Frying and baking machine

Abstract

The frying and baking machine comprises a lower baking tray assembly, the lower baking tray assembly comprises a base and a lower baking tray arranged on the base, the base comprises a lower shell and a base, part of the area of the lower shell sinks to form a concave cavity matched with the lower baking tray, an inner cavity is formed between the lower shell and the base, the lower shell is provided with a first heat insulation rib extending downwards, and the lower shell is provided with a second heat insulation rib extending downwards. The base is provided with a second heat insulation rib extending upwards, the first heat insulation rib and the second heat insulation rib are matched with each other to divide the inner cavity into a first area wrapping the concave cavity and a second area far away from the concave cavity, and a circuit board is arranged in the second area; the first heat insulation ribs and the second heat insulation ribs are distributed in a staggered mode in the horizontal direction so that projections of the first heat insulation ribs and the second heat insulation ribs in the vertical direction can be partially overlapped. Through the arrangement, the heat insulation thickness between the first area and the second area can be increased, and heat transfer from the first area to the second area is further reduced, so that the temperature rise of the circuit board is reduced, and the temperature of the environment where the circuit board is located can meet the requirement for normal work of the circuit board.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of kitchen appliances, and particularly relates to a frying and baking machine. BACKGROUND

[0002] At present, frying and baking machines are widely used in people's life, and can heat food on both sides at the same time, and are commonly used for frying or baking food. When consumers choose a frying and baking machine, they generally prefer an electronic control frying and baking machine, which can better interact with users. However, due to the small internal space of the frying and baking machine and the continuous generation of high temperature during work, the internal temperature is high, which leads to damage of the electronic control core element line board due to high temperature. To solve this problem, the prior art usually increases the internal space or adds a heat insulating piece to reduce the temperature at the line board, but the prior art scheme will cause problems such as high cost, large product size, and affecting appearance.

[0003] For example, the prior art discloses a frying and baking machine, which comprises a body and an upper cover, the body comprises a base, a line board mounted on the front part of the base, a baking tray mounted on the top surface of the base, a heating body mounted below the baking tray, and a bottom cover mounted below the base, the bottom cover and the base form a cavity for mounting the line board, and the line board is provided with heat insulation cotton on the side facing the heating body, so as to prevent the line board from being unable to be normally used due to the too high ambient temperature. In use, the line board is connected with an external power supply and controls the working of the heating body, and the heat insulation cotton can effectively reduce the heat transfer to the line board. However, the frying and baking machine with such a structure has the following defects: the frying and baking machine is usually used in a humid environment such as a kitchen, the heat insulation cotton has good heat insulation effect, but can absorb moisture in the air and has certain conductivity, which leads to short circuit of the line board due to contact with the heat insulation cotton, and affects the service life of the line board.

[0004] For example, the prior art discloses a frying and baking machine, which comprises a body and an upper cover, the body comprises a base, a circuit board mounted at the front of the base, a baking tray mounted on the top surface of the base, a heating body mounted below the baking tray, and a bottom cover mounted below the base, the bottom cover and the base enclose a cavity for mounting the circuit board, the bottom surface of the base is provided with an upper baffle, the top surface of the bottom cover is provided with a lower baffle, the upper baffle and the lower baffle are vertically connected to divide the cavity into a heat insulation cavity and a heat dissipation cavity, the circuit board is mounted in the heat insulation cavity, and the heat dissipation cavity is located between the heat insulation cavity and the baking tray. The upper baffle and the lower baffle are arranged on the original base and the bottom cover respectively, and the heat insulation cavity for mounting the circuit board and the heat dissipation cavity for isolating the heating body and the circuit board are formed, the heat dissipation cavity is located between the heating body and the heat insulation cavity, and the heat dissipation cavity plays a role in blocking the heat transfer to the heat insulation cavity, so as to ensure that the environment temperature in the heat insulation cavity meets the requirement of normal work of the circuit board. The vertical connection mode of the upper baffle and the lower baffle puts forward very high requirements on the machining precision and the assembly precision, greatly improves the machining cost of the frying and baking machine. Moreover, the thickness of the upper baffle and the lower baffle is limited due to the limitation of the mounting space, and the heat insulation effect is also limited, and it is found that the heat insulation effect is poor in actual use. Practical new type content

[0005] The present application provides a frying and baking machine to solve the technical problems of high heat insulation cost and poor heat insulation effect of the existing frying and baking machine.

[0006] The technical scheme adopted by the present application is:

[0007] A frying and baking machine, comprising an upper baking tray assembly and a lower baking tray assembly, the lower baking tray assembly comprising a base and a lower baking tray arranged on the base, the base comprising a lower shell and a bottom seat located below the lower shell, a part of the lower shell is sunken to form a concave cavity matched with the lower baking tray, an internal cavity is formed between the lower shell and the bottom seat, the lower shell is provided with a first heat insulation rib extending downward, the bottom seat is provided with a second heat insulation rib extending upward, the first heat insulation rib and the second heat insulation rib cooperate with each other to divide the internal cavity into a first area surrounding the concave cavity and a second area away from the concave cavity, and a circuit board is arranged in the second area; the first heat insulation rib and the second heat insulation rib are staggered in the horizontal direction, so that their projections in the vertical direction at least partially overlap.

[0008] The concave cavity formed by sinking part of the lower shell and matching the lower baking tray provides guidance for the installation and positioning of the lower baking tray, facilitates the quick assembly of the lower baking tray to the base, and also realizes the compact layout of the lower baking tray assembly, which helps to thin the design of the entire frying and baking machine. However, such a design also brings the problem that the heating device for heating the lower baking tray is closer to the internal cavity of the base, thereby causing the problem of upgrading of the heat radiation of the heating device to the internal cavity during the operation of the frying and baking machine. Generally, the circuit board is arranged in the internal cavity of the base, which will cause the temperature rise of the circuit board to increase. In view of this, the lower shell of the present application is provided with a first heat insulation rib extending downward, and the base is provided with a second heat insulation rib extending upward. The first heat insulation rib and the second heat insulation rib cooperate with each other to divide the internal cavity into a first region surrounding the concave cavity and a second region away from the concave cavity. The circuit board is arranged in the second region. The separation arrangement of the first region and the second region will have a preliminary blocking effect on the heat transfer. The first heat insulation rib and the second heat insulation rib are staggered in the horizontal direction, so that their vertical projections at least partially overlap, thereby improving the heat insulation thickness between the first region and the second region, further reducing the heat transfer from the first region to the second region, thereby reducing the temperature rise of the circuit board, and enabling the ambient temperature of the circuit board to meet the normal working requirements of the circuit board. Moreover, the first heat insulation rib and the second heat insulation rib are staggered in the horizontal direction, which reduces the requirements for the processing precision and assembly precision of the two, and also provides more possibilities for the individualized design of the two, for example, the thicknesses of the two can be designed to be different to further improve the heat insulation effect, and for example, the shapes of the two can be set to be inconsistent to meet the individualized needs of different models.

[0009] The first heat insulation rib and the second heat insulation rib form a flow-around gap between them, which communicates the first region and the second region.

[0010] In the technical solution, the flow-around gap formed between the first heat insulation rib and the second heat insulation rib can lengthen the flow path of hot air flowing from the first region to the second region, further improving the heat insulation effect. At the same time, it can also lengthen the flow path of cold air flowing from the second region to the first region, increase the residence time of cold air in the second region, and realize sufficient heat dissipation of the circuit board located in the second region.

[0011] The overlapping height H of the projections of the first heat insulation rib and the second heat insulation rib in the vertical direction satisfies: H≥5mm.

[0012] The higher the overlapping height of the projections of the first heat insulation rib and the second heat insulation rib in the vertical direction, the more the projections of the first heat insulation rib and the second heat insulation rib overlap in the vertical direction, and the greater the heat insulation thickness of the first region and the second region in the horizontal direction compared with a single first heat insulation rib or a single second heat insulation rib, thereby reducing the heat transfer from the first region to the second region. Moreover, the first heat insulation rib and the second heat insulation rib overlap from top to bottom in the vertical direction, and the circuit board is generally arranged at a position close to the operation surface on the base in the second region, so that the overlapping of the first heat insulation rib and the second heat insulation rib from top to bottom in the vertical direction at least increases the heat insulation thickness of the region where the circuit board is arranged or the region adjacent to the circuit board, thereby further reducing the temperature rise of the circuit board.

[0013] The second heat insulation rib is located on the side of the first heat insulation rib away from the recessed cavity.

[0014] Because the lower shell is shaped to form the recessed cavity, the inner part of the lower shell extends downward to form part of the side wall of the recessed cavity, so that the redundant space in the lower shell is limited. The second heat insulation rib is arranged on the side of the first heat insulation rib away from the recessed cavity, so that the space of the part of the lower shell opposite to the second region can be fully utilized to arrange the second heat insulation rib. Moreover, the first heat insulation rib is arranged on the side close to the recessed cavity, so that the first heat insulation rib can extend downward sufficiently to increase the overlapping length of the projections of the first heat insulation rib and the second heat insulation rib in the vertical direction, thereby improving the heat insulation effect and further improving the heat insulation effect.

[0015] The circuit board is arranged on the upper part of the second region, the lower part of the second region forms a heat dissipation cavity communicating with the outside, and a flow gap communicating the heat dissipation cavity and the first region is formed between the lower surface of the circuit board and the top end surface of the second heat insulation rib.

[0016] The top end surface of the second heat insulation rib is arranged lower than the lower surface of the circuit board, so that a flow gap communicating the heat dissipation cavity and the first region is formed between the top end of the second heat insulation rib and the lower surface of the circuit board. The flow gap provides a flow path for the cold air from the outside to flow from the heat dissipation cavity to the first region, so that the cold air can overflow from the heat dissipation cavity to the first region after entering the heat dissipation cavity, thereby taking away the heat on the circuit board in the flow and improving the heat dissipation efficiency of the circuit board, so that the ambient temperature of the circuit board can be maintained at a temperature at which the circuit board can work normally.

[0017] The first heat insulation rib is located on the side of the second heat insulation rib away from the recessed cavity.

[0018] The first heat insulation rib is arranged on the side of the second heat insulation rib away from the cavity, so that the gap opening between the first heat insulation rib and the second heat insulation rib faces upward, and the hot air in the first area is difficult to flow to the second area through the gap between the first heat insulation rib and the second heat insulation rib by using the principle of hot air rising and cold air sinking, so as to further reduce the heat transfer from the first area to the second area and reduce the temperature rise of the circuit board.

[0019] The lower shell is further provided with two third heat insulation ribs extending downward and located on two opposite sides of the first heat insulation rib, and the base is further provided with two fourth heat insulation ribs extending upward and located on two opposite sides of the first heat insulation rib, one end of the third heat insulation rib is connected with the first heat insulation rib, and the other end extends away from the cavity, one end of the fourth heat insulation rib is connected with the second heat insulation rib, and the other end extends away from the cavity, and the two third heat insulation ribs and the two fourth heat insulation ribs are opposite to each other and vertically abut against each other.

[0020] The third heat insulation rib and the fourth heat insulation rib are arranged, which cooperates with the first heat insulation rib and the second heat insulation rib and the lower shell and the base, so as to enclose the second area in a certain area range, so as to further reduce the heat transfer from the first area to the second area. The third heat insulation rib and the fourth heat insulation rib abut against each other in the vertical direction, so as to block the hot air in the first area, further reduce the probability of the hot air diffusing from the first area to the second area, and further reduce the temperature rise of the circuit board.

[0021] The lower shell is further provided with two third heat insulation ribs extending downward and located on two opposite sides of the first heat insulation rib, and the base is further provided with two fourth heat insulation ribs extending upward and located on two opposite sides of the first heat insulation rib, one end of the third heat insulation rib is connected with the first heat insulation rib, and the other end extends away from the cavity, one end of the fourth heat insulation rib is connected with the second heat insulation rib, and the other end extends away from the cavity, and the two third heat insulation ribs and the two fourth heat insulation ribs are opposite to each other and vertically abut against each other.

[0022] The third heat insulation rib and the fourth heat insulation rib are arranged longitudinally staggeredly, on one hand, the assembly of the lower shell and the base can be facilitated, on the other hand, the lead wire on the circuit board can be led out to the first area to realize the electrical connection with the electronic components of the upper baking tray assembly and the lower baking tray assembly through the leading-out gap formed between the third heat insulation rib and the fourth heat insulation rib, the holes are avoided to be opened on the first heat insulation rib, the second heat insulation rib, the third heat insulation rib and / or the fourth heat insulation rib, the processing difficulty of each is reduced, and the heat transfer caused by the holes is avoided.

[0023] The base is provided with a front side wall connected with the second heat insulation rib at one end and abutting against the lower shell at the other end to cooperatively enclose the second area, and a plurality of heat dissipation holes are formed in the front side wall to communicate the outside and the second area.

[0024] In the technical solution, the heat dissipation holes in the front side wall provide a medium for heat exchange between the second area and the outside, the cold air in the outside can enter the second area through the heat dissipation holes to take away the heat on the circuit board, so that the temperature rise of the circuit board is reduced.

[0025] The projection of the circuit board on the horizontal plane covers at least part of the area of the heat dissipation holes.

[0026] In the technical solution, the projection of the circuit board on the horizontal plane covers at least part of the area of the heat dissipation holes, so that part of the heat dissipation holes is directly opposite to the circuit board, and the heat dissipation efficiency of the circuit board is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0027] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and serve to explain the principles of the application, and do not limit the application in any way. In the drawings:

[0028] Figure 1 It is an exploded view of the cooking and baking machine according to one embodiment of the application;

[0029] Figure 2 It is a sectional view between the lower baking trays according to one embodiment of the application;

[0030] Figure 3 It is Figure 2 the enlarged view of A in FIG. 6;

[0031] Figure 4 It is a perspective view of the lower shell according to one embodiment of the application;

[0032] Figure 5Figure 1 is a perspective view of a base according to an embodiment of the present application.

[0033] wherein,

[0034] 1. an upper baking tray assembly;

[0035] 2. a lower baking tray;

[0036] 3. a lower housing; 31, a concave cavity; 32, a first heat insulation rib; 33, a third heat insulation rib;

[0037] 4. a base; 41, a second heat insulation rib; 42, a fourth heat insulation rib; 43, a front side wall; 44, a heat dissipation hole;

[0038] 5. a circuit board;

[0039] 6. a first area;

[0040] 7. a second area;

[0041] 8. a flow-around gap. DETAILED DESCRIPTION

[0042] In order to more clearly illustrate the overall concept of the present application, the following will be described in detail with reference to the accompanying drawings.

[0043] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one skilled in the art that the present application can be practiced without the specific details and other implementations can be employed. In other instances, well-known methods, procedures, components, and circuits have not been described in detail as not to unnecessarily obscure aspects of the present application. It will be understood that the embodiments of the present application and the features of the embodiments can be combined with each other, if not in conflict.

[0044] In addition, in the description of the present application, it should be understood that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0045] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood broadly, for example, can be fixed connection, can also be detachable connection, or can be integrated; can be mechanical connection, can also be electrical connection, or can be communication; can be directly connected, or can be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0046] In this application, unless otherwise explicitly specified and limited, a first feature is "on" or "under" a second feature can mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of the specification, the description referring to the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific feature, structure, material or characteristic being described is contained in at least one embodiment or example of the application. The illustrative representations of the above terms in the specification do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics being described can be combined in any suitable manner in one or more embodiments or examples.

[0047] As shown in Figures 1 to 3 A grilling machine, comprising an upper grill plate assembly 1 and a lower grill plate assembly, the lower grill plate assembly comprising a base and a lower grill plate 2 arranged on the base, the base comprising a lower housing 3 and a base plate 4 arranged below the lower housing 3, a part of the lower housing 3 is sunken to form a concave cavity 31 adapted to the lower grill plate 2, an internal cavity is formed between the lower housing 3 and the base plate 4, the lower housing 3 is provided with a first heat insulation rib 32 extending downward, the base plate 4 is provided with a second heat insulation rib 41 extending upward, the first heat insulation rib 32 and the second heat insulation rib 41 cooperate to divide the internal cavity into a first area 6 surrounding the concave cavity 31 and a second area 7 away from the concave cavity 31, a circuit board 5 is arranged in the second area 7; the first heat insulation rib 32 and the second heat insulation rib 41 are staggered distributed along the horizontal direction, so that the projections of the two in the vertical direction at least partially overlap.

[0048] In an embodiment, the lower grill plate 2 is detachably mounted on the base, so as to facilitate the user to detach the lower grill plate 2 for thorough cleaning. In another embodiment, the lower grill plate 2 is fixedly mounted on the base.

[0049] The recess 31 formed by the sunken part of the lower shell 3 in the application is adapted to the lower baking tray 2, which provides guidance for the installation and positioning of the lower baking tray 2, facilitates the quick assembly of the lower baking tray 2 to the base, and also realizes the compact layout of the lower baking tray assembly, which helps to thin the design of the entire grilling oven. However, such a design also brings the problem that the heating device for heating the lower baking tray 2 is closer to the internal cavity of the base, which leads to the problem of upgrading of heat radiation from the heating device to the internal cavity during the operation of the grilling oven. Generally, the circuit board 5 is arranged in the internal cavity of the base, which will cause the temperature rise of the circuit board 5 to increase. In view of this, the lower shell 3 of the application is provided with a first heat insulation rib 32 extending downward, and the base 4 is provided with a second heat insulation rib 41 extending upward. The first heat insulation rib 32 and the second heat insulation rib 41 cooperate with each other to divide the internal cavity into a first region 6 surrounding the recess 31 and a second region 7 away from the recess 31. The circuit board 5 is arranged in the second region 7. The separation of the first region 6 and the second region 7 will have a preliminary blocking effect on the heat transfer. The first heat insulation rib 32 and the second heat insulation rib 41 are staggered in the horizontal direction, so that their vertical projections at least partially overlap, thereby increasing the heat insulation thickness between the first region 6 and the second region 7, further reducing the heat transfer from the first region 6 to the second region 7, and reducing the temperature rise of the circuit board 5. The ambient temperature of the circuit board 5 can meet the normal working requirements of the circuit board 5. Moreover, the first heat insulation rib 32 and the second heat insulation rib 41 are staggered in the horizontal direction, which reduces the requirements for the processing precision and assembly precision of the two, and also provides more possibilities for the individualized design of the two, for example, the thicknesses of the two can be designed to be different to further improve the heat insulation effect, and for example, the shapes of the two can be set to be inconsistent to meet the individualized needs of different models.

[0050] In the application, the first heat insulation rib 32 and the second heat insulation rib 41 are staggered in the horizontal direction, so that the first heat insulation rib 32 and the second heat insulation rib 41 have a horizontal interval in the horizontal direction. The actual presentation of the horizontal interval can adopt any one of the following embodiments:

[0051] Embodiment one: This embodiment is not shown. In this embodiment, the first heat insulation rib and the second heat insulation rib are coated with heat insulation glue, which blocks the horizontal interval between the two. The presence of the heat insulation glue can not only block the overflow path of hot air from the first region to the second region, but also increase the heat insulation thickness between the first region and the second region, further reducing the heat transfer from the first region to the second region.

[0052] Embodiment two: As Figure 2 and Figure 3As shown, the flow-through gap 8 is formed between the first heat insulation rib 32 and the second heat insulation rib 41, and connects the first region 6 and the second region 7. That is, in the second embodiment, the horizontal interval between the first heat insulation rib 32 and the second heat insulation rib 41 is designed in an open type and is not sealed. In the second embodiment, the flow-through gap 8 formed between the first heat insulation rib 32 and the second heat insulation rib 41 can prolong the flow path of the hot air flowing from the first region 6 to the second region 7, further improve the heat insulation effect, and at the same time, can prolong the flow path of the cold air flowing from the second region 7 to the first region 6, increase the residence time of the cold air in the second region 7, and achieve sufficient heat dissipation of the circuit board 5 located in the second region 7.

[0053] Preferably, as shown in the following embodiments, the first heat insulation rib 32 and the second heat insulation rib 41 are arranged in a staggered manner in the horizontal direction. Figure 3 As shown, the width dimension d of the flow-through gap 8 in the horizontal direction satisfies: 0 < d ≤ 1.5 mm. In this way, the space layout in the internal cavity can be considered, and effective heat insulation between the first region 6 and the second region 7 can be achieved.

[0054] As a preferred embodiment of the present application, as shown in the following embodiments, the first heat insulation rib 32 and the second heat insulation rib 41 are arranged in a staggered manner in the horizontal direction. Figure 3 As shown, the overlapping height H of the projections of the first heat insulation rib 32 and the second heat insulation rib 41 in the vertical direction satisfies: H ≥ 5 mm. The higher the overlapping height of the projections of the first heat insulation rib 32 and the second heat insulation rib 41 in the vertical direction, the more the projections of the first heat insulation rib 32 and the second heat insulation rib 41 overlap in the vertical direction, the greater the heat insulation thickness of the first region 6 and the second region 7 in the horizontal direction compared with a single first heat insulation rib 32 or a single second heat insulation rib 41, thereby reducing the heat transfer from the first region 6 to the second region 7. Moreover, the first heat insulation rib 32 and the second heat insulation rib 41 overlap from top to bottom in the vertical direction, and the circuit board 5 is generally arranged at a higher position in the second region 7 to be close to the operation surface on the base, so that the overlapping of the first heat insulation rib 32 and the second heat insulation rib 41 from top to bottom in the vertical direction at least increases the heat insulation thickness of the region where the circuit board 5 is located or the region adjacent to the circuit board 5, thereby further reducing the temperature rise of the circuit board 5.

[0055] Furthermore, the overlapping height of the projections of the first heat insulation rib 32 and the second heat insulation rib 41 in the vertical direction is consistent with the extension length of the one of the first heat insulation rib 32 and the second heat insulation rib 41 with shorter extension length in the vertical direction. In this way, full coverage of the projection of the one of the first heat insulation rib 32 and the second heat insulation rib 41 with shorter extension length in the vertical direction in the vertical direction can be achieved, the heat insulation thickness is further increased, and the heat transfer from the first region 6 to the second region 7 is reduced.

[0056] The relative position relationship between the first heat insulation rib 32 and the second heat insulation rib 41 in the present application can adopt any one of the following embodiments:

[0057] Embodiment three: as shown in the figure, the second heat insulation rib 41 is located on the side of the first heat insulation rib 32 away from the cavity 31. Figure 2

[0058] Because the lower shell 3 needs to be shaped into the cavity 31, the inner part of the lower shell 3 needs to extend downward to form part of the side wall of the cavity 31, so the redundant space in the lower shell 3 is limited. By setting the second heat insulation rib 41 on the side of the first heat insulation rib 32 away from the cavity 31, the space of the part of the lower shell 3 opposite to the second area 7 can be fully utilized to realize the arrangement of the second heat insulation rib 41. Moreover, by setting the first heat insulation rib 32 on the side close to the cavity 31, the first heat insulation rib 32 can be fully extended downward to realize the increase of the overlapping length of the projections of the first heat insulation rib 32 and the second heat insulation rib 41 in the vertical direction, and to improve the heat insulation effect, thereby further improving the heat insulation effect.

[0059] As a preferred embodiment of the third embodiment, as shown in the figure, Figure 2 and Figure 3 the circuit board 5 is installed on the upper part of the second area 7, the lower part of the second area 7 forms a heat dissipation cavity communicating with the outside, and there is a flow gap between the top end surface of the second heat insulation rib 41 and the lower surface of the circuit board 5. In this embodiment, the top end surface of the second heat insulation rib 41 is set to be lower than the lower surface of the circuit board 5, so that the flow gap between the top end of the second heat insulation rib 41 and the lower surface of the circuit board 5 and the first area 6 can be formed. The existence of the flow gap provides a flow path for the flow of outside cold air from the heat dissipation cavity to the first area 6, so that the outside cold air can overflow to the first area 6 after entering the heat dissipation cavity, thereby taking away the heat on the circuit board 5 in the flow, improving the heat dissipation efficiency of the circuit board 5, and keeping the ambient temperature of the circuit board 5 at a temperature that allows it to work normally.

[0060] Embodiment four: the fourth embodiment is not shown in the figure. In the fourth embodiment, the first heat insulation rib is located on the side of the second heat insulation rib away from the cavity. In the fourth embodiment, the first heat insulation rib is set on the side of the second heat insulation rib away from the cavity, so that the gap between the first heat insulation rib and the second heat insulation rib opens upward. By using the principle of hot air rising and cold air sinking, the hot air in the first area is difficult to flow to the second area 7 through the gap between the first heat insulation rib and the second heat insulation rib, thereby further reducing the heat transfer from the first area to the second area and reducing the temperature rise of the circuit board.

[0061] The enclosing method of the second area in this application can adopt any of the following embodiments;

[0062] ​Embodiment five: in the embodiment five not shown, the first heat insulation ribs extend longitudinally to respectively adjoin two opposite side walls of the lower shell, the second heat insulation ribs extend longitudinally to respectively adjoin two opposite side walls of the base, and the second region is enclosed by the first heat insulation ribs, the second heat insulation ribs, part of the lower shell and part of the base.

[0063] Embodiment six: in the embodiment six not shown, the lower shell is further provided with two third heat insulation ribs extending downward and located on two opposite sides of the first heat insulation ribs, and the base is further provided with two fourth heat insulation ribs extending upward and located on two opposite sides of the first heat insulation ribs, one end of the third heat insulation rib is connected with the first heat insulation rib and the other end extends away from the recess, one end of the fourth heat insulation rib is connected with the second heat insulation rib and the other end extends away from the recess, and the two third heat insulation ribs and the two fourth heat insulation ribs are opposite to each other and vertically abut against each other.

[0064] The embodiment six can enclose the second region in a certain area range by the third heat insulation ribs and the fourth heat insulation ribs cooperating with the first heat insulation ribs and the second heat insulation ribs and the rest of the lower shell and the base, so as to further reduce the heat transfer from the first region to the second region. The third heat insulation ribs and the fourth heat insulation ribs vertically abut against each other, which can block the hot air in the first region and further reduce the probability of the hot air spreading from the first region to the second region, so as to further reduce the temperature rise of the circuit board.

[0065] Embodiment seven: as shown in Figure 4 and Figure 5 The lower shell 3 is further provided with two third heat insulation ribs 33 extending downward and located on two opposite sides of the first heat insulation rib 32, and the base 4 is further provided with two fourth heat insulation ribs 42 extending upward and located on two opposite sides of the first heat insulation rib 32, one end of the third heat insulation rib 33 is connected with the first heat insulation rib 32 and the other end extends away from the recess 31, one end of the fourth heat insulation rib 42 is connected with the second heat insulation rib 41 and the other end extends away from the recess 31, and the two third heat insulation ribs 33 and the two fourth heat insulation ribs 42 are opposite to each other and longitudinally staggered.

[0066] The third heat insulation rib 33 and the fourth heat insulation rib 42 are staggered in the longitudinal direction, on the one hand, the lower shell 3 and the base 4 can be assembled conveniently, on the other hand, the third heat insulation rib 33 and the fourth heat insulation rib 42 can form a lead-out gap between them, which is convenient for leading out the lead of the circuit board 5 to the first area 6 to realize electrical connection with the electronic components of the upper baking tray assembly 1 and the lower baking tray assembly, avoids opening holes on the first heat insulation rib 32, the second heat insulation rib 41, the third heat insulation rib 33 and / or the fourth heat insulation rib 42, reduces the processing difficulty of each, and can also avoid heat transfer caused by opening holes.

[0067] As a preferred embodiment of the present application, as shown in Figure 5 The base 4 is provided with a front side wall 43 connected to the second heat insulation rib 41 at one end and abutting against the lower shell 3 at the other end to cooperate to enclose the second area 7, and a plurality of heat dissipation holes 44 are formed in the front side wall 43 to communicate with the outside and the second area 7. The arrangement of the heat dissipation holes 44 in the front side wall 43 provides a medium for heat exchange between the second area 7 and the outside, and cold air from the outside can enter the second area 7 through the heat dissipation holes 44 to carry away the heat on the circuit board 5, thereby reducing the temperature rise of the circuit board 5.

[0068] The shape and arrangement of the heat dissipation holes 44 are not limited in the present embodiment, which can be long strip, grid, round hole, rectangle, etc.

[0069] As a preferred example in the present embodiment, the projection of the circuit board 5 on the horizontal plane covers at least part of the area of the heat dissipation holes 44. Such an arrangement can make part of the heat dissipation holes 44 directly face the circuit board 5, thereby further improving the heat dissipation efficiency of the circuit board 5.

[0070] The places not mentioned in the present application can be realized by using or referring to the existing technology.

[0071] Each embodiment in the present specification is described in a progressive manner, and the same or similar parts between each embodiment can be referred to each other, and each embodiment mainly describes the differences from other embodiments.

[0072] The above is only an embodiment of the present application and is not used to limit the present application. The technical features or structures in the foregoing different embodiments can be combined as needed to form other specific technical solutions. For those skilled in the art, the present application can have various changes and variations. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the scope of the claims of the present application.

Claims

1. A grill, comprising an upper grill plate assembly and a lower grill plate assembly, the lower grill plate assembly comprising a base and a lower grill plate disposed on the base, the base comprising a lower housing and a pedestal located below the lower housing, a portion of the lower housing being sunken to form a recessed cavity adapted to the lower grill plate, characterized in that, An inner cavity is formed between the lower shell and the base, the lower shell is provided with first heat insulation ribs extending downward, the base is provided with second heat insulation ribs extending upward, the first heat insulation ribs and the second heat insulation ribs cooperate to divide the inner cavity into a first region surrounding the concave cavity and a second region away from the concave cavity, and a circuit board is arranged in the second region; the first heat insulation ribs and the second heat insulation ribs are staggered in the horizontal direction so that their projections in the vertical direction at least partially overlap.

2. The cooking and roasting machine according to claim 1, characterized in that, A flow-through gap is formed between the first heat insulation ribs and the second heat insulation ribs, and the flow-through gap connects the first region and the second region.

3. The cooking and roasting machine according to claim 1, characterized in that, The overlapping height H of the projections of the first heat insulation ribs and the second heat insulation ribs in the vertical direction satisfies H≥5 mm.

4. The cooking and roasting machine according to claim 1, characterized in that, The second heat insulation ribs are located on the side of the first heat insulation ribs away from the concave cavity.

5. The cooking and roasting machine according to claim 4, characterized in that, The circuit board is arranged at the upper part of the second region, the lower part of the second region forms a heat dissipation cavity connected to the outside, and a flow-through gap exists between the lower surface of the circuit board and the top end surface of the second heat insulation ribs, and the flow-through gap connects the heat dissipation cavity and the first region.

6. The cooking and roasting machine according to claim 1, characterized in that, The first heat insulation ribs are located on the side of the second heat insulation ribs away from the concave cavity.

7. The cooking and roasting machine according to claim 1, characterized in that, The lower shell is further provided with two third heat insulation ribs extending downward and located on the two opposite sides of the first heat insulation ribs, and the base is further provided with two fourth heat insulation ribs extending upward and located on the two opposite sides of the first heat insulation ribs, one end of the third heat insulation rib is connected to the first heat insulation rib, and the other end extends away from the concave cavity, one end of the fourth heat insulation rib is connected to the second heat insulation rib, and the other end extends away from the concave cavity, and the two third heat insulation ribs and the two fourth heat insulation ribs are opposite to each other and vertically abut against each other.

8. The cooking and roasting machine according to claim 1, characterized in that, The lower shell is further provided with two third heat insulation ribs extending downward and located on the two opposite sides of the first heat insulation ribs, and the base is further provided with two fourth heat insulation ribs extending upward and located on the two opposite sides of the first heat insulation ribs, one end of the third heat insulation rib is connected to the first heat insulation rib, and the other end extends away from the concave cavity, one end of the fourth heat insulation rib is connected to the second heat insulation rib, and the other end extends away from the concave cavity, and the two third heat insulation ribs and the two fourth heat insulation ribs are opposite to each other and longitudinally staggered.

9. The cooking and roasting machine according to claim 1, characterized in that, The base is provided with a front side wall connected with the second heat insulation rib at one end and abutting against the lower shell at the other end to cooperate to enclose the second area, and a plurality of heat dissipation holes are formed in the front side wall to communicate with the outside and the second area.

10. The grill according to claim 9, wherein, The projection of the circuit board on the horizontal plane covers at least part of the area of the heat dissipation holes.

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