Glasses frame assembly and AR glasses
By setting specific airflow holes on the temples of AR glasses, the problems of insufficient heat dissipation of the main chip and temple breakage were solved, achieving efficient heat dissipation and structural stability, and improving the user experience.
Patent Information
- Application Number
- CN202520577537.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2026-03-17
- Estimated Expiration
- 2035-03-28
AI Technical Summary
The heat dissipation method of the main chip in existing AR glasses causes heat buildup in the temples, affecting the realization of product functions, and the openings in the temples increase the risk of breakage.
Multiple airflow holes are set on the temple, including a first airflow hole directly above the main chip and a second airflow hole directly below it. The hole diameter and hole spacing are controlled to form effective air convection, improve heat dissipation efficiency, and avoid insufficient rigidity of the temple by limiting the relationship between hole diameter and hole spacing.
The main chip's heat dissipation efficiency has been improved, reducing the risk of temple breakage, decreasing the possibility of dust entering the temple, and enhancing the comfort of using AR glasses.
Smart Images
Figure CN224005360U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of AR glasses technology, and in particular to a frame assembly and AR glasses. Background Technology
[0002] As AR glasses become more powerful, the computing power of the main chip increases, but so does the heat generated by the chip. Currently, there are two main chip placement methods: one is to vertically stack it with the display screen mounted on the frame. Since the display screen is located at the brow bone and also generates a lot of heat during operation, the combined heat from both causes the display screen temperature to rise significantly, reducing comfort at the brow bone. The other method is to integrate it into the temples. Because the temples are usually fully enclosed, the heat from the main chip can only be indirectly conducted to the outside through the temples. The small heat exchange area leads to a large amount of heat accumulation at the main chip location in the temples during long-term use, causing the main chip to reduce its frequency and affecting the full realization of the product's functions.
[0003] Existing AR glasses use holes in the temples near the main chip to allow heat to escape with the air. However, these holes reduce the rigidity of the temples, increasing the risk of breakage during repeated folding and use. Utility Model Content
[0004] Since the existing AR glasses rely on openings in the temples for heat dissipation, which increases the risk of temple breakage, it is necessary to provide a frame assembly and AR glasses.
[0005] A frame assembly for AR glasses, comprising:
[0006] Picture frames; and
[0007] A pair of temples are respectively mounted on both sides of the frame. The temples have a mounting cavity for accommodating the circuit components of AR glasses, a plurality of first airflow holes communicating with the mounting cavity and located on the upper side wall of the temple, and a plurality of second airflow holes communicating with the mounting cavity and located on the lower side wall of the temple. The plurality of first airflow holes are located above the circuit components, and the plurality of second airflow holes are located below the circuit components.
[0008] The first airflow hole located directly above the main chip of the circuit component satisfies: 0.1≤d1 / x1≤2.0, where d1 is the diameter of the current first airflow hole and x1 is the hole spacing between the current first airflow hole and the adjacent first airflow hole;
[0009] The second airflow hole located directly below the main chip of the circuit component satisfies: 0.1≤d2 / x2≤2.0, where d2 is the diameter of the current second airflow hole and x2 is the hole spacing between the current second airflow hole and the adjacent second airflow hole.
[0010] This design, with the first and second airflow holes respectively located above and below the main chip, facilitates the dissipation of heat from the main chip through air convection, thus improving heat dissipation efficiency. By limiting the relationship between the diameter and spacing of the first and second airflow holes, the problem of insufficient rigidity of the temples caused by opening holes on the temples is avoided, reducing the risk of temple breakage.
[0011] In one embodiment, the center of the second airflow hole corresponds one-to-one with the center of the first airflow hole.
[0012] This design helps to shorten the airflow path at the main chip, increase the airflow speed in the temple, and improve heat dissipation efficiency.
[0013] In one embodiment, the diameter of the second airflow orifice is smaller than the diameter of the corresponding first airflow orifice.
[0014] This design helps reduce dust from entering the mounting cavity through the second airflow hole, reduces dust accumulation inside the temple, and lowers the risk of short circuits in the circuit components.
[0015] In one embodiment, the diameter of the first airflow hole located directly above the main chip of the circuit assembly is larger than the diameter of the first airflow hole located above the main chip side of the circuit assembly, and the spacing between two adjacent first airflow holes located directly above the main chip of the circuit assembly is smaller than the spacing between two adjacent first airflow holes located above the main chip side of the circuit assembly.
[0016] The diameter of the second airflow hole located directly below the main chip of the circuit assembly is larger than the diameter of the second airflow hole located on the side below the main chip of the circuit assembly. The spacing between two adjacent second airflow holes located directly below the main chip of the circuit assembly is smaller than the spacing between two adjacent second airflow holes located on the side below the main chip of the circuit assembly.
[0017] This design allows airflow to be more easily discharged from the multiple primary airflow holes directly above the main chip, improving the heat dissipation efficiency of the main chip. In addition, it can reduce the heat from the main chip to spread to other components in the circuit assembly, preventing these other components from malfunctioning due to heat.
[0018] In one embodiment, the plurality of first airflow holes located above the main chip side of the circuit assembly are divided into two groups arranged at intervals along the extension direction of the temple, and the two groups of first airflow holes are respectively used to be located above the two sides of the main chip.
[0019] The plurality of second airflow holes located on the lower side of the main chip of the circuit assembly are divided into two groups arranged at intervals along the extension direction of the temple, and the two groups of second airflow holes are respectively located on the lower side of the main chip.
[0020] With this configuration, the first and second airflow holes are arranged in the manner described above. The air convection path formed by the multiple first and second airflow holes covers the entire main chip, further improving the heat dissipation efficiency of the main chip.
[0021] In one embodiment, the temple includes a temple body having an upper opening and a lower opening, a first opening member fitted into the upper opening of the temple body and providing the first airflow hole, and a second opening member fitted into the lower opening of the temple body and providing the second airflow hole to form the mounting cavity.
[0022] This design ensures the connection strength between the first and second opening components and the temple body, facilitates precise opening, and reduces processing difficulty.
[0023] In one embodiment, the thermal conductivity k of the first opening and the second opening satisfies: 14w / (m×k)≤k≤18w / (m×k).
[0024] With this configuration, on the one hand, the first and second openings can quickly absorb the heat radiated outward from the main chip, preventing the temple from overheating at the main chip. On the other hand, limiting the upper limit of the thermal conductivity of the two openings helps maintain the temperature difference of the temple in the extension direction, ensuring unobstructed air convection path within the mounting cavity.
[0025] In one embodiment, the temple includes a temple body providing the mounting cavity, a first opening member providing the first airflow hole, and a second opening member providing the second airflow hole;
[0026] The upper sidewall of the temple body is also provided with a plurality of third airflow holes communicating with the mounting cavity, and the lower sidewall of the temple body is also provided with a plurality of fourth airflow holes communicating with the mounting cavity.
[0027] The first opening is attached to the upper side of the temple body and the first airflow hole is connected to the third airflow hole; the second opening is attached to the lower side of the temple body and the second airflow hole is connected to the fourth airflow hole.
[0028] This setup reduces the difficulty of manufacturing the temples, while also allowing for controllable precision in manufacturing the air vents on the temples.
[0029] In one embodiment, the first opening and / or the second opening are detachably mounted to the temple body.
[0030] This design facilitates disassembly and dust removal, and reduces the risk of short circuits on the circuit board caused by dust entering the mounting cavity during direct dust removal.
[0031] This application also provides AR glasses, including:
[0032] As described above, eyeglass frame components;
[0033] Display components, mounted on the frame of the eyeglasses assembly; and
[0034] The circuit assembly includes a circuit board mounted in the mounting cavity of the eyeglass frame assembly and a main chip mounted on the circuit board, the circuit board being communicatively connected to the display assembly.
[0035] This configuration, by distributing the display components and circuit components, improves the heat dissipation of the AR glasses. Furthermore, the air vents arranged in a specific pattern on the temples of the frame further enhance the heat dissipation of the main chip in the circuit components, reducing the discomfort caused to the human body by the heat-generating components in the AR glasses. Attached Figure Description
[0036] Figure 1 This application provides a structural schematic diagram of an AR glasses.
[0037] Figure 2 A schematic diagram of the temple structure of AR glasses in one embodiment provided in this application;
[0038] Figure 3 for Figure 2 The image shows a cross-sectional view of the temple along the AA direction;
[0039] Figure 4 for Figure 3 A magnified view of a section at point X;
[0040] Figure 5 for Figure 3 A magnified view of a portion of point Y in the middle;
[0041] Figure 6 for Figure 3 Schematic diagram of the structure of the telescope's main body;
[0042] Figure 7 A schematic diagram of the temple structure of AR glasses in another embodiment provided in this application;
[0043] Figure 8 for Figure 7 The image shows a cross-sectional view of the temple along the BB direction;
[0044] Figure 9 for Figure 8 A magnified view of a section at point M;
[0045] Figure 10 for Figure 8 A magnified view of a portion of point N in the middle;
[0046] Figure 11 for Figure 8 Schematic diagram of the structure of the telescope's main body;
[0047] Figure 12 for Figure 11 The image shows a magnified view of the temple body at point Z.
[0048] Figure label:
[0049] 10. Temple; 101. Mounting cavity; 102. First airflow hole; 103. Second airflow hole; 104. Third airflow hole; 105. Fourth airflow hole; 11. Temple body; 1101. Upper opening; 1102. Positioning groove; 12. First opening component; 13. Second opening component; 20. Frame; 30. Circuit assembly; 31. Circuit board; 32. Main chip. Detailed Implementation
[0050] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.
[0051] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0052] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0053] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0054] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0055] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0056] As AR glasses become more powerful, the computing power of the main chip increases, but so does the heat generated by the chip. Currently, there are two main chip placement methods: one is to vertically stack it with the display screen mounted on the frame. Since the display screen is located at the brow bone and also generates a lot of heat during operation, the combined heat from both causes the display screen temperature to rise significantly, reducing comfort at the brow bone. The other method is to integrate it into the temples. Because the temples are usually fully enclosed, the heat from the main chip can only be indirectly conducted to the outside through the temples. The small heat exchange area leads to a large amount of heat accumulation at the main chip location in the temples during long-term use, causing the main chip to reduce its frequency and affecting the full realization of the product's functions.
[0057] Existing AR glasses use holes in the temples near the main chip to allow heat to escape with the air. However, these holes reduce the rigidity of the temples, increasing the risk of breakage during repeated folding and use.
[0058] Therefore, it is necessary to provide a frame assembly and AR glasses that can reduce the risk of decreased temple rigidity while ensuring the heat dissipation efficiency of the main chip.
[0059] Please see Figures 1 to 5 , Figure 1 This is a structural schematic diagram of an AR glasses provided in this application. Figure 2 This is a schematic diagram of the temple 10 of AR glasses in one embodiment provided in this application. Figure 3 for Figure 2 The diagram shows a cross-sectional view of the temple 10 along the AA direction. Figure 4 for Figure 3 A magnified view of the area at point X. Figure 5 for Figure 3A partial enlarged view at point Y. According to one aspect of this application, a glasses frame assembly is provided, including a frame 20 and a pair of temples 10 mounted on both sides of the frame 20. Each temple 10 has a mounting cavity 101 for accommodating a circuit assembly 30 of AR glasses, a plurality of first airflow holes 102 communicating with the mounting cavity 101 and located on the upper sidewall of the temple 10, and a plurality of second airflow holes 103 communicating with the mounting cavity 101 and located on the lower sidewall of the temple 10. The plurality of first airflow holes 102 are arranged on the upper sidewall of the temple 10 and positioned above the circuit assembly 30. The first airflow hole 102 directly above the main chip 32 of the circuit component 30 satisfies: 0.1 ≤ d1 / x1 ≤ 2.0, where d1 is the diameter of the current first airflow hole 102 and x1 is the hole spacing between the current first airflow hole 102 and the adjacent first airflow hole 102; the second airflow hole 103 located directly below the main chip 32 of the circuit component 30 satisfies: 0.1 ≤ d2 / x2 ≤ 2.0, where d2 is the diameter of the current second airflow hole 103 and x2 is the hole spacing between the current second airflow hole 103 and the adjacent second airflow hole 103. By opening the first airflow hole 102 and the second airflow hole 103 on the temple 10, when the air at the main chip 32 is heated, it is discharged from the first airflow hole 102 directly above the main chip 32. Under the action of atmospheric pressure, the cold air will enter the mounting cavity 101 from the second airflow hole 103, thus forming an airflow circulation, thereby carrying away the heat of the main chip 32 and improving the heat dissipation efficiency of the main chip 32. By limiting the aperture and spacing of the first airflow hole 102 and the second airflow hole 103, the problem of insufficient local rigidity of the temple 10 when the local openings are too dense and the opening area is too large is avoided, thus reducing the risk of temple 10 breakage. It is worth noting that in this application, the first airflow hole 102 located directly above the main chip 32 is the first airflow hole 102 within the projection range of the main chip 32 on the upper sidewall of the temple 10, while the first airflow hole 102 located above the side of the main chip 32 is the first airflow hole 102 outside the projection range.
[0060] Specifically, in one embodiment provided in this application, the diameter of the first airflow hole 102 located directly above the main chip 32 and the second airflow hole 103 located directly below the main chip 32 can reach 50µm, the hole spacing is 0.5mm, and the ratio of hole diameter to hole spacing is 0.1. This satisfies both dustproof and heat dissipation effects while ensuring the rigidity of the upper and lower sidewalls of the temple 10 during use. Alternatively, the diameter of the first airflow hole 102 located directly above the main chip 32 and the second airflow hole 103 located directly below the main chip 32 can reach 200µm, the hole spacing is 0.1mm, and the ratio of hole diameter to hole spacing is 2. This satisfies both heat dissipation and dustproof effects while ensuring the rigidity of the upper and lower sidewalls of the temple 10 during use.
[0061] Furthermore, in one embodiment provided in this application, the diameter of the first airflow hole 102 located directly above the main chip 32 of the circuit assembly 30 is larger than the diameter of the first airflow hole 102 located on the side above the main chip 32 of the circuit assembly 30; the spacing between two adjacent first airflow holes 102 located directly above the main chip 32 of the circuit assembly 30 is smaller than the spacing between two adjacent first airflow holes 102 located on the side above the main chip 32 of the circuit assembly 30; the diameter of the second airflow hole 103 located directly below the main chip 32 of the circuit assembly 30 is larger than the diameter of the second airflow hole 103 located on the side below the main chip 32 of the circuit assembly 30, and the spacing between two adjacent second airflow holes 103 located directly below the main chip 32 of the circuit assembly 30 is smaller than the spacing between two adjacent second airflow holes 103 located on the side below the main chip 32 of the circuit assembly 30. In other words, while satisfying the above-mentioned conditional constraints, the opening ratio of the temple 10 located directly above and below the main chip 32 is increased as much as possible. This makes it easier for hot air to be discharged from the multiple first airflow holes 102 directly above the main chip 32, and for cold air to enter from the multiple second airflow holes 103 directly below the main chip 32, thereby improving the air convection efficiency at the main chip 32 in the mounting cavity 101.
[0062] like Figure 3 As shown, optionally, in one embodiment provided in this application, the center of the second airflow hole 103 corresponds one-to-one with the center of the first airflow hole 102. This helps to shorten the air convection path at the main chip 32, increase the air convection speed in the temple 10, and thus improve heat dissipation efficiency. Considering that the second airflow hole 103 is mainly used for air intake, in order to avoid dust accumulation at the bottom of the temple 10, optionally, in one embodiment provided in this application, the diameter of the second airflow hole 103 is smaller than the diameter of the corresponding first airflow hole 102. This reduces the amount of dust entering from the second airflow hole 103 and lowers the risk of foreign objects entering the temple 10 and causing short circuits in the circuit components.
[0063] Optionally, in one embodiment provided in this application, a plurality of first airflow holes 102 located above the main chip 32 side of the circuit assembly 30 are divided into two groups arranged at intervals along the extension direction of the temple 10, and the two groups of first airflow holes 102 are respectively used to be located above the two sides of the main chip 32; a plurality of second airflow holes 103 located below the main chip 32 side of the circuit assembly 30 are divided into two groups arranged at intervals along the extension direction of the temple 10, and the two groups of second airflow holes 103 are respectively used to be located below the two sides of the main chip 32. In other words, the airflow holes on the temple 10 are divided into three groups along the extension direction of the temple 10, with the main chip 32 as a reference: the first group located directly above / below the main chip 32, the second group located near the beginning of the temple 10, and the third group located at the end of the temple 10. In this arrangement, the first airflow holes 102 and the second airflow holes 103 cover the entire main chip 32, further improving the heat dissipation efficiency of the main chip 32. It is understandable that some of the first airflow holes 102 in the second and third groups are farther from the main chip 32, mainly for air intake to compensate for any potential insufficient air intake in the temple 10, thus preventing hot air from being expelled from the temple 10.
[0064] Optionally, in one embodiment provided in this application, a plurality of first airflow holes 102 are arranged in an array, and a plurality of second airflow holes 103 are also arranged in an array, which facilitates processing, is more aesthetically pleasing, and meets the requirements of product ID design.
[0065] Understandably, considering that the opening of the first airflow hole 102 can easily lead to dust entering the mounting cavity 101, in one embodiment provided in this application, the aperture of the plurality of first airflow holes 102 firstly increases and then decreases along the extension direction of the temple 10, and the spacing between two adjacent first airflow holes 102 firstly increases and then decreases along the extension direction of the temple 10; in the plurality of second airflow holes 103, the aperture of the second airflow hole 103 firstly increases and then decreases along the extension direction of the temple 10, and the spacing between adjacent second airflow holes 102 firstly increases and then decreases along the extension direction of the temple 10; The spacing between the two second airflow holes 103 first increases and then decreases. In other words, the aperture distribution and spacing distribution of the second airflow holes 103 are the same as those of the first airflow hole 102. With this arrangement, the closer to the main chip 32, the faster the air convection speed, which ensures the local heat dissipation efficiency of the temple 10 and reduces the heat conduction from the main chip 32 to both sides. At the same time, the ratio of the aperture to the spacing of the first airflow hole 102 / second airflow hole 103 located above / below the main chip 32 can be smaller, which takes into account the structural rigidity of the temple 10.
[0066] Specifically, in one embodiment provided in this application, the diameter of the first airflow hole 102 located directly above the main chip 32 and the diameter of the second airflow hole 103 located directly below the main chip 32 can reach 100um, the hole spacing is 0.1mm, and the ratio of hole diameter to hole spacing is 1. This ensures the rigidity of the first opening member 12 and the second opening member 13 during use. The diameter of the portion of the first airflow hole 102 and the portion of the second airflow hole 103 away from the main chip 32 can reach 10um, the hole spacing can reach 0.2mm, and the ratio of hole diameter to hole spacing can reach 0.05. This prevents foreign objects from entering the mounting cavity 101 and causing a short circuit in the circuit board 31, thus ensuring the structural strength of the temple 10.
[0067] like Figures 2 to 6 As shown, Figure 6 for Figure 3 A schematic diagram of the temple body is shown in the attached figure. It is worth noting that the dimensions of the first airflow hole 102 and the second airflow hole 103 have been enlarged to better illustrate their distribution. According to one embodiment of the temple 10 in this application, the temple 10 specifically includes a temple body 11 with an upper opening 1101 and a lower opening, a first opening member 12 embedded in the upper opening 1101 of the temple body 11 and providing the first airflow hole 102, and a second opening member 13 embedded in the lower opening of the temple body 11 and providing the second airflow hole 103, forming a mounting cavity 101. The connection strength between the first opening member 12 and the second opening member 13 and the temple body 11 is ensured by embedding the first opening member 12 and the second opening member 13 into the temple body 11. It is understandable that the first opening 12 and the second opening 13 can be made of a different material than the temple body 11, such as powder metallurgy parts, which are low-cost, customizable in shape, and controllable in performance. Considering that the thermal conductivity of the first opening 12 and the second opening 13 will affect the airflow convection path in the mounting cavity 101, the first opening 12 and the second opening 13 can optionally be made of a material with a thermal conductivity k satisfying 14w / (m×k)≤k≤18w / (m×k). In this way, on the one hand, the first opening 12 and the second opening 13 can quickly absorb the heat radiated outward from the main chip 32, avoiding the temple 10 from overheating at the main chip 32. On the other hand, limiting the upper limit of the thermal conductivity of the two openings helps to maintain the temperature difference between the two openings in the extension direction of the temple 10, ensuring the smooth airflow path in the mounting cavity 101. Optionally, the temple body 11 can be made of plastic material with low thermal conductivity, which can reduce the transfer of heat to the human body and reduce the discomfort caused by the increase in temperature of the temple 10.
[0068] like Figures 7 to 12 As shown, Figure 7 This is a schematic diagram of the temple 10 structure of the AR glasses in another embodiment provided in this application. Figure 8 for Figure 7 The diagram shows a cross-sectional view of the temple 10 along the BB direction. Figure 9 for Figure 8 A magnified view of a section at point M. Figure 10 for Figure 8 A magnified view of a portion at point N. Figure 11 for Figure 8 A schematic diagram of the structure of the telescope temple body 11. Figure 12 for Figure 11 The image shows a partial enlarged view of the temple body 11 at point Z. According to another embodiment of the temple 10 in this application, the temple 10 includes a temple body 11 providing a mounting cavity 101, a first opening member 12 providing a first airflow hole 102, and a second opening member 13 providing a second airflow hole 103. A third airflow hole 104 communicating with the mounting cavity 101 is formed on the upper sidewall of the temple body 11, and a fourth airflow hole 105 communicating with the mounting cavity 101 is formed on the lower sidewall of the temple body 11. The first opening member 12 is attached to the upper side of the temple body 11, and the first airflow hole 102 communicates with the third airflow hole 104. The second opening member 13 is attached to the lower side of the temple body 11, and the second airflow hole 103 communicates with the fourth airflow hole 105. It is understandable that the temple body 11 needs to form an internal cavity, thus limiting the precision of the openings on the temple body 11. The third airflow hole 104 and the fourth airflow hole 105 are typically ordinary heat dissipation holes with larger diameters, while the first opening member 12 and the second opening member 13 are planar thin-layer structures, thus allowing for controllable opening precision. This mounting method can reduce the processing difficulty of the temple 10. Furthermore, in one embodiment provided in this application, the temple body 11 and the first and second opening members 12 and 13 can be made of the same material. This can avoid temperature deformation differences between the first and second opening members 12 and the temple body 11 during mounting, preventing cracking during long-term use. Optionally, in this embodiment, the first opening member 12 and the second opening member 13 can also be made of mesh film members, such as stainless steel film etched parts, which have more controllable opening precision. In order to facilitate the installation of the mesh film member and make the first airflow hole 102 correspond to the third airflow hole 104 and the second airflow hole 103 correspond to the fourth airflow hole 105, the temple body 11 is also provided with a positioning groove 1102 for accommodating the mesh film member and matching the shape of the mesh film member. The first opening member 12 and / or the second opening member 13 are detachably installed on the temple body 11.
[0069] According to another aspect of this application, an AR glasses system is also provided, including a frame assembly, a display assembly, and a circuit assembly 30. The display assembly is installed within the frame 20 of the frame assembly. The circuit assembly 30 includes a circuit board 31 mounted in the mounting cavity 101 of the frame assembly and a main chip 32 mounted on the circuit board 31. The circuit board 31 is communicatively connected to the display assembly. By distributing the display assembly and the circuit assembly 30, the heat dissipation effect of the AR glasses is improved. Furthermore, the airflow holes arranged in a specific pattern on the temples 10 of the frame assembly further enhance the heat dissipation effect on the main chip 32 in the circuit assembly 30, reducing the discomfort caused to the user by the heat-generating components in the AR glasses.
[0070] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0071] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A frame assembly for AR glasses, characterized by, The application relates to a pair of AR glasses, comprising: a frame; and a pair of temples respectively mounted on two sides of the frame, the temples having a mounting cavity for accommodating a circuit assembly of the AR glasses, a plurality of first airflow holes communicating with the mounting cavity and located on the upper side wall of the temple, and a plurality of second airflow holes communicating with the mounting cavity and located on the lower side wall of the temple, the plurality of first airflow holes being used for being located above the circuit assembly, and the plurality of second airflow holes being used for being located below the circuit assembly; the first airflow hole located directly above the main chip of the circuit assembly satisfies 0.1<=d1 / x1<=2.0, wherein d1 is the aperture of the current first airflow hole, and x1 is the hole spacing between the current first airflow hole and the adjacent first airflow hole; the second airflow hole located directly below the main chip of the circuit assembly satisfies 0.1<=d2 / x2<=2.0, wherein d2 is the aperture of the current second airflow hole, and x2 is the hole spacing between the current second airflow hole and the adjacent second airflow hole.
2. The frame assembly of claim 1, wherein, The center of the second airflow hole corresponds to the center of the first airflow hole one by one.
3. The frame assembly of claim 2, wherein, The aperture of the second airflow hole is smaller than the aperture of the corresponding first airflow hole.
4. The frame assembly of claim 1, wherein, The aperture of the first airflow hole located directly above the main chip of the circuit assembly is larger than the aperture of the first airflow hole located above the side of the main chip of the circuit assembly, and the hole spacing of the two adjacent first airflow holes located directly above the main chip of the circuit assembly is smaller than the hole spacing of the two adjacent first airflow holes located above the side of the main chip of the circuit assembly. The aperture of the second airflow hole located directly below the main chip of the circuit assembly is larger than the aperture of the second airflow hole located below the side of the main chip of the circuit assembly, and the hole spacing of the two adjacent second airflow holes located directly below the main chip of the circuit assembly is smaller than the hole spacing of the two adjacent second airflow holes located below the side of the main chip of the circuit assembly.
5. The frame assembly of claim 1, wherein, The plurality of first airflow holes located above the side of the main chip of the circuit assembly are divided into two groups arranged at intervals along the extension direction of the temple, and the two groups of first airflow holes are respectively used for being located above the two sides of the main chip. The plurality of second airflow holes located below the side of the main chip of the circuit assembly are divided into two groups arranged at intervals along the extension direction of the temple, and the two groups of second airflow holes are respectively used for being located below the two sides of the main chip.
6. The frame assembly of any one of claims 1 to 5, wherein, The temple comprises a temple body having an upper opening and a lower opening, a first perforated part embedded at the upper opening of the temple body and providing the first airflow holes, and a second perforated part embedded at the lower opening of the temple body and providing the second airflow holes to enclose the mounting cavity.
7. The frame assembly of claim 6, wherein, The thermal conductivity k of the first perforated part and the second perforated part satisfies 14w / (m*k) <= k <= 18w / (m*k).
8. The frame assembly of any one of claims 1 to 5, wherein, The temple comprises a temple body providing the mounting cavity, a first perforated part providing the first airflow holes, and a second perforated part providing the second airflow holes; the upper side wall of the temple body is further provided with a plurality of third airflow holes communicating with the mounting cavity, and the lower side wall of the temple body is further provided with a plurality of fourth airflow holes communicating with the mounting cavity. The first opening member is attached to the upper side of the temple body and the first airflow hole is communicated with the third airflow hole, and the second opening member is attached to the lower side of the temple body and the second airflow hole is communicated with the fourth airflow hole.
9. The frame assembly of claim 8, wherein, The first opening member and / or the second opening member are detachably mounted on the temple body.
10. An AR eyeglass, characterized by, Comprising: The eyeglass frame assembly according to any one of claims 1 to 9; A display assembly mounted on the frame of the eyeglass frame assembly; And A circuit assembly comprising a circuit board mounted in a mounting cavity of the eyeglass frame assembly and a main chip mounted on the circuit board, the circuit board being communicatively connected to the display assembly.