Correcting tool for wafer measuring machine

Abstract

The utility model discloses a wafer measuring machine table correction tool which comprises a sapphire wafer, the diameter of the sapphire wafer is 100 mm, the length of a single flat edge of the sapphire wafer is 34 mm, the sapphire wafer is provided with a positioning surface, the center position of the positioning surface is provided with a circular positioning original point with the diameter being 1 mm, and the diameter of the circular positioning original point is 1 mm. A plurality of first auxiliary positioning circular rings are arranged on the outer side of the positioning original point at intervals of 2 mm, and the width of each first auxiliary positioning circular ring is 1 mm. According to the wafer measuring machine table correction tool, center alignment can be conveniently and accurately carried out in the wafer machining process, the wafer machining machine table is corrected, and badness caused by center alignment errors in the wafer machining process can be effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer measuring machine auxiliary equipment, in particular to a wafer measuring machine calibration tool. Background Art

[0002] In the semiconductor manufacturing process, most of the processing of semiconductor wafers (including sapphire wafers, silicon wafers, silicon carbide wafers, etc.) is completed by fully automatic machines for wafer coating, exposure, development, coating, etching and measurement after each process.

[0003] Among them, in the process of automatic machine processing wafers (such as coating, exposure, development, etc.), the precise positioning of the wafer placement is particularly important, including whether it is placed in the middle. The deviation will cause process abnormalities. For example, when applying glue, the nozzle is not in the middle, resulting in uneven glue coating.

[0004] Among them, the wafer measurement process of automatic measurement equipment (such as film thickness meter, AOI, AFM, etc.) also requires strict positioning of the wafer position, including not only whether the center position is centered, but also precise alignment of different measurement points to ensure that the measurement position of each piece meets the design requirements.

[0005] Currently, when processing machines and measuring machines align wafers, they generally use online wafer visual alignment or manually draw the center on the wafer for alignment. This alignment method often has errors in the visual or hand-drawn center point, resulting in problems such as the wafer cannot be completely centered or the measurement point is not correct. Utility Model Content

[0006] The embodiment of the present application provides a wafer measurement machine calibration tool, which can conveniently and accurately perform center alignment during the wafer processing process, calibrate the wafer processing machine, and can effectively reduce the defects caused by center alignment errors during the wafer processing process.

[0007] An embodiment of the present application provides a wafer measurement machine calibration tool, including a sapphire wafer, the diameter of the sapphire wafer is 100 mm, and the length of a single flat edge of the sapphire wafer is 34 mm, the sapphire wafer has a positioning surface, a circular positioning origin with a diameter of 1 mm is arranged at the center of the positioning surface, and a plurality of first auxiliary positioning rings are arranged on the outside of the positioning origin at intervals of 2 mm, and the width of the first auxiliary positioning ring is 1 mm.

[0008] In a possible implementation, the number of the first auxiliary positioning rings is 2-4.

[0009] In a possible implementation, a plurality of full-surface positioning rings are arranged at intervals of 12.5 mm outside the positioning origin, and the width of the full-surface positioning rings is 0.5 mm.

[0010] In a possible implementation, the entire surface of the positioning ring has 2-4 rings.

[0011] In a possible implementation, the sapphire wafer is also provided with a light spot positioning line on the positioning surface, the light spot positioning line passes through the center of the positioning surface and is distributed at 45° intervals from each other, the width of the light spot positioning line is 0.5 mm, and light spot positioning points are respectively provided on the light spot positioning line at the radial 1 / 2 position and 1 / 4 position passing through the center of the circle, and the light spot positioning points are dots with a diameter of 1 mm.

[0012] In a possible implementation, the sapphire wafer is also provided with four edge positioning points 2 mm close to the edge of the positioning surface. The diameter of the edge positioning points is 1 mm. The edge positioning points are distributed in a cross shape on the positioning surface and pass through the center of the positioning surface. One of the edge positioning points is located at the center of the single flat edge.

[0013] In a possible implementation, a plurality of second auxiliary positioning rings are arranged at intervals of 2 mm on the outside of the edge positioning point, and the width of the second auxiliary positioning rings is 1 mm.

[0014] In a possible implementation manner, the positioning surface is a polished surface.

[0015] Beneficial effects: Compared with the prior art, the wafer measurement machine calibration tool provided by the present application sets a circular positioning origin on the positioning surface of the sapphire wafer, and sets a plurality of first auxiliary positioning rings on the outside of the circular positioning origin, so that the center alignment can be conveniently and accurately performed during the wafer processing process, and the wafer processing machine can be calibrated to confirm the size of the placement offset. When the position is not correct, the offset direction and distance can be determined according to the corresponding scale line, and the center alignment can be completed by setting the corresponding distance coordinate in the opposite direction.

[0016] During the wafer processing, the whole surface positioning ring can be used to assist in calibrating the wafer processing machine;

[0017] The spot positioning lines and spot positioning points on the positioning surface can meet the precise alignment of different wafer measurement machines to different measurement points during the measurement process, ensure the repeatability and consistency of the measurement of different points during the wafer measurement process, and assist in calibrating the wafer measurement machine;

[0018] The edge positioning point and the second auxiliary positioning ring can assist in the alignment of the measurement position during the measurement process, and facilitate quick adjustment of the position when it is offset, thereby facilitating the calibration of the wafer measurement machine.

[0019] These and other purposes, features and advantages of the present invention are fully reflected in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 The schematic diagram of the structure of the wafer measurement machine calibration tooling of the present application is shown. DETAILED DESCRIPTION

[0021] The following description is used to disclose the utility model so that those skilled in the art can implement the utility model. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the utility model defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the utility model.

[0022] Those skilled in the art should understand that, in the disclosure of the specification, the orientation or position relationship indicated by the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0023] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0024] refer to Figure 1The embodiment of the present application provides a wafer measurement machine calibration tool, including a sapphire wafer 10, wherein the diameter of the sapphire wafer is 100mm, and the length of a single flat edge 101 of the sapphire wafer 10 is 34mm. In addition, the sapphire wafer 10 has a positioning surface. For ease of use, the positioning plane is polished to form a polished smooth surface. A circular positioning origin 11 with a diameter of 1mm is provided at the center of the positioning surface, and a plurality of first auxiliary positioning rings 12 are provided at intervals of 2mm on the outside of the positioning origin 11, and the width of the first auxiliary positioning ring 12 is 1mm. In this way, the sapphire wafer with a pre-designed positioning origin can be used to conveniently and accurately perform center alignment during the wafer processing process, assist in calibrating the wafer processing machine, and reduce the defects caused by the center alignment error during the wafer processing process.

[0025] The sapphire wafer 10 is made by drawing the corresponding mask and performing the wafer gluing, exposure, development, etching, and degumming processes. When it is necessary to perform center alignment on a wafer processing machine (such as a coater, developer, etc.), the sapphire wafer 10 is placed in the Cassette, and the sapphire wafer is transferred to the position to be positioned, such as a spindle or a hot plate, by an arm, and the center alignment standard is observed to see whether it coincides with the center position of the spindle or the hot plate. If it does not coincide, the offset direction and distance are determined according to the scale lines on the sapphire wafer, and the center alignment can be completed by setting the corresponding distance coordinates in the opposite direction, which can assist in calibrating the wafer processing machine.

[0026] In one embodiment, the number of the first auxiliary positioning rings 12 is 2-4.

[0027] In one embodiment, a plurality of full-surface positioning rings 13 are arranged at intervals of 12.5 mm on the outside of the positioning origin 11, wherein the full-surface positioning rings 13 have 2-4 lines, and the width of the full-surface positioning rings 13 is 0.5 mm. Therefore, during the wafer processing, the full-surface positioning rings 13 can be used to assist in the correction of the wafer processing machine.

[0028] In one embodiment, the sapphire wafer 10 is further provided with a spot positioning line 14 on the positioning surface, wherein the spot positioning line 14 passes through the center of the positioning surface and is distributed at an interval of 45°. At the same time, the width of the spot positioning line 14 is 0.5 mm. In addition, the spot positioning line 14 is provided with a spot positioning point 15 at the radial 1 / 2 position and 1 / 4 position passing through the center of the circle, respectively, and the spot positioning point 15 is a circular dot with a diameter of 1 mm. Therefore, the wafer measuring machine can be calibrated by the spot positioning line 14 and the spot positioning point 15 to meet the precise positioning of different measuring points by different wafer measuring machines, thereby ensuring the repeatability and consistency of the measurement of different points.

[0029] When the measuring point of the wafer measurement machine (such as film thickness gauge, AFM, AOI, etc.) needs to be adjusted, the sapphire wafer is transferred to the Stage through the transmission arm, and the Stage is moved in sequence to align the measuring spot with the position on the sapphire wafer 10, such as the 1 / 2 or 1 / 4 position on the usual 45° spot positioning line, etc., and the coordinates of the alignment position are obtained for setting.

[0030] Taking into account that during measurement, the four edge positioning points of the sapphire wafer 10 that are 2 mm away from the edge may also be aligned, it is further preferred that the sapphire wafer 10 is also provided with four edge positioning points 16 on the positioning surface 2 mm close to the edge, wherein the diameter of the edge positioning point 16 is 1 mm, and the edge positioning points 16 are distributed in a cross shape on the positioning surface and pass through the center of the positioning surface, and one of the edge positioning points 16 is located at the center of the single flat edge 101.

[0031] Further preferably, a plurality of second auxiliary positioning rings 17 are arranged on the outside of the edge positioning point 16 at intervals of 2 mm, such as 2-4 second auxiliary positioning rings 17, and the width of the second auxiliary positioning ring 17 is 1 mm, so that the size of the placement offset can be conveniently and accurately confirmed, which is convenient for calibrating the measuring machine.

[0032] It should be noted that the terms "first, second" in the present application are only used for descriptive purposes and do not indicate any order. They cannot be understood as indicating or implying relative importance. These terms can be interpreted as names.

[0033] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The advantages of the present invention have been fully and effectively realized. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. Wafer measurement machine calibration tool, characterized in that: It includes a sapphire wafer, the diameter of the sapphire wafer is 100 mm, and the length of a single flat side of the sapphire wafer is 34 mm, the sapphire wafer has a positioning surface, a circular positioning origin with a diameter of 1 mm is arranged at the center of the positioning surface, and a plurality of first auxiliary positioning rings are arranged at intervals of 2 mm on the outside of the positioning origin, and the width of the first auxiliary positioning ring is 1 mm.

2. The wafer measurement machine calibration tool as claimed in claim 1, characterized in that: The number of the first auxiliary positioning rings is 2-4.

3. The wafer measurement machine calibration tool as claimed in claim 1, characterized in that: A plurality of full-surface positioning rings are arranged at intervals of 12.5 mm on the outside of the positioning origin, and the width of the full-surface positioning rings is 0.5 mm.

4. The wafer measurement machine calibration tool as claimed in claim 3, characterized in that: The whole surface positioning ring has 2-4 rings.

5. The wafer measurement machine calibration tool as claimed in claim 1, characterized in that: The sapphire wafer is also provided with a light spot positioning line on the positioning surface, the light spot positioning line passes through the center of the positioning surface and is distributed at 45° intervals, the width of the light spot positioning line is 0.5 mm, and light spot positioning points are respectively provided at the radial 1 / 2 position and 1 / 4 position passing through the center of the circle on the light spot positioning line, and the light spot positioning points are dots with a diameter of 1 mm.

6. The wafer measurement machine calibration tool as claimed in claim 5, characterized in that: The sapphire wafer is also provided with four edge positioning points on the positioning surface 2 mm close to the edge. The diameter of the edge positioning points is 1 mm. The edge positioning points are distributed in a cross shape on the positioning surface and pass through the center of the positioning surface. One of the edge positioning points is located at the center of the single flat edge.

7. The wafer measurement machine calibration tool as claimed in claim 6, characterized in that: A plurality of second auxiliary positioning rings are arranged at intervals of 2 mm on the outside of the edge positioning point, and the width of the second auxiliary positioning rings is 1 mm.

8. The wafer measurement machine calibration tool as claimed in claim 1, characterized in that: The positioning surface is a polished surface.

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