Heat dissipation device and electronic device comprising the same
By using a multi-directional heat conduction structure and spring screw connection, the problem of increased weight and assembly instability caused by traditional heat conduction pillars is solved, achieving a highly efficient heat dissipation effect, which is suitable for portable electronic products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ADLINK TECH INC
- Filing Date
- 2025-06-20
- Publication Date
- 2026-06-05
AI Technical Summary
In existing technologies, the increased weight, assembly instability, and low heat transfer efficiency caused by traditional heat-conducting pillars make it difficult to effectively dissipate heat in portable electronic products.
It adopts a multi-directional heat conduction structure, including a main heat base, multiple main heat plates and a main heat pipe, combined with heat dissipation shell and heat dissipation fins, to transfer heat to a larger heat dissipation structure through multiple heat dissipation paths, and uses a spring screw structure to ensure stable connection of components.
It improves heat dissipation efficiency, reduces heat buildup, enhances assembly stability, and is suitable for space-constrained electronic devices.
Smart Images
Figure CN224329814U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a heat dissipation device and an electronic device including the heat dissipation device, particularly a heat dissipation device with a multidirectional heat conduction structure and an electronic device including the heat dissipation device. Background Technology
[0002] With the rapid development of electronic technology, computers and portable devices have become deeply integrated into people's daily lives and work. As portable electronic products trend towards thinner and lighter designs, the heat generated by internal circuit boards, such as central processing units (CPUs), microprocessors, or single-chip microprocessors, must be effectively dissipated to maintain stable device operation. Due to space constraints, portable electronic devices often cannot be equipped with active cooling fans. Therefore, existing technologies mostly utilize the casing as a heat dissipation medium, or use aluminum or copper pillars to conduct heat to the casing to achieve a passive cooling effect.
[0003] However, the traditional use of aluminum or copper heat pipes has many drawbacks. For example, the material itself is relatively heavy, increasing the overall weight of the product and affecting shock absorption and impact resistance. Heat pipes create a fixed gap between the circuit board and the casing, which reduces overall heat transfer efficiency and leads to heat buildup. Heat pipes require high dimensional accuracy; even slight errors can affect assembly quality and product yield. Therefore, the industry urgently needs a more efficient heat transfer solution that balances heat dissipation and assembly stability. Utility Model Content
[0004] The present invention provides a heat dissipation device and an electronic device including the same, thereby solving the problems of poor heat dissipation performance, assembly accuracy and stability in the prior art.
[0005] One embodiment of this utility model discloses a heat dissipation device for cooling a heat source on a motherboard. The heat dissipation device includes a main heat sink, multiple main heat plates, and multiple main heat pipes. The main heat sink is used to fix itself to the motherboard and make thermal contact with the heat source. The multiple main heat plates are located on different sides of the main heat sink, and each of the multiple main heat plates makes thermal contact with a heat sink component. Each of the multiple main heat pipes is connected between the main heat sink and one of the multiple main heat plates, and the multiple main heat pipes are used to transfer heat from the main heat sink to the multiple main heat plates.
[0006] The plurality of main heating plates are located on opposite sides of the main heating base.
[0007] The plurality of main hot plates are located on adjacent sides of the main hot seat.
[0008] The heat dissipation device further includes a heat dissipation shell. The heat dissipation shell is the heat dissipation component and is used to house the motherboard and the heat source. The main heat sink, the plurality of main heat plates, and the plurality of main heat pipes are disposed inside the heat dissipation shell, and the plurality of main heat plates are respectively in thermal contact with different inner surfaces of the heat dissipation shell.
[0009] The heat dissipation device further includes a plurality of heat dissipation fins, wherein the plurality of heat dissipation fins are disposed on the outer surface of the heat dissipation housing.
[0010] The heat dissipation housing includes an upper cover and a lower cover. The upper cover is assembled to the lower cover and together they form an accommodating space. The accommodating space is used to accommodate the motherboard and the heat source. The main heat sink, the plurality of main heat plates and the plurality of main heat pipes are disposed in the accommodating space.
[0011] The main heat sink has an assembly groove in which the plurality of main heat pipes are disposed, and the plurality of main heat pipes extend out from one side of the main heat sink.
[0012] The plurality of main heat pipes include a plurality of first main heat pipes and a plurality of second main heat pipes. The plurality of first main heat pipes extend from the main heat base to one side of the main heat base, and the plurality of second main heat pipes extend from the main heat base to the other side of the main heat base. The plurality of first main heat pipes and the plurality of second main heat pipes are arranged alternately on the main heat base.
[0013] The heat dissipation device further includes a plurality of spring screw structures, wherein each of the plurality of spring screw structures is connected between at least one of the plurality of main heat plates and the main heat base, such that at least one of the plurality of main heat plates is movably connected to the main heat base.
[0014] Another embodiment of this utility model discloses an electronic device including a motherboard, at least one heat source, and a heat dissipation device. The heat source is disposed on the motherboard. The heat dissipation device is used to cool the heat source and includes a main heat sink, a plurality of main heat plates, and a plurality of main heat pipes. The main heat sink is fixed to the motherboard and in thermal contact with the at least one heat source. The plurality of main heat plates are respectively located on different sides of the main heat sink and are respectively used to in thermal contact with a heat sink. Each of the plurality of main heat pipes is connected between the main heat sink and one of the main heat plates, and the plurality of main heat pipes are used to transfer heat from the main heat sink to the plurality of main heat plates.
[0015] The at least one heat source includes two heat sources, and the heat dissipation device further includes an expanded heat conduction base, an expanded heat conduction plate, and at least one expanded heat pipe. The expanded heat conduction base is fixed to the motherboard and in thermal contact with one of the two heat sources. The expanded heat conduction plate is located on one side of the expanded heat conduction base and in thermal contact with the heat dissipation component. The at least one expanded heat pipe is connected between the expanded heat conduction base and the expanded heat conduction plate, and the at least one expanded heat pipe is used to transfer heat from the expanded heat conduction base to the expanded heat conduction plate.
[0016] According to the heat dissipation device and electronic device disclosed in the above embodiments, both the upper and lower sides of the main heat base have independent heat diffusion and conduction capabilities, which can provide multi-directional heat dissipation transfer paths, thereby conducting heat to other heat dissipation modules or a larger area heat dissipation structure, thereby effectively improving the overall heat dissipation efficiency.
[0017] The above description of the present utility model and the following description of the embodiments are used to demonstrate and explain the principles of the present utility model, and to provide a further explanation of the scope of the patent application of the present utility model. Attached Figure Description
[0018] Figure 1 This is a perspective view of an electronic device according to the first embodiment of the present invention.
[0019] Figure 2 for Figure 1 An exploded view of the electronic device.
[0020] Figure 3 for Figure 2 A partial exploded view of the electronic device.
[0021] Figure 4 for Figure 1 A cross-sectional schematic diagram of the electronic device.
[0022] Figure 5 This is a perspective view of another example of a portion of an electronic device according to an embodiment of the present invention.
[0023] Figure 6 This is a perspective view of an electronic device according to a second embodiment of the present invention.
[0024] Figure 7 for Figure 6 An exploded view of the electronic device.
[0025] Figure 8 for Figure 7 A partial exploded view of the electronic device.
[0026] Figure 9 for Figure 6 A cross-sectional schematic diagram of the electronic device. Detailed Implementation
[0027] The following detailed description of the embodiments of this utility model outlines its features and advantages, sufficient to enable any person skilled in the art to understand the technical content of the embodiments and implement them. Based on the content and drawings disclosed in this specification, any person skilled in the art can easily understand the related objectives and advantages of this utility model. The following embodiments further illustrate the viewpoints of this utility model, but are not intended to limit the scope of this utility model in any way.
[0028] <First Embodiment>
[0029] Please see Figures 1 to 4 ,in Figure 1 This is a perspective view of the electronic device according to the first embodiment of the present invention. Figure 2 for Figure 1 An exploded view of the electronic device. Figure 3 for Figure 2 An exploded view of a portion of the electronic device, and Figure 4 for Figure 1 A cross-sectional schematic diagram of the electronic device.
[0030] The electronic device 1 in this embodiment includes a motherboard 2, two heat sources 3, and a heat dissipation device 5. The two heat sources 3 are disposed on the motherboard 2, and these heat sources 3 can be, for example, a central processing unit, a graphics processing unit, a microprocessor, a chip, a single chip, or other electronic components that generate heat during use; however, this invention is not limited to these. Furthermore, this invention does not limit the number of heat sources.
[0031] The heat dissipation device 5 is used to cool these heat sources 3, and the heat dissipation device 5 may include a heat dissipation shell 50, a plurality of heat dissipation fins 51, a main heat sink 52, two main heat plates 53, two first main heat pipes H1 and two second main heat pipes H2.
[0032] The heat dissipation housing 50 may include an upper cover T1 and a lower cover B1, with the upper cover T1 assembled onto the lower cover B1 to form an accommodating space S1 for housing the motherboard 2 and its two heat sources 3. The heat dissipation housing 50 may be made of metal to facilitate rapid heat dissipation. The metal may be, for example, copper, aluminum, tin, copper alloy, aluminum alloy, or tin alloy, but this invention is not limited to these materials.
[0033] Heat dissipation fins 51 are disposed on the outer surface of the heat dissipation shell 50 to increase the overall heat dissipation area and facilitate the rapid conduction of heat from the heat dissipation shell 50. Specifically, heat dissipation fins 51 are disposed on the outer surfaces of the upper cover T1 and the bottom shell B1 of the heat dissipation shell 50, respectively. The heat dissipation fins 51 can be made of metal, and the metal can be, for example, copper, aluminum, tin, copper alloy, aluminum alloy, or tin alloy, but this utility model is not limited thereto.
[0034] The main heat sink 52, the two main heat plates 53, the first main heat pipes H1 and the second main heat pipes H2 are all disposed in the accommodating space S1. The main heat sink 52 is fixed to the main plate 2 by, for example, multiple threaded fasteners F1 and is in thermal contact with one of the heat sources 3. The main heat sink 52 is used to absorb the heat generated by the heat source 3, thereby cooling the heat source 3.
[0035] The two main heat plates 53 are located on different sides of the main heat base 52, and are in thermal contact with the heat sink. In this embodiment, the heat sink is a heat sink shell 50, and the two main heat plates 53 are in thermal contact with different inner surfaces of the heat sink shell 50. Specifically, the two main heat plates 53 are located on opposite sides of the main heat base 52, and are in thermal contact with the inner surfaces of the upper cover T1 and the bottom shell B1 of the heat sink shell 50.
[0036] In this embodiment, the heat sink is exemplified by the heat sink housing 50, but the present invention is not limited thereto. In other embodiments, the heat sink may be, for example, a panel or a fin assembly, or other heat dissipation device.
[0037] Each of the first main heat pipes H1 and the second main heat pipes H2 (either the first main heat pipe H1 or the second main heat pipe H2) is connected between the main heat base 52 and one of the main heat plates 53. The first main heat pipes H1 and the second main heat pipes H2 are used to transfer heat from the main heat base 52 to the main heat plates 53. Thus, the heat generated by the heat source 3 can be sequentially transferred from the main heat base 52, the main heat pipes H1, H2 and the main heat plate 53 to the heat dissipation shell 50 and the heat dissipation fins 51 on the heat dissipation shell 50, so that the heat can be quickly dissipated to the outside of the device and heat is prevented from accumulating inside the device.
[0038] The main heat sink 52 may have an assembly groove (not otherwise labeled), and the first main heat pipes H1 and the second main heat pipes H2 are disposed in the assembly groove. The first main heat pipes H1 and the second main heat pipes H2 extend from one side of the main heat sink 52. The two first main heat pipes H1 extend from the main heat sink 52 to one side of the main heat sink 52 and connect to one of the main heat plates 53. The two second main heat pipes H2 extend from the main heat sink 52 to the other side of the main heat sink 52 and connect to the other main heat plate 53. In this embodiment, the first main heat pipes H1 and the second main heat pipes H2 are staggered on the main heat sink 52, but this invention is not limited thereto.
[0039] The main heat sink 52, the main heat plate 53, the first main heat pipe H1 and the second main heat pipe H2 can be made of metal, and the metal can be, for example, copper, aluminum, tin, copper alloy, aluminum alloy or tin alloy, but this utility model is not limited thereto.
[0040] In this embodiment, the heat dissipation device 5 may further include a plurality of spring screw structures P1, and each spring screw structure P1 is connected between one of the main heat plates 53 and the main heat base 52, such that the corresponding main heat plate 53 is movably connected to the main heat base 52. Specifically, at least one of the main heat plates 53 can be movably connected to the main heat base 52 through a plurality of spring screw structures P1. For example, as Figure 3As shown, the main heating plate 53 on the upper side of the main heating base 52 is movably connected to the main heating base 52 by six spring screw structures P1. Depending on the design requirements, one or more main heating plates can also be movably connected to the main heating base by multiple spring screw structures. In other words, when the number of main heating plates included in the heat dissipation device is a non-zero integer N, it is feasible to have M main heating plates (M is also a non-zero integer) movably connected to the main heating base by multiple spring screw structures, where 1 ≤ M ≤ N. Specifically, each spring screw structure P1 includes a rod P2 and a spring P3 sleeved on the rod P2. The rod P2 passes through the main heating plate 53 and is fixed to the main heating base 52, and the head of the rod P2 (unlabeled) is located in the stop groove (unlabeled) of the main heating plate 53 and stops on the side of the main heating plate 53 away from the main heating base 52. The two ends of spring P3 abut against the main heating plate 53 and the main heating seat 52 respectively to maintain the distance between the main heating plate 53 and the main heating seat 52, and to allow the main heating plate 53 to move relative to the main heating seat 52 under force. Through the elastic extension and deformation of spring P3 in the spring-screw structure P1, the distance between the main heating plate 53 and the main heating seat 52 can be adjusted, and the flatness and stability between the main heating plate 53 and the main heating seat 52 can be adjusted to prevent tilting, misalignment, or loosening. Therefore, the assembly and adjustment of the components of the heat dissipation device 5 are not limited by size, tolerances, or spacing, ensuring solid contact between the main heating plate 53 and the upper cover T1 of the heat dissipation shell 50 for stable heat transfer and dissipation. It should be noted that the depth of the stop groove of the main heating plate 53 can be greater than the axial length of the head of the rod P2, so that when the main heating plate 53 moves relative to the main heating seat 52, the head of the rod P2 will not extend out of the stop groove and exceed the top surface of the main heating plate 53 (i.e. the contact surface that is in thermal contact with the inner surface of the upper cover T1), so that the head of the rod P2 will not interfere with the upper cover T1.
[0041] In this embodiment, another main heating plate 53 for thermal contact with the bottom shell component B1 is fixed immovably to the main plate 2, for example, by a plurality of threaded fasteners F1, but the present invention is not limited thereto.
[0042] With the above configuration, both the main heat sink 52 and the upper and lower sides of the motherboard 2 have independent heat diffusion and conduction capabilities, providing multi-directional heat dissipation paths. This allows heat to be transferred to other heat dissipation modules or larger heat dissipation structures, effectively improving overall heat dissipation efficiency. Furthermore, the spring screw structure P1 design offers high configuration flexibility, making it suitable for various electronic devices with limited space or complex heat dissipation requirements.
[0043] In this embodiment, the heat dissipation device 5 further includes an expanded heat-conducting base 54, an expanded heat-conducting plate 55, and two expanded heat pipes H3 disposed in the accommodating space S1. The expanded heat-conducting base 54 is fixed to the motherboard 2 by, for example, multiple threaded fasteners F1 and is in thermal contact with another heat source 3. The expanded heat-conducting base 54 is used to absorb the heat generated by the heat source 3, thereby cooling the other heat source 3. The expanded heat-conducting plate 55 is located on one side of the expanded heat-conducting base 54 and is in thermal contact with the heat sink. In this embodiment, the expanded heat-conducting plate 55 is in thermal contact with the inner surface of the upper cover T1 of the heat sink housing 50. A plurality of spring screw structures P1 are connected between the expanded heat-conducting plate 55 and the expanded heat-conducting base 54, so that the expanded heat-conducting plate 55 is movably connected to the expanded heat-conducting base 54. The two extended heat pipes H3 connect the extended heat conduction base 54 and the extended heat conduction plate 55 to transfer heat from the extended heat conduction base 54 to the extended heat conduction plate 55. Thus, the heat generated by the heat source 3 can be sequentially transferred from the extended heat conduction base 54, the extended heat pipes H3, and the extended heat conduction plate 55 to the heat dissipation shell 50 and its heat dissipation fins 51, allowing heat to be quickly dissipated to the outside of the device and preventing heat accumulation inside the device. However, this invention is not limited thereto. For example, in other embodiments, the heat dissipation device may not have the aforementioned extended heat conduction base, extended heat conduction plate, and extended heat pipes.
[0044] In the first embodiment, the heat dissipation device 5 has two main heat plates 53, and these two main heat plates 53 are located on opposite sides of the main heat base 52, but the present invention is not limited thereto. In other embodiments, the number of main heat plates may be three or more, and these main heat plates may be located on different sides of the main heat base.
[0045] For example, please refer to Figure 5 This is a perspective view of another example of a portion of an electronic device according to an embodiment of the present invention. Figure 5 In the example, the heat dissipation device 5a can have three main heat plates 53a, and these three main heat plates 53a are located on different sides of the main heat base 52a, for example, three adjacent sides. These three main heat plates 53a are in thermal contact with the inner surface of the upper cover of the heat dissipation shell 50 and the inner surface of the bottom and sidewalls of the bottom shell. This provides independent heat diffusion and conduction capabilities on the upper, lower, and lateral sides of the main heat base 52a and the motherboard 2a, offering more directional heat dissipation paths, allowing heat to be conducted to other heat dissipation modules or larger heat dissipation structures, thereby effectively improving overall heat dissipation efficiency.
[0046] <Second Embodiment>
[0047] Please see Figures 6 to 9 ,in Figure 6 This is a perspective view of an electronic device according to the second embodiment of the present invention. Figure 7 for Figure 6 An exploded view of the electronic device. Figure 8 for Figure 7 An exploded view of a portion of the electronic device, and Figure 9 for Figure 6 A cross-sectional schematic diagram of the electronic device.
[0048] The electronic device 1b in this embodiment includes a motherboard 2b, a heat source 3b, and a heat dissipation device 5b. The heat source 3b is disposed on the motherboard 2b, and the heat source 3b may be, for example, a central processing unit, a graphics processor, a microprocessor, a chip, a single chip, or other electronic components that generate heat during use; this invention is not limited to these.
[0049] The heat dissipation device 5b is used to cool the heat source 3b, and the heat dissipation device 5b may include a heat dissipation shell 50, multiple heat dissipation fins 51b, a main heat sink 52b, two main heat plates 53b and multiple main heat pipes H4.
[0050] The heat dissipation housing 50 may include an upper cover T1 and a lower cover B1, with the upper cover T1 assembled onto the lower cover B1 to form an accommodating space S1 for housing the motherboard 2b and its heat source 3b. The heat dissipation housing 50 may be made of metal to facilitate rapid heat dissipation. The metal may be, for example, copper, aluminum, tin, copper alloy, aluminum alloy, or tin alloy, but this invention is not limited thereto.
[0051] Heat dissipation fins 51b are disposed on the outer surface of the heat dissipation shell 50 to increase the overall heat dissipation area and facilitate the rapid conduction of heat from the heat dissipation shell 50. Specifically, heat dissipation fins 51b are respectively disposed on the outer surfaces of the upper cover T1 and the bottom shell B1 of the heat dissipation shell 50. The heat dissipation fins 51b can be made of metal, and the metal material can be, for example, copper, aluminum, tin, copper alloy, aluminum alloy, or tin alloy, but this utility model is not limited thereto.
[0052] The main heat sink 52b, the two main heat plates 53b, and the main heat pipes H4 are all disposed in the accommodating space S1. The main heat sink 52b is fixed to the main plate 2b and in thermal contact with the heat source 3b by, for example, multiple threaded fasteners F1, and the main heat sink 52b absorbs the heat generated by the heat source 3b, thereby cooling the heat source 3b.
[0053] The two main heat plates 53b are located on different sides of the main heat base 52b, and are in thermal contact with the heat sink. In this embodiment, the heat sink is a heat sink shell 50, and the two main heat plates 53b are in thermal contact with different inner surfaces of the heat sink shell 50. Specifically, the two main heat plates 53b are located on opposite sides of the main heat base 52b, and are in thermal contact with the inner surface of the upper cover T1 and the inner surface of the bottom shell B1 of the heat sink shell 50.
[0054] In this embodiment, the heat sink is exemplified by the heat sink housing 50, but the present invention is not limited thereto. In other embodiments, the heat sink may be, for example, a panel or a fin assembly, or other heat dissipation device.
[0055] Each of the main heat pipes H4 is connected between the main heat base 52b and one of the main heat plates 53b. The main heat pipes H4 are used to transfer heat from the main heat base 52b to the main heat plates 53b. Thus, the heat generated by the heat source 3b can be transferred sequentially from the main heat base 52b, the main heat pipes H4 and the main heat plates 53b to the heat dissipation shell 50 and its heat dissipation fins 51b, so that the heat can be quickly dissipated to the outside of the device and heat can be avoided from accumulating inside the device.
[0056] The main heat sink 52b may have an assembly slot (unspecified), and the main heat pipes H4 are disposed in the assembly slot. These main heat pipes H4 extend from one side of the main heat sink 52b. Some of the main heat pipes H4 extend from the main heat sink 52b to one side of the main heat sink 52b and connect to one of the main heat plates 53b. Other main heat pipes H4 extend from the main heat sink 52b to the other side of the main heat sink 52b and connect to another main heat plate 53b.
[0057] The main heat sink 52b, the main heat plate 53b and the main heat pipe H4 can be made of metal, and the metal can be, for example, copper, aluminum, tin, copper alloy, aluminum alloy or tin alloy, but this utility model is not limited thereto.
[0058] In this embodiment, the two main heating plates 53b are fixed immovably to the main heating base 52b or the main board 2b by a plurality of threaded fasteners F1, but the present invention is not limited thereto.
[0059] According to the heat dissipation device and electronic device in the above embodiments, both the main heat sink and the upper and lower sides of the motherboard have independent heat diffusion and conduction capabilities, which can provide multi-directional heat dissipation transfer paths, thereby conducting heat to other heat dissipation modules or larger heat dissipation structures, thereby effectively improving the overall heat dissipation efficiency.
[0060] [Icon Symbol Explanation]
[0061] 1,1b: Electronic devices
[0062] 2,2a,2b: Motherboard
[0063] 3,3b: Heat source
[0064] 5, 5a, 5b: Heat dissipation devices
[0065] 50: Heat dissipation housing
[0066] 51,51b: Heat dissipation fins
[0067] 52, 52a, 52b: Dominant Hot Seat
[0068] 53, 53a, 53b: Main hot plate
[0069] 54: Expanded heat sink
[0070] 55: Expanded heat dissipation plate
[0071] H1, H2, H4: Main heat pipes
[0072] H3: Expansion heat pipe
[0073] T1: Top cover
[0074] B1: Bottom shell component
[0075] S1: Storage space
[0076] F1: Threaded fasteners
[0077] P1: Spring screw structure
[0078] P2: Rod
[0079] P3: Spring
Claims
1. A heat dissipation device for cooling a heat source on a motherboard, characterized in that, The heat dissipation device includes: A primary heat sink is used to fix the motherboard and make thermal contact with the heat source; Multiple primary heating plates are located on different sides of the primary heating base, and each of the primary heating plates is used to make thermal contact with a heat sink; and Multiple main heat pipes, each of which is connected between the main heat sink and one of the main heat plates, and the multiple main heat pipes are used to transfer heat from the main heat sink to the multiple main heat plates.
2. The heat dissipation device as described in claim 1, characterized in that, The plurality of main heating plates are located on opposite sides of the main heating base.
3. The heat dissipation device as described in claim 1, characterized in that, The plurality of main heating plates are located on adjacent sides of the main heating seat.
4. The heat dissipation device as described in claim 1, characterized in that, The heat dissipation device further includes a heat dissipation shell, wherein the heat dissipation shell is the heat dissipation component and is used to house the motherboard and the heat source. The main heat sink, the plurality of main heat plates and the plurality of main heat pipes are disposed inside the heat dissipation shell, and the plurality of main heat plates are respectively in thermal contact with different inner surfaces of the heat dissipation shell.
5. The heat dissipation device as described in claim 4, characterized in that, The heat dissipation device further includes a plurality of heat dissipation fins, wherein the plurality of heat dissipation fins are disposed on the outer surface of the heat dissipation shell.
6. The heat dissipation device as described in claim 4, characterized in that, The heat dissipation housing includes an upper cover and a lower cover. The upper cover is assembled to the lower cover and together form an accommodating space. The accommodating space is used to accommodate the motherboard and the heat source. The main heat sink, the plurality of main heat plates and the plurality of main heat pipes are disposed in the accommodating space.
7. The heat dissipation device as described in claim 1, characterized in that, The main heat sink has an assembly groove, in which the plurality of main heat pipes are disposed, and the plurality of main heat pipes extend from one side of the main heat sink.
8. The heat dissipation device as described in claim 1, characterized in that, The plurality of main heat pipes include a plurality of first main heat pipes and a plurality of second main heat pipes. The plurality of first main heat pipes extend from the main heat base to one side of the main heat base, and the plurality of second main heat pipes extend from the main heat base to the other side of the main heat base. The plurality of first main heat pipes and the plurality of second main heat pipes are arranged alternately on the main heat base.
9. The heat dissipation device as described in claim 1, characterized in that, The heat dissipation device further includes a plurality of spring screw structures, wherein each of the plurality of spring screw structures is connected between at least one of the plurality of main heat plates and the main heat base, such that at least one of the plurality of main heat plates is movably connected to the main heat base.
10. An electronic device comprising a motherboard, at least one heat source, and a heat dissipation device, wherein the at least one heat source is disposed on the motherboard, and the heat dissipation device is used to cool the at least one heat source, characterized in that, The heat dissipation device includes: A primary heat sink is fixed to the motherboard and in thermal contact with the at least one heat source; Multiple primary heating plates are located on different sides of the primary heating base, and each of the primary heating plates is used to make thermal contact with a heat sink; and Multiple main heat pipes, each of which is connected between the main heat base and one of the multiple main heat plates, and the multiple main heat pipes are used to transfer heat from the main heat base to the multiple main heat plates.
11. The electronic device as claimed in claim 10, characterized in that, The at least one heat source includes two heat sources, and the heat dissipation device further includes an expanded heat conduction base, an expanded heat conduction plate, and at least one expanded heat pipe. The expanded heat conduction base is fixed to the motherboard and in thermal contact with one of the two heat sources. The expanded heat conduction plate is located on one side of the expanded heat conduction base and in thermal contact with the heat sink. The at least one expanded heat pipe is connected between the expanded heat conduction base and the expanded heat conduction plate, and the at least one expanded heat pipe is used to transfer heat from the expanded heat conduction base to the expanded heat conduction plate.