator cools the air on the cooling surface of the semiconductor refrigeration plate by energizing the semiconductor refrigeration plate, thereby cooling the interior of the power supply housing; the provision of a plurality of heat dissipation fins and a plurality of heat dissipation holes can increase the contact area between the heat dissipation surface of the semiconductor refrigeration plate and the air, thereby improving the heat dissipation efficiency; the hot air generated by the heat dissipation surface of the semiconductor refrigeration plate is quickly discharged by the heat dissipation fan; and a plurality of telescopic rods, a plurality of buffer springs and two dampers are provided between the radiator and the power supply housing, so that the vibration generated by the radiator during operation can be slowed down, thereby reducing the working noise of the radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional diagram of the utility model;

[0015] Figure 2 It is a partial front cross-sectional view of the utility model;

[0016] Figure 3 It is an enlarged view of the local structure of the utility model;

[0017] Figure 4 It is an enlarged view of part A of the utility model.

[0018] In the figure: 1. power supply housing; 2. mounting strip; 3. semiconductor cooling sheet; 4. heat dissipation fin; 5. heat dissipation hole; 6. mounting frame; 7. heat dissipation fan; 8. ventilation window; 9. dust screen; 10. connecting strip; 11. first support rod; 12. damper; 13. second support rod; 14. telescopic rod; 15. buffer spring; 16. first threaded hole; 17. fixing bolt; 18. second threaded hole; 19. socket; 20. heat dissipation window; 21. dust screen. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0020] See also Figure 1-4 The utility model provides a new type of heat sink used in a power supply, including a power supply housing 1, mounting bars 2 are arranged on both sides of the top of the inner wall of the power supply housing 1, a plurality of telescopic rods 14 and a plurality of buffer springs 15 are fixedly arranged on one side of the bottom of the two mounting bars 2, the plurality of buffer springs 15 are respectively sleeved on the surface of the plurality of telescopic rods 14, a connecting bar 10 is fixedly arranged on the bottom between the plurality of telescopic rods 14 and the plurality of buffer springs 15 on the same side, a semiconductor cooling sheet 3 is fixedly arranged between the two connecting bars 10, mounting frames 6 are fixedly arranged on both sides of the top of the semiconductor cooling sheet 3, a cooling fan 7 is fixedly installed on the top between the two mounting frames 6, a first support rod 11 is fixedly arranged on one side of the top of the two connecting bars 10, and the tops of the two first support rods 11 Both are fixedly connected with a damper 12, and the top ends of the two dampers 12 are fixedly connected with a second support rod 13, and the two second support rods 13 are respectively fixedly connected to the two mounting bars 2. The radiator cools the air on the cooling surface of the semiconductor cooling plate 3 by energizing the semiconductor cooling plate 3, thereby cooling the interior of the power supply housing 1. The provision of a plurality of heat dissipation fins 4 and a plurality of heat dissipation holes 5 can increase the contact area between the heat dissipation surface of the semiconductor cooling plate 3 and the air, thereby improving the heat dissipation efficiency. The hot air generated by the heat dissipation surface of the semiconductor cooling plate 3 is quickly discharged through the heat dissipation fan 7. By providing a plurality of telescopic rods 14, a plurality of buffer springs 15 and two dampers 12 between the radiator and the power supply housing 1, the vibration generated by the radiator during operation can be reduced, thereby reducing the working noise of the radiator.

[0021] The heat dissipation surface of the semiconductor cooling sheet 3 is fixedly provided with a plurality of evenly distributed heat dissipation fins 4, and the tops of the plurality of heat dissipation fins 4 are provided with a plurality of heat dissipation holes 5. A heat dissipation fan 7 is provided corresponding to the heat dissipation surface of the semiconductor cooling sheet 3. A ventilation window 8 is provided on one side of the power supply housing 1, and a dust screen 9 is fixedly provided inside the ventilation window 8.

[0022] When in use, the arrangement of a plurality of heat dissipation fins 4 and a plurality of heat dissipation holes 5 can increase the contact area between the heat dissipation surface of the semiconductor cooling plate 3 and the air, thereby improving the heat dissipation efficiency. The heat dissipation fan 7 quickly guides out the hot air generated by the heat dissipation surface of the semiconductor cooling plate 3, and the arrangement of the ventilation window 8 facilitates ventilation and heat dissipation inside the power supply housing 1.

[0023] A heat dissipation window 20 is provided at the top of the power supply housing 1, and a dustproof net 21 is fixedly provided inside the heat dissipation window 20. A socket 19 is fixedly provided at the top of the front of the power supply housing 1, and a plurality of plug interfaces are provided on the surface of the socket 19. A plurality of first threaded holes 16 are provided in the middle of the bottom ends of the two mounting bars 2, and a plurality of fixing bolts 17 are threadedly provided inside the plurality of first threaded holes 16. A plurality of second threaded holes 18 are provided at the connection between the power supply housing 1 and the two mounting bars 2, and a plurality of fixing bolts 17 are threadedly connected with the plurality of second threaded holes 18 respectively.

[0024] When in use, the heat dissipation window 20 facilitates the rapid discharge of hot air, and the socket 19 facilitates the connection of various plugs. By loosening a plurality of fixing bolts 17 and separating them from a plurality of second threaded holes 18, the radiator structure can be easily disassembled and maintained.

[0025] When the embodiment of the present application is in use: the radiator cools the air on the cooling surface of the semiconductor refrigeration plate 3 by energizing the semiconductor refrigeration plate 3, thereby cooling the interior of the power supply housing 1; the provision of a plurality of heat dissipation fins 4 and a plurality of heat dissipation holes 5 can increase the contact area between the heat dissipation surface of the semiconductor refrigeration plate 3 and the air, thereby improving the heat dissipation efficiency; the hot air generated by the heat dissipation surface of the semiconductor refrigeration plate 3 is quickly discharged by the heat dissipation fan 7; by providing a plurality of telescopic rods 14, a plurality of buffer springs 15 and two dampers 12 between the radiator and the power supply housing 1, the vibration generated during the operation of the radiator can be reduced, thereby reducing the working noise of the radiator; by loosening a plurality of fixing bolts 17, they are separated from a plurality of second threaded holes 18, thereby facilitating the disassembly and maintenance of the radiator structure.

[0026] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A novel heat sink for a power supply, comprising a power supply housing (1), characterized in that: Mounting bars (2) are provided on both sides of the top of the inner wall of the power supply housing (1); a plurality of telescopic rods (14) and a plurality of buffer springs (15) are fixedly provided on one side of the bottom of the two mounting bars (2); the plurality of buffer springs (15) are respectively sleeved on the surface of the plurality of telescopic rods (14); a connecting bar (10) is fixedly provided on the bottom between the plurality of telescopic rods (14) and the plurality of buffer springs (15) on the same side; a semiconductor cooling plate (3) is fixedly provided between the two connecting bars (10); mounting frames (6) are fixedly provided on both sides of the top of the semiconductor cooling plate (3); a cooling fan (7) is fixedly provided on the top between the two mounting frames (6); a first support rod (11) is fixedly provided on one side of the top of the two connecting bars (10); the tops of the two first support rods (11) are fixedly connected to dampers (12); the tops of the two dampers (12) are fixedly connected to second support rods (13); and the two second support rods (13) are respectively fixedly connected to the two mounting bars (2).

2. The novel heat sink for power supply according to claim 1, characterized in that: A plurality of evenly distributed heat dissipation fins (4) are fixedly disposed on the heat dissipation surface of the semiconductor cooling plate (3), and a plurality of heat dissipation holes (5) are provided at the top ends of the plurality of heat dissipation fins (4).

3. The novel heat sink for power supply according to claim 1, characterized in that: The heat dissipation fan (7) is arranged corresponding to the heat dissipation surface of the semiconductor refrigeration sheet (3).

4. The novel heat sink for power supply according to claim 1, characterized in that: A ventilation window (8) is provided on one side of the power supply housing (1), and a dust-proof net (9) is fixedly arranged inside the ventilation window (8).

5. The novel heat sink for power supply according to claim 1, characterized in that: A heat dissipation window (20) is provided at the top of the power supply housing (1), and a dustproof net (21) is fixedly arranged inside the heat dissipation window (20).

6. The novel heat sink for power supply according to claim 1, characterized in that: A socket (19) is fixedly arranged on the top of the front face of the power supply housing (1), and a plurality of sockets are provided on the surface of the socket (19).

7. The novel heat sink for power supply according to claim 1, characterized in that: A plurality of first threaded holes (16) are provided in the middle of the bottom ends of the two mounting bars (2), and fixing bolts (17) are threadedly provided inside the plurality of first threaded holes (16). A plurality of second threaded holes (18) are provided at the connection between the power supply housing (1) and the two mounting bars (2), and the plurality of fixing bolts (17) are respectively threadedly connected to the plurality of second threaded holes (18).

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