A polishing liquid supply system

Abstract

The application discloses a polishing liquid supply system for providing polishing liquid for a polishing device, which comprises a main storage device, a main power pump and a stirring device, the main storage device is used for storing the polishing liquid, the main storage device comprises a discharge port used for discharging the polishing liquid, a polishing return port used for recycling the polishing liquid after the polishing device is used and a circulating return port used for forming a first self-circulation, the discharge port is located at the bottom of the main storage device, and the return port is arranged higher than the discharge port; the inlet of the main power pump is connected to the discharge port through a pipeline, the outlet of the main power pump is connected to the circulating return port and the polishing device through a pipeline; and the stirring device is located in the main storage device, and the stirring device comprises a stirring shaft, and the axis of the stirring shaft and the axis of the main storage device are configured to be not collinear. Through the above arrangement, the polishing liquid can be fully stirred, and then the polishing liquid with uniform mixing can be stably provided, and the continuity and stability of the polishing processing technology are improved.

Description

Technical Field

[0001] This application relates to the field of polishing technology, and in particular to a polishing slurry supply system. Background Technology

[0002] The slurry supply system of a polishing machine is a core component in precision polishing processes, responsible for delivering a constant flow rate of high-purity, impurity-free polishing slurry to the workpiece. In actual operation, the slurry supply system maintains stable pressure and flow rate, continuously and evenly delivering high-quality polishing slurry under varying loads and conditions. This ensures that the slurry remains uniform and stable throughout the polishing process, guaranteeing that the workpiece surface finish, smoothness, and absence of micro-scratches or residual impurities meet processing requirements, thus ensuring processing accuracy and workpiece surface quality.

[0003] However, polishing slurries have a complex composition, containing various chemical substances and abrasive particles. When left to stand in the storage tank, these abrasive particles easily settle due to gravity. Existing polishing machine supply systems, under prolonged standing or complex operating conditions, can experience flow channel blockage and flow fluctuations if particle accumulation or solute sedimentation occurs in the pipelines or filter elements. When blockage occurs, the machine must be shut down for cleaning; otherwise, the performance of the output polishing slurry will be reduced, leading to unstable workpiece surface quality. Furthermore, due to limited equipment space and the cumbersome cleaning process, this not only increases maintenance costs but also interrupts the polishing process, reducing production efficiency. Utility Model Content

[0004] To address the shortcomings of existing technologies, the purpose of this application is to provide a polishing slurry supply system that can improve the uniformity and stability of the polishing slurry.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] A polishing slurry supply system is provided for supplying polishing slurry to polishing equipment. The system includes a main storage device, a main power pump, and a stirring device. The main storage device stores the polishing slurry and includes an outlet for discharging the polishing slurry, a return outlet for recovering the polishing slurry after use by the polishing equipment, and a circulation return outlet for forming a first self-circulation. The outlet is located at the bottom of the main storage device, and the return outlet is positioned higher than the outlet. The inlet of the main power pump is connected to the outlet via a pipe, and the outlet of the main power pump is connected to both the circulation return outlet and the polishing equipment via a pipe. The stirring device is located within the main storage device and includes a stirring shaft. The axis of the stirring shaft is configured to be non-collinear with the axis of the main storage device.

[0007] Furthermore, the polishing slurry supply system also includes a cooling device, which is installed on the outside of the main storage device.

[0008] Furthermore, the cooling device includes at least one of a semiconductor cooling device or a liquid cooling device.

[0009] Furthermore, the cooling device is a liquid cooling device, which includes a cooling shell, a cooling inlet and a cooling outlet. The cooling shell is sleeved on the outside of the main storage device, and a receiving cavity for containing coolant is formed between the cooling shell and the main storage device. The cooling inlet is connected to the lower part of the receiving cavity, and the cooling outlet is connected to the upper part of the receiving cavity.

[0010] Furthermore, at least one of the following is provided between the main power pump and the polishing equipment: a discharge valve, a filter device, and a flow meter.

[0011] Furthermore, the angle between the axis of the stirring shaft and the axis of the main storage device ranges from 0° to 90°.

[0012] Furthermore, an inclined guide surface is formed at the bottom of the interior of the main storage device, and the angle between the guide surface and the axis of the main storage device ranges from 0° to 60°.

[0013] Furthermore, the polishing slurry supply system also includes an auxiliary storage device for storing auxiliary polishing slurry and an auxiliary power pump for outputting auxiliary polishing slurry. The auxiliary storage device includes an auxiliary discharge port for outputting polishing slurry and an auxiliary circulation return port for forming a second self-circulation. The main storage device also includes an auxiliary material inlet. The inlet of the auxiliary power pump is connected to the auxiliary discharge port through a pipeline, and the outlet of the auxiliary power pump is connected to both the auxiliary circulation return port and the auxiliary material inlet of the main storage device through a pipeline.

[0014] Furthermore, the polishing slurry supply system also includes an auxiliary stirring device located in the auxiliary storage device. The auxiliary stirring device includes an auxiliary stirring shaft, and the axis of the auxiliary stirring shaft and the axis of the auxiliary storage device are configured to be non-collinear.

[0015] Furthermore, the polishing slurry supply system also includes a main liquid level sensor and a control device for obtaining the liquid level in the main storage device. The main liquid level sensor is electrically connected to the control device, and the control device is electrically connected to the auxiliary power pump.

[0016] The polishing slurry supply system provided in this application ensures the uniformity and stability of the polishing slurry in the main storage device through self-circulation and efficient stirring. It effectively suppresses solute sedimentation caused by the polishing slurry settling in the main storage device or entering reflux dead zones, ensuring that the main storage device outputs a uniformly mixed polishing slurry, thus providing a reliable slurry supply for precision polishing processes. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the polishing slurry supply system in the embodiments of this application;

[0018] Figure 2 This is a schematic diagram of the main storage device and the main power pump in the embodiments of this application;

[0019] Figure 3 This is a schematic diagram of the stirring device in the embodiments of this application;

[0020] Figure 4 This is a schematic diagram of the cooling device in the embodiments of this application;

[0021] Figure 5 This is a schematic diagram of the auxiliary storage device and part of the main storage device in the embodiments of this application;

[0022] Figure 6 This is a schematic diagram of the electrical connection between the auxiliary power pump and the auxiliary storage device in the embodiments of this application.

[0023] Reference numerals: 100, Polishing fluid supply system; 101, Agitator shaft axis; 102, Main storage device axis; 103, Receiving cavity; 104, Auxiliary agitator shaft axis; 105, Auxiliary storage device axis; 11, Main storage device; 111, Discharge port; 112, Polishing return port; 113, Circulation return port; 114, Guide surface; 115, Auxiliary material inlet; 12, Main power pump; 13, Agitator; 131, Agitator shaft; 14, Cooling device; 141, Liquid cooling device; 1411, Cooling shell; 1412, Cooling inlet; 1413, Cooling outlet; 15, Auxiliary storage device; 151, Auxiliary discharge port; 152, Auxiliary circulation return port; 16, Auxiliary power pump; 17, Auxiliary agitator; 171, Auxiliary agitator shaft; 18, Main liquid level sensor; 19, Control device. Detailed Implementation

[0024] To enable those skilled in the art to better understand the present application, the technical solutions in specific embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0025] It should be noted that the directional terms such as "up" and "down" or ordinal numbers such as "first" and "second" mentioned herein are introduced for ease of description based on the specification and accompanying drawings, and do not imply any limitation on the order of the components. Furthermore, since some parts of the components provided in the above embodiments have the same function, this specification adopts a uniform naming convention for these parts. To clearly illustrate the technical solution of this application, the following are also provided: Figure 1 The diagram shows the vertical direction of the polishing slurry supply system 100. Unless otherwise specified, the arrows on the pipelines in the accompanying drawings of this manual indicate the flow direction of the polishing slurry.

[0026] In the description of this application, the height direction of the polishing slurry supply system 100 is... Figure 1 The up and down directions are shown.

[0027] like Figure 1 As shown, this application provides a polishing slurry supply system 100 for supplying polishing slurry to polishing equipment. It includes a main storage device 11, a main power pump 12, and a stirring device 13. The main storage device 11 is a container with an internal cavity. The main power pump 12 includes an inlet and an outlet. The inlet of the main power pump 12 is connected to the main storage device 11 via a pipe, and the outlet of the main power pump 12 is connected to the polishing equipment via a pipe. The stirring device 13 is located inside the main storage device 11. The main storage device 11 is used to store polishing slurry. It includes an outlet 111 for discharging polishing slurry, a polishing return port 112 for recovering polishing slurry after use by the polishing equipment, and a circulation return port 113 for forming a first self-circulation. The polishing return port 112 recovers polishing slurry discharged from the polishing equipment, and the circulation return port 113 recovers a portion of the polishing slurry from the outlet 111 of the main power pump 12. In the height direction of the polishing slurry supply system 100, the discharge port 111 is located at the bottom of the main storage device 11, while the polishing return port 112 and the circulation return port 113 are both positioned above the discharge port 111. The inlet of the main power pump 12 is connected to the discharge port 111 via a pipe, and the outlet of the main power pump 12 is connected to both the circulation return port 113 and the polishing equipment via a pipe. The stirring device 13 includes a stirring shaft 131, and the axis 101 of the stirring shaft is configured to be non-collinear with the axis 102 of the main storage device.

[0028] Specifically, the discharge port 111 at the bottom of the main storage device 11 is connected to the inlet of the main power pump 12 via a pipe. The outlet of the main power pump 12 is connected to the polishing equipment at one end via a pipe, and to the circulation return port 113 at the other end. A first self-circulating pipeline is formed between the main storage device 11, the discharge port 111, the main power pump 12, the circulation return port 113, and the main storage device 11. When necessary, such as when the polishing slurry supply system 100 does not supply polishing slurry to the polishing equipment, the polishing slurry in the main storage device 11 can circulate in the first self-circulating pipeline, avoiding the sedimentation of some components in the polishing slurry due to stagnation, and improving the uniformity of the polishing slurry. A polishing circulation pipeline is formed between the main storage device 11, the discharge port 111, the polishing return port 112, the main power pump 12, the polishing equipment, the polishing return port 112, and the main storage device 11. The polishing slurry in the main storage device 11 is output to the polishing equipment under the action of the main power pump 12. At the same time, the polishing slurry used by the polishing equipment can flow back to the main storage device 11 to complete the polishing cycle. The stirring shaft 131 is set inside the main storage device 11 and rotates at high speed in a manner that is not coaxial with the axis 102 of the main storage device. This causes strong shearing and convection in the polishing slurry at different heights, thereby disrupting the particle aggregation in the polishing slurry and preventing sedimentation.

[0029] The above settings ensure that the polishing slurry circulates and mixes continuously and evenly in the main storage device 11, effectively suppressing solute sedimentation caused by the polishing slurry settling in the main storage device 11 or entering the reflux dead zone, so that the main storage device 11 outputs a uniformly mixed polishing slurry, providing a reliable liquid guarantee for precision polishing.

[0030] like Figure 2 As shown, at least one of the following is provided between the main power pump 12 and the polishing equipment: discharge valve 121, filter device 122, and flow meter 123.

[0031] As an alternative implementation, the discharge valve 121 is located between the outlet of the power pump 12 and the polishing equipment to control the opening and closing of the polishing fluid pipeline.

[0032] As an alternative implementation, a filter device 122 is installed between the outlet of the main power pump 12 and the polishing equipment, allowing the polishing slurry to undergo filtration once as it enters the polishing equipment from the main storage device 11. This arrangement prevents impurities in the circulating polishing slurry caused by pipeline corrosion or system wear from entering the polishing equipment along with the slurry, ensuring the performance of the polishing slurry output from the polishing slurry supply system 100, preventing scratches on the polishing head and workpiece surface by impurity particles, and ensuring the final polishing effect of the polishing equipment.

[0033] As an alternative implementation, a flow meter 123 is installed on the connecting pipeline between the outlet of the main power pump 12 and the polishing equipment to monitor and provide feedback on the polishing fluid flow rate in real time. By continuously monitoring the polishing fluid flow rate data, problems such as pipeline blockage and abnormal output function of the main power pump 12 can be detected in a timely manner. Then, based on the measured flow rate data, the pumping speed of the main power pump 12 can be adjusted, or an early warning can be given for abnormal situations, ensuring that the polishing fluid supply system 100 always supplies polishing fluid to the polishing equipment at the designed flow rate, so that the polishing equipment can maintain stable operation.

[0034] like Figure 3 As shown, in one implementation, the angle α formed between the axis 101 of the stirring shaft and the axis 102 of the main storage device ranges from 0° to 90°. Further, the angle α between the axis 101 of the stirring shaft and the axis 102 of the main storage device ranges from 0° to 81°. Even further, the angle α between the axis 101 of the stirring shaft and the axis 102 of the main storage device ranges from 0° to 72°. If the angle between the axis 101 of the stirring shaft and the axis 102 of the main storage device is too small, the stirring shaft 131 will rotate almost coaxially with the main storage device 11, failing to effectively break the settling dead angle of the polishing liquid, thus weakening the stirring effect. If the angle between the axis 101 of the stirring shaft and the axis 102 of the main storage device is too large, the stirring shaft 131 will be almost horizontally arranged, the flow field formed by the stirring will mainly be radially distributed, lacking axial stirring, and there is also the possibility of failing to eliminate the settling dead angle within the main storage device 11, thereby affecting the stirring efficiency. With the above settings, when the stirring shaft 131 rotates in the main storage device 11, the polishing liquid generates sufficient radial and axial flow, which can effectively destroy the sedimentation dead zone of the polishing liquid, inhibit the sedimentation of particles or solutes in the polishing liquid, and thus achieve uniform mixing of the polishing liquid.

[0035] like Figure 3As shown, in one implementation, an inclined guide surface 114 is formed at the bottom of the interior of the main storage device 11. The angle β formed between the guide surface 114 and the axis 102 of the main storage device ranges from 0° to 60°. Further, the angle β formed between the guide surface 114 and the axis 102 of the main storage device ranges from 0° to 54°. Even further, the angle β formed between the guide surface 114 and the axis 102 of the main storage device ranges from 0° to 48°. If the angle formed between the guide surface 114 and the axis 102 of the main storage device is too small, the guide surface 114 will be almost parallel to the bottom of the interior of the main storage device 11, making it impossible to effectively guide the polishing fluid. If the angle between the guide surface 114 and the axis 102 of the main storage device is too large, the guide surface 114 will be too steep, the flow rate of the guided polishing fluid will increase, and it will easily generate a strong impact on the inner wall of the main storage device 11 and form eddies, which is not conducive to the smooth return of the polishing fluid. With the above settings, a smooth and continuous flow direction is formed for the polishing fluid at the bottom inside the main storage device 11, avoiding the stagnation and sedimentation of the polishing fluid and maintaining the stable performance of the polishing fluid output from the main storage device 11.

[0036] like Figure 4 As shown, in one implementation, the polishing slurry supply system 100 also includes a cooling device 14, which is sleeved on the outside of the main storage device 11. The cooling device 14 is used to control the temperature of the polishing slurry in the main storage device 11, preventing changes in viscosity or chemical instability of the polishing slurry due to temperature rise, thus affecting the performance of the polishing slurry. The cooling device 14 ensures that the output polishing slurry maintains consistent performance during circulation, improving the stability of the supply system.

[0037] Furthermore, the cooling device 14 includes at least one of a semiconductor cooling device or a liquid cooling device 141.

[0038] Specifically, the cooling device 14 is a liquid cooling device 141, which includes a cooling shell 1411, a cooling inlet 1412, and a cooling outlet 1413. The cooling shell 1411 is fitted onto the outside of the main storage device 11, forming a receiving cavity 103 for containing coolant between the cooling shell 1411 and the main storage device 11. The cooling inlet 1412 is connected to the lower part of the receiving cavity 103, and the cooling outlet 1413 is connected to the upper part of the receiving cavity 103. When the polishing fluid circulates in the main storage device 11, the liquid cooling device 141 introduces pre-cooled coolant from the cooling inlet 1412 into the lower part of the receiving cavity 103, allowing it to flow upwards along the outer wall of the main storage device 11. As it flows through the receiving cavity 103, it absorbs the heat conducted by the polishing fluid to the main storage device 11 and flows out through the cooling outlet 1413, thereby continuously removing heat from the main storage device 11. Furthermore, by setting up a cooling housing 1411, the use of a complex cooling coil structure is avoided, resulting in a simple structure. Through the above-mentioned configuration, the cooling device 14 effectively suppresses the temperature rise of the polishing fluid in the main storage device 11.

[0039] It should be noted that, Figure 4 The arrows at the coolant inlet 1412 and coolant outlet 1413 indicate the direction of coolant flow.

[0040] As an alternative implementation, the cooling device 14 is a semiconductor refrigeration device. Specifically, the semiconductor refrigeration device includes a semiconductor refrigeration chip. The semiconductor refrigeration device is located outside the main storage device and cools through the thermo-electric effect. Semiconductor refrigeration devices have advantages such as small size and high controllability of cooling capacity. Using a semiconductor refrigeration device can reduce the overall volume of the liquid supply device and improve temperature control efficiency.

[0041] like Figure 5 As shown, in one implementation, the polishing slurry supply system 100 further includes an auxiliary storage device 15 for storing auxiliary polishing slurry and an auxiliary power pump 16 for outputting auxiliary polishing slurry. The main storage device 11 also includes an auxiliary material inlet 115. The auxiliary storage device 15 is used to replenish the main storage device 11 with auxiliary polishing slurry or a portion of the components in the polishing slurry when necessary. The auxiliary storage device 15 includes an auxiliary discharge port 151 and an auxiliary circulation return port 152. The auxiliary discharge port 151 is used to output polishing slurry, and the auxiliary circulation return port 152 is used to provide an opening for forming a second self-circulation. The inlet of the auxiliary power pump 16 is connected to the auxiliary discharge port 151 via a pipe, and the outlet of the auxiliary power pump 16 is connected to the auxiliary circulation return port 152 via a pipe to form a second self-circulation. At the same time, the outlet of the auxiliary power pump 16 is also connected to the auxiliary material inlet 11 of the main storage device 11 via a pipe to replenish the main storage device 11 with polishing slurry or a portion of the components in the polishing slurry when necessary.

[0042] Specifically, the auxiliary discharge port 151 at the bottom of the auxiliary storage device 15 is connected to the inlet of the auxiliary power pump 16 via a pipe. One end of the outlet of the auxiliary power pump 16 is connected to the auxiliary material inlet 115 of the main storage device 11, and the other end is connected to the auxiliary circulation return port 152 on the side wall of the auxiliary storage device 15. A second self-circulating pipeline is formed between the auxiliary discharge port 151, the auxiliary power pump 16, the auxiliary circulation return port 152, and the auxiliary storage device 15. When necessary, the auxiliary polishing liquid in the auxiliary main material device 15 can circulate in the second self-circulating pipeline, avoiding problems such as sedimentation of some components in the auxiliary polishing liquid due to stagnation. A polishing supply pipeline is formed between the auxiliary storage device 15, the auxiliary discharge port 151, the auxiliary power pump 16, and the auxiliary material inlet 115 of the main storage device 11. The auxiliary polishing liquid in the auxiliary storage device 15 is output from the auxiliary discharge port 151 under the action of the auxiliary power pump 16 and enters the main storage device 11 through the auxiliary material inlet 115 to replenish the polishing liquid in the main storage device 11.

[0043] Furthermore, the polishing slurry supply system 100 also includes an auxiliary stirring device 17 located in the auxiliary storage device 15. The auxiliary stirring device 17 includes an auxiliary stirring shaft 171, and the axis 104 of the auxiliary stirring shaft and the axis 105 of the auxiliary storage device are configured to be non-collinear.

[0044] In the auxiliary storage device 15, the axis 104 of the auxiliary stirring shaft is not collinear with the axis 105 of the auxiliary storage device. Under the action of the auxiliary stirring device 17, the polishing liquid in the auxiliary storage device 15 generates strong radial and axial flow. During the stirring process, the polishing liquid in the auxiliary storage device 15 is fully and evenly mixed.

[0045] It should be noted that the auxiliary stirring device 17 can operate independently to stir the polishing fluid in the auxiliary storage device 17, unaffected by the second self-circulation. Through the above configuration, the performance of the polishing fluid in the auxiliary storage device 15 is kept stable.

[0046] like Figures 5 to 6 As shown, the polishing slurry supply system 100 further includes a main liquid level sensor 18 and a control device 19. The main liquid level sensor 18 is used to acquire the liquid level in the main storage device 11, and the control device 19 controls the auxiliary power pump 16 based on the acquired liquid level information. The main liquid level sensor 18 is electrically connected to the control device 19, and the control device 19 is electrically connected to the auxiliary power pump 16.

[0047] Specifically, to ensure the stability of the main storage device 11, a preset range for the liquid level within the main storage device 11 is established. The main liquid level sensor 18 monitors the polishing fluid level within the main storage device 11 in real time and transmits the liquid level signal to the control device 19. When the detected liquid level is below the preset lower limit, the control device 19 controls the start of the auxiliary power pump 16. When the auxiliary power pump 16 starts working, it outputs auxiliary polishing fluid from the auxiliary discharge port 151 at the bottom of the auxiliary storage device 15 through the auxiliary material inlet 115 to the main storage device 11, replenishing the polishing fluid in the main storage device 11. When the main liquid level sensor 18 detects that the liquid level is above the preset upper limit, the control device 19 controls the auxiliary power pump 16 to stop. When the auxiliary power pump 16 stops working, it no longer adds auxiliary polishing fluid from the auxiliary storage device 15 to the main storage device 11. With the above settings, the liquid level of the main storage device 11 can be maintained within the preset range, avoiding cavitation or dry running of the main power pump 12 due to low liquid level, and also avoiding problems such as polishing liquid overflow due to high liquid level, thus improving the liquid level stability of the polishing liquid supply system 100.

[0048] Finally, it should be noted that the above are only some preferred embodiments of this application and are not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A polishing slurry supply system (100) for supplying polishing slurry to polishing equipment, characterized in that, include: The main storage device (11) is used to store polishing liquid. The main storage device (11) includes an outlet (111) for discharging the polishing liquid, a polishing return port (112) for recovering the polishing liquid after the polishing equipment has been used, and a circulation return port (113) for forming a first self-circulation. The outlet (111) is located at the bottom of the main storage device (11), and the return port is set higher than the outlet (111). A power pump (12) is provided, the inlet of which is connected to the outlet (111) via a pipe, and the outlet of which is connected to both the circulation return port (113) and the polishing equipment via a pipe. A stirring device (13) is located inside the main storage device (11). The stirring device (13) includes a stirring shaft (131), the axis of which is configured to be non-collinear with the axis of the main storage device (11).

2. The polishing slurry supply system (100) according to claim 1, characterized in that: The polishing slurry supply system (100) also includes a cooling device (14), which is sleeved on the outside of the main storage device (11).

3. The polishing slurry supply system (100) according to claim 2, characterized in that: The cooling device (14) includes at least one of a liquid cooling device (141) or a semiconductor cooling device.

4. The polishing slurry supply system (100) according to claim 2, characterized in that: The cooling device (14) is a liquid cooling device (141). The liquid cooling device (141) includes a cooling shell (1411), a cooling inlet (1412), and a cooling outlet (1413). The cooling shell (1411) is sleeved on the outside of the main storage device (11). A receiving cavity (103) for containing coolant is formed between the cooling shell (1411) and the main storage device (11). The cooling inlet (1412) is connected to the lower part of the receiving cavity (103), and the cooling outlet (1413) is connected to the upper part of the receiving cavity (103).

5. The polishing slurry supply system (100) according to claim 1, characterized in that: The power pump (12) is further provided with at least one of the following: a discharge valve, a filter device, and a flow meter between it and the polishing equipment.

6. The polishing slurry supply system (100) according to claim 1, characterized in that: The angle between the axis of the stirring shaft (131) and the axis of the main storage device (11) ranges from 0° to 90°.

7. The polishing slurry supply system (100) according to claim 1, characterized in that: The bottom of the interior of the main storage device (11) forms an inclined guide surface (114), and the angle between the guide surface (114) and the axis of the main storage device (11) ranges from 0° to 60°.

8. The polishing slurry supply system (100) according to claim 1, characterized in that: The polishing slurry supply system (100) further includes an auxiliary storage device (15) for storing auxiliary polishing slurry and an auxiliary power pump (16) for outputting the auxiliary polishing slurry. The auxiliary storage device (15) includes an auxiliary discharge port (151) for outputting the polishing slurry and an auxiliary circulation return port (152) for forming a second self-circulation. The main storage device (11) further includes an auxiliary material inlet (115). The inlet of the auxiliary power pump (16) is connected to the auxiliary discharge port (151) through a pipe, and the outlet of the auxiliary power pump (16) is connected to both the auxiliary circulation return port (152) and the auxiliary material inlet (115) of the main storage device (11) through a pipe.

9. The polishing slurry supply system (100) according to claim 8, characterized in that: The polishing slurry supply system (100) further includes an auxiliary stirring device (17) located in the auxiliary storage device (15). The auxiliary stirring device (17) includes an auxiliary stirring shaft (171), and the axis of the auxiliary stirring shaft (171) is configured to be non-collinear with the axis of the auxiliary storage device (15).

10. The polishing slurry supply system (100) according to claim 8, characterized in that: The polishing fluid supply system (100) further includes a main liquid level sensor (18) and a control device (19) for obtaining the liquid level in the main storage device (11). The main liquid level sensor (18) is electrically connected to the control device (19), and the control device (19) is electrically connected to the auxiliary power pump (16).

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