Apparatus for manufacturing display panel

Abstract

There is provided an apparatus for manufacturing a display panel, the apparatus including: a loading plate having a plurality of pattern electrodes arranged in a matrix on a front surface, in which a manufacturing substrate is loaded on the front surface of the loading plate on which the plurality of pattern electrodes are arranged; a dispenser for dispensing a liquid dispensing material on the manufacturing substrate; and a thin film coating controller disposed on the rear surface of the loading plate and connected to the plurality of pattern electrodes to supply a high-level pattern voltage to at least one pattern electrode among the plurality of pattern electrodes so as to form an electric field between the plurality of pattern electrodes, the thin film coating controller selectively supplies a high-level pattern voltage to the at least one pattern electrode based on pattern information including a type of the distribution material, a pattern design structure of the manufacturing substrate, or a step structure. By means of the apparatus, a thin film having uniform thickness and flatness can be formed, and as a result, manufacturing efficiency can be improved.

Description

Technical Field

[0001] This disclosure relates to an apparatus for manufacturing a display panel and a method for manufacturing a display panel. Background Technology

[0002] With the development of multimedia technology, display devices have become increasingly important. Accordingly, various display devices such as organic light-emitting diode (OLED) displays, liquid crystal displays (LCDs), field emission displays (FETs), and plasma displays are currently in use.

[0003] The display device is used to display images and includes a display panel such as an organic light-emitting display panel or a liquid crystal display panel. For example, an organic light-emitting display panel may include light-emitting diodes (LEDs). Light-emitting diodes may include organic light-emitting diodes that use organic materials as light-emitting materials or inorganic light-emitting diodes that use inorganic materials as light-emitting materials.

[0004] To manufacture image display panels such as organic light-emitting diode (OLED) or liquid crystal display (LCD) panels, it may be necessary to distribute and print photoresist or organic or inorganic insulating materials onto a transparent insulating substrate made of silicon, glass, etc. (hereinafter referred to as the manufacturing substrate). In doing so, the manufacturing substrate is precisely placed on a loading plate, and a distributor or inkjet printer is used to distribute coating materials such as photoresist and organic or inorganic insulating materials onto the manufacturing substrate. However, due to the surface energy difference between the loading plate and the manufacturing substrate, as well as other manufacturing conditions, there are issues with the leveling uniformity of the coating material applied to the manufacturing substrate. Utility Model Content

[0005] The purpose of this invention is to provide an apparatus for manufacturing a display panel, which can form a thin film by uniformly leveling a material dispensed and coated on a transparent insulating substrate (hereinafter referred to as the manufacturing substrate).

[0006] The present invention also aims to provide an apparatus for manufacturing a display panel, the apparatus ensuring that the material dispensed and coated on the manufacturing substrate is selectively formed into a thin film in a specific area of ​​the manufacturing substrate, and that a uniformly flat thin film can be formed in a portion of the manufacturing substrate by minimizing the influence of irregularities in the manufacturing substrate.

[0007] It should be noted that the features of this disclosure are not limited to those described above; and other features of this disclosure will be apparent to those skilled in the art from the following description.

[0008] According to embodiments of this disclosure, an apparatus for manufacturing a display panel includes: a loading plate having a plurality of patterned electrodes arranged in a matrix on a front surface, wherein a manufacturing substrate is loaded on the front surface of the loading plate on which the plurality of patterned electrodes are arranged; at least one dispenser for dispensing a liquid dispensing material onto the manufacturing substrate; and a thin-film coating controller disposed on a rear surface of the loading plate and connected to the plurality of patterned electrodes to supply a high-level pattern voltage to at least one of the plurality of patterned electrodes, thereby forming an electric field between the plurality of patterned electrodes, wherein the thin-film coating controller selectively supplies the high-level pattern voltage to at least one patterned electrode based on pattern information, the pattern information including the type of dispensing material, a pattern design structure of the manufacturing substrate, or a stepped structure.

[0009] According to embodiments of this disclosure, an apparatus for manufacturing a display panel includes: a loading plate having a plurality of patterned electrodes arranged in a matrix on a front surface, wherein a manufacturing substrate is loaded on the front surface of the loading plate on which the plurality of patterned electrodes are arranged; at least one dispenser for dispensing a liquid dispensing material onto the manufacturing substrate; and a thin-film coating controller disposed on a rear surface of the loading plate and connected to the plurality of patterned electrodes to supply a high-level pattern voltage to at least one of the plurality of patterned electrodes, thereby forming an electric field between the plurality of patterned electrodes, wherein the loading plate includes a plurality of plates connected or separated from each other in a flat manner to conform to the planar shape and size of the manufacturing substrate, and wherein the thin-film coating controller selectively supplies a high-level pattern voltage to at least one patterned electrode based on pattern information, the pattern information including the type of dispensing material, the pattern design structure of the manufacturing substrate, or a stepped structure.

[0010] According to embodiments of this disclosure, by uniformly planarizing the material dispensed and coated on the manufacturing substrate to form a thin film, the manufacturing quality of the display panel can be improved and image display defects can be prevented.

[0011] Furthermore, thin films can be selectively formed in specific areas of the manufacturing substrate, and the impact of horizontal differences on the substrate can be reduced to form flat films, thereby reducing the number of manufacturing steps and time required to produce display panels. As a result, manufacturing efficiency can be improved.

[0012] It should be noted that the effects of this disclosure are not limited to those described above, and other effects of this disclosure will be apparent to those skilled in the art from the following description. Attached Figure Description

[0013] The above and other features of this disclosure will become more apparent from a detailed description of embodiments thereof with reference to the accompanying drawings.

[0014] Figure 1This is a side view of an apparatus for manufacturing a display panel according to an embodiment of the present disclosure.

[0015] Figure 2 It is shown schematically. Figure 1 The image shows a top view of the equipment used to manufacture display panels.

[0016] Figure 3 It is shown schematically. Figure 1 The image shows a front view of the equipment used to manufacture display panels.

[0017] Figure 4 This is a transparent perspective view schematically illustrating the construction and structure of a loading plate according to an embodiment of the present disclosure.

[0018] Figure 5 This illustrates an embodiment. Figure 4 The cross-sectional view of the loading plate shown is taken in the first direction.

[0019] Figure 6 This illustrates an embodiment. Figure 4 The cross-sectional view of the loading plate shown is taken in the first direction.

[0020] Figure 7 It is shown Figure 4 The circuit diagram shows the wire connection structure of the patterned electrodes.

[0021] Figure 8 It is a cross-sectional view showing the material applied to the manufacturing substrate with the patterned electrode in a floating state.

[0022] Figure 9 It is a cross-sectional view showing the material applied to the fabrication substrate when a high-level pattern voltage is applied to the pattern electrode.

[0023] Figure 10 This is a plan view schematically illustrating the construction and structure of a loading plate according to an embodiment of the present disclosure.

[0024] Figure 11 It is along Figure 10 The line I-I' cuts out a cross-sectional view of the structure of the material being distributed on the manufacturing substrate.

[0025] Figure 12 This is a cross-sectional view showing the distribution of material on a fabrication substrate when a high-level patterned voltage is selectively applied to each of the patterned electrodes in the plate.

[0026] Figure 13 This is a cross-sectional view showing material applied to a fabrication substrate with a horizontal difference when the patterned electrode is in a floating state.

[0027] Figure 14 This is a cross-sectional view showing the material applied to a fabrication substrate with a horizontal difference when a high-level patterned voltage is selectively applied to the patterned electrodes of each plate. Detailed Implementation

[0028] The present disclosure will now be described more fully below with reference to the accompanying drawings, in which embodiments of the present disclosure are illustrated. However, the present disclosure may be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided only to ensure the completeness of the present disclosure and to fully convey the scope of the present invention to those skilled in the art.

[0029] It will also be understood that when a layer is referred to as being "on" another layer or substrate, it can be directly on said other layer or substrate, or an intermediary layer may also be present. Throughout the specification, the same reference numerals indicate the same components.

[0030] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element. Similarly, the second element may also be referred to as the first element.

[0031] Each feature of the various embodiments of this disclosure may be combined partially or entirely with each other, and may cooperate technically with each other in various ways. Each embodiment may be implemented independently of each other, or may be implemented together in association with each other.

[0032] In the following description, embodiments according to the present disclosure will be described with reference to the accompanying drawings.

[0033] Figure 1 This is a side view of an apparatus for manufacturing a display panel according to an embodiment of the present disclosure.

[0034] Reference Figure 1 The apparatus for manufacturing a display panel includes at least one loading plate 100, a thin film coating controller 140, a loading track L1, at least one dispensing device 200, and a dispensing track L2. Additionally, the apparatus for manufacturing a display panel may also include a chamber in which the loading plate 100, the thin film coating controller 140, the loading track L1, and at least one dispensing device 200 are disposed.

[0035] A chamber provides an internal process space for performing manufacturing processes such as inkjet printing, dispensing, coating, dipping, alignment, lamination, bonding, laser irradiation, and loading / unloading. The chamber can provide a vacuum, heat-and-cool, soundproof, vibration-free, and waterproof process space. For this purpose, the chamber may also include vacuum units, suction units, purification units, heating units, cooling units, etc.

[0036] The loading plate 100 may be a plate on which a manufacturing substrate 10 for manufacturing a display panel is mounted, and may be formed in the shape of a disc, a rectangular plate, or a square plate.

[0037] On the mounting plate 100, a manufacturing substrate 10 (e.g., a wafer or a transparent glass substrate) for manufacturing a display panel can be mounted. In addition, the manufacturing substrate 10 may include a pixel circuit substrate for forming multiple pixel electrodes, a light-emitting diode arrangement substrate, etc.

[0038] The loading plate 100 has multiple patterned electrodes PE (see Figure 4 The plurality of patterned electrodes PE are arranged in a matrix on one side of the mounting surface on which the manufacturing substrate 10 is mounted. The patterned electrodes PE can be embedded in this side of the mounting surface or disposed in the front surface of the mounting surface. Additionally, a dielectric layer can be formed on the front surface of the mounting surface, including the patterned electrodes PE. Each of the patterned electrodes PE can be formed as a plate-type electrode having a polygonal shape such as a triangle, rectangle, rhombus, pentagon, hexagon, or octagon. Each of the patterned electrodes PE can also be formed as a plate-type electrode with a circular, elliptical, or semi-circular shape. The patterned electrodes PE are electrically connected to terminals disposed on at least one side or rear surface of the mounting plate 100 via connecting wires embedded in the mounting plate 100. The patterned electrodes PE can form groups, each group can be connected in series or parallel to corresponding terminals, and each of the patterned electrodes PE can be connected to a terminal in a one-to-one manner.

[0039] The loading plate 100 can be moved by a moving floor module 120 along the loading track L1. Depending on the panel manufacturing process, the plate moving module 120 moves the loading plate 100 to loading positions, process positions (such as dispensing, lamination, and laser irradiation) and unloading positions of the manufacturing substrate 10. The plate moving module 120 may include at least one motor, microprocessor, drive shaft, rotary shaft, belt, chain, gear, wheel, etc.

[0040] The loading track L1 forms a movement path for at least one loading plate 100, a plate moving module 120, and at least one manufacturing process device (such as an alignment device or a laminating device). The loading track L1 may be configured as a conveyor system or a transport robot rather than a simple track.

[0041] The thin-film coating controller 140 selectively supplies a high-level pattern voltage to a group of pattern electrodes PE connected in series or parallel in the loading plate 100. The thin-film coating controller 140 can select the pattern electrodes PE of the loading plate 100 and supply a high-level pattern voltage to each of the pattern electrodes PE one by one.

[0042] The thin film coating controller 140 can selectively supply a high-level pattern voltage to a group of pattern electrodes PE connected to each other via terminals and connecting wires of the loading plate 100. Depending on the connection structure between the pattern electrodes PE and the terminals, the pattern electrodes PE of the loading plate 100 can be selected, and the high-level pattern voltage can be supplied to each of the pattern electrodes PE one by one.

[0043] The thin film coating controller 140 can be disposed independently of the loading plate 100, either inside or outside the chamber. For example, the thin film coating controller 140 can be disposed on the rear surface or a side surface of the loading plate 100. The thin film coating controller 140 can be disposed on either side surface of the loading track L1 or the plate moving module 120.

[0044] The thin film coating controller 140 is electrically connected to terminals formed on a side surface, rear surface, etc., of the loading plate 100. The thin film coating controller 140 receives a supply voltage from an external power supply unit and changes the magnitude of the supply voltage to generate a high-level pattern voltage.

[0045] The thin-film coating controller 140 receives and stores pattern information and voltage setting information based on the pattern design structure, step structure, and type of material to be applied to the substrate 10. The thin-film coating controller 140 changes the magnitude of the supply voltage to a high-level pattern voltage according to the voltage setting information. Based on the pattern information, it selects either a group of interconnected pattern electrodes PE or individual pattern electrodes PE, and supplies a high-level pattern voltage to the selected pattern electrodes PE.

[0046] The dispensing device 200 may include a dispenser 220 for applying a liquid insulating material (such as an organic or inorganic material, ink, water, adhesive, sealant, photoresist, etc.) or a printing apparatus for performing an inkjet printing process. In the following description, the dispenser 220 for applying insulating or liquid materials such as ink and photoresist will be described as an example. The type, form, and use of the dispensing device 200 are not limited to the embodiments disclosed herein.

[0047] Figure 2 It is shown schematically. Figure 1 The image shows a top view of the equipment used to manufacture display panels. Figure 3 It is shown schematically. Figure 1 The image shows a front view of the equipment used to manufacture display panels.

[0048] Reference Figure 2 and Figure 3 The dispensing device 200 includes at least one dispenser 220.

[0049] During the manufacturing process, at least one dispenser 220 dispenses liquid dispensing material onto the manufacturing substrate 10 of the loading plate 100.

[0050] At least one dispenser 220 includes a plurality of dispenser heads 201, at least one pump 202, at least one tank 210, and dispenser moving module 212.

[0051] Multiple dispensing heads 201 may be disposed on one side of at least one pump 202 and tank 210, and may be fixed such that they are connected to tank 210 via at least one pump 202 and a fixing frame, etc. These dispensing heads 201 dispense dispensing material supplied by at least one pump 202 in the direction in which the dispensing heads 201 are arranged.

[0052] Multiple dispensing heads 201 are fixed in a dispensing process direction and process position toward the loading plate 100 and the manufacturing substrate 10. The dispensing heads 201 dispense dispensing material supplied by at least one pump 202 onto the loading plate 100 and onto the manufacturing substrate 10 at the dispensing process position during the manufacturing process.

[0053] Multiple dispensing heads 201 can dispense liquid dispensing material in the form of continuous fluid or droplets, or they can dispense it using a fine jetting method according to a predetermined dispensing scheme.

[0054] At least one pump 202 supplies dispensing material stored in at least one tank 210 to a plurality of dispensing heads 201. During predetermined manufacturing process periods and concentration detection periods, at least one pump 202 supplies dispensing material to the plurality of dispensing heads 201 and controls the dispensing operation such that the dispensing material is dispensed through the dispensing heads 201 according to the predetermined manufacturing process periods and concentration detection periods.

[0055] Dispenser moving module 212 moves at least one tank 210, at least one pump 202, and multiple dispensing heads 201 along dispensing track L2. Specifically, dispenser moving module 212 moves at least one dispenser 220 to a dispensing process position or concentration detection position for predetermined manufacturing process periods and unloading periods of manufacturing substrate 10. Dispenser moving module 212 may include at least one motor, microprocessor, drive shaft, rotating shaft, belt, chain, gear, wheel, etc.

[0056] The distribution track L2 forms a movement path for at least one manufacturing process device (such as at least one distributor 220). The distribution track L2 may be configured as a conveyor system or a transport robot rather than a simple track.

[0057] Figure 4 This is a transparent perspective view schematically illustrating the construction and structure of a loading plate according to an embodiment of the present disclosure.

[0058] Reference Figure 4 The loading plate 100 includes a substrate 101, a plurality of patterned electrodes PE, a plurality of electrical terminals SE, and a plurality of connecting lines IL. In addition, the loading plate 100 may also include a dielectric layer 102 formed to cover the entire substrate 101 including the plurality of patterned electrodes PE.

[0059] The substrate plate 101 is formed as a circular plate or as a polygonal plate such as a rectangle or square. According to embodiments of this disclosure, the substrate plate 101 is shown as a square plate with its front (or upper) surface formed as a square plane. However, it should be understood that, when viewed from above, the shape of the substrate plate 101 is not limited to a polygonal shape such as a square, but can be formed as a circular plate, an elliptical plate, or a semi-circular plate.

[0060] Multiple patterned electrodes PE are arranged in a matrix on the front side (e.g., the mounting surface) of the substrate 101 on which the manufacturing substrate 10 is mounted. For example, the patterned electrodes PE may be arranged and positioned parallel to each other in a first direction (e.g., the X-axis direction or the row direction) and a second direction (e.g., the Y-axis direction or the column direction) with the same spacing. The multiple patterned electrodes PE may be disposed on the front surface of the substrate 101 or may be embedded in the front side of the substrate 101.

[0061] Each of the patterned electrodes PE can be formed as a plate electrode in a polygonal shape such as a triangle, rectangle, rhombus, or pentagon. Each of the patterned electrodes PE can also be formed as a disc electrode in a circular, elliptical, or semi-circular shape.

[0062] Electrical terminals SE are configured to be exposed on at least one side or rear surface of the substrate 101 and are electrically connected to the film coating controller 140 via connection terminals and cables connected to the electrical terminals SE.

[0063] Connecting lines IL are connected in series or parallel to each group of patterned electrodes PE, such that the patterned electrodes PE form a corresponding group. These connecting lines IL electrically connect each group of patterned electrodes PE to at least one of a plurality of electrical terminals SE.

[0064] Multiple connecting lines IL can be connected in series or in parallel to patterned electrodes PE arranged in the first direction, such that the patterned electrodes PE arranged in the first direction (e.g., the X-axis direction or the row direction) form respective groups. Each of the connecting lines IL is connected in series or in parallel to the patterned electrodes PE forming each respective group. One end of each of the connecting lines IL is connected to an electrical terminal SE from which a low-level voltage is applied, and the other end of each is electrically connected to another electrical terminal SE from which a high-level patterned voltage is applied.

[0065] The dielectric layer 102 is formed to cover the entire substrate 101, which includes multiple patterned electrodes PE. The dielectric layer 102 may be made of an insulating organic material or such as SiO2 or SiN. x An insulating inorganic material is formed to insulate the multiple patterned electrodes PE from the manufacturing substrate 10.

[0066] Figure 5 This illustrates an embodiment. Figure 4 The cross-sectional view of the loading plate shown is taken in the first direction.

[0067] Reference Figure 5 Multiple patterned electrodes PE can be embedded in the front side of the substrate plate 101. In this case, the front surface of the substrate plate 101 can be flat without any level difference caused by the patterned electrodes PE, etc. The dielectric layer 102 is formed to cover the entire substrate plate 101 including the multiple patterned electrodes PE to provide a flat surface.

[0068] The patterned electrode PE is electrically connected to an electrical terminal SE disposed on at least one side surface or rear surface of the loading plate 100 via a connecting wire IL embedded in the loading plate 100. The patterned electrodes PE can be formed in corresponding groups in a first direction or a second direction, and can be connected in series or in parallel to other adjacent patterned electrodes PE.

[0069] The connecting lines IL can be connected in series or parallel to the patterned electrodes PE that form each group. For example, as... Figure 5 As shown, the connecting line IL can be connected in series with the patterned electrodes PE arranged parallel in the first direction, such that the patterned electrodes PE arranged parallel in the first direction (e.g., the X-axis direction or the row direction) form corresponding groups. In this case, one end of each of the connecting lines IL connected in series with each group of patterned electrodes PE can be connected to one of the electrical terminals SE from which a low-level voltage is applied, and the other end of each can be electrically connected to another electrical terminal SE from which a high-level patterned voltage is applied.

[0070] Figure 6 This illustrates an embodiment. Figure 4 The cross-sectional view of the loading plate shown is taken in the first direction.

[0071] Reference Figure 6 Multiple patterned electrodes PE can be disposed on the front surface of the substrate plate 101. In this case, a horizontal difference may exist on the front surface of the substrate plate 101 due to the patterned electrodes PE, etc.

[0072] The dielectric layer 102 is formed to cover the entire front surface of the substrate 101, which includes a plurality of patterned electrodes PE, to provide a flat surface, such that the front surface of the loading plate 100 is flat.

[0073] The connecting lines IL can be connected in series or parallel to the patterned electrodes PE that form each group. For example, as... Figure 6 As shown, the connecting line IL can be connected in series with the patterned electrodes PE arranged parallel in the first direction, such that the patterned electrodes PE arranged parallel in the first direction (e.g., the X-axis direction or the row direction) form corresponding groups. In this case, one end of each of the connecting lines IL connected in series with each group of patterned electrodes PE can be connected to one of the electrical terminals SE from which a low-level voltage is applied, and the other end of each can be electrically connected to another electrical terminal SE from which a high-level patterned voltage is applied.

[0074] Figure 7 It is shown Figure 4 The circuit diagram shows the wire connection structure of the patterned electrodes.

[0075] Reference Figure 7 Multiple patterned electrodes PE can be arranged and positioned in parallel at the same spacing in a first direction (e.g., the X-axis direction or the row direction) and a second direction (e.g., the Y-axis direction or the column direction).

[0076] Multiple connecting lines IL can be connected in series or in parallel to the patterned electrodes PE arranged in parallel in the first direction, so that the patterned electrodes PE arranged in parallel in the first direction form a corresponding group.

[0077] One end of each of the connecting lines IL connected in series with each group of patterned electrodes PE is connected to at least one electrical terminal SE from which a ground voltage or a low-level voltage is applied. On the other hand, the other end of each of the connecting lines IL connected in series with each group of patterned electrodes PE is electrically connected to another electrical terminal SE from which a high-level patterned voltage VD(+) is applied.

[0078] In the connecting lines IL connected to the group of patterned electrodes PE arranged in the first direction, one end of each of the connecting lines IL arranged in the odd-numbered rows (i.e., the 2n-1th group) can be connected to at least one electrical terminal SE from which a ground voltage or a low-level voltage is applied, and the other end can be connected to another electrical terminal SE from which a high-level patterned voltage VD(+) is applied, where n is a positive integer.

[0079] On the other hand, in the connecting lines IL of the group of patterned electrodes PE arranged in the first direction, the other end of each of the connecting lines IL in the even-numbered rows (i.e., the 2nth group) can be connected to at least one electrical terminal SE from which a ground voltage or a low-level voltage is applied, while one end of each can be electrically connected to another electrical terminal SE from which a high-level patterned voltage VD(+) is applied, where n is a positive integer.

[0080] The patterned electrode PE in the 2n-1 group and the patterned electrode PE in the adjacent 2n group can receive a high-level patterned voltage VD(+) in opposite directions.

[0081] Figure 8 It is a cross-sectional view showing the material applied to the manufacturing substrate with the patterned electrode in a floating state.

[0082] Reference Figure 8 The loading plate 100 can be moved by the plate moving module 120, which moves along the loading track L1. The manufacturing base 10 is placed on the loading plate 100.

[0083] At least one dispenser 220 of the dispensing device 200 dispenses liquid dispensing material LQ onto the manufacturing substrate 10 via a plurality of dispensing heads 201.

[0084] Due to manufacturing environments such as the surface energy difference between the loading plate 100 and the manufacturing substrate 10, the dispensing material LQ applied to the manufacturing substrate 10 may not maintain a uniformly flat level. In particular, when a high-level patterning voltage VD(+) is not applied to each group of patterned electrodes PE and the patterned electrodes PE are in a floating state, the dispensing material LQ may stick together or move together, depending on the process environment. As a result, the thickness and flatness of the film formed on the manufacturing substrate 10 may be non-uniform, and there may be level differences.

[0085] Figure 9 It is a cross-sectional view showing the material applied to the fabrication substrate when a high-level pattern voltage is applied to the pattern electrode.

[0086] Reference Figure 9 The thin-film coating controller 140 supplies a high-level patterning voltage VD(+) to at least one of the patterned electrodes PE forming a plurality of patterned electrodes PE. Here, the high-level patterning voltage VD(+) can be supplied in the form of a DC voltage or an AC voltage. For example, the maximum voltage level of the high-level patterning voltage VD(+) can be one of a voltage from about 5V to about 30V.

[0087] An electric field is formed on the group of patterned electrodes PE supplied with a high-level pattern voltage VD(+). Therefore, there is an electric field difference between the group of patterned electrodes PE supplied with a high-level pattern voltage VD(+) and the group of patterned electrodes PE not supplied with a high-level pattern voltage VD(+).

[0088] The dispensing material LQ, deposited on the manufacturing substrate 10, is influenced by an electric field, causing it to flow as a fluid towards the front side of the group of patterned electrodes PE that generate a larger electric field (i.e., the group supplied with a high-level pattern voltage VD(+)). As a result, the dispensing material LQ is formed flatly along the front side of the group of patterned electrodes PE supplied with the high-level pattern voltage VD(+). In this way, the thickness and flatness of the thin film formed on the manufacturing substrate 10 can be uniform.

[0089] The thin film coating controller 140 can receive and store pattern information and voltage setting information in advance from an external main control system or the like, based on the pattern design structure, step structure and type of material to be applied to the manufacturing substrate 10.

[0090] The thin film coating controller 140 reduces or amplifies the supplied voltage to a high-level pattern voltage VD(+) based on voltage setting information. Based on predetermined pattern information such as the pattern design structure and step structure of the manufacturing substrate 10, it selects either a group of pattern electrodes PE connected to each other or selects pattern electrodes PE individually. The thin film coating controller 140 supplies the high-level pattern voltage VD(+) to the electrical terminals SE and connecting lines IL that are electrically connected to the selected pattern electrode PE or the group of selected pattern electrodes PE.

[0091] Figure 10 This is a plan view schematically illustrating the construction and structure of a loading plate according to an embodiment of the present disclosure.

[0092] Reference Figure 10 When viewed from above, the loading plate 100 comprises a plurality of plates BL_1 to BL_n that conform to the shape and size of the manufacturing base 10 and are connected or separated from each other in a flat form.

[0093] Each of the plates BL_1 to BL_n is formed as a flat plate (i.e., a polygonal shape such as a triangle, rectangle, rhombus or square when viewed from above) with the front surface on which the manufacturing base 10 is disposed.

[0094] The size or area of ​​the front surface of each of the polygonal plates BL_1 to BL_n can be equal to or different from the size or area of ​​the other adjacent plates BL_1 to BL_n.

[0095] Plates BL_1 to BL_n are connected (or assembled) or separated from each other, such that they conform to the shape and area or planar shape of the rear surface of the manufacturing substrate 10 disposed on the front surface.

[0096] At least one of the plates BL_1 to BL_n, plate BL_5, includes an electrode placement area DPE and a non-electrode placement area PEN that are separated from each other on the front surface of the mounting manufacturing substrate 10.

[0097] Multiple patterned electrodes PE are arranged in a matrix in the electrode placement area DPE.

[0098] Figure 11 It is along Figure 10 The line I-I' cuts out a cross-sectional view of the structure of the material being distributed on the manufacturing substrate.

[0099] Reference Figure 11 Each of the plates BL_1 to BL_n includes a substrate plate 101, multiple patterned electrodes PE, multiple electrical terminals SE, and multiple connecting lines IL.

[0100] Additionally, each of the plates BL_1 to BL_n may also include a dielectric layer 102 formed to cover the entire substrate plate 101 comprising multiple patterned electrodes PE.

[0101] The base plate 101 of each of the plates BL_1 to BL_n is formed as a flat plate with a polygonal shape, such as a rectangle or a square. Figure 10 In the example shown, the substrate plate 101 is formed as a square plate with a square plane on the front surface (or top surface).

[0102] Multiple patterned electrodes PE are arranged in a matrix on the front side (e.g., the mounting surface side) of the substrate 101 on which the manufacturing substrate 10 is mounted.

[0103] Among the multiple plates BL_1 to BL_n, at least one plate BL_5 is divided into an electrode placement area DPE and a non-electrode placement area PEN on the front surface on which the manufacturing substrate 10 is mounted. Multiple patterned electrodes PE are arranged in a matrix only in the electrode placement area DPE.

[0104] Patterned electrodes PE can be arranged and positioned parallel to each other in a first direction (e.g., the X-axis direction or the row direction) and a second direction (e.g., the Y-axis direction or the column direction) with the same spacing. Multiple patterned electrodes PE can be disposed on the front surface of the substrate 101, or can be embedded in the front side of the substrate 101.

[0105] In each of the plates BL_1 to BL_n, the electrical terminals SE are configured such that they are exposed on at least one side or rear surface of the substrate plate 101 and are electrically connected to the film coating controller 140 via connection terminals and cables connected to the electrical terminals SE.

[0106] The connecting line IL is connected in series or in parallel to each corresponding group of patterned electrodes PE, such that the patterned electrodes PE form a corresponding group, and each group of patterned electrodes PE is electrically connected to at least one of a plurality of electrical terminals SE.

[0107] The patterned electrode PE is electrically connected via a connecting line IL embedded in plates BL_1 to BL_n to an electrical terminal SE disposed on at least one side surface or rear surface of each of plates BL_1 to BL_n. The patterned electrodes PE can be formed in corresponding groups in a first direction or a second direction, and can be connected in series or in parallel to other adjacent patterned electrodes PE.

[0108] Multiple connecting lines IL can be connected in series with patterned electrodes PE arranged parallel in a first direction for each of multiple plates BL_1 to BL_n, such that the patterned electrodes PE arranged parallel in the first direction (e.g., the X-axis direction or the row direction) form corresponding groups. In this case, one end of each connecting line IL connected in series to each group of patterned electrodes PE can be connected to one of the electrical terminals SE from which a low-level voltage is applied, and its other end can be electrically connected to another electrical terminal SE from which a high-level patterned voltage is applied.

[0109] The dielectric layer 102 is formed to cover the entire substrate 101, which includes multiple patterned electrodes PE.

[0110] When the manufacturing substrate 10 is placed on the loading plate 100, which includes multiple interconnected plates BL_1 to BL_n, the dispenser 220 dispenses liquid dispensing material LQ onto the manufacturing substrate 10 through multiple dispensing heads 201.

[0111] When a high-level pattern voltage VD(+) is not applied to the pattern electrodes PE forming the corresponding group and the pattern electrodes PE in each of the multiple plates BL_1 to BL_n remain floating, the dispensing material LQ may stick together or move together depending on the process environment. As a result, the thickness and flatness of the film formed on the manufacturing substrate 10 will be uneven, and there will be horizontal differences.

[0112] Figure 12 It is a cross-sectional view showing the distribution of material on the fabrication substrate when a high-level pattern voltage is selectively applied to the patterned electrodes in each of the plates.

[0113] Reference Figure 12The thin film coating controller 140 supplies a high-level pattern voltage VD(+) to at least one set of pattern electrodes PE among the pattern electrodes PE of each of the plurality of plates BL_1 to BL_n.

[0114] An electric field is formed on the group of patterned electrodes PE supplied with a high-level pattern voltage VD(+). Therefore, there is an electric field difference between the group of patterned electrodes PE supplied with a high-level pattern voltage VD(+) and the group of patterned electrodes PE not supplied with a high-level pattern voltage VD(+).

[0115] The dispensing material LQ, deposited on the manufacturing substrate 10, is influenced by an electric field, causing it to flow as a fluid towards the front side of the group of patterned electrodes PE that generate a larger electric field (i.e., the group supplied with a high-level pattern voltage VD(+)). As a result, the dispensing material LQ is formed flatly along the front side of the group of patterned electrodes PE supplied with the high-level pattern voltage VD(+). In this way, the thickness and flatness of the thin film formed on the manufacturing substrate 10 can be uniform.

[0116] Figure 13 This is a cross-sectional view showing material applied to a fabrication substrate with a horizontal difference when the patterned electrode is in a floating state.

[0117] Reference Figure 13 When a high-level pattern voltage VD(+) is not applied to the pattern electrodes PE forming the corresponding group and the pattern electrodes PE in each of the multiple plates BL_1 to BL_n remain floating, the dispensing material LQ may adhere together or move together depending on the process environment. Specifically, the dispensing material LQ may adhere together or move depending on the pattern design structure and step structure of the manufacturing substrate 10. As a result, the thickness and flatness of the film formed on the manufacturing substrate 10 will be uneven, and there will be horizontal differences.

[0118] Figure 14 It is a cross-sectional view showing the material applied to a fabrication substrate with a horizontal difference when a high-level patterned voltage is selectively applied to the patterned electrodes of each plate.

[0119] Reference Figure 14 The thin film coating controller 140 can receive and store pattern information and voltage setting information in advance from an external main control system, etc., based on the pattern design structure, step structure and type of material to be distributed on the manufacturing substrate 10.

[0120] The thin film coating controller 140 selects groups of patterned electrodes PE connected to each other or selects patterned electrodes PE one by one for each plate BL_1 to BL_n based on predetermined pattern information.

[0121] The thin film coating controller 140 supplies a high-level pattern voltage VD(+) to the electrical terminal SE and the connection line IL, which are electrically connected to the selected pattern electrode PE or the group of selected pattern electrodes PE.

[0122] The dispensing material LQ, deposited on the manufacturing substrate 10, is influenced by an electric field and thus flows as a fluid towards the front side of the group of patterned electrodes PE that generate a larger electric field (i.e., the group supplied with a high-level pattern voltage VD(+)). As a result, the dispensing material LQ is formed flatly along the front side of the group of patterned electrodes PE supplied with the high-level pattern voltage VD(+). In this way, the thickness and flatness of the thin film formed on the manufacturing substrate 10 can be uniform.

[0123] In summarizing the detailed description, those skilled in the art will understand that many variations and modifications can be made to the embodiments of this disclosure without substantially departing from the principles of this disclosure. Therefore, the disclosed embodiments are used in a general and descriptive sense only and not for limiting purposes.

Claims

1. An apparatus for manufacturing a display panel, characterized by comprising: The apparatus includes: a loading plate having a plurality of pattern electrodes arranged in a matrix on a front surface, wherein a manufacturing substrate is loaded on the front surface of the loading plate on which the plurality of pattern electrodes are arranged; at least one dispenser for dispensing a dispensing material of a liquid on the manufacturing substrate; and a thin film coating controller provided on a rear surface of the loading plate and connected to the plurality of pattern electrodes to supply a high-level pattern voltage to at least one pattern electrode among the plurality of pattern electrodes so that an electric field is formed between the plurality of pattern electrodes, wherein the thin film coating controller selectively supplies the high-level pattern voltage to the at least one pattern electrode based on pattern information including a type of the dispensing material, a pattern design structure, or a step structure of the manufacturing substrate.

2. The apparatus of claim 1, wherein, The loading plate includes: a base plate formed as a flat plate in a circular shape or a polygonal shape; the plurality of pattern electrodes provided on a front surface of the base plate on which the manufacturing substrate is seated; a plurality of electrical terminals formed on at least one side surface or a rear surface of the base plate; a plurality of connection lines connected in series or in parallel to each group of the plurality of pattern electrodes and electrically connecting each group of the plurality of pattern electrodes to at least one electrical terminal among the plurality of electrical terminals; and a dielectric layer formed on the front surface of the base plate including the plurality of pattern electrodes.

3. The apparatus of claim 2, wherein, The plurality of pattern electrodes are formed as plate-type electrodes having at least one polygonal shape of a triangle, a rectangle, a rhombus, a pentagon, a hexagon, and an octagon, or as disc-type electrodes having at least one circular shape of a circle, an ellipse, and a semicircle, wherein the plurality of pattern electrodes are arranged in parallel in a matrix in a first direction and a second direction perpendicular to the first direction, and are arranged at the same pitch, and wherein the plurality of pattern electrodes are arranged on or embedded in the front surface of the base plate.

4. The apparatus of claim 3, wherein, Each group of the plurality of pattern electrodes connected in series or in parallel to the plurality of connection lines is arranged in parallel in the first direction, and wherein one end of each of the plurality of connection lines is connected to an electrical terminal to which a low-level voltage is applied, and the other end of each of the plurality of connection lines is electrically connected to another electrical terminal to which the high-level pattern voltage is applied, wherein, among the plurality of connection lines connected to each group of the plurality of pattern electrodes arranged in the first direction, a first end of each connection line of the plurality of connection lines for a group of the plurality of pattern electrodes arranged along an odd-numbered row is connected to at least one electrical terminal to which a ground voltage or a low-level voltage is applied, and a second end of each connection line of the plurality of connection lines for the group of the plurality of pattern electrodes arranged along the odd-numbered row is electrically connected to another electrical terminal to which the high-level pattern voltage is applied, and wherein, among the plurality of connection lines connected to each group of the plurality of pattern electrodes arranged in the first direction, a first end of each connection line of the plurality of connection lines for a group of the plurality of pattern electrodes arranged along an even-numbered row is connected to at least one electrical terminal to which a ground voltage or a low-level voltage is applied, and a second end of each connection line of the plurality of connection lines for the group of the plurality of pattern electrodes arranged along the even-numbered row is electrically connected to another electrical terminal to which the high-level pattern voltage is applied. Among the plurality of connection lines connected to each group of the plurality of pattern electrodes arranged in the first direction, a second end of each of the plurality of connection lines for a group of the plurality of pattern electrodes arranged along an even-numbered row is connected to at least one electrical terminal to which a ground voltage or a low-level voltage is applied, and a first end of each of the plurality of connection lines for the group of the plurality of pattern electrodes arranged along the even-numbered row is electrically connected to another electrical terminal to which the high-level pattern voltage is applied.

5. The apparatus of claim 3, wherein, The thin film coating controller receives and stores the pattern information and voltage setting information according to a pattern design structure of the manufacturing substrate, a step structure, and a type of the dispensing material, selects a group of the plurality of pattern electrodes or each of the plurality of pattern electrodes based on the pattern information, and supplies the high-level pattern voltage to an electrical terminal and a connection line electrically connected to the selected pattern electrode or the selected group of the plurality of pattern electrodes.

6. The apparatus of claim 1, wherein, The loading plate includes a plurality of plate blocks connected or separated from each other in a flat form to conform to a planar shape and a size of the manufacturing substrate, wherein each of the plurality of plate blocks includes: a base plate formed in a flat shape of a circular shape or a polygonal shape; the plurality of pattern electrodes disposed on a front surface of the base plate on which the manufacturing substrate is seated; a dielectric layer formed to cover the front surface of the base plate including the plurality of pattern electrodes; a plurality of electrical terminals formed on at least one side surface or a rear surface of the base plate; and a plurality of connection lines connected in series or in parallel with each group of the plurality of pattern electrodes and electrically connecting each group of the plurality of pattern electrodes to at least one electrical terminal among the plurality of electrical terminals.

7. The apparatus of claim 6, wherein, The manufacturing substrate is seated on a front side of each of the plurality of plate blocks, and the front side of each of the plurality of plate blocks is formed in at least one polygonal shape selected from the group consisting of a triangle, a rectangle, a rhombus, and a square, and wherein a size or an area of the front side of each of the plurality of plate blocks formed in a polygonal shape is the same as or different from a size or an area of a front side of other adjacent plate blocks.

8. The apparatus of claim 7, wherein, at least one plate block among the plurality of plate blocks includes an electrode placement area and a non-electrode placement area on the front side of the at least one plate block, wherein the plurality of pattern electrodes are disposed in a matrix in the electrode placement area, wherein the plurality of pattern electrodes are arranged in parallel in a first direction and a second direction perpendicular to the first direction at the same pitch in the electrode placement area, wherein the plurality of pattern electrodes are arranged on or embedded in the front surface of the base plate, and wherein the plurality of connection lines are connected in series or in parallel with each group of the plurality of pattern electrodes and electrically connect each group of the plurality of pattern electrodes to at least one electrical terminal among the plurality of electrical terminals.

9. An apparatus for manufacturing a display panel, comprising: The apparatus includes: a loading plate having a plurality of pattern electrodes arranged in a matrix on a front surface, wherein a manufacturing substrate is loaded on the front surface of the loading plate on which the plurality of pattern electrodes are arranged; at least one dispenser for dispensing a dispensing material of a liquid on the manufacturing substrate; and a thin film coating controller disposed on a rear surface of the loading plate and connected to the plurality of pattern electrodes to supply a high level pattern voltage to at least one pattern electrode among the plurality of pattern electrodes so that an electric field is formed between the plurality of pattern electrodes, wherein the loading plate includes a plurality of plate blocks connected or separated from each other in a flat form to conform to a planar shape and a size of the manufacturing substrate, and wherein the thin film coating controller selectively supplies the high level pattern voltage to the at least one pattern electrode based on pattern information including a type of the dispensing material, a pattern design structure, or a step structure of the manufacturing substrate.

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