Automatic scribing device for silicon rod cutting

Abstract

The utility model provides an automatic scribing device for silicon rod cutting. The monitoring mechanism comprises a plurality of monitors and is used for photographing the side surface and the top of the silicon rod; the scribing mechanism is provided with a scriber and a moving assembly used for controlling the position of the scriber; the monitor, the scriber and the moving assembly are all arranged on the machine frame. And the scriber can automatically scribe the silicon rod based on the scribing position identified by the monitor when the silicon rod is placed at a specified position on the rack. The automatic scribing device for silicon rod cutting is reasonable and simple in structural design, the positions of the end faces and the abutted seams of the silicon rods can be automatically recognized, scribing can be automatically conducted on the end faces and the abutted seams of the silicon rods, the scribing position is accurate, and cleaning is conducted; the overall working efficiency is high, the scribing quality is stable, and the accuracy and stability of follow-up slicing line net arrangement can be guaranteed.

Description

Technical Field

[0001] This application belongs to the technical field of silicon rod splicing, and particularly relates to an automatic scribing device for silicon rod cutting. Background Art

[0002] Before slicing, the end face of the silicon rod needs to be spun cut. At the same time, for silicon rods with non-standard lengths, they need to be spliced first and then sliced, and spin cutting is also required at the seam position. Whether it is the end face of the silicon rod or the seam, a certain width of silicon wafers needs to be reserved, that is, thick wafers are spun cut at the head and tail of the silicon rod to ensure the stability of the diamond wire operation and the cutting quality of the silicon wafers.

[0003] Existing spin cutting and scribing are all manually operated. Measurements and scribing are carried out in advance at the seam or end face of the silicon rod with the help of a gauge. However, this method depends on the proficiency of the operator; moreover, this manual scribing method not only has low efficiency but also low scribing accuracy and poor stability, resulting in a high waste rate in slicing, serious waste, and directly affecting the slicing quality. Summary of the Invention

[0004] This application provides an automatic scribing device for silicon rod cutting, which solves the technical problems in the prior art that manual scribing leads to low scribing accuracy and directly affects the slicing quality and slicing efficiency.

[0005] To solve at least one of the above technical problems, the technical solution adopted in this application is:

[0006] An automatic scribing device for silicon rod cutting, comprising:

[0007] A frame;

[0008] A monitoring mechanism, including several monitors, for taking pictures of the side and top of the silicon rod;

[0009] A scribing mechanism, which is provided with a scriber and a moving component for controlling the position of the scriber;

[0010] The monitor, the scriber, and the moving component are all arranged on the frame;

[0011] When the silicon rod is placed at a specified position on the frame, the scriber can automatically scribe the silicon rod based on the scribing position identified by the monitor.

[0012] Further, a roller belt for conveying the silicon rod is provided at the bottom of the frame, which can drive the silicon rod to roll along the length direction of the frame.

[0013] Further, in the middle of the roller belt, positioning blocks are arranged side by side. The positioning blocks are arranged along the width direction of the silicon rod, pass through the gaps of the roller belt and are driven by a motor placed below the roller belt to abut against the silicon rod and position it on the roller belt.

[0014] Further, the monitors are fixed on both side walls and the top of the frame through brackets; the monitors located on both side walls of the frame are symmetrically arranged on both sides of the silicon rod.

[0015] Further, the monitor located on the top of the frame is non-aligned with the monitors located on both side walls of the frame.

[0016] Further, the scribing mechanism is configured on a single side wall of the frame and is misaligned with the monitor on this side wall; it includes:

[0017] A fixing frame, arranged along the length direction of the frame, for supporting the moving component;

[0018] The moving component is provided with a translation group moving along the length direction of the frame, a transverse movement group moving along the width direction of the frame, and a longitudinal movement group moving along the height direction of the frame;

[0019] The translation group is directly connected to the fixing frame, and the transverse movement group is connected to the translation group, and the longitudinal movement group is connected to the transverse movement group;

[0020] The scriber is arranged at the lower end of the longitudinal movement group.

[0021] Further, the fixing frame is fixed on the side wall of the frame through several angle brackets, and the position of the fixing frame is higher than the position of the monitor arranged on the same side as it.

[0022] Further, the scriber is a laser head, which is connected to a laser generator located on the top of the frame.

[0023] Further, a control cabinet and an industrial control computer are also arranged on the top of the frame, and an alarm is also arranged on the upper end face of the control cabinet.

[0024] Further, a display is also equipped on the frame, and the scribing mechanism and the monitoring mechanism are both connected to the display through the control cabinet.

[0025] An automatic scribing device for silicon rod cutting designed by the present application has a reasonable and simple structure design, can automatically identify the positions of the end face and the joint of the silicon rod, and can automatically scribe lines on the end face and the joint of the silicon rod. The scribing position is accurate and clean; the overall working efficiency is high and the scribing quality is stable, which can ensure the accuracy and stability of the subsequent slicing wire mesh layout. Brief Description of the Drawings

[0026] Figure 1 is a perspective view of the scribing device in the present application;

[0027] Figure 2 is a side view of the scribing device in the present application;

[0028] Figure 3 is a bottom view of the scribing device in the present application;

[0029] Figure 4 is a top view of a partial structure of the scribing device in the present application;

[0030] Figure 5 is a side view of a partial structure of the scribing device from another angle in the present application;

[0031] Figure 6 is a schematic diagram of an unfolded two-dimensional image in the present application.

[0032] In the figure:

[0033] 10, frame; 11, roller belt; 12, positioning block

[0034] 13, motor; 20, monitoring mechanism; 21, monitor one

[0035] 22, monitor two; 30, scribing mechanism; 31, fixing frame

[0036] 32, scriber; 33, laser generator; 34, industrial control computer

[0037] 35, translation group; 36, transverse movement group; 37, longitudinal movement group

[0038] 40, control cabinet; 50, display; 60, silicon rod

[0039] 61, end; 62, seam; 63, defect Detailed Description of the Preferred Embodiment

[0040] The present application will be described in detail below with reference to the drawings and specific embodiments.

[0041] This embodiment provides an automatic scribing device for silicon rod cutting, as Figure 1As shown in the figure, it includes a frame 10, a monitoring mechanism 20 and a scribing mechanism 30 placed inside the frame, as well as a control cabinet 40 and a display 50 arranged outside the frame 10. Among them, a roller belt 11 for conveying a silicon rod 60 is provided at the bottom of the frame 10. The monitoring mechanism 20 is provided with a number of monitors, namely, a first monitor 21 for taking pictures and monitoring the side of the silicon rod and a second monitor 22 for taking pictures of the top of the silicon rod. The scribing mechanism 30 is provided with a scriber 32 and a moving component for controlling the position of the scriber 32; when the silicon rod 60 is placed at a specified position on the roller belt 11, the scriber 32 can automatically scribe the side surface of the silicon rod 60 based on the scribing position identified by the monitor and in accordance with the scribing standard.

[0042] As Figure 2-3 As shown in the figure, fixing plates are provided around the lower section of the frame 10, that is, both the monitoring mechanism 20 and the scribing mechanism 30 are fixedly arranged on the fixing plates on the side wall surface of the frame 10; several pairs of opening structures are provided in the upper section of the frame 10; the fixing plates and the opening doors are omitted in the drawings, and they enclose the two side wall surfaces of the frame 10, so that the length side surface of the machine table 10 is constructed as a closed structure. Both ends of the frame 10 are open structures, and the roller belt 11 is arranged at the bottom of the frame 10, and its position can be set in the width direction of the frame 10 based on actual needs, and it can drive the silicon rod 60 to roll unidirectionally along the length direction of the frame 11. The silicon rod 60 can enter from one end of the frame 10 and then move out from the other end.

[0043] In this embodiment, the silicon rod 60 is adhered to the base frame and is supported by the base frame to move along the length direction of the roller belt 11, and the cutting surface in contact with the wire mesh is arranged upward; after the silicon rod 60 is scribed, it can be loaded into the chamber of the slicing machine for cutting.

[0044] At the middle position of the roller belt 11, two positioning blocks 12 are arranged side by side. The positioning blocks 12 are arranged along the width direction of the silicon rod, and their lengths are arranged along the width direction of the roller belt 11, mainly used to abut against the silicon rod. The positioning blocks 12 pass through the gap of the roller belt 11 and are driven by a motor 13 placed below the roller belt 11 to abut against the lower bottom surface of the silicon rod 60 and fix the silicon rod 60 in place at a specified position on the roller belt 11, waiting for the scriber 32 to be ready to scribe.

[0045] As Figure 4As shown in the figure, the monitors are all fixed on the two side walls and the top of the frame 10 through brackets. Monitor 1-21 is respectively arranged on the two side walls of the frame 10, and there are two Monitor 1-21 on one side wall. Monitor 1-21 is mainly used to monitor the position of the seam and the end face in the length direction of the silicon rod 60, and take pictures of its entire side. The two side Monitor 1-21 are symmetrically arranged. Since Monitor 1-21 mainly monitors the end face position of the silicon rod, the position where Monitor 1-21 is located is close to the outer end face of the silicon rod 60. Monitor 2-22 is arranged on the top of the frame 10. It is mainly used to take pictures and check the upper end face of the silicon rod 60, that is, the cutting-in surface where the silicon rod 60 contacts the wire mesh during slicing. It is mainly used to facilitate monitoring the position of the seam on the silicon rod. Monitor 2-22 and Monitor 1-21 are non-aligned configurations, that is, Monitor 2-22 is farther from the silicon rod end face than Monitor 1-21. In this embodiment, the monitor is a common industrial camera.

[0046] As Figure 5 shown in the figure, the scribing mechanism 30 is configured on a single side wall of the frame 10, and is misaligned with Monitor 1-21 along the height of the frame 10 to prevent the scribing mechanism 30 from affecting the operation of Monitor 1-21. The scribing mechanism 30 also includes a fixing frame 31 for supporting the moving component. The fixing frame 31 is arranged along the length direction of the frame 10, and its plane faces upward. The lower bottom surface of the fixing frame 31 is fixed on several corner brackets, and it is connected to the frame 10 through the corner brackets. The corner bracket is a right-angled tripod. One of its straight sides is fixedly installed on the side wall of the frame 10. The position of the fixing frame 31 is higher than the position of Monitor 1-21 arranged on the same side to prevent the fixing frame 31 from affecting the shooting angle of Monitor 1-21; at the same time, since the scriber 32 can be telescoped up and down, its hanging height should not be too low.

[0047] The moving component includes a translation group 35 that moves along the length direction of the frame 10, a transverse movement group 36 that moves along the width direction of the frame 10, and a longitudinal movement group 37 that moves along the height direction of the frame 10. Among them, the translation group 35 is directly arranged on the fixing frame 31 through a slide rail. The transverse movement group 36 is connected to the translation group 35, and the longitudinal movement group 37 is connected to the transverse movement group 36. This structure is a conventional structure in the field and will not be elaborated here. The scriber 32 is arranged at the lower end of the longitudinal movement group 37. Among them, the scriber 37 is a laser head, which is connected to the laser generator 33 located on the top of the frame 10, and is connected to the control cabinet 40 through the industrial control computer 34. Through the industrial control computer 34, the working state and real-time position of the scriber 37 are displayed on the display 50.

[0048] After Monitor 1-21 and Monitor 2-22 finish taking pictures of the outer surface of the silicon rod 60 placed on the positioning block 12, the images will be transmitted to the control cabinet 40. The control cabinet 40 is provided with a controller, which will process the images and convert them into digital images to form an expanded two-dimensional image, such asFigure 6 as shown, and directly display the result of the above two-dimensional image on the monitor 50.

[0049] As Figure 6 shown, the middle shaded position in the figure is the top position of the silicon rod 60. After unfolding, the top surface is in the middle, and the two side surfaces are on both sides. On this two-dimensional image, the positions of the end 61 and the seam 62 can be directly confirmed. At the same time, based on comparing these three surface images obtained by monitoring with the standard surface image, it can also be obtained whether there are defects on these three surfaces, that is, the position of the defect 63 can be monitored and identified on both side surfaces or the top of the silicon rod. Correspondingly, the situation of the defect 63 at any position can be displayed on this two-dimensional image.

[0050] Based on the position of the defect 63, the maximum width w of the area occupied by the defect 63 along the length direction of the silicon rod can also be monitored. If the maximum width w is greater than or equal to 1 mm, then the position of the defect 63 must be removed during cutting, that is, avoid this position during cutting; furthermore, laser scribing needs to be performed on both sides of the defect 63. If the maximum width is less than 1 mm, then there is no need to consider the influence of this position on subsequent slicing, and the operation can be performed according to the normal surface quality.

[0051] The controller can quickly and accurately find the position of the end face 61 on the silicon rod 60, the position at the seam 62, and the position of the defect 63 based on the content identified by the monitor. At the same time, it will also calculate the total length of the silicon rod, the seam width, and the maximum width w of the defect along the length direction of the silicon rod.

[0052] The laser generator 33, the industrial control computer 34, and the control cabinet 40 are all fixed on the top of the frame 10. At the same time, an alarm is provided on the upper end face of the control cabinet 40. A monitor 50 is also provided on the frame 10. In order to facilitate the operator to control the monitor 50, generally the monitor 50 is fixedly arranged on one side of the end of the frame 10 through a mounting bracket, and the monitor 50 is also equipped with a corresponding keyboard. The scribing mechanism 30 and the monitoring mechanism 20 are both electrically connected to the monitor 50 through the control cabinet 40.

[0053] The control cabinet 40 will inform the scriber 37 of the identified position, and the scriber 37 is based on a preset standard, that is, in Figure 6As shown in the figure, along the length direction of the silicon rod 60, at points a and b which are inside the two end positions 61 of the silicon rod and are 0.4 - 0.6 mm away from the two end positions, at points c and d which are on both sides of the seam 62 and are 0.4 - 0.6 mm away from the seam position, and at points e and f which are on both sides of the maximum width W of the defect 63 and are 0.4 - 0.6 mm away from this position, laser scribing is respectively carried out. All scribing positions start from 1 - 2 mm below the chamfer position of the upper end face of the silicon rod and are scribed from top to bottom, and the scribing height is not specifically limited and can be set based on actual requirements. Of course, for the standard of scribing the silicon rod, there can also be other requirements, and all can be preset in advance, which will not be specifically described here.

[0054] When scribing, first drive the transverse movement group 36 and the longitudinal movement group 37 to move along the translation track together through the translation group 35, so that the scribing device 32 moves to the corresponding scribing position. Then drive the scribing device 32 to gradually approach the single side of the silicon rod 60 through the transverse movement group 36, and then control the height of the scribing device 32 through the longitudinal movement group 37 to make it move to the starting point of the scribing position. Start the laser generator 33 and control the scribing device 32 to start scribing from top to bottom. After the single - side scribing is completed, turn off the laser generator 33, keep the position of the translation group 35 unchanged, first lift the position height of the scribing device 32 through the longitudinal movement group 37 and raise it above the silicon rod 60; then control the transverse movement group 36 to move to the other single side of the silicon rod 60 and start scribing the other side at the same position. Repeat the above scribing method to complete the scribing of both sides at the same position.

[0055] Repeat the above steps, and then through the cooperation of the translation group 35, the transverse movement group 36 and the longitudinal movement group 37, use the scribing device 32 to scribe the other positions to be scribed in turn until all the positions to be scribed on the silicon rod 60 are completely scribed.

[0056] Adopting an automatic scribing device for silicon rod cutting designed by the present application, the structure design is reasonable and simple. It can automatically identify the positions of the end face and the seam of the silicon rod, and can automatically scribe on the end face and the seam of the silicon rod. The scribing position is accurate and clean; the overall working efficiency is high and the scribing quality is stable, which can ensure the accuracy and stability of the subsequent slicing wire mesh layout.

[0057] Adopting an automatic scribing device for silicon rod cutting designed by the present application, the structure design is reasonable and the degree of automation is high. It can not only automatically screen out the excess broken silicon chips in the silicon material, but also remove the silicon powder in the silicon material, ensuring the purity and cleanliness of the silicon material entering the re - feeding cylinder, laying a foundation for the crystal growth rate of subsequent direct - drawn single - crystal silicon, and ensuring the product quality; at the same time, the automatic loading not only improves the production efficiency, but also avoids the operations of human missed inspection or mis - inspection, ensures the quality of the silicon material, and reduces the production cost.

[0058] The embodiments of the present application have been described in detail above. The above content is only the preferred embodiments of the present application and cannot be considered as limiting the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application shall still fall within the scope covered by the patent of the present application.

Claims

1. An automatic marking device for silicon rod cutting, characterized in that: include: frame; A monitoring mechanism, including a plurality of monitors, for taking pictures of the side and top of the silicon rod; A marking mechanism, which is provided with a marking device and a moving assembly for controlling the position of the marking device; The monitor, the marking device and the moving assembly are all configured on the frame; The marking device can automatically mark the silicon rod based on the marking position identified by the monitor when the silicon rod is placed at a specified position on the rack.

2. The automatic marking device for silicon rod cutting according to claim 1, characterized in that: A roller belt for conveying silicon rods is provided at the bottom of the frame, and the roller belt can drive the silicon rods to roll along the length direction of the frame.

3. The automatic marking device for silicon rod cutting according to claim 2, characterized in that: In the middle of the roller belt, there are positioning blocks arranged side by side. The positioning blocks are arranged along the width direction of the silicon rod. They pass through the gap of the roller belt and are driven by a motor placed under the roller belt to push against the silicon rod and position it on the roller belt.

4. The automatic marking device for cutting silicon rods according to any one of claims 1 to 3, characterized in that: The monitor is fixed on the two side walls and the top of the frame through a bracket; the monitor located on the two side walls of the frame is symmetrically arranged on both sides of the silicon rod.

5. The automatic marking device for silicon rod cutting according to claim 4, characterized in that: The monitor located on the top of the rack is not aligned with the monitors located on the two side walls of the rack.

6. An automatic marking device for cutting silicon rods according to any one of claims 1 to 3 and 5, characterized in that: The marking mechanism is arranged on a single side wall of the frame and is staggered with the monitor on the side wall; It includes: A fixed frame, arranged along the length direction of the frame, for supporting the moving assembly; The moving assembly is provided with a translation group moving along the length direction of the frame, a transverse movement group moving along the width direction of the frame, and a longitudinal movement group moving along the height direction of the frame; The translation group is directly connected to the fixed frame, the transverse movement group is connected to the translation group, and the longitudinal movement group is connected to the transverse movement group; The scriber is arranged at the lower end of the longitudinal shifting group.

7. The automatic marking device for silicon rod cutting according to claim 6, characterized in that: The fixing frame is fixed on the side wall surface of the rack through a plurality of angle brackets, and the position of the fixing frame is higher than the position of the monitor arranged on the same side thereof.

8. An automatic marking device for cutting silicon rods according to any one of claims 1-3, 5 and 7, characterized in that: The scriber is a laser head, which is connected to a laser generator located on the top of the frame.

9. The automatic marking device for silicon rod cutting according to claim 8, characterized in that: A control cabinet and an industrial computer are also arranged on the top of the frame, and an alarm is also arranged on the upper end surface of the control cabinet.

10. The automatic marking device for silicon rod cutting according to claim 9, characterized in that: The frame is also provided with a display, and the marking mechanism and the monitoring mechanism are both connected to the display through the control cabinet.

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