Three-dimensional wave absorber and electronic equipment

Abstract

The utility model discloses a three-dimensional wave absorber and electronic equipment, and relates to the technical field of metamaterial wave absorbers, and the three-dimensional wave absorber comprises a substrate which is provided with a first surface and a second surface which are opposite to each other; the horizontal wave absorbing structure is arranged on the first surface and is provided with a plurality of first wave absorbing units; the bearing plate is fixed on the first surface between the first wave absorbing units; the side wall, perpendicular to the substrate, of the bearing plate is provided with a vertical wave-absorbing structure, and the vertical wave-absorbing structure is provided with a plurality of second wave-absorbing units. The pattern structure of the first wave absorbing unit is different from that of the second wave absorbing unit. According to the technical scheme, the three-dimensional wave absorbing body can be formed based on the horizontal wave absorbing structure and the vertical wave absorbing structure, compared with a two-dimensional wave absorbing body, the three-dimensional wave absorbing body has the wide absorption bandwidth and the high absorption rate, the performance of the three-dimensional wave absorbing body can be optimized by adjusting the graph structure of the wave absorbing unit, the angle stability is improved, and the wave absorbing effect is improved. And wave absorption in a relatively high bandwidth range is realized.

Description

Technical Field

[0001] The present application relates to the technical field of metamaterial absorbers, and more specifically, to a three-dimensional absorber and an electronic device. Background Art

[0002] Metamaterial absorbers are one of the important application areas of metamaterials. Their working principle is mainly to use the resonant loss of their own structure to absorb electromagnetic waves, convert electromagnetic energy into other forms of energy such as heat energy for dissipation, thereby achieving the loss of electromagnetic waves.

[0003] At present, metamaterial absorbers can be divided into dielectric loss absorbers and ohmic loss absorbers according to different loss mechanisms. Conventional dielectric loss absorbers are mostly two-dimensional structures, with narrow absorption bandwidth and low absorption rate. Utility Model Content

[0004] In view of this, the present application provides a three-dimensional absorber and an electronic device, and the scheme is as follows:

[0005] A three-dimensional wave absorbing body, comprising:

[0006] a substrate having a first surface and a second surface opposite to each other;

[0007] A horizontal wave absorbing structure is arranged on the first surface, wherein the horizontal wave absorbing structure has a plurality of first wave absorbing units;

[0008] A carrying plate, the carrying plate is fixed on the first surface between the first absorbing units; the carrying plate has a vertical absorbing structure on the side wall perpendicular to the substrate, and the vertical absorbing structure has a plurality of second absorbing units; the graphic structure of the first absorbing unit is different from the graphic structure of the second absorbing unit.

[0009] Optionally, in the above three-dimensional absorbing body, the horizontal absorbing structure includes a plurality of first absorbing units arranged in an array;

[0010] The carrier plate has a first baffle and a second baffle arranged crosswise to divide the first surface into a plurality of grid areas, each of which has m rows×n columns of first absorbing units; wherein m and n are both positive integers, and at least one of them is greater than 1.

[0011] Optionally, in the above three-dimensional absorbing body, the grid area has 4 first absorbing units, and m=n=2.

[0012] Optionally, in the above three-dimensional absorbing body, the first baffle extends based on the row direction of the array; two opposite side walls of the first baffle are provided with a plurality of second absorbing units, and the second absorbing units on the same side wall of the first baffle are provided in one-to-one correspondence with a row of first absorbing units;

[0013] The second baffle extends based on the column direction of the array; two opposite side walls of the second baffle are each provided with a plurality of second absorbing units, and the second absorbing units on the same side wall of the second baffle are provided in one-to-one correspondence with a column of first absorbing units.

[0014] Optionally, in the above three-dimensional wave absorbing body, the first wave absorbing unit is a resonant ring with an opening;

[0015] The second wave absorbing unit is a closed resonant ring.

[0016] Optionally, in the above three-dimensional absorbing body, the first absorbing unit is a first rectangular metal frame arranged on the first surface, and two opposite vertex corners of the first rectangular metal frame are respectively provided with an opening to divide the first rectangular metal frame into two parts that are centrally symmetrical to each other.

[0017] Optionally, in the above three-dimensional absorbing body, the second absorbing unit is a second rectangular metal frame arranged on the side wall of the carrying plate.

[0018] Optionally, in the above three-dimensional absorber, the substrate comprises: a first dielectric substrate layer and a second dielectric substrate layer stacked in layers; a surface of the second dielectric substrate layer facing away from the first dielectric substrate layer is the first surface;

[0019] The first dielectric substrate layer and the second dielectric substrate layer have different dielectric losses.

[0020] Optionally, in the above three-dimensional absorbing body, an electromagnetic wave reflecting layer is also provided on the second surface.

[0021] The present application also provides an electronic device, comprising any of the three-dimensional absorbers described above.

[0022] It can be seen from the above description that in the technical solution of the present application, a horizontal absorber structure and a supporting plate are arranged on the first surface of the substrate, and a vertical absorber structure is provided on the side wall of the supporting plate perpendicular to the substrate. The horizontal absorber structure has a plurality of first absorbing units, and the vertical absorber structure has a plurality of second absorbing units. A three-dimensional absorber can be formed based on the horizontal absorbing structure and the vertical absorbing structure. Compared with a two-dimensional absorber, the three-dimensional absorber has a wider absorption bandwidth and a higher absorption rate.

[0023] Furthermore, since the first absorbing unit and the second absorbing unit have different graphic structures, the performance of the three-dimensional absorbing body can be optimized by adjusting the graphic structures of the first absorbing unit and the second absorbing unit, so that the three-dimensional absorbing body has good angular stability and achieves absorption within a higher bandwidth range. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0025] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which this application can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by this application, should still fall within the scope of the technical contents disclosed in this application.

[0026] Figure 1 A three-dimensional schematic diagram of a three-dimensional absorber provided in an embodiment of the present application;

[0027] Figure 2 for Figure 1 A partial top view of the three-dimensional absorber shown;

[0028] Figure 3 for Figure 1 A partial front view of the three-dimensional absorber shown;

[0029] Figure 4 A schematic diagram of a reflection coefficient curve of an absorber provided in an embodiment of the present application;

[0030] Figure 5 This is a graph showing the absorptivity of a three-dimensional absorber at different incident angles provided in an embodiment of the present application.

[0031] Reference numerals:

[0032] 1-electromagnetic wave reflecting layer; 2-first dielectric substrate layer; 3-second dielectric substrate layer; 4-first absorbing unit; 5-carrying plate; 51-first baffle plate; 52-second baffle plate; 6-second absorbing unit; 7-substrate. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the embodiments in the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0034] The traditional two-dimensional dielectric loss absorber usually adopts a "sandwich" absorber structure, which is a planar laminated structure formed by metal layer-dielectric layer-metal layer. Due to the limitations of its two-dimensional structure, it has performance defects such as narrow absorption bandwidth and poor angle stability. The angle of stable absorption of the two-dimensional absorber in the broadband range does not exceed 45°, which is difficult to meet specific engineering applications.

[0035] In view of the above problems, an embodiment provides a three-dimensional wave absorbing body, including:

[0036] a substrate having a first surface and a second surface opposite to each other;

[0037] A horizontal wave absorbing structure is arranged on the first surface, wherein the horizontal wave absorbing structure has a plurality of first wave absorbing units;

[0038] A carrying plate, the carrying plate is fixed on the first surface between the first absorbing units; the carrying plate has a vertical absorbing structure on the side wall perpendicular to the substrate, and the vertical absorbing structure has a plurality of second absorbing units; the graphic structure of the first absorbing unit is different from the graphic structure of the second absorbing unit.

[0039] Based on the above description, it can be known that in the technical solution of the embodiment of the present application, a horizontal absorber structure and a carrying plate are arranged on the first surface of the substrate, and a vertical absorber structure is provided on the side wall of the carrying plate perpendicular to the substrate. The horizontal absorber structure has a plurality of first absorbing units, and the vertical absorber structure has a plurality of second absorbing units. A three-dimensional absorber can be formed based on the horizontal absorbing structure and the vertical absorbing structure. Compared with a two-dimensional absorber, the three-dimensional absorber has a wider absorption bandwidth and a higher absorption rate.

[0040] Furthermore, since the first absorbing unit and the second absorbing unit have different graphic structures, the performance of the three-dimensional absorbing body can be optimized by adjusting the graphic structures of the first absorbing unit and the second absorbing unit, so that the three-dimensional absorbing body has good angular stability and achieves absorption within a higher bandwidth range.

[0041] The above is the core inventive concept of the embodiments of the present application. In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0042] refer to Figure 1-Figure 3 , Figure 1 A three-dimensional schematic diagram of a three-dimensional absorber provided in an embodiment of the present application, Figure 2 for Figure 1 A partial top view of the three-dimensional absorber shown in FIG. Figure 3 for Figure 1 The partial front view of the three-dimensional absorber shown, the three-dimensional absorber includes:

[0043] A substrate 7 having a first surface and a second surface opposite to each other;

[0044] A horizontal wave absorbing structure disposed on the first surface, wherein the horizontal wave absorbing structure has a plurality of first wave absorbing units 4;

[0045] The supporting plate 5 is fixed on the first surface between the first absorbing units 4; the supporting plate 5 has a vertical absorbing structure on the side wall perpendicular to the substrate 7, and the vertical absorbing structure has a plurality of second absorbing units 6; the graphic structure of the first absorbing unit 4 is different from the graphic structure of the second absorbing unit 6.

[0046] Among them, the horizontal absorbing structure and the vertical absorbing structure on the surface of the substrate 7 are both periodic structures, so the three-dimensional absorber is a metamaterial absorber with an artificial periodic structure, which can absorb and regulate electromagnetic waves through the periodic three-dimensional structure composed of the horizontal absorber structure and the vertical absorber structure.

[0047] In the three-dimensional absorber provided in the embodiment of the present application, a horizontal absorber structure and a supporting plate 5 are arranged on the first surface of the substrate 7. The supporting plate 5 has a vertical absorber structure on the side wall perpendicular to the substrate 7. The horizontal absorber structure has a plurality of first absorber units 4, and the vertical absorber structure has a plurality of second absorber units 6. A three-dimensional three-dimensional absorber can be formed based on the horizontal absorber structure and the vertical absorber structure. Compared with the two-dimensional absorber, the three-dimensional absorber has a wider absorption bandwidth and a higher absorption rate.

[0048] Furthermore, in the three-dimensional absorbing body provided in the embodiment of the present application, the performance of the three-dimensional absorbing body can be optimized by adjusting the graphic structure of the first absorbing unit 4 and the second absorbing unit 6, so that the three-dimensional absorbing body has good angular stability and achieves absorption within a higher bandwidth range.

[0049] The first wave absorbing unit 4 and the second wave absorbing unit 6 serve as resonant structures and can perform conductor loss on electromagnetic waves of a certain frequency and convert them into heat energy, thereby achieving the purpose of wave absorption.

[0050] Furthermore, in the embodiment of the present application, the first absorbing unit 4 and the second absorbing unit 6 are provided with different graphic structures. By adjusting the graphic structures of the first absorbing unit 4 and the second absorbing unit 6, the performance of the three-dimensional absorbing body can be optimized, so that the three-dimensional absorbing body has good angular stability and achieves absorption within a higher bandwidth range.

[0051] The horizontal absorbing structure includes a plurality of first absorbing units 4 arranged in an array; the supporting plate 5 has a first baffle 51 and a second baffle 52 arranged crosswise to divide the first surface into a plurality of grid areas, each grid area having m rows × n columns of first absorbing units 4; wherein m and n are both positive integers, and at least one of them is greater than 1.

[0052] Based on the supporting plate 5, the first surface can be divided into a plurality of grid areas, each of which has m rows×n columns of first absorbing units 4. By adjusting the values ​​of m and n of the first absorbing units 4 in each grid area, the performance of the three-dimensional absorbing body can be adjusted, which facilitates the optimization design of the performance of the three-dimensional absorbing body.

[0053] Optionally, in the three-dimensional wave absorbing body, the grid area may be set to have four first wave absorbing units, and m=n=2. In this way, the three-dimensional wave absorbing body may include a plurality of first wave absorbing units. Figure 2 In the periodic structure shown, the first baffle 51 and the second baffle 52 in the support plate 5 can isolate the four first absorbing units 4 distributed in 2 rows×2 columns at the intersection position, and make each grid area have 2 rows×2 columns of first absorbing units 4 located in the same area.

[0054] In the embodiment of the present application, the plurality of first absorbing units 4 in the same grid area are a graphical structure that is centrally symmetrical based on the midpoint position of the grid area. The support plate 5 is used to isolate the cross structure of the four first absorbing units 4 distributed in 2 rows × 2 columns and the second absorbing units 6 on its surface are centrally symmetrical based on the cross position.

[0055] The values ​​of m and n can be set based on the needs, without limitation Figure 1-Figure 2 As shown, m=n=2. In other implementations, m=n=1 may also be set. m and n may be set to any positive integers based on requirements, and the present application embodiment does not limit the values ​​of the two.

[0056] The supporting plate 5 is provided with a first baffle 51 and a second baffle 52 which are arranged crosswise, so that the supporting plate 5 includes a plurality of Figure 2 The cross-shaped bearing structure shown. Each cross-shaped structure in the bearing plate 5 can be integrally formed, or the bearing plate 5 is formed by bonding and fixing multiple cross-shaped structures. The bearing plate 5 with the required three-dimensional structure can be prepared by 3D printing technology or mechanical processing technology.

[0057] In one implementation of the embodiment of the present application, the first baffle 51 extends based on the row direction of the array; the two opposite side walls of the first baffle 51 are each provided with a plurality of second absorbing units 6, and the second absorbing units 6 on the same side wall of the first baffle 51 are arranged in a one-to-one correspondence with a row of first absorbing units 4; the second baffle 52 extends based on the column direction of the array; the two opposite side walls of the second baffle 52 are each provided with a plurality of second absorbing units 6, and the second absorbing units 6 on the same side wall of the second baffle 52 are arranged in a one-to-one correspondence with a column of first absorbing units 4.

[0058] like Figure 1 and Figure 2As shown, in the three-dimensional wave absorbing body, the first wave absorbing unit 4 is a resonant ring with an opening; the second wave absorbing unit 6 is a closed resonant ring. The horizontal wave absorbing structure absorbs waves based on the resonant ring with an opening, and the vertical wave absorbing structure absorbs waves based on the closed resonant ring. The two different resonant ring structures work together to optimize the wave absorbing effect.

[0059] In the embodiment of the present application, the first wave absorbing unit 4 is set as a first rectangular metal frame set on the first surface, and two opposite corners of the first rectangular metal frame are respectively provided with an opening to divide the first rectangular metal frame into two parts with mutually centrally symmetrical figures. For the first rectangular metal frame with an opening, by adjusting the size of the figure of the first metal frame, its horizontal wave absorbing effect can be optimized and adjusted.

[0060] In the embodiment of the present application, the second absorbing unit 6 is a second rectangular metal frame arranged on the side wall of the bearing plate. For the closed second rectangular metal frame, the vertical absorbing effect thereof can be optimized and adjusted by adjusting the graphic size of the second metal frame.

[0061] Optionally, the first rectangular metal frame with an opening and the closed second rectangular metal frame can both be square metal frames. The square metal frame structure is used to facilitate the adjustment of the graphic structure of the resonant ring and the optimization of the wave absorbing effect.

[0062] Optionally, the first rectangular metal frame and the second rectangular metal frame can be made of copper wire, which can be prepared by printing, etching, printing, or electroplating. The conductivity of the first absorbing unit 4 and the second absorbing unit 6 made of copper is 5.8·10 7 S / m, the thickness can be 0.017mm.

[0063] In one implementation of the embodiment of the present application, the substrate 7 includes: a first dielectric substrate layer 2 and a second dielectric substrate layer 3 which are stacked; a surface of the second dielectric substrate layer 3 which faces away from the first dielectric substrate layer 2 is a first surface; wherein the first dielectric substrate layer 2 and the second dielectric substrate layer 3 are made of different materials and have different dielectric losses.

[0064] The first dielectric substrate layer 2 can provide high-frequency dielectric loss, and the second dielectric substrate layer 3 and the carrier plate 5 can provide certain dielectric loss and structural strength.

[0065] Optionally, the first dielectric substrate layer 2 may be an ECCOSORB dielectric substrate layer, and further may be an ECCOSORB-BSRU1 dielectric substrate layer. ECCOSORB is a high-performance absorbing material with a volume resistivity of 2×10 8 Ohm-cm, which can provide high-frequency dielectric loss.

[0066] Among them, ECCOSORB absorbing materials are specially designed to solve electromagnetic compatibility problems. They absorb electromagnetic wave energy, reduce unnecessary reflections and interference, and thus improve the operating performance of electronic equipment. This material can be used in various high-frequency and high-temperature environments, such as power amplifiers, oscillators, and commercial telecommunications and automotive industries. In the embodiment of the present application, if the first dielectric substrate layer 2 is a dielectric substrate layer made of ECCOSORB material, the material is not limited to ECCOSORB-BSRU1, and can also be other types of materials in ECCOSORB.

[0067] In one implementation of the embodiment of the present application, the second dielectric substrate layer 3 and the carrier plate 5 can be set to be a plate of the same material. Optionally, the dielectric constant of the second dielectric substrate layer 3 and the carrier plate 5 can be 4.2, and the loss tangent can be 0.025. The second dielectric substrate layer 3 and the carrier plate 5 can be FR-4 plates, such as epoxy glass cloth laminates. The second dielectric substrate layer 3 and the carrier plate 5 can provide a certain dielectric loss and structural strength.

[0068] Among them, FR-4 is a flame retardant material grade code widely used in the manufacture of printed circuit boards (PCBs), and FR-4 board represents epoxy resin glass fiber laminated material with set flame retardant properties. FR-4 board has stable electrical insulation performance and excellent machinability, and is widely used in insulating structural components of electrical equipment. It is easy to know that in the three-dimensional absorber provided in the embodiment of the present application, the material of the bearing plate 5 can be set based on demand and is not limited to FR-4 board.

[0069] In other implementations, the second dielectric substrate layer 3 and the carrier plate 5 may also be dielectric plates made of different materials.

[0070] Optionally, in the three-dimensional wave absorbing body, the second surface is further provided with an electromagnetic wave reflecting layer 1. The electromagnetic wave reflecting layer 1 may be a copper foil layer with a conductivity of 5.8·10 7 The electromagnetic wave reflecting layer 1 can make the electromagnetic wave reflect multiple times in the substrate 7, thereby improving the wave absorbing effect of the substrate 7.

[0071] It should be noted that, in the embodiment of the present application, the first absorbing unit 4, the second absorbing unit 6 and the electromagnetic wave reflecting layer 1 are all copper structural parts. It is easy to know that metal structural parts of other materials, such as gold structural parts, can also be used. The embodiment of the present application does not limit the specific materials of the first absorbing unit 4, the second absorbing unit 6 and the electromagnetic wave reflecting layer 1.

[0072] If the base 7 is formed by stacking the first dielectric substrate layer 2 and the second dielectric substrate layer 3, and the electromagnetic wave reflection layer 1 is arranged on the second surface, a four-layer stacked structure can be formed in which the electromagnetic wave reflection layer 1, the first dielectric substrate layer 2, the second dielectric substrate layer 3 and the horizontal wave absorbing structure are stacked in sequence. Based on the periodically arranged first wave absorbing units 4 in the horizontal wave absorbing structure, the four-layer stacked structure can be used as a four-layer wave absorbing metamaterial to form a good horizontal wave absorbing effect. Combined with the periodically arranged second wave absorbing units 6 in the vertical wave absorbing structure, a good vertical wave absorbing effect can be formed.

[0073] It can be seen from the above description that in the embodiment of the present application, based on the periodically arranged first absorbing units 4 and the periodically arranged second absorbing units 6, a new three-dimensional metamaterial absorber can be formed to improve the absorption bandwidth and absorption rate.

[0074] In the three-dimensional absorber, the supporting plate 5 can form a plurality of first baffles 51 and second baffles 52 that intersect vertically. Figure 2 The three-dimensional vertically symmetrical periodic structure shown in FIG. Figure 2 In the area where the 2 rows × 2 columns of first absorbing units 4 are located, the overall graphic structure formed by the 4 first absorbing units and the 8 second absorbing units 6 on the side wall of the cross-type supporting plate 5 is symmetrical based on the axis of the vertical substrate 7, and the axis passes through the intersection of the first baffle 51 and the second baffle 52. After the three-dimensional vertically symmetrical periodic structure is rotated 180° based on the axis, the graphic structure coincides with that before the rotation.

[0075] Since the three-dimensional absorber has Figure 2 The three-dimensional vertically symmetrical periodic structure shown in the figure greatly enhances the angular stability of the three-dimensional absorber for absorbing electromagnetic waves, and can meet the angular stability of 60°. Moreover, the three-dimensional absorber, based on the periodic horizontal absorbing structure and the vertical absorbing structure, forms a new type of three-dimensional metamaterial. By optimizing the graphic design of the first absorbing unit 4 and the second absorbing unit 6, an absorption rate of more than 90% in the ultra-wideband range of 10GHz to 27GHz can be achieved.

[0076] The structure and technical effects of the three-dimensional wave absorbing body provided in the embodiment of the present application are further described below in conjunction with a three-dimensional wave absorbing body in an implementation manner.

[0077] The three-dimensional absorber has the following characteristics: Figure 2 In the three-dimensional vertically symmetrical periodic structure shown, the carrier plate 5 is a cross-shaped FR-4 plate in the area corresponding to the periodic structure, and the area can be divided into four sub-areas, each of which has a first absorbing unit 4.

[0078] The thickness of the cross-shaped FR-4 plate is t, that is, the thickness of the first baffle 51 and the second baffle 52 are both t.

[0079] The graphic structure of the first absorbing unit 4 in the same sub-region is symmetrical based on the center of the midpoint of the sub-region. The first absorbing unit 4 has two L-shaped copper wires, and the two L-shaped copper wires in the same first absorbing unit 4 are symmetrical based on the center of the midpoint of the first absorbing unit 4 to form a square resonant ring with an opening. The distance between the square resonant ring and the boundary of the sub-region is t 1 At the opening position, the distance between the two L-shaped copper wires is t 2 The length of the L-shaped copper wire on the row square is l 1 , the length in the column direction is l 2 .

[0080] Figure 2 The main view of the three-dimensional vertically symmetrical periodic structure is shown in Figure 3 As shown. The thickness of the first dielectric substrate layer 2 is h 2 , the thickness of the second dielectric substrate layer 3 is h 1 In a three-dimensional vertically symmetrical periodic structure, the width of the first dielectric substrate layer 2 and the second dielectric substrate layer 3 are both l. The height of the carrier plate 5 is h.

[0081] In a three-dimensional vertically symmetrical periodic structure, the side wall of the cross-shaped FR-4 plate is spatially divided into 8 surfaces, each of which is provided with a second absorbing unit 6. The second absorbing unit 6 is a square copper wire frame, the internal width of the frame is w, and the copper wire width is t. 3 .

[0082] The values ​​of the above-mentioned size parameters can be shown in Table 1 below.

[0083] Table 1

[0084]

[0085] The reflection coefficient curve of the three-dimensional absorber prepared based on the size parameters shown in Table 1 is as follows: Figure 4 Shown as the solid line curve.

[0086] refer to Figure 4 , Figure 4 A schematic diagram of a reflection coefficient curve of an absorber provided in an embodiment of the present application, Figure 4 The solid line curve represents the reflection coefficient curve of the three-dimensional absorber provided in the embodiment of the present application, and the dashed line curve represents the reflection coefficient curve of a conventional absorber based on pure ECCOSORB absorbing material.

[0087] based on Figure 4It can be seen that the three-dimensional absorber using the structure of the embodiment of the present application makes up for the defect of the ECCOSORB material in insufficient electromagnetic wave absorption in the mid-frequency part, and the reflection coefficient S11 of the three-dimensional absorber in the ultra-wide range of 10GHz~27GHz is lower than -10dB. It can be seen that the three-dimensional absorber provided by the embodiment of the present application has excellent electromagnetic wave absorption characteristics in the ultra-wideband frequency range of 10GHz~27GHz.

[0088] refer to Figure 5 , Figure 5 The absorption rate curve of a three-dimensional absorber provided in the embodiment of the present application at different incident angles. The incident angle is the angle between the incident direction of the electromagnetic wave and the normal line of the substrate 7. Figure 5 It can be seen that when the incident angle is 0°, the three-dimensional absorber can achieve an absorption rate of more than 90% for electromagnetic waves in the frequency range of 10GHz~27GHz. As the incident angle of the electromagnetic wave increases, at an incident angle of 45°, the three-dimensional absorber can still achieve an absorption rate of more than 80% for electromagnetic waves in the absorbing frequency band. When the incident angle increases to 60°, the average absorption rate of the three-dimensional absorber is also not less than 70%. Figure 5 It can be seen that the three-dimensional absorber provided in the embodiment of the present application has excellent angular stability.

[0089] From the above description, it can be seen that the three-dimensional absorber provided in the embodiment of the present application is a three-dimensional ultra-wideband angularly stable metamaterial absorber, which can achieve an absorption rate of more than 90% for electromagnetic waves in a bandwidth range of 10GHz to 27GHz at an incident angle of 0°. In the incident angle range of 0° to 60°, it can ensure an absorption rate of no less than 70% for electromagnetic waves, and has good angular stability.

[0090] It should be noted that, in the embodiment of the present application, the size parameters and materials of each structure in the three-dimensional absorber can be set according to the use requirements, the materials of each structure in the three-dimensional absorber are not limited to those in the embodiment of the present application, and the values ​​of the above-mentioned size parameters are not limited to the data in Table 1, and the ranges of the above-mentioned size parameters can be adjusted based on the performance requirements of the three-dimensional absorber. The data in Table 1 are only the values ​​in one embodiment of the present application, and are used to illustrate the technical effects of the three-dimensional absorber provided in the embodiment of the present application.

[0091] It is easy to know that under the inventive concept of the technical solution of the present application, the performance of the three-dimensional absorber can be adjusted by adjusting the values ​​of one or more parameters in Table 1. The embodiment of the present application does not limit the values ​​of the parameters in Table 1.

[0092] Based on the three-dimensional wave absorbing body provided in the above embodiments, another embodiment of the present application further provides an electronic device, and the electronic device includes the three-dimensional wave absorbing body provided in any implementation manner of the above embodiments.

[0093] The electronic device may be a communication device with a wireless communication function. By integrating the three-dimensional wave absorber provided in the above embodiment into the electronic device, the influence of the electromagnetic radiation of the electronic device on the user can be reduced, thereby reducing the harm of the electromagnetic radiation to the user.

[0094] Integrating three-dimensional absorbers into electronic devices can adjust the electromagnetic radiation characteristics and improve the EMC (electromagnetic compatibility) characteristics of electronic equipment.

[0095] Among them, the electronic device can be a tablet computer, a laptop computer, a mobile phone, a smart wearable device, etc.

[0096] In the embodiments of the present application, the three-dimensional absorber is not limited to being used for absorbing electromagnetic waves in electronic devices to reduce radiation hazards, but can also be used for stealth design of radars and antennas. The embodiments of the present application do not limit the application scenarios of the three-dimensional absorber and the implementation methods of the electronic devices.

[0097] In the specification of this application, each embodiment is described in a progressive, parallel, or progressive and parallel manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. The implementation methods provided in the embodiments of this application can be combined with each other if there is no contradiction.

[0098] It should be noted that in the description of the present application, it should be understood that the description of the drawings and embodiments is illustrative rather than restrictive. The same reference numerals throughout the embodiments of the specification identify the same structure. In addition, for the sake of understanding and ease of description, the drawings may exaggerate the thickness of some layers, films, panels, regions, etc. It is also understood that when an element such as a layer, film, region, or substrate is referred to as "on" another element, the element may be directly on the other element or there may be an intermediate element. In addition, "on" refers to positioning an element on or below another element, but does not essentially refer to positioning on the upper side of another element according to the direction of gravity.

[0099] The terms "upper", "lower", "top", "bottom", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0100] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that an article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or device. In the absence of further restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the article or device including the above elements.

[0101] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A three-dimensional absorber, characterized in that: include: a substrate having opposing first and second surfaces; A horizontal wave absorbing structure arranged on the first surface, wherein the horizontal wave absorbing structure has a plurality of first wave absorbing units; A carrying plate, wherein the carrying plate is fixed on the first surface between the first absorbing units; the carrying plate has a vertical absorbing structure on a side wall perpendicular to the substrate, and the vertical absorbing structure has a plurality of second absorbing units; the graphic structure of the first absorbing unit is different from the graphic structure of the second absorbing unit.

2. The three-dimensional absorber according to claim 1, characterized in that: The horizontal wave absorbing structure comprises a plurality of the first wave absorbing units arranged in an array; The supporting plate has a first baffle and a second baffle arranged crosswise to divide the first surface into a plurality of grid areas, each of which has m rows×n columns of first absorbing units; wherein m and n are both positive integers, and at least one of them is greater than 1.

3. The three-dimensional absorber according to claim 2, characterized in that: The grid area has four first absorbing units, and m=n=2.

4. The three-dimensional absorber according to claim 2, characterized in that: The first baffle extends based on the row direction of the array; two opposite side walls of the first baffle are each provided with a plurality of the second absorbing units, and the second absorbing units on the same side wall of the first baffle are provided in one-to-one correspondence with a row of the first absorbing units; The second baffle extends based on the column direction of the array; two opposite side walls of the second baffle are each provided with a plurality of the second absorbing units, and the second absorbing units on the same side wall of the second baffle are arranged in one-to-one correspondence with a column of first absorbing units.

5. The three-dimensional absorber according to claim 1, characterized in that: The first wave absorbing unit is a resonant ring with an opening; The second wave absorbing unit is a closed resonant ring.

6. The three-dimensional absorber according to claim 5, characterized in that: The first wave absorbing unit is a first rectangular metal frame arranged on the first surface, and two opposite vertex corners of the first rectangular metal frame are respectively provided with an opening to divide the first rectangular metal frame into two parts that are centrally symmetrical to each other.

7. The three-dimensional absorber according to claim 5, characterized in that: The second wave absorbing unit is a second rectangular metal frame arranged on the side wall of the carrying plate.

8. The three-dimensional absorber according to claim 1, characterized in that: The substrate comprises: a first dielectric substrate layer and a second dielectric substrate layer which are stacked; a surface of the second dielectric substrate layer which faces away from the first dielectric substrate layer is the first surface; The first dielectric substrate layer and the second dielectric substrate layer have different dielectric losses.

9. The three-dimensional absorber according to claim 1, characterized in that: The second surface is also provided with an electromagnetic wave reflecting layer.

10. An electronic device, characterized in that: It comprises the three-dimensional wave absorbing body as described in any one of claims 1 to 9.

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