A bonding device for optical components

Abstract

This application provides a bonding device for optical components, used to bond optical components to a bonding mold. The bonding device includes: a frame, vertically arranged; a support platform, mounted on the frame and used to connect the bonding mold, the bonding mold being rotatable on the support platform; a calibration support frame, mounted on the frame and located above the support platform, and having an adjustment cavity; and multiple adjusting members, adjustablely arranged on the calibration support frame and distributed around the central axis of the adjustment cavity, the adjusting members being radially movable along the adjustment cavity; the optical component is bonded to the bonding mold by hot melt wax and placed within the adjustment cavity, and the optical component is pushed horizontally by the multiple adjusting members to make the optical component coaxial with the bonding mold. This solves the problems of low mounting accuracy and large positioning accuracy error of optical components caused by manual mounting in the prior art.

Description

Technical Field

[0001] This application relates to the field of optical component processing technology, and more specifically, to an optical component bonding device. Background Technology

[0002] In the manufacturing process of optical components, when grinding or polishing optical components, they are usually bonded to a bonding mold. The bonding mold is then fixed on the processing equipment before further processing. This process is usually called the mounting process. In the mounting process, it is necessary to ensure that the central axis of the optical component and the central axis of the bonding mold are as coincident as possible.

[0003] In the conventional process of mounting optical components, experienced operators typically manually bond the optical components to the bonding mold using wax. Adjusting the deviation between the optical component and the mold's central axis is usually done manually. However, manual adjustment is often difficult to control due to the challenge of applying force, leading to inaccurate positioning of the optical component and low efficiency. Therefore, this conventional manual mounting method results in low mounting accuracy, a significant deviation between the central axis of the optical component and the mold's central axis, and substantial positioning errors that negatively impact the manufacturing precision of the optical component.

[0004] Therefore, existing technologies still need to be improved and developed. Utility Model Content

[0005] The purpose of this application is to provide a bonding device for optical components, which solves the problems of low bonding accuracy and large positioning accuracy error of optical components caused by manual bonding in the prior art.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0007] This application provides an optical component bonding device for bonding optical components onto a bonding mold, wherein the bonding device includes: a frame, the frame being vertically arranged;

[0008] A support platform is mounted on the frame and used to connect the bonding mold. The bonding mold can rotate on the support platform.

[0009] The calibration support frame is mounted on the frame and located above the support platform, and has an adjustment cavity;

[0010] Multiple adjusting components are adjustablely mounted on the correction support frame and distributed around the central axis of the adjusting cavity. The adjusting components can move radially along the adjusting cavity.

[0011] Optical components are attached to the bonding mold using hot melt wax and placed in the adjustment cavity. Multiple adjustment components push the optical components horizontally to make them coaxial with the bonding mold.

[0012] In an optional embodiment, the calibration support frame includes a height adjustment member, which is adjustablely mounted on the frame;

[0013] The support ring is connected to the height adjustment component and the distance between the support ring and the support platform is adjusted through the height adjustment component. The support ring forms an adjustment cavity.

[0014] The adjusting element is mounted on the support ring and can be adjusted to move along the central axis near or away from the adjusting cavity.

[0015] In an optional embodiment, the adjusting member includes a measuring screw that passes through the support ring;

[0016] The measuring screw is moved toward or away from the central axis of the adjustment cavity by being turned.

[0017] In an optional embodiment, the support platform includes: a base, which is disposed on the frame;

[0018] The coaxial disk is rotatably mounted on the base, and a connector is provided on the coaxial disk. The connector is used to connect the bonding mold so as to drive the bonding mold to rotate coaxially.

[0019] In an optional embodiment, a temperature control component is provided below the calibration support frame. The temperature control component is used to heat the wax between the optical component and the bonding mold to form hot melt wax, or to cool and solidify the hot melt wax between the optical component and the bonding mold.

[0020] In an optional embodiment, the temperature control component includes: a heating plate on which a high-frequency heating coil is disposed;

[0021] The cooling section is located on the high-frequency heating coil. The heating plate and the cooling section together control the temperature of the wax between the optical components and the bonding mold.

[0022] In an optional embodiment, the high-frequency heating coil is a metal tube coil, and the inner hole of the metal tube coil is cooled by a coolant.

[0023] In an optional embodiment, the bonding device further includes a ventilation assembly for removing fumes generated by the hot melt wax.

[0024] The exhaust assembly includes an exhaust fan and an exhaust duct. The exhaust duct is connected to the frame and its outlet is located above the calibration support frame to draw air from the optical components and bonding mold.

[0025] In an optional embodiment, the exhaust assembly is height-adjustably mounted on the rack.

[0026] In an optional embodiment, the frame includes: a base platform, and a support platform disposed on the base platform;

[0027] The columns are erected vertically on the base platform along the height direction, and the correction support frame is set on the columns.

[0028] The beneficial effects of the bonding device for optical components provided in this application are at least as follows: By setting the bonding mold on a support platform and making the bonding mold rotatable on the support platform, when the optical component is bonded to the bonding mold with hot melt wax, the rotating bonding mold drives the optical component to rotate within the adjustment cavity of the alignment support frame. During the rotation of the optical component, the position of the optical component can be detected by a detection device (e.g., a dial indicator), allowing the operator to understand the direction and amount of deviation between the central axis of the optical component and the central axis of the bonding mold. Based on the direction and amount of deviation, the operator adjusts the corresponding adjusting component, thereby pushing the optical component located in the adjustment cavity. This causes the optical component to move horizontally and gradually approach the central axis of the bonding mold, thus enabling the optical component to become coaxial with the bonding mold under the adjustment and pushing of the adjusting component. In this way, the adjusting component allows for precise pushing of the optical component, making the process of aligning the central axis of the optical component with the central axis of the bonding mold easier, thereby improving bonding efficiency. Furthermore, it enables high-precision bonding of optical components to the bonding mold, ensuring the mounting accuracy of the optical components, improving the positioning accuracy of the optical components, and further enhancing the processing accuracy. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A schematic diagram of the structure of an optical component bonding device provided in this application during use;

[0031] Figure 2 A cross-sectional view of an optical component bonding device provided in an embodiment of this application during use;

[0032] Figure 3 for Figure 2 Enlarged view of point A;

[0033] Figure 4This is a schematic diagram showing the positional distribution of the adjusting members of an optical component bonding device provided in an embodiment of this application on a calibration support frame.

[0034] The following are the labeling elements in the figure:

[0035] 10. Optical components; 20. Bonding mold; 100. Frame; 110. Base; 120. Column; 200. Support platform; 210. Base; 220. Coaxial disk; 300. Correction support frame; 310. Height adjustment component; 320. Support ring; 321. Adjustment cavity; 400. Adjustment component; 410. Measuring screw; 500. Temperature control assembly; 510. Heating plate; 511. High-frequency heating coil; 520. Temperature control bracket; 530. Cooling section; 531. Inner hole; 600. Exhaust assembly; 610. Exhaust duct; 620. Exhaust bracket; 630. Exhaust fan. Detailed Implementation

[0036] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0037] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0038] Please see Figure 1 , Figure 2This embodiment provides a bonding device for optical components, which can use wax to bond optical components 10 to a bonding mold 20. The bonding device mainly includes: a frame 100, a support platform 200, a correction support frame 300, and multiple adjusting components 400. The frame 100 is vertically arranged so that it can provide support for each component in the height direction (vertical direction). The support platform 200 is arranged on the frame 100 and is used to connect the bonding mold 20. The bonding mold 20 is rotatable on the support platform 200. In the specific structure, after the bonding mold 20 is installed on the support platform 200, it can be rotated coaxially through the support platform 200. A calibration support frame 300 is mounted on the frame 100 and located above the support platform 200, and has an adjustment cavity 321. The adjustment cavity 321 extends vertically, and the bonding mold 20 mounted on the support platform 200 can be located below the adjustment cavity 321. The optical component 10 is first connected to the upper surface of the bonding mold 20 by hot melt wax, thereby placing the optical component 10 in the adjustment cavity 321, and the position of the optical component 10 on the upper surface is adjustable. Multiple adjustment members 400 are adjustablely mounted on the calibration support frame 300 and distributed around the central axis of the adjustment cavity 321. The adjustment members 400 can move radially along the adjustment cavity 321. Therefore, when one end of the adjustment member 400 located in the adjustment cavity 321 abuts against the side of the optical component 10, the optical component 10 can be pushed and its position on the upper surface of the bonding mold 20 can be adjusted by adjusting the adjustment member 400. When the bonding mold 20 of the support platform 200 rotates, the optical component 10 is connected to the bonding mold 20 by hot melt wax and placed in the adjustment cavity 321, so that the optical component 10 rotates with the bonding mold 20. The deviation between the central axis of the optical component 10 and the central axis of the bonding mold 20 can be detected by external testing equipment (such as a dial indicator). Then, the optical component 10 is pushed horizontally by multiple adjusting parts 400 to adjust the position of the optical component 10 so that the optical component 10 is coaxial with the bonding mold 20.

[0039] Please see Figure 1 , Figure 2In this embodiment, the optical component bonding device involves placing a bonding mold 20 on a support platform 200, allowing the mold 20 to rotate. When the optical component 10 is bonded to the bonding mold 20 using hot melt wax, the rotating mold 20 causes the optical component 10 to rotate within the adjustment cavity 321 of the calibration support frame 300. During the rotation of the optical component 10, a dial indicator can be used to measure the outer circumference of the optical component 10, allowing the operator to determine the direction and amount of deviation between the central axis of the optical component 10 and the central axis of the bonding mold 20. Based on the deviation direction and amount, the operator adjusts the corresponding adjustment component 400. By moving the adjustment component 400, the operator pushes the optical component 10 located in the adjustment cavity 321, causing it to move horizontally and gradually approach the central axis of the bonding mold 20. This ensures that the optical component 10 and the bonding mold 20 are coaxial under the adjustment and pushing action of the adjustment component 400. This allows for precise pushing of the optical component 10 via the adjusting component 400, making it easier to align the central axis of the optical component 10 with the central axis of the bonding mold 20, thereby improving bonding efficiency. Furthermore, it enables high-precision bonding of the optical component 10 to the bonding mold 20, ensuring the mounting accuracy of the optical component 10 and improving its positioning accuracy and further processing precision.

[0040] Please see Figure 1 , Figure 2 Furthermore, the frame 100 in this embodiment includes a base 110 and a column 120. The base 110 is arranged horizontally, and the column 120 is vertically arranged on the base 110. The support platform 200 can be fixedly arranged on the base 110 and has a rotation function, with its rotation axis facing up and down. The correction support frame 300 is arranged on the column 120, and the column 120 can support the correction support frame 300, so that the correction support frame 300 is stably positioned above the support platform 200.

[0041] Please see Figure 1 , Figure 2 , Figure 3Furthermore, the support platform 200 in this embodiment specifically includes a base 210 and a coaxial disk 220. The base 210 can be fixedly mounted on the frame 100, and the coaxial disk 220 is rotatably mounted on the base 210. A connector is provided on the coaxial disk 220, which is used to connect the bonding mold 20 to drive the bonding mold 20 to rotate coaxially. Both the base 210 and the coaxial disk 220 are existing connecting and rotating structures, such as triangular rotary chucks or rotary clamping chucks. As long as the coaxial disk 220 fulfills the function of connecting and driving the bonding mold 20 to rotate, the technical problem can be solved. Specific structures are not described in detail. After the bonding mold 20 is connected to the support platform 200, the central axis of the bonding mold 20 coincides with the central axis of the support platform 200. The bonding mold 20 is set vertically and can rotate coaxially relative to the support platform 200. In this way, when the optical component 10 on it is tested with a dial indicator, the deviation between the central axis of the optical component 10 and the central axis of the bonding mold 20 can be detected.

[0042] Please see Figure 2 , Figure 3 Furthermore, the calibration support frame 300 of this embodiment specifically includes a height adjustment member 310 and a support ring 320. The height adjustment member 310 is adjustablely mounted on the frame 100, and the support ring 320 is connected to the height adjustment member 310 and its distance from the support platform 200 is adjusted via the height adjustment member 310. The support ring 320 forms an adjustment cavity 321. The adjustment member 400 is mounted on the support ring 320 and can be adjusted along the central axis near or away from the adjustment cavity 321. In a specific structure, the height adjustment member 310 can be sleeved on the column 120 and fixed at a predetermined height position on the column 120 by a through locking screw. This allows the height of the support ring 320 to be adjusted according to the different heights of the optical components 10, so that the support ring 320 can be sleeved on the outside of the optical components 10, thereby allowing the adjustment member 400 to push against the outer wall of the optical components 10.

[0043] Please see Figure 1 , Figure 3 Furthermore, the adjusting member 400 in this embodiment specifically includes a measuring screw 410, which is disposed through the support ring 320. The measuring screw 410 moves toward or away from the central axis of the adjusting cavity 321 by turning. The measuring screw 410 is a precision measuring rod, which, when turned multiple times, moves only a small distance radially, thus enabling more precise movement of the optical component 10. Please refer to [link to previous section]. Figure 3 , Figure 4The measuring screw 410 has at least three measuring heads on the support ring 320. During the process of pressing the measuring screw 410 onto the optical component 10 blank, the optical component 10 blank is adjusted to move on the standard to ensure that the central axis of the optical component 10 blank coincides with the central axis of the bonding mold 20.

[0044] Please see Figure 1 , Figure 2 , Figure 3 Furthermore, a temperature control component 500 is provided below the calibration support frame 300. The temperature control component 500 can realize heating and cooling functions. Therefore, the temperature control component 500 is used to heat the wax between the optical component 10 and the bonding mold 20 to form hot melt wax, or to cool and solidify the hot melt wax between the optical component 10 and the bonding mold 20. Before placing the optical component 10 on the bonding mold 20, wax is applied to the bonding mold 20. At this time, it is solid wax at room temperature and does not have adhesive properties. After the optical component 10 is placed on the bonding mold 20, the temperature control component 500 is activated to heat it. By heating the bonding mold 20, the wax on the bonding mold 20 is melted to form hot melt wax. Then, by adjusting the position of the optical component 10 on the bonding mold 20 through the adjusting component 400, it is easy to move the optical component 10. Once the optical component 10 is positioned on the bonding mold 20, the temperature control component 500 is activated for cooling. As the temperature decreases, the hot melt wax between the optical component 10 and the bonding mold 20 cools into a solid, thereby completing the bonding of the optical component 10 and the bonding mold 20 through the curing of the wax.

[0045] Please see Figure 1 , Figure 2 , Figure 3 Furthermore, the temperature control component 500 in this embodiment specifically includes a heating plate 510, on which a high-frequency heating coil 511 is disposed. In this specific structure, heating is performed via the high-frequency heating coil 511, which has the advantages of fast heating speed for metals (the bonding mold 20 is a metal part) and high heating efficiency, thereby avoiding the problem of large heat loss leading to significant energy loss. This saves energy, improves heating efficiency, and reduces production costs.

[0046] Please see Figure 1 , Figure 2 , Figure 3 Furthermore, the temperature control component 500 in this embodiment also includes a cooling section 530, which is disposed on the high-frequency heating coil 511. Firstly, the combination of the cooling section 530 and the high-frequency heating coil 511 helps to control the heating temperature of the bonding mold 20 within a predetermined temperature range. Secondly, after the optical component 10 is adjusted, the temperature can be slowly reduced by the cooling section 530, thereby gradually cooling the hot melt wax into a solid, achieving bonding and fixation.

[0047] Please see Figure 1 , Figure 2 Furthermore, in this embodiment, the high-frequency heating coil 511 is a metal tube coil, and the inner hole 531 of the metal tube coil forms a cooling section 530 through a coolant. The high-frequency heating plate 510 is made of wound copper tube, and is directly cooled by water cooling within the inner hole 531 of the copper tube. Thus, the internal water flow not only adjusts the temperature of the high-frequency heating coil 511, but also provides cooling when not heating. Water cooling from within the metal tube coil optimizes the cooling structure. After heating and alignment adjustment, the cooling medium inside the copper tube carries away the heat from the bonding mold 20 and the optical component 10, achieving gradual cooling and preventing the optical component 10 from cracking due to extreme temperature fluctuations during bonding.

[0048] Please see Figure 1 , Figure 2 Furthermore, the frame 100 is also equipped with an exhaust assembly 600, which is used to remove the fumes generated by the hot melt wax and to provide a certain degree of auxiliary cooling. During the bonding process, the wax typically generates fumes at high temperatures. To protect the health of operators, the exhaust assembly 600 is activated to remove these fumes. In this embodiment, the exhaust assembly 600 specifically includes an exhaust fan 630 and an exhaust duct 610. The exhaust duct 610 is connected to the frame 100, and its opening is located above the correction support frame 300 to exhaust air from the position of the optical component 10 and the bonding mold 20. When the exhaust fan 630 is turned on, it generates suction, drawing away the fumes around the optical component 10 through the exhaust duct 610.

[0049] Please see Figure 1 , Figure 2 Furthermore, the temperature control component 500 and the exhaust component 600 are located below and above the calibration support frame 300, respectively. The temperature control component 500 is height-adjustably mounted on the column 120 of the frame 100 via the temperature control bracket 520. Since the bonding mold 20 needs to pass through the heating plate 510 and be installed on the support platform 200 below during installation, the heating plate 510 is provided with a through hole, around which the high-frequency heating coil 511 can be arranged so that the bonding mold 20 can pass through. The height of the heating plate 510 is adjusted via the temperature control bracket 520 according to the height of different bonding molds 20, thereby adapting to bonding molds 20 of different heights.

[0050] Please see Figure 1 , Figure 2Furthermore, the exhaust assembly 600 is height-adjustably mounted on the frame 100 via the exhaust bracket 620. Specifically, the exhaust duct 610 is connected to the column 120 of the frame 100 via the exhaust bracket 620, allowing the opening of the exhaust duct 610 to face the optical component 10. The height of the opening of the exhaust duct 610 can be adjusted via the exhaust bracket 620, thus adjusting the suction force on the optical component 10 and the operating space below. The outlet height of the exhaust duct 610 can also be adjusted according to the different heights of the optical component 10, enhancing its practicality.

[0051] In summary, the bonding device for optical components provided in this application can achieve high-precision positioning of optical components on the bonding mold, further improving the processing accuracy of optical components. It is suitable for processing aspherical components, as well as spherical, planar and other types of products.

[0052] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A bonding apparatus for optical components, used to bond optical components onto a bonding mold, characterized in that, The bonding device includes: a frame, wherein the frame is vertically arranged; A support platform is provided on the frame and is used to connect the bonding mold, the bonding mold being rotatable on the support platform; A calibration support frame is disposed on the frame and above the support platform, and has an adjustment cavity; Multiple adjusting members are adjustablely mounted on the correction support frame and distributed around the central axis of the adjusting cavity. The adjusting members can move radially along the adjusting cavity. The optical component is attached to the bonding mold by hot melt wax and placed in the adjustment cavity. The optical component is pushed horizontally by multiple adjustment components to make the optical component coaxial with the bonding mold.

2. The bonding device for optical components as described in claim 1, characterized in that, The correction support frame includes a height adjustment component, which is adjustablely mounted on the frame. A support ring is connected to the height adjustment member and the distance between the support ring and the support platform is adjusted through the height adjustment member, and the support ring forms the adjustment cavity; The adjusting member is disposed on the support ring and can be adjusted to move along the central axis near or away from the adjusting cavity.

3. The bonding device for optical components as described in claim 2, characterized in that, The adjusting component includes a measuring screw, which is disposed through the support ring. The measuring screw is moved toward or away from the central axis of the adjustment cavity by being turned.

4. The bonding device for optical components as described in claim 1, characterized in that, The support platform includes a base, which is mounted on the frame. A coaxial disk is rotatably mounted on the base, and a connector is provided on the coaxial disk. The connector is used to connect the bonding mold so as to drive the bonding mold to rotate coaxially.

5. The bonding device for optical components as described in claim 1, characterized in that, A temperature control component is provided on one side of the correction support frame. The temperature control component is used to heat the wax between the optical component and the bonding mold to form hot melt wax, or to cool and solidify the hot melt wax between the optical component and the bonding mold.

6. The bonding apparatus for optical components as described in claim 5, characterized in that, The temperature control component includes: a heating plate, on which a high-frequency heating coil is disposed; A cooling section is provided on the high-frequency heating coil, and the heating plate and the cooling section together control the temperature of the wax between the optical component and the bonding mold.

7. The bonding device for optical components as described in claim 6, characterized in that, The high-frequency heating coil is a metal tube coil, and the cooling section is formed by the coolant passing through the inner hole of the metal tube coil.

8. The bonding apparatus for optical components as described in claim 1, characterized in that, The bonding device also includes a ventilation assembly for removing the fumes generated by the hot melt wax. The exhaust assembly includes an exhaust fan and an exhaust duct. The exhaust duct is connected to the frame, and the outlet of the exhaust duct is located above the calibration support frame to draw air from the optical components and the bonding mold.

9. The bonding apparatus for optical components as described in claim 8, characterized in that, The exhaust assembly is adjustable in height on the frame.

10. The bonding apparatus for optical components as described in any one of claims 1-9, characterized in that, The frame includes a base platform, and the support platform is disposed on the base platform; A column is erected vertically on the base platform along its height direction, and the correction support frame is mounted on the column.

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