High heat dissipation type combined circuit board connecting structure

Abstract

The utility model discloses a high heat dissipation type combined circuit board connecting structure belongs to electronic circuit packaging technical field, including circuit board, aluminium base plate and glass board, the aluminium base plate partial inlay is in glass board, the surface fixed with a plurality of heat conduction bosses of aluminium base plate, the glass board inside is equipped with a plurality of heat conduction through -hole, and heat conduction through -hole and the heat conduction boss on aluminium base plate correspond inlay, and the heat conduction through -hole is filled with graphene heat conduction glue, the surface of glass board is provided with copper foil wiring area, and the copper foil wiring area is covered with solder resist layer outward. This high heat dissipation type combined circuit board connecting structure, convenient connection has solved the contradiction of traditional circuit board heat dissipation and wiring, is applicable to new energy automobile, industrial power supply and other high heat consumption electronic equipment, has the advantages such as high heat dissipation efficiency, strong reliability, good process compatibility.

Description

Technical Field

[0001] This utility model belongs to the field of electronic circuit packaging technology, specifically relating to a high heat dissipation type combined circuit board connection structure. Background Technology

[0002] In existing circuit board technologies, although aluminum substrates have excellent heat dissipation performance, they can only be wired on one side, which limits the complexity of the circuit. Glass substrates can achieve double-sided / multi-layer wiring, but due to their poor thermal conductivity, heat-generating components are prone to heat accumulation. Especially in power electronic devices, heat accumulation can significantly affect the lifespan and stability of the devices.

[0003] In traditional solutions, the aluminum substrate (heat dissipation layer) and the glass plate (wiring layer) are connected by simple lamination or jumper welding, forming an air gap and point contact conductivity, resulting in low heat dissipation efficiency and low signal stability. Utility Model Content

[0004] The purpose of this invention is to provide a high heat dissipation type combined circuit board connection structure to solve the problem mentioned in the background art that the aluminum substrate (heat dissipation layer) and the glass plate (wiring layer) are connected by simple lamination or jumper welding, forming an air gap and point contact conductivity, resulting in low heat dissipation efficiency and low signal stability.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high heat dissipation type combined circuit board connection structure, including a circuit board, an aluminum substrate, and a glass plate. The aluminum substrate is partially embedded in the glass plate. Multiple heat-conducting protrusions are fixed on the surface of the aluminum substrate. Multiple through-holes are provided inside the glass plate. The heat-conducting holes are correspondingly fitted with the heat-conducting protrusions on the aluminum substrate, and the heat-conducting holes are filled with graphene thermally conductive adhesive. Heat dissipation fins are fixed on the outer walls of the heat-conducting protrusions. A copper foil trace area is provided on the surface of the glass plate, and a solder resist layer is covered outside the copper foil trace area.

[0006] In a further embodiment, the surface of the aluminum substrate is provided with a plurality of conductive pillars, the bottom of the glass plate is provided with a plurality of conductive holes that match the conductive pillars, and the conductive pillars are wrapped with an insulating ceramic sleeve.

[0007] In a further embodiment, the inner layer of the solder resist layer is a high-temperature resistant insulating varnish, and the outer layer is a nano-ceramic layer.

[0008] In a further embodiment, the area of ​​the aluminum substrate not covered by the glass plate is directly exposed for attaching the heat sink.

[0009] In a further embodiment, the surface of the heat dissipation fins is provided with multiple grooves, and the grooves are filled with a superhydrophobic coating.

[0010] In a further embodiment, the exposed area of ​​the aluminum substrate that does not cover the glass plate is etched with liquid cooling channels, the cross-section of which is trapezoidal, forming a mesh flow channel.

[0011] The technical effects and advantages of this utility model are as follows:

[0012] This high-heat-dissipation modular circuit board connection structure features an aluminum substrate embedded in a glass plate. The interference fit design of thermally conductive bosses and through-holes enables rapid connection between the aluminum substrate and the glass plate. Graphene thermally conductive adhesive fills the gaps, creating a low-resistance heat conduction path. During operation, the structure operates at a lower temperature than traditional circuit boards, ensuring the stability of the connection between the aluminum substrate and the glass plate. Furthermore, the heat dissipation grooves and fins within the glass plate work together to ensure a quick and stable connection between the aluminum substrate and the glass plate, while also increasing the heat dissipation area and improving heat dissipation efficiency. Multiple grooves on the surface of the heat dissipation fins inhibit condensation adhesion and prevent electrochemical corrosion in humid environments, making it suitable for high-humidity industrial scenarios.

[0013] The exposed area of ​​the aluminum substrate not covered by the glass plate can be directly attached to the heat sink (such as a microchannel water cooling plate). The contact is enhanced by thermal grease, which further improves the heat dissipation efficiency. It is suitable for high heat-consuming electronic devices such as new energy vehicles and industrial power supplies. At the same time, liquid cooling channels are etched on the exposed area of ​​the aluminum substrate not covered by the glass plate. Low viscosity coolant (such as deionized water or fluorinated liquid) flows through the microchannels and carries away the heat conducted by the aluminum substrate through forced convection, thereby improving the heat dissipation effect.

[0014] The conductive pillars on the surface of the aluminum substrate match the conductive holes of the glass plate. They are made of nickel-plated phosphor bronze and using welding technology to ensure signal transmission stability. The conductive pillars are wrapped with insulating ceramic sleeves to solve the problem of insufficient insulation in traditional lamination connections, reduce the risk of arc discharge, and further strengthen the connection between the aluminum substrate and the glass plate.

[0015] The solder mask layer adopts a composite structure of "high temperature resistant insulating varnish + nano ceramic layer". The inner layer isolates copper foil to prevent oxidation, and the outer layer is resistant to salt spray corrosion, which improves signal transmission performance and extends the life of the circuit board. This high heat dissipation type combined circuit board connection structure is easy to connect and solves the contradiction between heat dissipation and wiring in traditional circuit boards. It is suitable for high heat-consuming electronic devices such as new energy vehicles and industrial power supplies. It has the advantages of high heat dissipation efficiency, high reliability and good process compatibility. Attached Figure Description

[0016] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the circuit board and aluminum substrate of this utility model;

[0019] Figure 3 This is a cross-sectional view of the glass glaze of this utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the heat-conducting boss of this utility model.

[0021] In the diagram: 1. Circuit board; 2. Aluminum substrate; 3. Glass glaze; 4. Thermally conductive boss; 5. Graphene thermally conductive adhesive; 6. Conductive pillar; 7. Insulating ceramic sleeve; 8. Copper foil trace area; 9. Solder resist layer; 10. High-temperature resistant insulating varnish; 11. Nano-ceramic layer; 12. Heat sink fins. Detailed Implementation

[0022] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the present invention.

[0023] Unless otherwise defined, the directions mentioned herein, such as up, down, left, right, front, back, inside, and outside, are based on the directions shown in the figures of this utility model, and are explained here together.

[0024] This utility model provides, for example Figure 1-4The diagram shows a high-heat-dissipation modular circuit board connection structure, including a circuit board 1, an aluminum substrate 2, and a glass plate 3. The aluminum substrate 2 is partially embedded in the glass plate 3. Multiple thermally conductive protrusions 4 are fixed on the surface of the aluminum substrate 2. Multiple through-holes are provided inside the glass plate 3. The thermally conductive holes are correspondingly fitted with the thermally conductive protrusions 4 on the aluminum substrate 2, and the thermally conductive holes are filled with graphene thermally conductive adhesive 5. Heat dissipation fins 12 are fixed on the outer walls of the thermally conductive protrusions 4. Multiple heat dissipation grooves matching the heat dissipation fins 12 are opened inside the glass plate 3. This not only enables a stable connection between the aluminum substrate 2 and the glass plate 3, but also increases the heat dissipation area and improves the heat dissipation effect. Multiple grooves (depth 50-100μm, spacing 200-300μm) are opened on the surface of the heat dissipation fins 12. The grooves are filled with a superhydrophobic coating (contact angle > 150°). The superhydrophobic grooves inhibit the adhesion of condensate and avoid electrochemical corrosion in humid and hot environments, making it suitable for high-humidity industrial scenarios.

[0025] The aluminum substrate 2 is made of 6061-T6 aluminum alloy (thermal conductivity 205 W / m·K), with a thickness of 2-3 mm. The thermally conductive protrusions 4 are cylindrical, with a diameter of 1.5-3 mm and a height of 0.5-1 mm, arranged in an array (spacing 2-5 mm). The material is the same as that of the aluminum substrate 2. They are integrally formed by stamping, with a thermal contact resistance of <0.1 K / W with the aluminum substrate 2. The thermally conductive through-holes have a diameter of 2-4 mm, penetrating the glass plate 3 (thickness 1.6-2 mm). The hole wall roughness Ra ≤3.2 μm, and the fit clearance with the thermally conductive protrusions 4 is ≤0.05 mm, forming an interference fit structure. The graphene thermally conductive adhesive 5 has a filling density ≥95%, a thermal conductivity ≥15 W / m·K, and a volume resistivity ≥10 after curing. 12 Ω·cm, breakdown voltage ≥25kV / mm, meets UL94V-0 flame retardant standard, the area of ​​aluminum substrate 2 not covered by glass plate 3 is directly exposed for bonding to the heat sink, the exposed area of ​​not covered by glass plate 3 accounts for ≥30%, surface roughness Ra≤1.6μm, facilitating tight bonding with the heat sink (such as microchannel water cooling plate) through thermally conductive silicone grease (thermal conductivity ≥5W / m·K), the exposed area of ​​aluminum substrate 2 not covered by glass plate 3 is processed by microelectromechanical systems (MEMS). The liquid cooling channels are etched with a trapezoidal cross-section (500-800μm wide at the top, 300-500μm wide at the bottom, and 200-300μm deep) and spaced 1-2mm apart to form a mesh-like flow channel. The inlet and outlet of the liquid cooling channels are led out through metal connectors (such as stainless steel capillaries) on the edge of the glass plate 3. The connectors are brazed to seal the aluminum substrate 2. Low-viscosity coolant (such as deionized water or fluorinated liquid) flows through the microchannels and carries away the heat conducted by the aluminum substrate through forced convection, thereby improving the heat dissipation effect.

[0026] Multiple conductive pillars 6 are provided on the surface of the aluminum substrate 2. Multiple conductive holes matching the conductive pillars 6 are opened on the bottom of the glass plate 3. The conductive pillars 6 are wrapped with insulating ceramic sleeves 7. The conductive pillars 6 are made of nickel-plated phosphor bronze (conductivity ≥58% IACS), with a diameter of 0.8-1.2mm and a height exceeding the bottom surface of the glass plate 3 by 0.3-0.5mm. The surface nickel plating layer is 2-3μm thick and the tin plating layer is 3-5μm thick for easy welding. The insulating ceramic sleeves 7 are made of 95% alumina ceramic (thermal conductivity 20W / m·K, dielectric constant 9.5), with a wall thickness of 0.1-0.2mm. The fitting gap with the conductive pillars 6 is 0.02-0.03mm. They are fixed by high-temperature sintering (1600℃) and have an insulation withstand voltage ≥5000VDC.

[0027] The surface of the glass plate 3 is provided with a copper foil trace area 8, and the copper foil trace area 8 is covered with a solder resist layer 9. The inner layer of the solder resist layer 9 is a high-temperature resistant insulating varnish 10, and the outer layer is a nano-ceramic layer 11. The high-temperature resistant insulating varnish 10: the inner layer is made of polyimide varnish (glass transition temperature Tg≥280℃, breakdown voltage≥40kV / mm), with a thickness of 15-25μm, used to isolate the copper foil from the external environment. The nano-ceramic layer 11: the outer layer is a silicon dioxide-alumina composite nano-coating (particle size 50-100nm), with a thickness of 5-10μm, a surface hardness ≥9H, and corrosion resistance reaching 1000 hours of salt spray test without rust. At the same time, it can reduce the surface roughness to Ra≤0.8μm and reduce signal loss.

[0028] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. The control method of this utility model is through a controller. The control circuit of the controller can be implemented by those skilled in the art through simple programming. The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0029] In the description of this utility model, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this utility model and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0030] Working principle: In operation, the aluminum substrate 2 is embedded in the glass plate 3, and the thermally conductive protrusions 4 on its surface are fitted into the thermally conductive through holes in the glass plate 3, so that the two are quickly and stably connected. The graphene thermally conductive adhesive 5 filled in the thermally conductive through holes quickly conducts the heat generated by the circuit board to the aluminum substrate 2. The exposed area of ​​the aluminum substrate 2 that is not covered by the glass plate 3 is directly attached to the heat sink, so that the heat can be dissipated to the outside.

[0031] The conductive pillars 6 on the surface of the aluminum substrate 2 pass through the conductive holes at the bottom of the glass plate 3. The external insulating ceramic sleeve 7 ensures electrical insulation, and the conductive pillars 6 enable circuit conduction. The copper foil trace area 8 on the surface of the glass plate 3 is isolated and protected by the solder resist layer 9 (inner high-temperature resistant insulating varnish 10 and outer nano-ceramic layer 11) to ensure circuit safety and stability. The whole structure achieves efficient heat dissipation and reliable electrical connection through the synergistic effect of the composite structure.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high heat dissipation type combined circuit board connection structure, comprising a circuit board (1), an aluminum substrate (2), and a glass glaze plate (3), characterized in that: The aluminum substrate (2) is partially embedded in the glass plate (3). The surface of the aluminum substrate (2) is fixed with multiple heat-conducting protrusions (4). The glass plate (3) has multiple through-holes for heat conduction. The through-holes are fitted with the heat-conducting protrusions (4) on the aluminum substrate (2). The through-holes are filled with graphene thermal conductive adhesive (5). Heat dissipation fins (12) are fixed on the outer walls of the heat-conducting protrusions (4). The surface of the glass plate (3) is provided with a copper foil trace area (8). The copper foil trace area (8) is covered with a solder resist layer (9).

2. The high heat dissipation type combined circuit board connection structure according to claim 1, characterized in that: The surface of the aluminum substrate (2) is provided with a plurality of conductive pillars (6), and the bottom of the glass plate (3) is provided with a plurality of conductive holes that match the conductive pillars (6). The conductive pillars (6) are wrapped with an insulating ceramic sleeve (7).

3. The high heat dissipation type combined circuit board connection structure according to claim 1, characterized in that: The inner layer of the solder resist layer (9) is a high-temperature resistant insulating varnish (10), and the outer layer is a nano-ceramic layer (11).

4. The high heat dissipation type combined circuit board connection structure according to claim 1, characterized in that: The area of ​​the aluminum substrate (2) not covered by the glass plate (3) is directly exposed for attaching the heat sink.

5. The high heat dissipation type combined circuit board connection structure according to claim 1, characterized in that: The surface of the heat dissipation fins (12) has multiple grooves, and the grooves are filled with a superhydrophobic coating.

6. The high heat dissipation type combined circuit board connection structure according to claim 4, characterized in that: The aluminum substrate (2) does not cover the exposed area of ​​the glass plate (3), and the liquid cooling channel is etched. The cross-section of the liquid cooling channel is trapezoidal, forming a mesh flow channel.

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