Silicon wafer tool basket
By designing the support structure of the silicon wafer tooling basket and utilizing the combination of wing screws and nuts, the problem of silicon wafers tilting and breaking during the debinding process was solved, thus improving production efficiency.
Patent Information
- Application Number
- CN202520038675.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2026-03-17
- Estimated Expiration
- 2035-01-08
AI Technical Summary
During the debinding process, silicon wafers may not completely fill the tooling basket due to differences in size or processing technology, leading to tilting and breakage, which affects production efficiency.
A silicon wafer tooling basket was designed, comprising a frame, a support plate, and a movable baffle. The silicon wafer is movable and supported by a combination of wing screws and nuts, preventing it from tilting and breaking.
It effectively prevents silicon wafers from tilting and breaking after debonding, reducing the breakage rate and improving production efficiency.
Smart Images

Figure CN224007068U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of silicon wafers, and in particular to a silicon wafer tooling basket. Background Technology
[0002] The manufacturing process of wafer-shaped monocrystalline silicon solar cells typically includes: using a squaring machine to cut cylindrical monocrystalline silicon rods into square rods, then using a slicing machine to cut the square rods into square silicon wafers, followed by steps such as cleaning, debinding, and wafer insertion. After the silicon wafers come off the slicing machine, they are placed in a tooling basket and then enter a debinding machine for debinding.
[0003] Due to differences in silicon wafer size or processing technology, the total length of the silicon wafers during debonding will vary, making it impossible to fill the space inside the tooling basket. Therefore, after debonding, the silicon wafers are prone to tilting and breaking in the basket, affecting production. Utility Model Content
[0004] The purpose of this invention is to provide a silicon wafer tooling basket to overcome the shortcomings of the prior art.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] This application discloses a silicon wafer jig basket, including a frame, in which a receiving space for accommodating silicon wafers is formed. The basket is characterized by: a pair of support plates symmetrically arranged front and rear within the frame; a movable baffle within the receiving space; a transverse groove on each support plate penetrating the front and rear ends of the support plate; a wing screw inserted into the transverse groove; the end of the wing screw facing the movable baffle being threadedly connected to the movable baffle; and a wing nut at the end of the wing screw facing away from the movable baffle.
[0007] Preferably, in the silicon wafer tooling basket described above, the movable baffle is recessed with a threaded hole that engages with a wing screw.
[0008] Preferably, in the silicon wafer tooling basket described above, the support plate is arranged horizontally, and a limiting rod that penetrates the movable baffle is fixed inside the frame, the limiting rod being parallel to the support plate.
[0009] Preferably, in the silicon wafer tooling basket described above, a pair of limiting rods are provided, and the pair of limiting rods are symmetrically arranged front and back.
[0010] Preferably, in the silicon wafer tooling basket described above, both ends of the support plate are fixedly connected to the frame.
[0011] Compared with the prior art, the advantages of this utility model are:
[0012] The silicon wafer is supported by a movable baffle and a wing screw in a fixed cooperation manner, preventing the silicon wafer from tilting and breaking after the glue is removed, reducing the breakage rate and improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings described below are only some embodiments recorded in the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0014] Figure 1 The perspective view of the silicon wafer tooling basket in the specific embodiment of the present utility model is shown. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0015] The following will describe the technical solutions in the embodiments of the present utility model in detail with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts belong to the scope of protection of the present utility model.
[0016] Refer Figure 1 As shown, the silicon wafer tooling basket in this embodiment includes a frame 1. An accommodation space 2 for accommodating silicon wafers is formed inside the frame 1. A pair of support plates 3 are symmetrically arranged front and back inside the frame 1. A movable baffle 4 is arranged inside the accommodation space 2. A transverse groove 5 is provided on the support plate 3, and the transverse groove 5 penetrates the front and rear end faces of the support plate 3. A wing screw 6 is inserted into the transverse groove 5. One end of the wing screw 6 facing the movable baffle 4 is in threaded connection with the movable baffle 4, and the other end of the wing screw 6背离 the movable baffle 4 has a wing nut 7.
[0017] Further, a threaded hole for threaded connection with the wing screw 6 is recessed on the movable baffle 4.
[0018] Further, the support plate 3 is arranged horizontally, and a limiting rod 8 penetrating the movable baffle 4 is fixed inside the frame 1, and the limiting rod 8 is parallel to the support plate 3.
[0019] Further, there are a pair of limiting rods 8, and the pair of limiting rods 8 are symmetrically arranged front and back.
[0020] Further, both ends of the support plate 3 are fixedly connected to the frame 1.
[0021] In this technical solution, the silicon wafer is supported by a movable baffle and a wing screw in a fixed cooperation manner, preventing the silicon wafer from tilting and breaking after the glue is removed, reducing the breakage rate and improving the production efficiency.
[0022] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.
[0023] The above are merely specific embodiments of this application. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.
Claims
1. A silicon wafer tool basket comprising a frame having a receiving space formed therein for receiving a silicon wafer, characterized by: A pair of support plates are symmetrically arranged in the frame, a movable baffle is arranged in the accommodating space, a horizontal groove is arranged on the support plate, the horizontal groove penetrates the front and rear end surfaces of the support plate, a butterfly screw is inserted into the horizontal groove, one end of the butterfly screw that faces the movable baffle is threadedly connected with the movable baffle, and the other end of the butterfly screw that is away from the movable baffle is provided with a butterfly nut.
2. The wafer boat of claim 1 wherein: A threaded hole that threadedly connects with the butterfly screw is concavely arranged on the movable baffle.
3. The wafer boat of claim 1 wherein: The support plate is arranged in the transverse direction, a limiting rod that penetrates the movable baffle is fixed in the frame, and the limiting rod is parallel to the support plate.
4. The wafer boat of claim 3 wherein: The limiting rod is provided with a pair of limiting rods that are symmetrically arranged in the front and rear directions.
5. The wafer boat of claim 1 wherein: The two ends of the support plate are fixedly connected with the frame.