Circuit board and electronic equipment

Abstract

The utility model provides a circuit board and an electronic device. The circuit board comprises a first substrate layer, a conductive layer and a second substrate layer. The first substrate layer comprises a first hard plate, a second hard plate and a soft plate connected with the first hard plate and the second hard plate, the first hard plate is electrically connected with the second substrate layer through a conducting layer, at least one reinforcing rib is arranged on the second substrate layer, and the reinforcing rib is in a closed geometrical shape. The electronic equipment comprises a circuit board and at least one electronic device, and the electronic device is arranged on the side, close to the first hard board, of the circuit board. According to the circuit board and the electronic equipment provided by the utility model, the reinforcing ribs in the closed geometrical shape are arranged on the second substrate layer of the circuit board, so that the stress acting on the second substrate layer is dispersed, the structural stability and the torsional strength of the circuit board and the electronic equipment can be remarkably improved, and the deformation and fracture risks caused by external force are reduced.

Description

Technical Field

[0001] The utility model relates to the field of electronic technology, in particular to a circuit board and electronic equipment. Background Art

[0002] The trend toward thinner and lighter electronic devices with camera modules is driving the need for extreme compression in camera module size. This, in turn, places higher demands on the sheet materials used in these modules—they must be as thin as possible. However, the use of thin materials comes with a significant drawback: reduced rigidity and a tendency to deform. In camera modules, in particular, due to the sheet material's fundamental support, even the slightest deformation can trigger a chain reaction, potentially affecting the safety of optical components such as the photosensitive chip and the blue glass. Deformation of the sheet material can not only cause misalignment between the chip and the blue glass, but in severe cases, can even cause the chip to crack or the blue glass to shatter, severely impacting the function and lifespan of the camera module.

[0003] The preceding description is intended to provide general background information and does not necessarily constitute prior art. Utility Model Content

[0004] The purpose of the present utility model is to provide a circuit board and an electronic device, in which reinforcing ribs with a closed geometric shape are arranged on the second substrate layer of the circuit board, which disperses the stress acting on the second substrate layer, can significantly improve the structural stability and torsional strength of the circuit board and the electronic device, and reduce the risk of deformation and fracture caused by external forces.

[0005] The utility model provides an electronic device, comprising a first substrate layer, a conductive layer and a second substrate layer;

[0006] The first substrate layer includes a first hard board, a second hard board and a soft board connecting the first hard board and the second hard board. The first hard board and the second substrate layer are electrically connected through the conductive layer. The second substrate layer is provided with at least one reinforcing rib, and the reinforcing rib is in a closed geometric shape.

[0007] In one embodiment, the shape of the reinforcement rib is at least one of polygonal, circular, and elliptical.

[0008] In one embodiment, a plurality of reinforcing ribs are provided on the second substrate layer, and the plurality of reinforcing ribs are distributed in a ring shape at intervals.

[0009] In one embodiment, the plurality of reinforcing ribs have the same shape, and are distributed in a ring shape with equal intervals.

[0010] In one embodiment, the reinforcing rib is a concave-convex structure, and the conductive layer is formed by conductive adhesive.

[0011] In one embodiment, the convex side of the reinforcing rib faces the first hard plate.

[0012] In one embodiment, the second substrate layer matches the shape of the first hard plate; the second substrate layer is made of metal.

[0013] The utility model also provides an electronic device, comprising the circuit board as described above and at least one electronic device, wherein the electronic device is arranged on a side of the circuit board close to the first hard board.

[0014] In one embodiment, a filter and a lens are further included. The filter is arranged above the electronic device, and the light-transmitting area of ​​the filter corresponds to the position of the electronic device. The lens is arranged above the filter.

[0015] In one embodiment, a lens is further included, and the first lens at the end of the lens or the last lens at the bottom of the lens is coated with an infrared cut-off film to replace the filter.

[0016] The circuit board and electronic device of the embodiment of the present invention include a first substrate layer, a conductive layer, and a second substrate layer; the first substrate layer includes a first hard board, a second hard board, and a soft board connecting the first hard board and the second hard board; the first hard board and the second substrate layer are electrically connected via the conductive layer; the second substrate layer is provided with at least one reinforcing rib, and the reinforcing rib is in a closed geometric shape. The electronic device includes a circuit board and at least one electronic device, and the electronic device is provided on a side of the circuit board close to the first hard board. In the circuit board and electronic device of the present invention, since the reinforcing rib in a closed geometric shape is provided on the second substrate layer of the circuit board, the stress acting on the second substrate layer is dispersed, which can significantly improve the structural stability and torsional strength of the circuit board and electronic device, and reduce the risk of deformation and fracture due to external forces. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention, but should not constitute a limitation to the present invention.

[0018] Figure 1 This is a schematic diagram of the exploded structure of a circuit board according to an embodiment of the present utility model.

[0019] Figure 2 This is a schematic diagram of the front structure of a circuit board according to an embodiment of the present utility model.

[0020] Figure 3 This is a schematic cross-sectional view of a circuit board according to an embodiment of the present invention.

[0021] Figure 4 Schematic diagram of test results of a circuit board according to an embodiment of the present invention.

[0022] Figure 5 This is a structural diagram of an electronic device according to another embodiment of the present invention.

[0023] Description of the accompanying drawings:

[0024] 1. Lens; 2. Motor; 3. First substrate layer; 31. First hard board; 32. Flexible board; 33. Second hard board; 4. Conductive layer; 5. Second substrate layer; 41. Reinforcement ribs; 6. Filter; 7. Bracket; 8. Electronic components. DETAILED DESCRIPTION

[0025] The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0026] like Figures 1 to 3 As shown, a circuit board according to an embodiment of the present invention includes a first substrate layer 3, a conductive layer 4, and a second substrate layer 5. The first substrate layer 3 includes a first rigid board 31, a second rigid board 33, and a flexible board 32 connecting the first rigid board 31 and the second rigid board 33. The first rigid board 31 is electrically connected to the second substrate layer 5 via the conductive layer 4. The second substrate layer 5 is provided with at least one reinforcing rib 51, which has a closed geometric shape.

[0027] The circuit board provided in this embodiment significantly enhances its strength by providing reinforcing ribs 51 on the second substrate layer 5, while maintaining the thickness and material of the first and second substrate layers 3 and 5. The reinforcing ribs 51 are closed geometric shapes, which can be regular or irregular. They provide enhanced resistance to bending and torsion, distributing stresses applied to various locations on the circuit board and enhancing the circuit board's overall torsional strength.

[0028] In one embodiment, the first substrate layer 3 can be a rigid-flex board, which is a composite circuit board that integrates rigid circuit board and flexible circuit board technologies. Specifically, the first rigid board 31 and the second rigid board 33 can be made of a hard material with high mechanical strength and stability for supporting electronic devices. The flexible board 32 can be made of a flexible material such as polyimide, polyester (PET), or polyethylene naphthalate (PEN) and has bendability.

[0029] In one embodiment, the conductive layer 4 may be formed of a conductive adhesive and disposed between the first rigid board 31 and the second substrate layer 5 to electrically connect the first rigid board 31 and the second substrate layer 5 .

[0030] In one embodiment, the shape of the reinforcement rib 51 is at least one of polygonal, circular, and elliptical.

[0031] In this embodiment, the shape of the reinforcing rib 51 is preferably a regular shape, which can be a triangle, a quadrilateral (such as a square, rectangle, rhombus, trapezoid and parallelogram, etc.), a pentagon, a hexagon, a heptagon and other higher-order polygons, or a circle or an ellipse, which facilitates batch standardized processing and improves production efficiency.

[0032] In one embodiment, a plurality of reinforcing ribs 51 are provided on the second substrate layer 5 , and the plurality of reinforcing ribs 51 are distributed in a ring shape at intervals.

[0033] In this embodiment, the multiple annularly distributed reinforcing ribs 51 can better disperse the radial and axial stresses on the second substrate layer 5, avoiding localized stress concentration. Preferably, the multiple reinforcing ribs 51 have the same shape and are evenly spaced in an annular pattern. Thus, by employing multiple reinforcing ribs 51 of the same shape and evenly spaced in an annular pattern, each reinforcing rib 51 can bear a similar load, preventing structural failure caused by uneven stress. This ensures uniform stress distribution across the structure, thereby improving the overall structural stability of the circuit board.

[0034] In one embodiment, the reinforcing rib 51 is a concave-convex structure.

[0035] In this embodiment, Figure 2 As shown, the concave-convex reinforcement ribs 51 form a series of alternating depressions and protrusions on the second substrate layer 5, improving the overall performance of the structure by changing the local shape of the second substrate layer 5. The concave-convex reinforcement ribs 51 only change the local geometry of the second substrate layer 5, eliminating the need for additional material and achieving a lightweight circuit board. Furthermore, the concave-convex structure of the reinforcement ribs 51 increases the surface area of ​​the material, helping to improve heat conduction efficiency and accelerate heat exchange.

[0036] In one embodiment, the manufacturing method of the reinforcing rib 51 includes but is not limited to stamping, injection molding, milling, laser engraving, 3D printing, casting, thermoforming, rolling, etc. Preferably, the reinforcing rib 51 is manufactured by stamping, which is suitable for mass production, has high efficiency, and low cost.

[0037] In one embodiment, the convex side of the reinforcing rib 51 faces the first substrate layer 3 .

[0038] In this embodiment, Figure 1As shown, the convex side of the reinforcing rib 51 can be arranged toward the first substrate layer 3. This ensures that the overall thickness of the circuit board does not increase, which is conducive to achieving a lighter and thinner circuit board. Of course, the concave side of the reinforcing rib 51 can also be arranged toward the first substrate layer 3 to increase the anti-slip stability of the circuit board.

[0039] In one embodiment, the second substrate layer 5 matches the shape of the first rigid board 31 , so that the second substrate layer 5 can fully support the first rigid board 31 and the stress from the rigid board 31 is dispersed by the reinforcing ribs 51 .

[0040] In one embodiment, the second substrate layer 5 is made of metal, which can be a single metal or an alloy, such as gold, silver, copper, iron, steel, etc. The second substrate layer 5 made of metal has high strength and is easy to be processed and deformed to form the second substrate layer 5 with the reinforcing rib 51 structure.

[0041] In this embodiment, a three-point bending simulation test can be used to test and verify the strength of the circuit board of the embodiment of the utility model. It should be noted that the three-point bending simulation test is an engineering analysis method, which is mainly used to predict and evaluate the behavior and performance of materials or structures under bending loads. This test is used to simulate the situation where a material or structure is fixed at both ends and the middle point is subjected to force when it is subjected to a force perpendicular to its length. In the three-point bending simulation test, the circuit board is placed in a virtual three-point bending device, with two fulcrums fixed at both ends of the model, and a vertical downward force is applied to the center of the model. Finite element analysis (FEA) software can be used to calculate the stress and strain distribution of the circuit board under this loading condition, as well as displacement, deformation and potential failure mode.

[0042] Specific test data and test results can be found in Table 1 and Figure 4 As shown in Table 1 and Figure 4 As shown, the circuit board design of the present invention, when compared to the prior art, increases the downward force strength of the circuit board by approximately 7% on average under the same displacement. This demonstrates that the circuit board of the present invention has greater strength and torsional resistance, effectively reducing the risk of electronic components, such as photosensitive chips or blue glass, being shattered due to circuit board deformation.

[0043] Table 1. Three-point bending simulation test data and results

[0044]

[0045]

[0046] The circuit board of this embodiment includes a first substrate layer, a conductive layer, and a second substrate layer. The first substrate layer includes a first rigid board, a second rigid board, and a flexible board connecting the first and second rigid boards. The first rigid board and the second substrate layer are electrically connected via the conductive layer. The second substrate layer is provided with at least one reinforcing rib, and the reinforcing rib has a closed geometric shape. The circuit board of this embodiment of the utility model, because the reinforcing rib with a closed geometric shape is provided on the second substrate layer of the circuit board, the stress acting on the second substrate layer is dispersed, which can significantly improve the structural stability of the circuit board and reduce the risk of deformation and fracture caused by external forces.

[0047] This embodiment discloses a circuit board, which can be applied to electronic devices that require a shooting function, such as cameras, mobile phones, drones, sweepers, and robots.

[0048] An embodiment of the present invention further provides an electronic device, which includes the circuit board as described above and at least one electronic device 8 . The electronic device 8 is disposed on a side of the circuit board close to the first substrate layer 3 .

[0049] In this embodiment, the circuit board comprises, from bottom to top, a second substrate layer 5, a conductive layer 4, and a first substrate layer 3. An electronic device 8, which is a photosensitive chip, is disposed on the first substrate layer 3. In other embodiments, two or three photosensitive chips are disposed on the circuit board. This means that the electronic device is a multi-camera module, and the chips of the multiple camera modules are all disposed on the same circuit board, meaning that the multiple camera modules share the same circuit substrate.

[0050] In one embodiment, it also includes a filter 6 and a lens 1. The filter 6 is arranged above the electronic device 8, and the light-transmitting area of ​​the filter 6 corresponds to the position of the electronic device 8. The lens 1 is arranged above the filter 6, and the central optical axis of the lens 1 corresponds to the center position of the filter 6.

[0051] In this embodiment, a bracket 7 is provided above the first substrate layer 3. The bracket 7 is used to support and fix the filter 6, and to support the motor 2. The lens 1 is mounted on the motor 2 and can be telescopically moved under the drive of the motor 2. The lens 1 is used to collect and focus light, and to converge the light of the external scene to form an image on the electronic device 8. The filter 6 is located between the lens 1 and the electronic device 8, and is used to filter out unnecessary light. The electronic device 8 is used to convert the light information collected by the lens 1 into an electrical signal. In addition, the electronic device is a camera module. The manufacturing process of the camera module requires injection molding the bracket 7 on the circuit board. The bracket 7 is fixed to the circuit board by dispensing glue, and the filter 6 is also fixed to the bracket 7 by dispensing glue.

[0052] In another embodiment, to eliminate filter 6 and reduce the overall camera module size, achieving miniaturization, an infrared-cutting film is applied to the first lens element at the end of lens 1 or the last lens element at the bottom of lens 1. This film replaces the light filtering function of filter 6. In this embodiment, the bottom of motor 2 is directly glued to the circuit board, eliminating not only filter 6 but also the need for bracket 7 above first substrate layer 3. This eliminates the need for injection molding bracket 7 onto the circuit board during camera module manufacturing, and correspondingly eliminates the glue-dispensing steps of both fixing bracket 7 to the circuit board and fixing filter 6 to bracket 7.

[0053] An electronic device according to an embodiment of the present invention includes a circuit board and at least one electronic device, the electronic device being disposed on a side of the circuit board adjacent to the first rigid board. In the electronic device according to the present invention, the closed geometrically shaped reinforcing ribs disposed on the second substrate layer of the circuit board disperse the stress acting on the second substrate layer, significantly improving the structural stability and torsional strength of the electronic device and reducing the risk of deformation and fracture due to external forces.

[0054] In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. It should be understood that when an element, such as a layer, region, or substrate, is referred to as being "formed on," "disposed on," or "located on" another element, the element can be disposed directly on the other element or intervening elements may be present. In contrast, when an element is referred to as being "formed directly on" or "disposed directly on" another element, there are no intervening elements present.

[0055] In this document, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms based on specific circumstances.

[0056] In this document, the directions or positional relationships indicated by terms such as "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "vertical", and "horizontal" are based on the directions or positional relationships shown in the accompanying drawings and are only for the clarity of the technical solution and the convenience of description. Therefore, they should not be understood as limitations on the present invention.

[0057] In this document, the ordinal adjectives "first", "second", etc. used to describe elements are only used to distinguish elements with similar attributes, and do not mean that the elements described must follow a given order, or be subject to time, space, level or other limitations.

[0058] As used herein, unless otherwise specified, “a plurality of” or “a number of” means two or more.

[0059] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion of elements other than the listed elements and may also include additional elements not specifically listed.

[0061] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A circuit board, characterized in that: comprising a first substrate layer, a conductive layer, and a second substrate layer; The first substrate layer includes a first hard board, a second hard board and a soft board connecting the first hard board and the second hard board. The first hard board and the second substrate layer are electrically connected through the conductive layer. The second substrate layer is provided with at least one reinforcing rib, and the reinforcing rib is in a closed geometric shape.

2. The circuit board according to claim 1, wherein: The shape of the reinforcement rib is at least one of polygonal, circular, and elliptical.

3. The circuit board according to claim 1 or 2, characterized in that: A plurality of reinforcing ribs are provided on the second substrate layer, and the plurality of reinforcing ribs are distributed in a ring shape at intervals.

4. The circuit board according to claim 3, wherein: The multiple reinforcing ribs have the same shape and are distributed in a ring shape with equal intervals.

5. The circuit board according to claim 1, wherein: The reinforcing ribs are of a concave-convex structure, and the conductive layer is formed by conductive adhesive.

6. The circuit board according to claim 5, characterized in that The convex side of the reinforcing rib faces the first hard plate.

7. The circuit board according to claim 1, wherein: The second substrate layer matches the shape of the first hard plate; The second substrate layer is made of metal.

8. An electronic device, characterized in that: It comprises the circuit board according to any one of claims 1 to 7 and at least one electronic device, wherein the electronic device is arranged on a side of the circuit board close to the first hard board.

9. The electronic device according to claim 8, wherein: It also includes a filter and a lens. The filter is arranged above the electronic device, and the light-transmitting area of ​​the filter corresponds to the position of the electronic device. The lens is arranged above the filter.

10. The electronic device according to claim 8, wherein The invention also comprises a lens, wherein the first lens at the end of the lens or the last lens at the bottom of the lens is coated with an infrared cut-off film to replace the filter.

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