Solid-phase gene chip packaging box
By designing a solid-phase gene chip packaging box suitable for two chip specifications, and using the retaining part to contact and fix it with the protective film, the problem of poor packaging box versatility was solved, and cost reduction and volume optimization were achieved.
Patent Information
- Application Number
- CN202520437269.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-13
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-03-13
AI Technical Summary
The existing packaging boxes used for solid-phase gene chips have poor versatility, resulting in high production costs.
Design a solid-phase gene chip packaging box, including a receiving slot and a retaining part, which can be used for two different sizes of chips. The chips are fixed by contacting the retaining part with the protective film, thereby reducing production costs.
The packaging box has been made more versatile, reducing production costs. The size and height of the packaging box have been reduced by optimizing the clamping method, thus preventing damage to the chip.
Smart Images
Figure CN223822424U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of solid-phase gene chip technology, specifically relating to a solid-phase gene chip packaging box. Background Technology
[0002] Solid-phase gene chips are a gene detection technology based on a solid substrate. They utilize the principle of nucleic acid hybridization to achieve parallel detection of a large number of SNPs (single nucleotide polymorphisms) in DNA samples by immobilizing high-density oligonucleotide probes. With the booming development of the solid-phase gene chip industry, the types and models of these chips are increasing, leading to higher requirements for chip packaging. Packaging boxes used for solid-phase gene chips serve as important protective carriers during transportation, storage, and sales, effectively preventing physical damage such as collisions and compression during transport.
[0003] Currently, most packaging boxes used for solid-phase gene chips on the market have certain limitations. One prominent problem is poor versatility; a single packaging box is often only suitable for one specific model of solid-phase gene chip. When different models of solid-phase gene chips need to be packaged, the corresponding packaging box must be changed, and different packaging boxes require different production equipment, resulting in high production costs. Utility Model Content
[0004] The technical problem this application aims to solve is that existing packaging boxes for solid-phase gene chips have poor versatility. To solve this problem, this application provides a solid-phase gene chip packaging box with better versatility.
[0005] The technical solution proposed in this application is as follows:
[0006] A solid-phase gene chip packaging box, comprising:
[0007] The housing has a receiving slot for accommodating a first chip or a second chip. The side wall of the receiving slot has a first holding part and a second holding part, with the first holding part located below the second holding part.
[0008] The first chip and the second chip are respectively covered with a first protective film and a second protective film; the first holding part can abut against the upper surface of the first protective film, and the second holding part can abut against the side of the second protective film.
[0009] The solid-phase gene chip packaging box described above allows for the placement of either a first chip or a second chip within the receiving slot. The first chip can be secured using a first retaining part, while the second chip can be secured using a second retaining part. This design makes the packaging box suitable for packaging two types of chips, improving its versatility and reducing production costs.
[0010] In addition, the second holding part abuts against the side of the second protective film to fix the second protective film and the second chip. Compared with pressing and fixing from above the second protective film, this method can reduce the height of the packaging box and reduce the volume of the packaging box while fixing the second chip.
[0011] Furthermore, the two opposite sidewalls of the receiving groove are each provided with the first retaining portion and the second retaining portion.
[0012] Furthermore, the first retaining part has an arc-shaped retaining surface, the top end of the arc-shaped retaining surface gradually approaches the side wall of the receiving groove from the bottom end, and the bottom end of the arc-shaped retaining surface is connected to the side wall of the receiving groove.
[0013] Furthermore, the first card-holding part and the second card-holding part are integrally formed.
[0014] Furthermore, the box body also has a loading and unloading slot that communicates with the receiving slot.
[0015] Furthermore, both the first retaining portion and the second retaining portion extend along the length direction of the box body.
[0016] Furthermore, the solid-phase gene chip packaging box also includes a cover, which is detachably connected to the box body to close the receiving slot when connected to the box body.
[0017] Furthermore, the box body is also provided with a slot, and the receiving groove is provided at the bottom of the slot; a snap-fit part is provided on one side of the cover body, and the snap-fit part is engaged with the slot.
[0018] Furthermore, the box body is made of plastic.
[0019] A solid-phase gene chip packaging box, comprising:
[0020] The housing has a receiving slot for accommodating a first chip and a second chip. The side wall of the receiving slot has a first holding part and a second holding part, with the first holding part located below the second holding part.
[0021] The first chip is located below the second chip, and the upper surfaces of the first chip and the second chip are respectively covered with a first protective film and a second protective film; the first holding part can abut against the upper surface of the first protective film, and the first holding part can support the second chip, while the second holding part can abut against the side of the second protective film. Attached Figure Description
[0022] The accompanying drawings are provided to further understand this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof.
[0023] Figure 1 This is a schematic diagram of the structure of a solid-phase gene chip packaging box provided in an embodiment of this application;
[0024] Figure 2 for Figure 1 The diagram shows a top view of the solid-phase gene chip packaging box.
[0025] Figure 3 This is a schematic diagram of the structure of the housing and the first chip in the first embodiment;
[0026] Figure 4 This is a schematic diagram of the structure of the housing and the second chip in the first embodiment.
[0027] Label Explanation:
[0028] 100. Box body; 110. Receiving groove; 111. First holding part; 112. Second holding part; 113. Arc-shaped holding surface; 120. Card slot; 130. Removal and placement slot; 140. Protective groove; 150. Hollowed-out groove; 200. Cover body; 210. Snap-fit part; 21. First chip; 22. First protective film; 31. Second chip; 32. Second protective film. Detailed Implementation
[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0030] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the equipment or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0031] This application provides a solid-phase gene chip packaging box (hereinafter referred to as the solid-phase gene chip packaging box) that can hold two types of solid-phase gene chips, has good versatility, and does not require two different packaging boxes when packaging two types of solid-phase gene chips, which can reduce production and management costs.
[0032] like Figures 1 to 4 As shown, in the first embodiment, the solid-phase gene chip packaging box includes a box body 100. The box body 100 has a receiving groove 110 for accommodating the first chip 21 or the second chip 31. The side wall of the receiving groove 110 has a first holding part 111 and a second holding part 112, and the first holding part 111 is located below the second holding part 112, that is, the first holding part 111 is closer to the bottom of the receiving groove 110.
[0033] The upper surface of the first chip 21 and the upper surface of the second chip 31 are respectively covered with a first protective film 22 and a second protective film 32; the first holding part 111 can abut against the upper surface of the first protective film 22 to fix the first chip 21 in the receiving groove 110; the second holding part 112 can abut against the side of the second protective film 32, thereby fixing the second chip 31 holding part in the receiving groove 110 by holding and fixing the second protective film 32.
[0034] It should be noted that in this embodiment, both the first chip 21 and the second chip 31 are solid-phase gene chips, but their specifications are different. For example, the first chip 21 is a 24-position solid-phase gene chip, which can hold 24 samples; the second chip 31 is a 96-position solid-phase gene chip, which can hold 96 samples, and the thickness of the first protective film 22 on the first chip 21 is less than the thickness of the second protective film 32 on the second chip 31. Of course, in other embodiments, the first chip 21 and the second chip 31 can also be solid-phase gene chips of other specifications.
[0035] The solid-phase gene chip packaging box described above allows for the placement of either a first chip 21 or a second chip 31 within the receiving slot 110. The first chip 21 can be secured by the first holding part 111, while the second chip 31 can be secured by the second holding part 112. This design makes the packaging box suitable for packaging two types of solid-phase gene chips, improving its versatility and reducing production costs.
[0036] In addition, the second holding part 112 abuts against the side of the second protective film 32 to fix the second protective film 32 and the second chip 31. Compared with pressing and fixing from above the second protective film 32, this method can reduce the height of the packaging box and reduce the volume of the packaging box while fixing the second chip 31.
[0037] It should be explained that, as mentioned above, the second chip 31 is larger than the first chip 21, and the thickness of the first protective film 22 is less than the thickness of the second protective film 32. Therefore, the first retaining part 111 can abut against the upper surface of the first protective film 22 to fix the first chip 21. If the second chip 31 is fixed by abutting against the upper surface of the second protective film 32, the height of the retaining part will be relatively high, which will also increase the overall height and volume of the packaging box. In addition, both the first retaining part 111 and the second retaining part 112 are in contact with the protective film, which can prevent damage to the chip.
[0038] In the first embodiment, the packaging box can package either the first chip 21 or the second chip 31, that is, it can be used to package two types of solid-phase gene chips, which has good versatility. It eliminates the need to set up two different devices for the preparation of the packaging box, thus reducing production costs.
[0039] In the second embodiment, the receiving slot 110 in the packaging box can also simultaneously hold the first chip 21 and the second chip 31. The first chip 21 is located below the second chip 31, and the first holding part 111 abuts against the upper surface of the first protective film 22 to fix the first chip 21. The first holding part 111 can also support the second chip 31, while the second holding part 112 can abut against the side of the second protective film 32 to fix the second chip 31. In this case, the packaging box can also be used for packaging the first chip 21 and the second chip 31, which has better versatility. Moreover, it can simultaneously hold the first chip 21 and the second chip 31, further reducing production and packaging costs.
[0040] It should be noted that, in this application, the first chip 21 and the second chip 31 are preferably packaged separately. Unless otherwise stated below, the structure of the first embodiment shall prevail. However, if the features introduced below do not conflict with the structure of the second embodiment, those skilled in the art can apply them to the second embodiment.
[0041] Please see Figure 1 In one embodiment, the solid-phase gene chip packaging box further includes a cover 200, which is detachably connected to the box body 100 to seal the receiving groove 110 when connected to the box body 100, ensuring the airtightness of the chip's environment and preventing impurities from the external environment from entering and contaminating the chip. In practical applications, the cover 200 and the box body 100 are locked together.
[0042] Please also refer to Figure 2In one embodiment, the housing 100 is further provided with a slot 120, and a receiving groove 110 is provided at the bottom of the slot 120; a latching part 210 is provided on one side of the cover 200, and the latching part 210 latches with the slot 120 to realize the latching connection between the cover 200 and the housing 100. Furthermore, when the cover 200 is connected to the housing 100, the latching part 210 can also extend into the receiving groove 110, and when the second chip 31 is placed in the receiving groove 110, the latching part 210 can abut against the upper surface of the second protective film 32, thereby further improving the stability of the second chip 31.
[0043] In one embodiment, the housing 100 also has a pick-and-place slot 130 communicating with the receiving slot 110, which facilitates the picking and placing of chips. Specifically... Figure 2 In the embodiment shown, there are two pick-up and put-down slots 130, which are located at both ends of the receiving slot 110.
[0044] In one embodiment, the housing 100 also has a plurality of protective slots 140 communicating with the receiving slot 110, so that when the chip is rectangular, the right angle of the chip can extend into the protective slot 140. Specifically Figure 2 In the embodiment shown, there are four protective grooves 140.
[0045] Please see Figure 3 and Figure 4 In one embodiment, the bottom wall of the receiving groove 110 is also provided with a hollow groove 150. When the chip is placed at the bottom of the receiving groove 110, the hollow groove 150 can make the bottom of the chip hollow, thereby improving air permeability.
[0046] In one embodiment, the two opposite sidewalls of the receiving groove 110 are each provided with a first retaining portion 111 and a second retaining portion 112 to ensure that the first chip 21 or the second chip 31 is stably fixed in the receiving groove 110. Furthermore, both the first retaining portion 111 and the second retaining portion 112 extend along the length of the housing 100 to increase the contact area between the retaining portion and the protective film, thereby improving retaining stability. In addition, compared to the dot-protrusion retaining method, the contact area between the retaining portion and the protective film is larger, which can avoid the severe local deformation of the protective film caused by dot-protrusion, leading to chip leakage.
[0047] In one embodiment, the first holding portion 111 and the second holding portion 112 are integrally disposed to further facilitate the processing of the housing 100. It is understood that this feature applies to the first embodiment. In the second embodiment, the second chip 31 is placed on the first holding portion 111, and the first holding portion 111 and the second holding portion 112 are arranged at intervals.
[0048] In one embodiment, the first retaining portion 111 has an arc-shaped retaining surface 113, which is located on the side of the first retaining portion 111 away from the sidewall. The top and bottom of the arc-shaped retaining surface 113 gradually approach the sidewall of the receiving groove 110, and the bottom of the arc-shaped retaining surface 113 is connected to the sidewall of the receiving groove 110. Thus, in the first embodiment, the arc-shaped retaining surface 113 can both retain and fix the first chip 21, and reduce the deformation of the bottom of the second protective film 32 when the second chip 31 is placed, thereby preventing leakage of the second chip 31.
[0049] It should be explained that, in the first embodiment, both the first chip 21 and the second chip 31 are placed at the bottom of the receiving groove 110 and are both located below the first holding portion 111. The first protective film 22 is located below the first holding portion 111, and its upper surface abuts against the first holding portion 111; the second protective film 32 passes through the first holding portion 111 and extends into the space between the second holding portions 112, so the arc-shaped holding surface 113 can reduce the deformation of the bottom of the second protective film 32, thus preventing leakage of the second chip 31.
[0050] In one embodiment, both the housing 100 and the cover 200 are made of plastic. Since plastic has a certain degree of plasticity, it can facilitate the placement of the chip while holding and fixing it, thus avoiding damage to the chip during placement.
[0051] In summary, the solid-phase gene chip packaging box provided in this application has at least the following advantages:
[0052] 1. The receiving slot 110 can hold the first chip 21 and / or the second chip 31, which has good versatility and does not require two different production equipment, resulting in lower production costs;
[0053] 2. The second holding part 112 abuts against the side of the second protective film 32, reducing the overall height of the box body 100 and reducing the volume of the packaging box;
[0054] 3. The first holding part 111 adopts an arc-shaped holding surface 113, which can not only hold and fix the first chip 21, but also reduce the deformation of the bottom of the second protective film 32 when the second chip 31 is placed, thus preventing the second chip 31 from leaking liquid.
[0055] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A solid-phase gene chip packaging box, characterized in that, include: The housing has a receiving slot for accommodating a first chip or a second chip. The side wall of the receiving slot has a first holding part and a second holding part, with the first holding part located below the second holding part. The first chip and the second chip are respectively covered with a first protective film and a second protective film; the first holding part can abut against the upper surface of the first protective film, and the second holding part can abut against the side of the second protective film.
2. The solid-phase gene chip packaging box according to claim 1, characterized in that, The receiving groove has a first retaining part and a second retaining part on each of its two opposite side walls.
3. The solid-phase gene chip packaging box according to claim 1, characterized in that, The first retaining part has an arc-shaped retaining surface, the top end of the arc-shaped retaining surface gradually approaches the side wall of the receiving groove from the bottom end, and the bottom end of the arc-shaped retaining surface is connected to the side wall of the receiving groove.
4. The solid-phase gene chip packaging box according to claim 1, characterized in that, The first card holder and the second card holder are integrally formed.
5. The solid-phase gene chip packaging box according to claim 1, characterized in that, The box body also has a retrieval slot that communicates with the receiving slot.
6. The solid-phase gene chip packaging box according to claim 1, characterized in that, Both the first retaining portion and the second retaining portion extend along the length direction of the box body.
7. The solid-phase gene chip packaging box according to claim 1, characterized in that, It also includes a cover that is detachably connected to the housing to close the receiving slot when connected to the housing.
8. The solid-phase gene chip packaging box according to claim 7, characterized in that, The box body is also provided with a slot, and the receiving groove is provided at the bottom of the slot; a snap-fit part is provided on one side of the cover, and the snap-fit part is engaged with the slot.
9. The solid-phase gene chip packaging box according to claim 1, characterized in that, The box is made of plastic.
10. A solid-phase gene chip packaging box, characterized in that, include: The housing has a receiving slot for accommodating a first chip and a second chip. The side wall of the receiving slot has a first holding part and a second holding part, with the first holding part located below the second holding part. The first chip is located below the second chip, and the upper surfaces of the first chip and the second chip are respectively covered with a first protective film and a second protective film; the first holding part can abut against the upper surface of the first protective film, and the first holding part can support the second chip, while the second holding part can abut against the side of the second protective film.
Citation Information
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