Wafer surface glue removing device

Abstract

The utility model discloses a wafer surface degumming device which comprises an installation box and a driving motor arranged at the lower end of the installation box, the output end of the driving motor is connected with a transmission shaft, a centrifugal tray used for fixing and heating a wafer is movably arranged on the transmission shaft, a connecting assembly is arranged between the transmission shaft and the centrifugal tray, and the centrifugal tray is connected with the transmission shaft. A vibration mechanism for improving the centrifugal efficiency is arranged in the mounting box; the wafer centrifugal degumming device is simple in structure and reasonable in design, achieves the effect of synchronous high-frequency vibration of a wafer in the centrifugal degumming process, reduces the bonding force between molten glue points and the surface of the wafer under the action of vibration, is easier to throw out under the same centrifugal force, remarkably improves the efficiency and the degumming effect of the wafer centrifugal degumming, and reduces the production cost of the wafer centrifugal degumming device. Meanwhile, effective power output of the centrifugal tray in vibration is achieved through the transmission shaft, the transmission effect can still be guaranteed under the condition that the centrifugal tray inclines, and the wafer degumming efficiency is further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer glue removing equipment technical field, concretely is a wafer surface glue removing device. BACKGROUND

[0002] In the semiconductor manufacturing process, the wafer surface processing is one of the most important links. In the wafer processing process, it is often necessary to coat photoresist or protective film on its surface. However, in the subsequent process, some of these glues need to be completely removed to meet the repair or cleaning needs in the later period, at which time special glue removing means needs to be used.

[0003] Disadvantages of prior art:

[0004] The current method for removing the glue droplets on the wafer surface mainly includes two kinds of melting first and then absorbing or centrifugal rotating to remove the glue. The centrifugal rotating removal is widely used because it has no damage to the wafer surface, is easy to operate and has high efficiency. This method drives the wafer to rotate at high speed by the driving motor, and uses the centrifugal force to throw the melted glue from the wafer surface, so as to achieve the purpose of removing the glue. However, although the centrifugal rotating removal has many advantages, there are still some defects in the actual application process. In particular, after the glue melts, it still has a certain adhesive force, which makes it difficult for the glue to completely separate from the wafer surface under the centrifugal force, and the control of the rotating speed is extremely high. This not only reduces the efficiency of removing the glue, but also makes it difficult to achieve the best glue removing effect. Utility model content

[0005] The utility model aims at providing a wafer surface glue removing device to solve the problems raised in the above background technology.

[0006] To achieve the above purpose, the utility model provides the following technical scheme: a wafer surface glue removing device, comprising a mounting box and a driving motor arranged at the lower end of the mounting box, the output end of the driving motor is connected with a transmission shaft, a centrifugal tray for fixing and heating the wafer is movably arranged on the transmission shaft, a connecting assembly is arranged between the transmission shaft and the centrifugal tray, and a vibration mechanism for improving the centrifugal efficiency is arranged in the mounting box.

[0007] The vibration mechanism comprises:

[0008] The driving bevel gear is arranged at the lower end of the transmission shaft inside the mounting box, the connecting shafts are symmetrically arranged on both sides of the mounting box, the adjacent ends of the connecting shafts are all provided with driven bevel gears meshing with the driving bevel gear, and the other ends of the connecting shafts are provided with eccentric wheels.

[0009] Positioning sleeve, symmetrically arranged on the upper end of the installation box, both sides of the positioning sleeve are movably provided with a vibrating member through a vertical slot, the lower end of the vibrating member is rotatably connected with a driving bar, the other end of the driving bar is rotatably connected with the output shaft of the eccentric wheel.

[0010] Preferably, the connecting assembly comprises:

[0011] Connecting sleeve, centrally arranged on the lower end of the centrifugal tray, the lower end of the connecting sleeve is sleeved on the transmission shaft;

[0012] Split transmission sleeve, symmetrically arranged on both sides of the transmission shaft and located at the lower end of the connecting sleeve, a plurality of compression springs are arranged between the split transmission sleeve and the inner wall of the connecting sleeve, a sliding member for reducing friction is further arranged between the split transmission sleeve and the transmission shaft, and the profiles of the connecting sleeve, the split transmission sleeve and the transmission shaft sleeve embedding part are matched with each other.

[0013] Preferably, the vibrating member is a resin wheel and the wheel shaft is movably arranged in the vertical slot on both sides of the positioning sleeve.

[0014] Preferably, the upper end of the transmission shaft is provided with a spring sheet.

[0015] Preferably, the sliding member comprises a sliding groove, the sliding groove is arranged on the end wall of the transmission shaft, and a plurality of steel balls are arranged on the inner wall of the split transmission sleeve through the recesses and are in sliding connection with the sliding groove.

[0016] Preferably, the outer wall of the installation box is provided with a glue collecting ring for collecting glue.

[0017] Compared with the prior art, the device has the advantages that:

[0018] 1. The wafer surface glue removing device is provided with a vibrating mechanism, which comprises a driving bevel gear, a connecting shaft, a driven bevel gear, an eccentric wheel, a positioning sleeve, a vibrating member and a driving bar, so as to realize the effect of synchronous high-frequency vibration of the wafer during the process of centrifugal glue removing. Under the action of vibration, the adhesion between the melted glue points and the wafer surface is weakened, so that the glue points are more easily thrown out under the same centrifugal force, and the efficiency and effect of wafer centrifugal glue removing are significantly improved.

[0019] 2. The wafer surface glue removing device is provided with a connecting assembly, which comprises a connecting sleeve, a split transmission sleeve, a compression spring and a sliding member, so that the transmission shaft can realize effective power output to the centrifugal tray in vibration, and the transmission effect can still be ensured when the centrifugal tray is inclined, without jamming, and the glue removing efficiency of the wafer is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1It is the integral front view of the utility model;

[0021] Figure 2 It is the front view of the utility model without the glue ring;

[0022] Figure 3 It is the internal structure front view schematic diagram of the utility model;

[0023] Figure 4 It is the internal structure top view schematic diagram of the utility model connecting assembly;

[0024] Figure 5 It is the utility model Figure 3 The enlarged schematic diagram at A;

[0025] Figure 6 It is the utility model Figure 3 The enlarged schematic diagram at B;

[0026] Figure 7 It is the utility model Figure 3 The enlarged schematic diagram at C.

[0027] In the figure: 1, installation box; 2, drive motor; 3, transmission shaft; 4, centrifugal tray; 5, connecting assembly; 501, connecting sleeve; 502, split transmission sleeve; 503, compression spring; 504, sliding piece; 5041, sliding groove; 5042, steel ball; 6, vibration mechanism; 601, driving bevel gear; 602, connecting shaft; 603, driven bevel gear; 604, eccentric wheel; 605, positioning sleeve; 606, vibrating piece; 607, driving bar; 7, spring sheet; 8, glue ring. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0029] In the description of the utility model, it should be understood that the orientation or position relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like is the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0030] In the description of the present patent, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "arranging" should be understood broadly, for example, can be fixedly connected, arranged, or detachably connected, arranged, or integrally connected, arranged. For those skilled in the art, the specific meanings of the above terms in the present patent can be understood according to the specific circumstances.

[0031] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the present utility model, the meaning of "several" is two or more than two, unless otherwise explicitly specified.

[0032] Embodiment

[0033] Please refer to Figures 1-7 As shown in the drawings, the utility model provides a kind of wafer surface glue removing device technical scheme: a kind of wafer surface glue removing device, including installation box 1 and fixedly installed in the lower end of installation box 1 driving motor 2, the output end of driving motor 2 is connected with transmission shaft 3, the upper end of transmission shaft 3 passes through installation box 1 and is movably installed with centrifugal tray 4 for fixing and heating wafer, installation box 1 can be adjusted to the final rotating speed of centrifugal tray 4 by setting gearbox, connecting assembly 5 is installed between transmission shaft 3 and centrifugal tray 4, vibration mechanism 6 for improving centrifugal efficiency is installed in installation box 1. Vibration mechanism 6 includes driving bevel gear 601 and positioning sleeve 605. Driving bevel gear 601 is fixedly installed at the lower end of transmission shaft 3 in the interior of installation box 1, connecting shaft 602 is symmetrically installed on the two sides of installation box 1, connecting shaft 602 is positioned on the tank wall of installation box 1 by support, the end adjacent to connecting shaft 602 is equipped with driven bevel gear 603 meshing with driving bevel gear 601, the other end of connecting shaft 602 is equipped with eccentric wheel 604. Positioning sleeve 605 is symmetrically installed at the upper end of installation box 1, and vibration piece 606 is movably installed on the two sides of positioning sleeve 605 by the vertical slot of penetration, vibration piece 606 can slide and rotate up and down along the vertical slot of positioning sleeve 605, and the upper end of vibration piece 606 is attached to the lower end surface of centrifugal tray 4, and the other end of driving bar 607 is rotatably connected with the output shaft of eccentric wheel 604.

[0034] When the gel on the upper surface of the centrifugal tray 4 needs to be removed, the centrifugal tray 4 is heated first, and then the driving motor 2 is started by the staff or an external controller to drive the centrifugal tray 4 to rotate through the transmission shaft 3, so that the gel on the surface of the wafer is thrown out. In the process of rotating the wafer, the transmission shaft 3 drives the driving bevel gear 601 to rotate, the driving bevel gear 601 drives the two eccentric wheels 604 on both sides to rotate synchronously through the connecting shaft 602 and the driven bevel gears 603 on both sides, and the rotational speed of the eccentric wheels 604 is ensured through a certain gear ratio setting. The eccentric wheels 604 drive the driving bars 607 to stretch up and down in the process of rotation, so as to realize the effect that the two vibration pieces 606 on both sides move up and down synchronously along the vertical slot of the positioning sleeve 605. The vibration pieces 606 drive the rotating centrifugal tray 4 on both sides to move up and down synchronously in the process of moving up and down, realizing the effect of vibration, and the frequency of vibration is determined by the rotational speed of the driving motor 2.

[0035] Through the vibration mechanism 6, the effect of synchronous high-frequency vibration of the wafer in the process of centrifugal gel removal is realized. Under the action of vibration, the adhesion between the melted gel point and the surface of the wafer is weakened, and it is easier to be thrown out under the same centrifugal force, which significantly improves the efficiency and effect of wafer centrifugal gel removal.

[0036] The connecting assembly 5 includes a connecting sleeve 501 and a split transmission sleeve 502. The connecting sleeve 501 is centrally fixedly installed at the lower end of the centrifugal tray 4, and the lower end of the connecting sleeve 501 is sleeved on the transmission shaft 3. The split transmission sleeve 502 is symmetrically installed at the lower end of the connecting sleeve 501 on both sides of the transmission shaft 3. A plurality of compression springs 503 are installed between the split transmission sleeve 502 and the inner wall of the connecting sleeve 501, and a sliding piece 504 for reducing friction is also installed between the split transmission sleeve 502 and the transmission shaft 3. The compression springs 503 are in a tension state, the split transmission sleeve 502 is tightly fitted with the transmission shaft 3 under the pressure action of the compression springs 503, to ensure the transmission effect, but also to reserve a certain amount of expansion. The cross section of the transmission shaft 3 can be a regular hexagon, so as to ensure the transmission effect, the lower end of the connecting sleeve 501, the split transmission sleeve 502 and the transmission shaft 3 are all regular hexagons matched with each other.

[0037] In the normal gel removal process, the transmission shaft 3 drives the centrifugal tray 4 to rotate through the split transmission sleeve 502 and the connecting sleeve 501, the vibration mechanism 6 drives the centrifugal tray 4 on both sides to vibrate synchronously up and down due to the synchronous rotation of the eccentric wheels 604, and the split transmission sleeve 502 slides up and down relative to the transmission shaft 3 in the process of transmission.

[0038] If the installation angle of the eccentric wheel 604 has errors, or the rotation angles of the two eccentric wheels 604 are inconsistent due to long-time working wear and the like, at this time, the heights of the two vibration pieces 6 are likely to be inconsistent, that is, the highest point and the lowest point cannot be reached at the same time, and then the centrifugal tray 4 will be inclined during the vibration. When the centrifugal tray 4 is inclined, since the compression spring 503 reserves a certain expansion amount, the upper end or the lower end of the split transmission sleeve 502 will be slightly inclined relative to the transmission shaft 3 according to the inclination direction of the centrifugal tray 4, but under the compression of the compression spring 503, the effective transmission can still be ensured, and the stoppage will not occur.

[0039] Through the connecting assembly 5, the transmission shaft 3 can realize the effective power output to the centrifugal tray 4 in the vibration, and the transmission effect can still be ensured when the centrifugal tray 4 is inclined, the stoppage will not occur, and the glue removal efficiency of the wafer is further improved.

[0040] The vibration piece 606 is a resin wheel and the wheel shaft is movably installed in the vertical groove on the two sides of the positioning sleeve 605, the resin wheel can play a certain protection role on the centrifugal tray 4, and the contact between the rotating centrifugal tray 4 and the vibration piece 606 is rolling friction.

[0041] The upper end of the transmission shaft 3 is provided with the spring sheet 7, the spring sheet 7 is used for soft connection between the centrifugal tray 4 and the top end of the transmission shaft 3, and the spring sheet 7 has a certain hardness to ensure that the up-down movement stroke of the centrifugal tray 4 can be limited and the buffering can be provided.

[0042] The sliding piece 504 comprises the sliding groove 5041, the sliding groove 5041 is arranged on the end wall of the transmission shaft 3, and the inner wall of the split transmission sleeve 502 is provided with a plurality of steel balls 5042 through the recesses and is in sliding connection with the sliding groove 5041, and the sliding groove 5041 can prevent the split transmission sleeve 502 from sliding off from the upper side of the transmission shaft 3. When the steel balls 5042 move up and down on the split transmission sleeve 502, the friction can be effectively reduced and the damage can be avoided.

[0043] The mounting box 1 is provided with the glue collecting ring 8 for collecting the glue through the buckle on the outer wall of the mounting box 1.

[0044] The basic principle, the main features and the advantages of the present application are shown and described above. It should be understood by the person skilled in the art that the present application is not limited by the above examples, and the above examples and the description in the specification are only preferred examples of the present application and are not used to limit the present application. Without departing from the spirit and scope of the present application, the present application can also have various changes and improvements, and these changes and improvements all fall within the scope of the present application. The protection scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A device for removing glue on wafer surface, comprising a mounting box (1) and a driving motor (2) arranged at the lower end of the mounting box (1), characterized in that: The output end of the driving motor (2) is connected with a transmission shaft (3), a centrifugal tray (4) for fixing and heating wafers is movably arranged on the transmission shaft (3), a connecting assembly (5) is arranged between the transmission shaft (3) and the centrifugal tray (4), and a vibration mechanism (6) for improving centrifugal efficiency is arranged in the mounting box (1). The vibration mechanism (6) comprises: A driving bevel gear (601) is arranged at the lower end of the transmission shaft (3) and located in the interior of the mounting box (1), connecting shafts (602) are symmetrically arranged at the two sides of the mounting box (1), adjacent ends of the connecting shafts (602) are each provided with a driven bevel gear (603) engaged with the driving bevel gear (601), and the other ends of the connecting shafts (602) are provided with eccentric wheels (604); Positioning sleeves (605) are symmetrically arranged at the upper end of the mounting box (1), vibration pieces (606) are movably arranged at the two sides of the positioning sleeves (605) through vertical grooves formed at the two sides, the lower ends of the vibration pieces (606) are rotatably connected with driving bars (607), and the other ends of the driving bars (607) are rotatably connected with the output shafts of the eccentric wheels (604).

2. The wafer surface adhesive removing apparatus according to claim 1, wherein: The connecting assembly (5) comprises: A connecting sleeve (501) is arranged at the lower end of the centrifugal tray (4) and located in the center, and the lower end of the connecting sleeve (501) is sleeved on the transmission shaft (3); Split transmission sleeves (502) are symmetrically arranged at the two sides of the transmission shaft (3) and located at the lower end of the connecting sleeve (501), a plurality of compression springs (503) are arranged between the split transmission sleeves (502) and the inner walls of the connecting sleeve (501), sliding pieces (504) for reducing friction are further arranged between the split transmission sleeves (502) and the transmission shaft (3), and the profiles of the sleeve embedding parts of the connecting sleeve (501), the split transmission sleeves (502) and the transmission shaft (3) are matched with each other.

3. The wafer surface adhesive removing apparatus according to claim 1, wherein: The vibration pieces (606) are resin wheels and the wheel shafts are movably arranged in the vertical grooves at the two sides of the positioning sleeves (605).

4. The wafer surface adhesive removing apparatus according to claim 2, wherein: Spring sheets (7) are arranged at the upper end of the transmission shaft (3).

5. The wafer surface adhesive removing apparatus according to claim 2, wherein: The sliding pieces (504) comprise sliding grooves (5041) formed on the end walls of the transmission shaft (3), and a plurality of steel balls (5042) are arranged on the inner walls of the split transmission sleeves (502) through recesses and slidably connected with the sliding grooves (5041).

6. The wafer surface adhesive removing apparatus of claim 1, wherein: A glue collecting ring (8) for collecting glue is arranged on the outer wall of the mounting box (1).

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