Fixing equipment with central pressurizing structure

Abstract

The fixing equipment comprises a main polishing head, the main polishing head comprises a pressure plate and a plurality of clamping blocks installed in the circumferential direction of the pressure plate, a ceramic disc is arranged on one side of the pressure plate in an abutting mode, and the clamping blocks abut against the circumferential direction of the ceramic disc. A plurality of wafers are evenly arranged on the side, away from the pressure plate, of the ceramic disc, a pressurizing assembly is arranged in the pressure plate and comprises a pressurizing hole, a piston structure, a pressurizing plate, a cover plate and an air inlet nozzle, the pressurizing hole is formed in the center of the pressure plate and penetrates through the pressure plate, and the piston structure is arranged in the pressurizing hole in a sliding mode; the piston structure blocks the pressurizing hole, the pressurizing plate is installed on the side, facing the ceramic disc, of the piston structure, the cover plate is installed on the pressure plate on the side, away from the ceramic disc, of the pressure plate, the pressurizing hole is closed by the cover plate, and the air inlet nozzle is installed on the cover plate and communicated with the pressurizing hole. The method has the effect of improving the flatness of the surface of the wafer.

Description

Technical Field

[0001] This application relates to the field of equipment, and in particular to a fixed device having a central pressurization structure. Background Technology

[0002] Chemical mechanical polishing (CMP) is a key process for achieving wafer surface planarization in integrated circuit manufacturing. CMP combines surface chemical action with mechanical abrasion to remove micron / nanoscale materials from the wafer surface, achieving nanoscale planarization and enabling subsequent photolithography processes.

[0003] The main working principle of CMP is that, under certain pressure and in the presence of polishing fluid, the wafer being polished moves relative to the polishing pad. Through the highly organic combination of the mechanical grinding action of nano-abrasives and the chemical action of various chemical reagents, the surface of the polished wafer achieves the requirements of high flatness, low surface roughness, and low defects.

[0004] In the process of processing products, single-sided polishing equipment uses a main polishing head to clamp a ceramic disk on which a wafer is mounted, and to bring the wafer into contact with the surface of the polishing disk. The main polishing head drives the ceramic disk to rotate, and the wafer surface is polished by the highly organic combination of the mechanical grinding action of the nano-abrasives on the polishing disk and the chemical action of various chemical reagents. The polishing effect is related to the linear velocity, pressure and chemical action of the workpiece surface. However, because the polishing linear velocity of the workpiece exhibits a linear relationship of being larger on the outside and smaller on the inside when the ceramic disk rotates, the polishing effect shows the characteristic of greater wear on the outer ring and less wear on the inner ring when the pressure is consistent. This can easily lead to poor flatness of the wafer surface. Utility Model Content

[0005] To improve wafer surface flatness, this application provides a fixing device with a central pressure structure.

[0006] The fixed device with a central pressure structure provided in this application adopts the following technical solution:

[0007] A fixed device with a central pressurization structure includes a main polishing head. The main polishing head includes a pressure plate and a plurality of clamping blocks mounted around the circumference of the pressure plate. A ceramic disk is abutted against one side of the pressure plate, and the plurality of clamping blocks abut against the circumference of the ceramic disk. A plurality of wafers are uniformly arranged on the side of the ceramic disk away from the pressure plate. A pressurization assembly is disposed inside the pressure plate. The pressurization assembly includes a pressurization hole, a piston structure, a pressurization plate, a cover plate, and an air inlet. The pressurization hole is opened at the center of the pressure plate and penetrates the pressure plate. The piston structure is slidably disposed within the pressurization hole and blocks the pressurization hole. The pressurization plate is mounted on the side of the piston structure facing the ceramic disk. The cover plate is mounted on the pressure plate on the side of the pressure plate away from the ceramic disk and closes the pressurization hole. The air inlet is mounted on the cover plate and communicates with the pressurization hole.

[0008] By adopting the above technical solution, the air inlet is used to connect to the air pump, which introduces air into the pressure hole. The air pressure drives the piston structure to apply pressure to the center of the pressure plate, thereby subjecting the central area of ​​the ceramic disk to pressure. The closer the wafer is to the center of the ceramic disk, the greater the pressure it experiences, resulting in a higher coefficient of friction. This increases the friction loss of the wafer near the center of the ceramic disk, making it closer to the friction loss of the wafer near the edge of the ceramic disk, thus improving the flatness of the wafer surface.

[0009] Optionally, the piston structure includes a fixed plate and a sliding plate. The fixed plate is fixed to the pressure plate inside the pressure hole and blocks the pressure hole. The sliding plate is slidably disposed on the fixed plate and the pressure plate is fixed on the sliding plate. The fixed plate has a plurality of vent holes for the pipe sealing plate, and the vent holes are located near the center of the fixed plate.

[0010] By adopting the above technical solution, the air pressure introduced into the pressurization hole by the air pump drives the sliding plate to slide through the vent hole. The vent hole is opened near the center of the fixed plate so that the air pressure is more concentrated, thus driving the sliding plate more easily.

[0011] Optionally, a guide rod is fixedly provided on the sliding plate, and the guide rod is inserted into one of the vent holes of the fixed plate.

[0012] By adopting the above technical solution, the guide rod can guide the sliding plate, thereby reducing the probability of the sliding plate tilting.

[0013] Optionally, the piston structure further includes a guide ring, which is fixed on the fixed plate and the inner wall of the guide ring abuts against the outer wall of the sliding plate.

[0014] By adopting the above technical solution, the guide ring can not only assist in guiding the sliding plate, but also reduce the size of the sliding plate, so that the sliding plate can be smaller than the pressure hole, thereby concentrating the area of ​​air pressure action and reducing the pressure of air pressure driving the sliding plate.

[0015] Optionally, the fixing plate and the guide ring are mounted on the pressure plate by the same fixing bolt.

[0016] By adopting the above technical solution, the fixing plate and the guide ring are installed on the pressure plate by the same fixing bolt, which can facilitate the installation of the fixing plate and the guide ring and also save on fasteners.

[0017] Optionally, a limiting groove is formed on the inner wall of the guide ring, and a limiting ring is installed on the sliding plate, wherein the limiting ring is slidably disposed in the limiting groove.

[0018] By adopting the above technical solution, the limiting groove and the limiting ring can limit the pressure stroke of the pressure plate, reduce the probability that the pressure plate will directly crush the ceramic plate due to excessive pressure, and also reduce the probability that the pressure plate will detach from the pressure plate.

[0019] Optionally, sealing rings are provided at the connection between the pressure plate and the fixed plate, the connection between the pressure plate and the guide ring, the connection between the guide ring and the sliding plate, and the connection between the cover plate and the pressure plate.

[0020] By adopting the above technical solution, the sealing ring can reduce gas leakage, thereby ensuring the stability of the gas pressure in the pressurization hole.

[0021] In summary, this application includes at least one of the following beneficial technical effects:

[0022] The air inlet is used to connect to the air pump, which introduces air into the pressure hole. The air pressure drives the piston structure to drive the pressure plate to apply pressure to the center of the pressure plate. This causes the central area of ​​the ceramic disk to be under pressure, and the closer the wafer is to the center of the ceramic disk, the greater the pressure it experiences, resulting in a higher coefficient of friction. This increases the friction loss of the wafer near the center of the ceramic disk, making the friction loss of the wafer near the edge of the ceramic disk more similar to that of the wafer near the edge of the ceramic disk, thereby improving the flatness of the wafer surface.

[0023] The air pressure introduced into the pressurization hole by the air pump drives the sliding plate to slide through the vent hole. The vent hole is located near the center of the fixed plate so that the air pressure is more concentrated, thus making it easier to drive the sliding plate.

[0024] The guide ring can both assist in guiding the sliding plate and reduce the size of the sliding plate, making the sliding plate smaller than the pressurization hole, thereby concentrating the area of ​​air pressure and reducing the pressure of air pressure driving the sliding plate;

[0025] The combination of the limiting groove and the limiting ring can limit the pressurization stroke of the pressure plate, reduce the probability that excessive pressure will cause the pressure plate to directly crush the ceramic plate, and also reduce the probability that the pressure plate will detach from the pressure plate.

[0026] The sealing ring reduces gas leakage, thus ensuring the stability of the gas pressure inside the pressurization port. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application.

[0028] Figure 2 This is a cross-sectional view of the overall structure of an embodiment of this application.

[0029] Figure 3 yes Figure 2 A magnified view of section A in the middle.

[0030] Explanation of reference numerals in the attached drawings: 1. Main polishing head; 101. Pressure plate; 102. Clamping block; 2. Ceramic disk; 3. Wafer; 4. Pressurization assembly; 41. Pressurization hole; 42. Piston structure; 421. Fixing plate; 422. Sliding plate; 423. Guide ring; 43. Pressurization plate; 44. Cover plate; 45. Air inlet; 5. Vent hole; 6. Guide rod; 7. Fixing bolt; 8. Limiting groove; 9. Limiting ring; 10. Sealing ring. Detailed Implementation

[0031] The following is in conjunction with the appendix Figure 1-3 This application will be described in further detail.

[0032] First, it should be noted that in the description of this application, the use of directional terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" indicates the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used solely for descriptive purposes and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the use of numerical quantifiers such as "first," "second," and "third" is for descriptive purposes only and should not be construed as indicating or implying relative importance. Additionally, in this application, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, interference fits, transition fits, or integral connections; they can refer to direct connections or indirect connections through an intermediate medium. Therefore, those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] This application discloses a fixing device with a central pressure structure, referring to... Figure 1 , Figure 2 and Figure 3 The system includes a main polishing head 1 mounted on a polishing device. The main polishing head 1 is rotatable on the polishing device. The main polishing head 1 includes a circular pressure plate 101 and a plurality of clamping blocks 102 mounted circumferentially on the pressure plate 101. In this embodiment, six clamping blocks 102 are provided. All six clamping blocks 102 are arc-shaped blocks made of plastic. The clamping blocks 102 are adjustablely mounted on the pressure plate 101 by bolts. When the ceramic disc 2 is mounted on the pressure plate 101, one side of the pressure plate 101 abuts against the ceramic disc 2. The six clamping blocks 102 abut against the ceramic disc by adjustment. The clamping block 102 is made of plastic to reduce the probability of damage to the ceramic disk 2 due to pressure when clamping and fixing it. Several wafers 3 are evenly arranged on the side of the ceramic disk 2 away from the pressure plate 101. The wafers 3 are detachably attached to the ceramic disk 2 by adhesive. A pressure assembly 4 is provided inside the pressure plate 101. The pressure assembly 4 includes a pressure hole 41 opened in the center of the pressure plate 101, a piston structure 42 slidably disposed in the pressure hole 41, a pressure plate 43 installed on the side of the piston structure 42 facing the ceramic disk 2, and a pressure plate 43 on the side of the pressure plate 101 away from the ceramic disk 2. A cover plate 44 and an air inlet 45 are mounted on the pressure plate 101. A pressurization hole 41 penetrates the pressure plate 101, and a piston structure 42 blocks the pressurization hole 41. Under normal conditions, a pressure plate 43 is embedded in the pressurization hole 41 and is flush with the side of the ceramic disc 2 of the pressure plate 101. The air inlet 45 is installed at the center of the cover plate 44 and is located on the axis of the pressure plate 101. The air inlet 45 is connected to the pressurization hole 41. The air inlet 45 located on the axis of the pressure plate 101 can reduce the influence of rotation on the air inlet 45 when the pressure plate rotates. An air pump is connected through a pipe, and air is introduced into the pressure hole through the air pump. The air pressure drives the piston structure 42 to drive the pressure plate 43 to apply pressure to the center of the pressure plate 101. This causes the central area of ​​the ceramic disk 2 to be under pressure, and the closer the wafer 3 on the ceramic disk 2 is to the center, the greater the pressure is, and the greater the coefficient of friction is. This increases the friction loss of the wafer 3 near the center of the ceramic disk 2, making the friction loss of the wafer 3 near the center of the ceramic disk 2 closer to the friction loss of the wafer 3 near the edge of the ceramic disk 2, thereby improving the surface flatness of the wafer 3.

[0034] Reference Figure 2 and Figure 3The piston structure 42 includes a fixed plate 421, a sliding plate 422, and a guide ring 423. The fixed plate 421 is fixed to the pressure plate 101 within the pressure hole 41, blocking the pressure hole 41. The sliding plate 422 is slidably disposed on the fixed plate 421, and the pressure plate 43 is fixed on the sliding plate 422. The fixed plate 421 has several vent holes 5 for pipe sealing plates. The vent holes 5 are located near the center of the fixed plate 421. The air pressure introduced into the pressure hole 41 by the air pump drives the sliding plate 422 to slide through the vent holes 5. The location of the vent holes 5 near the center of the fixed plate 421 allows for more concentrated air pressure, thus driving the sliding plate 422 more easily. In this embodiment, the vent holes 5 are located at the center of the fixed plate 421, surrounding the center of the fixed plate 421. Four vent holes 5 are provided. A guide ring 423 is fixed on the fixed plate 421. The inner wall of the guide ring 423 abuts against the outer wall of the sliding plate 422. The limiting groove 8 and the limiting ring 9 cooperate to limit the pressurization stroke of the pressure plate 43, reducing the probability that the pressure plate 43 will directly crush the ceramic plate due to excessive pressure. At the same time, it can also reduce the probability that the pressure plate 43 will detach from the pressure plate 101. The fixed plate 421 is installed on the pressure plate 101 by a number of circumferential fixing bolts 7. The guide ring 423 is installed on the pressure plate 101 by the same batch of fixing bolts 7 used to install the fixed plate 421. A guide rod 6 is fixed on the sliding plate 422. The guide rod 6 is inserted into one of the vent holes 5 of the fixed plate 421. In this embodiment, the guide rod 6 is inserted into the vent hole 5 at the center of the fixed plate 421.

[0035] Reference Figure 2 and Figure 3 A limiting groove 8 is provided on the inner wall of the guide ring 423, and a limiting ring 9 is installed on the sliding plate 422. The limiting ring 9 is slidably set in the limiting groove 8. The limiting groove 8 and the limiting ring 9 cooperate to limit the pressure stroke of the pressure plate 43, reduce the probability that the pressure plate 43 will directly crush the ceramic plate due to excessive pressure, and also reduce the probability that the pressure plate 43 will detach from the pressure plate 101.

[0036] Reference Figure 2 and Figure 3 Sealing rings 10 are provided at the connection between pressure plate 101 and fixed plate 421, the connection between pressure plate 101 and guide ring 423, the connection between guide ring 423 and sliding plate 422, and the connection between cover plate 44 and pressure plate 101. In this embodiment, sealing rings 10 are made of sealing rubber with deformation capability. The setting of sealing rings 10 can reduce gas leakage, thereby ensuring the stability of gas pressure in pressurization hole 41.

[0037] The implementation principle of this application embodiment is as follows: the wafer 3 is mounted on the ceramic disk 2 and the ceramic disk 2 is made to abut against the pressure plate 101. By adjusting the clamping block 102, the clamping block 102 is made to abut against the ceramic disk 2 and clamp and fix the ceramic disk 2 in the circumferential direction. Then, the pressure plate 101 is mounted on the polishing equipment and the air inlet 45 is connected to the air pump. The air pump fills the pressure hole 41 with air and drives the pressure plate 43 to slide, thereby applying pressure to the central area of ​​the ceramic disk 2. The wafer 3 is abutted against the polishing disk surface and the pressure plate 101 is rotated so that the polishing disk surface polishes the surface of the wafer 3. During the polishing process, polishing liquid can be injected between the polishing disk surface and the wafer 3 according to actual needs.

[0038] It should be noted that the above embodiments are only used to illustrate this application and are not intended to limit the technical solutions described in this application. Although this specification has described this application in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to this application. All technical solutions and improvements that do not depart from the spirit and scope of this application should be covered within the scope of the claims of this application.

Claims

1. A fixing device with a central pressure structure, comprising a main polishing head (1), the main polishing head (1) comprising a pressure plate (101) and a plurality of clamping blocks (102) mounted circumferentially on the pressure plate (101), a ceramic disk (2) being disposed abutting against one side of the pressure plate (101), the plurality of clamping blocks (102) being abutting against the circumferential of the ceramic disk (2), and a plurality of wafers (3) being uniformly disposed on the side of the ceramic disk (2) away from the pressure plate (101), characterized in that: The pressure plate (101) is provided with a pressurizing component (4). The pressurizing component (4) includes a pressurizing hole (41), a piston structure (42), a pressurizing plate (43), a cover plate (44), and an air inlet (45). The pressurizing hole (41) is opened in the center of the pressure plate (101) and penetrates the pressure plate (101). The piston structure (42) is slidably disposed in the pressurizing hole (41) and blocks the pressurizing hole (41). The pressurizing plate (43) is installed on the side of the piston structure (42) facing the ceramic disk (2). The cover plate (44) is installed on the pressure plate (101) on the side of the pressure plate (101) away from the ceramic disk (2) and closes the pressurizing hole (41). The air inlet (45) is installed on the cover plate (44) and connects to the pressurizing hole (41).

2. The fixing device with a central pressure structure according to claim 1, characterized in that: The piston structure (42) includes a fixed plate (421) and a sliding plate (422). The fixed plate (421) is fixed on the pressure plate (101) inside the pressure hole (41). The fixed plate (421) blocks the pressure hole (41). The sliding plate (422) is slidably disposed on the fixed plate (421). The pressure plate (43) is fixed on the sliding plate (422). The fixed plate (421) has a plurality of vent holes (5) for pipe sealing plates. The vent holes (5) are located near the center of the fixed plate (421).

3. A fixing device with a central pressure structure according to claim 2, characterized in that: A guide rod (6) is fixed on the sliding plate (422), and the guide rod (6) is inserted into one of the ventilation holes (5) of the fixed plate (421).

4. A fixing device with a central pressure structure according to claim 3, characterized in that: The piston structure (42) also includes a guide ring (423), which is fixed on the fixed plate (421) and the inner wall of the guide ring (423) abuts against the outer wall of the sliding plate (422).

5. A fixing device with a central pressure structure according to claim 4, characterized in that: The fixing plate (421) and the guide ring (423) are mounted on the pressure plate (101) by the same fixing bolt (7).

6. A fixing device with a central pressure structure according to claim 5, characterized in that: A limiting groove (8) is provided on the inner wall of the guide ring (423), and a limiting ring (9) is installed on the sliding plate (422). The limiting ring (9) is slidably disposed in the limiting groove (8).

7. A fixing device with a central pressure structure according to claim 6, characterized in that: Sealing rings (10) are provided at the connection between the pressure plate (101) and the fixed plate (421), the connection between the pressure plate (101) and the guide ring (423), the connection between the guide ring (423) and the sliding plate (422), and the connection between the cover plate (44) and the pressure plate (101).

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