Efficient silicon carbide wafer grinding device

Abstract

The utility model relates to an efficient silicon carbide wafer grinding device which comprises a base, two positioning assemblies and a grinding assembly are arranged on the base, and the centers of the two positioning assemblies and the grinding assembly are arranged in an isosceles triangle shape with the grinding assembly as the top. The positioning assembly comprises a first telescopic cylinder, the output end of the first telescopic cylinder is connected with a supporting disc, a suction cup frame is arranged outside the first telescopic cylinder below the supporting disc, a plurality of suction cups are fixedly arranged outside the suction cup frame around the first telescopic cylinder, through holes for containing the suction cups are formed in the supporting disc, and wafers are positioned through cooperation of the suction cups and the supporting disc; the grinding assembly comprises a rotating motor, the output end of the rotating motor is connected with a swing arm, the tail end of the swing arm is connected with a second telescopic cylinder, the output end of the swing arm is connected with a grinding motor, the output end of the grinding motor is connected with a grinding head, and the rotating motor enables the grinding head to be switched between the two positioning assemblies to alternately grind the positioned wafers. According to the efficient silicon carbide wafer grinding device, the wafer grinding efficiency can be obviously improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of silicon carbide wafer production, especially to a high -efficient silicon carbide wafer grinding device. BACKGROUND

[0002] Silicon carbide material becomes the ideal material of making high temperature, high frequency, high power, anti radiation, short wavelength luminescence and photoelectric integrated device with its unique big band gap, high critical breakdown field, high electron mobility, high thermal conductivity etc.

[0003] Silicon carbide wafer refers to the silicon carbide wafer used for making silicon semiconductor integrated circuit, is called wafer because its shape is circular, generally needs to remove a certain thickness of the redundant matrix material on the back of wafer before integrated circuit packaging, is called wafer back thinning process, and the specific rapid thinning is realized through a grinding device, but the existing grinding device has the problem of low grinding efficiency when grinding the wafer, which is specifically shown in the following aspects: first, because most wafers are not fixed firmly during grinding, the wafer occasionally rotates with the grinding head to cause invalid grinding, thereby leading to low grinding efficiency; second, most devices can only grind a single wafer, cannot be continuous, and also affect the grinding efficiency to some extent. UTILITY MODEL CONTENTS

[0004] The utility model provides a high -efficient silicon carbide wafer grinding device to make up for the deficiency of prior art, can improve wafer grinding efficiency.

[0005] The utility model adopts the technical scheme to solve the above technical problems:

[0006] A kind of high -efficient silicon carbide wafer grinding device, including base, two positioning components and a grinding component are equipped on the base, and the center of the three is top with grinding component as isosceles triangle arrangement;

[0007] The positioning component includes first telescopic cylinder, the output end of the first telescopic cylinder is connected with support disc, the lower portion of the support disc is equipped with suction disc holder outside first telescopic cylinder, multiple suction discs are fixed outside around first telescopic cylinder on the suction disc holder, the support disc is equipped with the through hole containing suction disc, to position wafer by the cooperation of suction disc and support disc;

[0008] The grinding component includes rotating motor, the output end of the rotating motor is connected with swing arm, the end of the swing arm is connected with second telescopic cylinder, the output end of the second telescopic cylinder is connected with grinding motor, the output end of the grinding motor is connected with grinding head, and the rotating motor makes grinding head switch between two positioning components to alternately grind positioned wafer.

[0009] Further, the top outer edge of the support disc is provided with a limiting protrusion, and the height of the limiting protrusion is less than the height of the grinding wafer.

[0010] Further, the base outside the two positioning assemblies is provided with a dust suction box, the dust suction box comprises a box wall, the top of the box wall is provided with a dust suction pipeline, and the inner side of the dust suction pipeline corresponding to the wafer position is provided with a dust suction hole.

[0011] Further, the two positioning assemblies are matched with a section of dust suction pipeline respectively to separately control the dust suction process.

[0012] Further, the suction disc frame is fixed around the first telescopic cylinder and is externally provided with three suction discs.

[0013] Further, a mechanical arm is further arranged on one side of the two positioning assemblies, and the end of the mechanical arm is provided with a suction disc gripper to cooperate with the two positioning assemblies to transfer the wafer.

[0014] The high-efficiency silicon carbide wafer grinding device has the advantages that: the grinding efficiency is high, and the advantages are embodied in the following two aspects: first, the silicon carbide wafer can be continuously ground by the alternating cooperation of the grinding assembly and the two positioning assemblies, and the grinding efficiency is improved; second, in each positioning assembly, the wafer can be firmly adsorbed by the plurality of suction discs, the invalid grinding condition is effectively avoided, the wafer can be well supported by the support disc, and the wafer can be efficiently ground by the cooperation of the two and the grinding head, and finally the purpose of significantly improving the grinding efficiency is achieved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 It is a structural schematic view of one embodiment of the utility model;

[0016] Fig. 2 It is a structural schematic view of another embodiment of the utility model;

[0017] Fig. 3 It is a structural schematic view of still another embodiment of the utility model.

[0018] In the figure, 1 is a base, 2 is a positioning assembly, 3 is a grinding assembly, 4 is a wafer, 5 is a dust suction box; 21 is a first telescopic cylinder, 22 is a support disc, 23 is a suction disc frame, 24 is a suction disc, 25 is a through hole, 26 is a limiting protrusion; 31 is a rotating motor, 32 is a swing arm, 33 is a second telescopic cylinder, 34 is a grinding motor, 35 is a grinding head; 51 is a box wall, 52 is a dust suction pipeline, and 53 is a dust suction hole. DETAILED DESCRIPTION

[0019] In order to clearly illustrate the technical features of the scheme, the utility model is described in detail below through specific implementation manners and in combination with the drawings.

[0020] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present application. Throughout this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0021] like Figs. 1-3 As shown, in this embodiment, the high-efficiency silicon carbide wafer grinding device includes a base 1, and two positioning assemblies 2 and a grinding assembly 3 are provided on the base 1. The three are arranged in an isosceles triangle with the grinding assembly 3 as the vertex; the positioning assembly 2 includes a first telescopic cylinder 21, the output end of the first telescopic cylinder 21 is connected to a support plate 22, and a suction cup frame 23 is provided below the support plate 22 outside the first telescopic cylinder 21, and a plurality of suction cups 24 are fixed on the suction cup frame 23 around the first telescopic cylinder 21, and a through hole 25 for accommodating the suction cup is provided on the support plate 22, so that the wafer 4 is positioned by the suction cup 24 and the support plate 22; the grinding assembly 3 includes a rotary motor 31, the output end of the rotary motor 31 is connected to a swing arm 32, the end of the swing arm 32 is connected to a second telescopic cylinder 33, the output end of the second telescopic cylinder 33 is connected to a grinding motor 34, and the output end of the grinding motor 34 is connected to a grinding head 35, and the rotary motor 31 enables the grinding head 35 to switch between the two positioning assemblies 2 to alternately grind the positioned wafers.

[0022] Working principle: The two positioning components 2 can each hold a silicon carbide wafer. When placing the wafer, first press it onto a plurality of suction cups 24 to complete adsorption and fixation. Then, the first telescopic cylinder 21 is raised to support the wafer. Only in this way can the arrangement cooperate with the grinding head 35 to achieve effective grinding. After the silicon carbide wafer on one of the positioning components 2 is ground, the rotary motor 31 rotates 60 degrees and switches to the top of the other positioning component 2. Then, the corresponding second telescopic cylinder 33 and the grinding motor 34 cooperate to realize the grinding of the silicon carbide wafer on the positioning component. During this grinding process, the wafer on the previous positioning component can be replaced with a new silicon carbide wafer. The specific replacement process is: the support plate can be lowered first, then released through the wafer, and then the new wafer can be positioned again according to the above-mentioned fixing process.

[0023] The above grinding process can not only realize the effective grinding of silicon carbide wafers, but also realize continuous grinding, which greatly improves the grinding efficiency of silicon carbide wafers.

[0024] In one of the specific embodiments, the top outer edge of the support disc 22 is provided with a limiting protrusion 26, which is lower than the height of the grinding wafer and slightly higher than the diameter of the wafer, so as to avoid excessive deviation of the wafer.

[0025] In one of the specific embodiments, in order to improve the production environmental friendliness, the following structure can be provided, specifically, a dust suction box 5 is arranged on the base outside the two positioning assemblies 2, the dust suction box 5 comprises a box wall 51, the top of the box wall 51 is provided with a dust suction pipeline 52, and the dust suction pipeline 52 is provided with a dust suction hole 53 corresponding to the inner side of the wafer position.

[0026] When the silicon carbide wafer is ground, some powders will be generated, the existence of the powders not only affects the grinding effect, but also easily disperses into the air to affect the production environment. The dust suction box is arranged, so that most of the powders can be sucked away in time during grinding, and the above problems are better solved.

[0027] In one of the specific embodiments, the two positioning assemblies 2 are respectively matched with a section of dust suction pipeline to separately control the dust suction process, and in specific application, a connecting head is arranged on each section of the dust suction pipeline to be connected with a fan or the like to suck away the ground dust.

[0028] In one of the specific embodiments, the three suction discs 24 are uniformly fixed on the suction disc frame 23 around the first telescopic cylinder 21, and the three are the most stable.

[0029] In one of the specific embodiments, in order to realize automatic production, a conventional mechanical arm can also be arranged on one side of the two positioning assemblies 2, a suction disc gripper is arranged at the tail end of the mechanical arm, and the mechanical arm is matched with the two positioning assemblies to transfer the wafer, and the specific process comprises wafer feeding and discharging.

[0030] The above specific embodiments cannot be regarded as a limitation on the protection scope of the utility model, and any alternative improvement or change made by the person skilled in the art to the utility model embodiments falls within the protection scope of the utility model.

[0031] The parts not described in the utility model are the known technology of the person skilled in the art.

Claims

1. A high-efficiency silicon carbide wafer grinding device, characterized in that: The base comprises two positioning components and a grinding component, which are arranged in an isosceles triangle with the grinding component as the top. The positioning assembly includes a first telescopic cylinder, the output end of which is connected to a support plate, a suction cup frame is provided below the support plate and outside the first telescopic cylinder, a plurality of suction cups are fixed on the suction cup frame around the first telescopic cylinder, and a through hole for accommodating the suction cups is provided on the support plate, so that the wafer is positioned by the cooperation of the suction cups and the support plate; The grinding assembly includes a rotating motor, the output end of the rotating motor is connected to a swing arm, the end of the swing arm is connected to a second telescopic cylinder, the output end of the second telescopic cylinder is connected to the grinding motor, and the output end of the grinding motor is connected to a grinding head. The rotating motor enables the grinding head to switch between the two positioning assemblies to alternately grind the positioned wafers.

2. The high-efficiency silicon carbide wafer grinding device according to claim 1, characterized in that: The top outer edge of the support plate is provided with a limiting protrusion, the height of which is smaller than the height of the grinding wafer.

3. The high-efficiency silicon carbide wafer grinding device according to claim 1, characterized in that: A dust collection box is provided on the base outside the two positioning components. The dust collection box includes a box wall. A dust collection duct is provided on the top of the box wall. Dust collection holes are provided on the inner side of the dust collection duct corresponding to the wafer position.

4. The high-efficiency silicon carbide wafer grinding device according to claim 1, characterized in that: The two positioning components are respectively matched with a section of the dust collection pipe to separately control the dust collection process.

5. The high-efficiency silicon carbide wafer grinding device according to claim 1, characterized in that: Three suction cups are fixed on the suction cup frame around the first telescopic cylinder.

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