Wafer detection device

Abstract

The utility model discloses a wafer detection device which comprises a workbench, a fixing mechanism and a detection mechanism, and one side of the workbench is provided with a mounting rack. The fixing mechanism comprises a fixing disc and a plurality of fixing rings, the fixing disc is arranged on the surface of the workbench, a plurality of fixing grooves distributed in a concentric circle mode are formed in the surface of the fixing disc, a plurality of fixing holes are evenly formed in the edges of the fixing grooves, the diameters of the fixing rings correspond to the fixing grooves in a one-to-one mode, and fixing blocks corresponding to the fixing holes are arranged at the bottoms of the fixing rings. The fixing blocks can be inserted into the fixing holes; the detection mechanism comprises a laser generator, a CCD detector, a coaxial light generator and a controller, the laser generator, the CCD detector and the coaxial light generator are sequentially arranged on the mounting frame, the controller is arranged adjacent to the mounting frame, and the laser generator, the CCD detector and the coaxial light generator are all located above the fixing disc and electrically connected to the controller. According to the technical scheme of the utility model, wafers of different sizes can be replaced and detected rapidly and conveniently, time and labor are saved, and the working efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of detection device technology, and in particular to a wafer detection device. Background Technology

[0002] In the wafer inspection process, the wafer needs to be placed on a fixed plate with a circular groove that matches the size of the wafer. The wafer is placed in the groove and then inspected using a microscope, probe station, laser scanning, or other methods. However, since wafers of different specifications have different sizes, a fixed plate of the corresponding size needs to be replaced when inspecting wafers of different specifications. This operation is cumbersome and time-consuming, and the work efficiency needs to be improved. Utility Model Content

[0003] The main purpose of this invention is to provide a wafer inspection device that enables quick and convenient replacement and inspection of wafers of different sizes, saving time and effort and helping to improve work efficiency.

[0004] To achieve the above objectives, this utility model proposes a wafer inspection device, comprising:

[0005] A workbench, with a mounting bracket provided on one side;

[0006] The fixing mechanism includes a fixing plate and multiple fixing rings. The fixing plate is disposed on the surface of the worktable. Multiple fixing grooves are arranged in concentric circles on the surface of the fixing plate. Multiple fixing holes are evenly distributed on the edges of the fixing grooves. The diameters of the multiple fixing rings correspond one-to-one with the multiple fixing grooves. A fixing block is disposed at the bottom of the fixing ring corresponding to the fixing hole. The fixing block can be inserted into the fixing hole.

[0007] The detection mechanism includes a laser generator, a CCD detector, a coaxial light generator, and a controller arranged sequentially on the mounting frame. The laser generator, CCD detector, and coaxial light generator are all located above the fixed plate and are all electrically connected to the controller.

[0008] In one embodiment of this utility model, an anti-detachment groove is formed at the bottom of the fixing groove, and rotating the fixing ring can cause the fixing block to move along the anti-detachment groove.

[0009] In one embodiment of the present invention, the fixing plate has a first placement opening on the side away from the mounting frame, and the fixing ring has a second placement opening corresponding to the first placement opening.

[0010] In one embodiment of this utility model, the top of the fixing ring is bent to form an inclined portion.

[0011] In one embodiment of this utility model, a movable plate is also connected to the mounting bracket. The movable plate is located below the laser generator, CCD detector and coaxial light generator. The movable plate has multiple lens holes, and APO lenses can be installed in the lens holes.

[0012] This utility model's technical solution involves setting fixed grooves and fixed rings of different diameters on a fixed disk. When it is necessary to inspect wafers of different sizes, simply remove the previous fixed ring, insert a fixed ring of the corresponding diameter, and then place the wafer into the fixed ring for inspection. This is simple and convenient, eliminates the need to replace the entire fixed disk, and greatly improves work efficiency. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;

[0016] Figure 3 This is a schematic diagram of the fixing ring structure of this utility model.

[0017] Explanation of icon numbers:

[0018] 1. Workbench; 11. Mounting bracket; 12. Movable plate; 13. Lens hole; 14. APO lens; 2. Fixing plate; 21. Fixing groove; 211. Anti-detachment groove; 22. Fixing hole; 23. First placement port; 3. Fixing ring; 31. Fixing block; 32. Second placement port; 33. Inclined part; 4. Laser generator; 5. CCD detector; 6. Coaxial light generator; 7. Controller.

[0019] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0021] Reference Figures 1 to 3 This utility model proposes a wafer inspection device, including a worktable 1, a fixing mechanism, and an inspection mechanism. A mounting frame 11 is provided on one side of the worktable 1. The fixing mechanism includes a fixing plate 2 and multiple fixing rings 3. The fixing plate 2 is disposed on the surface of the worktable 1. Multiple fixing grooves 21 arranged in concentric circles are opened on the surface of the fixing plate 2. Multiple fixing holes 22 are evenly opened on the edges of the fixing grooves 21. The diameters of the multiple fixing rings 3 correspond one-to-one with the multiple fixing grooves 21. A fixing block 31 is provided at the bottom of the fixing ring 3 corresponding to the fixing hole 22. The fixing block 31 can be inserted into the fixing hole 22. The inspection mechanism includes a laser generator 4, a CCD detector 5, a coaxial light generator 6, and a controller 7 disposed adjacent to the mounting frame 11, which are sequentially disposed on the mounting frame 11. The laser generator 4, CCD detector 5, and coaxial light generator 6 are all located above the fixing plate 2 and are all electrically connected to the controller 7.

[0022] Understandably, the worktable 1 and mounting bracket 11 provide stable support, ensuring that other components can function properly on them. The fixing mechanism includes a fixing disk 2 and multiple fixing rings 3 for securing the wafer to the worktable 1, preventing movement or tilting during inspection. The surface of the fixing disk 2 has multiple concentric circular grooves for placing the fixing rings 3. Each fixing groove 21 has multiple holes along its edge for inserting fixing blocks 31 into the fixing rings 3, ensuring a secure connection between the fixing rings 3 and the fixing disk 2. The diameter of each fixing ring 3 corresponds one-to-one with the diameter of the fixing groove 21, with each fixing ring 3 fitting perfectly into one groove. Each fixing ring 3 has a fixing block 31 at its bottom; when the fixing ring 3 is placed in the fixing groove 21, the fixing block 31 inserts into a fixing hole 22, ensuring the fixing ring 3 is securely fixed to the disk and preventing loosening. When it is necessary to inspect wafers of different sizes, simply remove the previous retaining ring 3, insert the retaining ring 3 of the corresponding diameter, and then place the wafer into the retaining ring 3 for inspection. This is simple and convenient, and does not require replacing the entire retaining plate 2, which greatly improves work efficiency.

[0023] The inspection mechanism includes a laser generator 4, a CCD detector 5, a coaxial light generator 6, and a controller 7, used to inspect the wafer and acquire images or other relevant information about it. The laser generator 4 emits a laser beam to illuminate the wafer and acquire its reflected signals or to scan the wafer surface. The CCD detector 5 receives the laser reflection signal or visible light signal to generate an image or inspection display. The coaxial light generator 6 provides a light source coaxial with the laser, helping to obtain more accurate inspection results. The controller 7 controls the operation of the above inspection equipment, ensuring they work together according to predetermined procedures and requirements. In addition, the controller 7 may also be responsible for data collection and processing; it may contain a CPU, microcontroller, or other similar devices, without further limitations.

[0024] Reference Figures 1 to 2 In one embodiment of this application, an anti-detachment groove 211 is formed at the bottom of the fixing groove 21, and the fixing block 31 can be moved along the anti-detachment groove 211 by rotating the fixing ring 3.

[0025] Understandably, the anti-detachment groove 211 is designed to prevent the fixing ring 3 from coming out of the fixing groove 21. When the fixing block 31 is inserted into the fixing hole 22, the fixing ring 3 is gently rotated, and the fixing block 31 moves along the anti-detachment groove 211 away from the fixing hole 22, so that the fixing ring 3 cannot come out of the fixing groove 21. When it is necessary to remove the fixing ring 3, the fixing ring 3 is rotated so that the fixing block 31 is aligned with the fixing hole 22 and then it can be removed.

[0026] Reference Figures 1 to 3 In one embodiment of this application, the fixing plate 2 has a first placement opening 23 on the side opposite to the mounting bracket 11, and the fixing ring 3 has a second placement opening 32 corresponding to the first placement opening 23.

[0027] Understandably, both the first placement port 23 and the second placement port 32 are designed to facilitate the insertion or removal of the wafer from the retaining ring 3. If the equipment requires automated wafer loading and unloading, the openings allow robotic arms or robots to accurately grasp and place the wafers. The design of the openings helps the equipment quickly identify the wafer's position and orientation, reducing operation time and improving production efficiency.

[0028] Reference Figure 3 In one embodiment of this application, the top of the fixing ring 3 is bent to form an inclined portion 33.

[0029] Understandably, the inclined section 33 effectively reduces the risk of wafers slipping due to instability or improper handling during placement and handling. The ramp design allows the wafer to gradually position itself by gravity as its edge contacts the pad surface, which helps maintain wafer stability. Wafers are typically very thin and fragile, and excessive mechanical pressure or friction should be avoided during placement. The edge design of the inclined section 33 allows the wafer to slide more naturally into the pad, reducing the pressure applied directly to the flat surface and preventing damage to the wafer surface or the wafer itself.

[0030] Reference Figure 1 In one embodiment of this application, a movable plate 12 is also connected to the mounting bracket 11. The movable plate 12 is located below the laser generator 4, the CCD detector 5 and the coaxial light generator 6. The movable plate 12 has a plurality of lens holes 13, and an APO lens 14 can be installed on the lens holes 13.

[0031] Understandably, the APO lens 14, or achromatic lens, is a high-performance optical lens typically used to reduce chromatic aberration between different wavelengths of light, thereby reducing image blur and improving image quality. The lens holes 13 on the movable plate 12 are used to mount this high-precision lens to ensure that the laser and optical inspection system can obtain clear, high-quality images during operation. Furthermore, multiple lens holes 13 can accommodate lenses of different specifications as needed.

[0032] This utility model provides a simple and convenient solution by setting fixed grooves 21 and fixed rings 3 of different diameters on the fixed disk 2. When it is necessary to test wafers of different sizes, it is only necessary to remove the previous fixed ring 3, insert a fixed ring 3 of the corresponding diameter, and then put the wafer into the fixed ring 3 for testing. This method is simple and convenient, and does not require replacing the entire fixed disk 2, which greatly improves work efficiency.

[0033] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0034] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer inspection apparatus characterized by comprising: The utility model relates to a kind of laser detection device, including: Workbench (1), the workbench (1) one side is equipped with mounting rack (11); Fixing mechanism, including fixed disc (2) and multiple fixed rings (3), the fixed disc (2) is arranged on the surface of the workbench (1), the surface of the fixed disc (2) is equipped with multiple fixed slots (21) in concentric circle arrangement, multiple fixed slots (21) edge is evenly equipped with multiple fixed holes (22), multiple the diameter of the fixed ring (3) is respectively corresponding to multiple fixed slots (21), the fixed ring (3) bottom is equipped with fixed block (31) corresponding to the fixed hole (22), the fixed block (31) can be inserted into the fixed hole (22); Detection mechanism, including laser generator (4), CCD detector (5), coaxial light generator (6) sequentially arranged on the mounting rack (11) and controller (7) adjacent to the mounting rack (11), the laser generator (4), CCD detector (5) and coaxial light generator (6) are all above the fixed disc (2), and three are electrically connected to the controller (7).

2. The wafer inspection apparatus of claim 1, wherein The bottom of the fixed slot (21) is formed with an anti-drop groove (211), and rotating the fixed ring (3) can move the fixed block (31) along the anti-drop groove (211).

3. The wafer inspection apparatus of claim 2, wherein The fixed disc (2) is provided with a first placing opening (23) on the side away from the mounting rack (11), and the fixed ring (3) is provided with a second placing opening (32) corresponding to the first placing opening (23).

4. The wafer inspection apparatus of claim 3, wherein The top of the fixed ring (3) is bent to form an inclined portion (33).

5. The wafer inspection apparatus of claim 1, wherein The mounting rack (11) is further connected with a movable plate (12), and the movable plate (12) is located below the laser generator (4), the CCD detector (5) and the coaxial light generator (6). The movable plate (12) is provided with a plurality of lens holes (13), and an APO lens (14) can be installed on the lens hole (13).

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