Heat dissipation system of heat dissipation pad

Abstract

This application discloses a heat dissipation system for a heat dissipation patch, including a housing, a power supply, and a heat dissipation assembly. The housing includes an upper cover and a lower cover. The lower cover includes a bottom wall and a side wall extending upwards from the bottom wall. The bottom wall has an installation opening, and the bottom wall and side wall enclose a body cavity with an opening. The housing has a flow port, and the upper cover covers the opening of the body cavity and forms another flow port on one side of the housing. One flow port is for air intake, and the other flow port is for air exhaust. The heat dissipation assembly includes a heat exchange plate with silicone thermal paste on both ends, a heat dissipation body, and a cooling fan. The heat exchange plate is fixedly disposed in the installation opening, and one end of the heat dissipation body is connected to the heat exchange plate and located within the body cavity. The power supply is located within the body cavity and away from the end of the air exhaust flow port, and the power supply is electrically connected to both the cooling fan and the heat exchange plate. This invention improves heat dissipation efficiency by placing the two flow ports in different directions to prevent turbulence during air exhaust.

Description

Technical Field

[0001] This application relates to the field of medical cooling, and in particular to a heat dissipation system for a heat dissipation patch. Background Technology

[0002] Normal human body temperature is between 36°C and 37.2°C. A temperature exceeding 37.2°C is considered a fever. Whether it is a low-grade fever or a high fever, it is necessary to lower the patient's temperature as soon as possible. Usually, physical cooling methods are preferred to lower the temperature, avoiding the use of medication. However, in cases of high fever, physical cooling methods combined with medication are used to achieve the goal of lowering the body temperature as quickly as possible.

[0003] Existing technology includes a patent application (application number 202210911838.0) entitled "Forehead Cooler," which uses a semiconductor cooling chip placed between an upper and lower cover, and a fan positioned above the chip to dissipate heat from the hot surface of the semiconductor, thus continuously cooling the forehead through the cooling effect of the semiconductor cooling chip. However, in this prior art, both the air inlet and outlet are located at the top of the upper cover, and the fan's airflow is horizontal when dissipating heat from the semiconductor. Therefore, during heat dissipation, hot air is expelled from the heat sink housing and enters the space between the upper cover and the heat sink housing before being expelled through the outlet. This creates turbulence and reversal of the hot air between the upper cover and the heat sink housing, resulting in poor heat dissipation efficiency.

[0004] The above content is only used to assist in understanding the technical solution of the utility model and does not represent an admission that the above content is prior art. Utility Model Content

[0005] In view of the aforementioned problem of poor heat dissipation efficiency, this utility model proposes a heat dissipation system for a heat dissipation patch, aiming to solve the aforementioned technical problem of poor heat dissipation efficiency.

[0006] To achieve the above objectives, the heat dissipation system of the heat dissipation patch proposed in this utility model includes a housing, a power supply, and heat dissipation components; wherein,

[0007] The housing includes an upper cover and a lower cover; the lower cover includes a bottom wall and a side wall extending upward from the bottom wall, the bottom wall is provided with an installation opening, and the bottom wall and the side wall enclose a body cavity with an opening; the housing is provided with a flow port, the upper cover covers the opening of the body cavity and forms another flow port on one side of the housing, one flow port is used for air intake and the other flow port is used for air exhaust.

[0008] The heat dissipation assembly includes a heat exchange plate with silicone thermal paste on both ends, a heat dissipation body, and a cooling fan; wherein, the heat exchange plate is fixedly installed in the mounting port, one end of the heat dissipation body is connected to the heat exchange plate and located inside the body cavity, and the cooling fan is fixedly installed on the other end of the heat dissipation body, with a gap between the cooling fan and the heat dissipation body; or, the cooling fan is fixedly installed on one side of the heat dissipation body.

[0009] The power supply is located inside the housing cavity and away from the air vent, and is electrically connected to both the cooling fan and the heat exchange fins.

[0010] In one embodiment, the heat dissipation body includes a heat dissipation substrate and a plurality of spaced lower guide strips protruding from the side of the heat dissipation substrate facing the upper cover, and each lower guide strip extends along the flow direction of the air outlet, and a lower guide groove is formed between adjacent lower guide strips.

[0011] In one embodiment, the innermost lower guide bar of a plurality of lower guide bars is interrupted to form an exhaust zone on the heat dissipation body, and the heat dissipation fan is fixedly disposed in the exhaust zone.

[0012] In one embodiment, the installation port and exhaust area are in the flow direction of the air inlet.

[0013] In one embodiment, when the cooling fan is located on one side of the heat dissipation body, the cooling fan and the air outlet are located on both ends of the heat dissipation body.

[0014] In one embodiment, the protrusion height of each lower guide bar is the same, and the protrusion height of each lower guide bar is 3mm to 50mm; when the cooling fan is located in the exhaust area, the fan blades of the cooling fan at least partially intersect with the lower guide bar.

[0015] The spacing between two adjacent lower guide strips is 5mm to 10mm.

[0016] In one embodiment, an upper guide strip is provided on the side of the upper cover facing the body cavity, corresponding to each lower guide strip, and an upper guide groove is formed between adjacent upper guide strips;

[0017] When the top cover is closed to the opening, the upper guide groove and the lower guide groove form a heat dissipation airflow channel.

[0018] In one embodiment, a partition plate is also fixedly disposed on the heat dissipation assembly. One end of the partition plate abuts against the bottom wall and extends upward along the direction of the opening. The extension height of the partition plate is greater than the height of the heat dissipation body, thereby separating the heat dissipation assembly from the power supply.

[0019] In one embodiment, a guide plate is also provided in the cavity of the body. One end of the guide plate abuts against the end of the heat dissipation body away from the partition plate, and the other end abuts against the side wall of the lower cover facing the air outlet.

[0020] The end of the guide plate that abuts against the heat dissipation body is higher than the end that abuts against the side wall, so that the guide plate is tilted upward on the side wall at the end of the air outlet, and the tilt angle of the guide plate is 10° to 30°.

[0021] In one embodiment, a heat exchange groove is provided on the side of the bottom wall away from the body cavity, and the heat dissipation system also includes a heat conduction plate disposed in the heat exchange groove. When the heat conduction plate is disposed in the heat exchange groove, at least one end face of the heat conduction plate abuts against the heat exchange plate.

[0022] In one embodiment, a plurality of protrusions are provided on the side of the heat conduction sheet facing away from the heat exchange groove.

[0023] In one embodiment, a plurality of grooves are provided on the wall surface around the mounting opening; when one end face of the heat conduction sheet abuts against the heat exchange sheet, a portion of the surface of the heat exchange sheet abutting against the heat conduction sheet is filled into the grooves with silicone thermal paste.

[0024] In one embodiment, a plurality of heat insulation grooves are provided on the bottom wall around the mounting opening.

[0025] In one embodiment, the side of the top cover facing the body cavity is provided with light shields on both sides of the flow port on the top cover along the flow direction of another flow port, and each light shield is intermittently arranged in relation to the flow port on the top cover to form auxiliary ventilation ports.

[0026] The heat dissipation system of this utility model heat dissipation patch features two flow ports located on opposite sides of the patch. Compared to placing both flow ports on the top of the casing, this arrangement better aligns with the fan's intake and exhaust directions and prevents the exhaust direction from changing. Therefore, the hot air exhausted by the fan does not create turbulence, thus improving heat dissipation efficiency. Furthermore, placing the power supply at the end furthest from the main exhaust port prevents hot air from affecting the power supply and causing overheating damage, thereby extending the power supply's lifespan and indirectly improving the lifespan of the heat dissipation system and the heat dissipation patch itself. Additionally, placing the power supply at the end furthest from the main exhaust port enhances the safety of the heat dissipation patch, as excessively high power supply temperatures could lead to spontaneous combustion or explosion. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A schematic diagram of the heat dissipation patch structure is shown;

[0029] Figure 2 for Figure 1 An explosion diagram;

[0030] Figure 3 for Figure 1A schematic diagram of the structure of the upper cover;

[0031] Figure 4 for Figure 1 A schematic diagram of the structure of the lower cover;

[0032] Figure 5 for Figure 1 The lower cover of the middle section includes a structural diagram of part of the heat dissipation system;

[0033] Figure 6 for Figure 1 The lower cover includes a structural diagram of the heat dissipation system;

[0034] Figure 7 for Figure 6 A schematic diagram of the heat dissipation components in the heat dissipation system;

[0035] Figure 8 for Figure 7 A schematic diagram of the structure of the heat dissipation body in the heat dissipation component;

[0036] Figure 9 for Figure 6 A schematic diagram of the air guide plate in the heat dissipation system;

[0037] Figure 10 for Figure 1 Front view diagram of the heat dissipation pad;

[0038] Figure 11 for Figure 10 A cross-sectional view along AA in the diagram;

[0039] Figure 12 for Figure 10 A cross-sectional view along BB in the diagram;

[0040] Figure 13 for Figure 1 A top view of the heat dissipation pads;

[0041] Figure 14 for Figure 1 A left-side view of the heat dissipation pad;

[0042] Figure 15 for Figure 1 A schematic diagram of the first usage state of the heat dissipation pad;

[0043] Figure 16 for Figure 1 A schematic diagram of the second usage state of the heat dissipation pad.

[0044] Explanation of icon numbers:

[0045]

[0046] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application. In addition, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those of ordinary skill in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0048] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0049] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text is to include three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies both A and B.

[0050] This utility model proposes a heat dissipation system for a heat dissipation patch 100, including a housing 1, a power supply 2, and a heat dissipation assembly 4; wherein, the housing 1 includes an upper cover 11 and a lower cover 12; the lower cover 12 includes a bottom wall 121 and a side wall 123 extending upward from the bottom wall 121, the bottom wall 121 is provided with an installation opening 122, and the bottom wall 121 and the side wall 123 surround to form a body cavity 124 with an opening; the housing 1 is provided with a flow port, the upper cover 11 covers the opening of the body cavity 124 and forms another flow port on one side of the housing 1, wherein one flow port is used for air intake and the other flow port is used for air exhaust; the heat dissipation assembly 4 includes Both ends are provided with heat exchange plates 43 containing silicone thermal paste, heat dissipation body 42, and cooling fan 41; wherein, the heat exchange plate 43 is fixedly installed in the mounting port 122, one end face of the heat dissipation body 42 is connected to the heat exchange plate 43 and located in the body cavity 124, the cooling fan 41 is fixedly installed on the other end face of the heat dissipation body 42, and there is a gap between the cooling fan 41 and the heat dissipation body 42, or the cooling fan 41 is fixedly installed on one side of the heat dissipation body 42; the power supply 2 is located in the body cavity 124 and away from the end of the air outlet, and the power supply 2 is electrically connected to the cooling fan 41 and the heat exchange plate 43 respectively.

[0051] In this embodiment of the utility model, please refer to Figures 1 to 6 , Figures 10 to 12 As shown, the heat dissipation system includes an external housing 1, a heat dissipation component 4 for cooling / heating, and a power supply 2 for providing electrical energy. Details are as follows.

[0052] In this embodiment, the housing 1 includes an upper cover 11 and a lower cover 12. The lower cover 12 includes a curved bottom wall 121 and an upwardly extending side wall 123. The curvature of the bottom wall 121 roughly matches the curvature of the human forehead; specific numerical descriptions are not provided here. When the side wall 123 extends upward from the bottom wall 121, the angle between the side wall 123 and the bottom wall 121 includes, but is not limited to, less than, equal to, or greater than 90°. When the angle between the side wall 123 and the bottom wall 121 is less than 90°, the side wall 123 is inclined inward and extends upward. When the angle between the side wall 123 and the bottom wall 121 is equal to 90°, the side wall 123 extends vertically upward on the bottom wall 121. When the angle between the side wall 123 and the bottom wall 121 is greater than 90°, the side wall 123 is inclined outward and extends upward. It should be noted that in this embodiment, the angle between the side wall 123 and the bottom wall 121 is greater than 90°. The bottom wall 121 has a mounting opening 122, which includes, but is not limited to, being located in the middle of the bottom wall 121. It should be noted that side walls 123 extend upwards around the bottom wall 121, and each side wall 123 and the bottom wall 121 enclose a body cavity 124 with an opening. A flow port is provided on the upper cover 11, and this flow port on the upper cover 11 serves as an air inlet, i.e., an air inlet 111 in this embodiment. A grille strip is provided on the air inlet 111. The upper cover 11 covers the opening of the body cavity 124 of the lower cover 12, and another flow port is formed on one side of the housing 1, i.e., this flow port serves as an air outlet, i.e., the main air outlet 13 in this embodiment. Figure 11 The main air outlet 13 is formed on the right side of the casing 1.

[0053] In this embodiment, refer to Figure 7 , Figure 8As shown, the heat dissipation assembly 4 includes a heat exchange plate 43, a heat dissipation body 42, and a cooling fan 41; wherein the heat exchange plate 43 is fixedly disposed in the mounting port 122. Specifically, the heat exchange plate 43 is fixedly abutted against the wall of the mounting port 122 around its perimeter. It should be noted that the heat exchange plate 43 is a semiconductor plate, including a heating surface and a cooling surface on both sides. In this embodiment, when the cooling surface of the heat exchange plate 43 faces down, the heat dissipation assembly 4 provided in this embodiment is used for cooling; conversely, when the heating surface of the heat exchange plate 43 faces down, the heat dissipation assembly 4 provided in this embodiment is used for heating. In this embodiment, the description and implementation mainly focus on the cooling surface of the heat exchange plate 43 facing down for cooling. The heat dissipation body 42 and the cooling fan 41 are stacked sequentially on the heat exchange plate 43 in the air intake direction, that is, the heat exchange plate 43 is on the lower end surface of the heat dissipation body 42, and the cooling fan 41 is on the upper end surface of the heat exchange plate 43. It should be noted that when the heat sink 42 and the cooling fan 41 are stacked on the heat exchange plate 43, the heat sink 42 and the cooling fan 41 are located inside the housing cavity 124. It should also be noted that the airflow direction described in this embodiment refers to the direction in which air enters the housing cavity 124 from the air inlet 111 when the cooling fan 41 is running. Figure 11 The vertical direction in the middle.

[0054] In this embodiment, the power supply 2 is located inside the housing cavity 124 and away from the main air outlet 13, that is, the main air outlet 13 is located at the right end of the housing cavity 124, and the power supply 2 is located on the left side of the housing cavity 124. The power supply 2 is electrically connected to the cooling fan 41 and the heat exchange plate 43. In this embodiment, the cooling fan 41 and the heat exchange plate 43 are electrically connected through the circuit board 3 to provide power to the cooling fan 41 and the heat exchange plate 43.

[0055] The working principle of this embodiment is as follows: when the heat dissipation pad 100 is started by the control circuit board 3, the control circuit board 3 controls the power supply 2 to supply power to the heat dissipation fan 41 and heat exchange plate 43 of the heat dissipation component 4. After being powered on, the heat exchange plate 43 achieves the effect of cooling on one side and heating on the other side through thermoelectricity. The heating side of the heat exchange plate 43 is pressed tightly against the heat dissipation body 42. The heat dissipation body 42 will absorb the heat from the cooling side of the heat exchange plate 43, and the heat dissipation body 42 will conduct the absorbed heat to the air in the body cavity 124. The heat dissipation fan 41 will quickly exhaust the heat in the body cavity 124 through the main air outlet 13, thus circulating the heat.

[0056] It should be noted that in this embodiment, the circuit board 3 can be fixedly mounted on either side wall 123 and / or bottom wall 121 of the lower cover 12, and the circuit board 3 can be placed inside the body cavity 124 to fix its position. Alternatively, the circuit board 3 can be placed anywhere inside the body cavity 124 without fixing its position. It should be noted that when the circuit board 3 is fixedly mounted on either side wall 123 and / or bottom wall 121 of the lower cover 12, compared to when the circuit board 3 is not fixed, its position within the body cavity 124 is fixed. Therefore, the circuit board 3 will not wobble during use, making the connection between the circuit board 3 and the power supply 2, cooling fan 41, and heat exchange plate 43 less likely to detach, thereby improving the service life of the heat dissipation pad 100. Furthermore, it should be noted that when the circuit board 3 is fixed inside the body cavity 124, it can be fixed on either side wall 123 or bottom wall 121, or simultaneously on both side wall 123 and bottom wall 121. In this embodiment, the circuit board 3 is fixed to the side wall 123 on the front side of the lower cover 12 for description and implementation. It should be noted that when the circuit board 3 is fixed to any side wall 123 and / or bottom wall 121 of the lower cover 12, the circuit board 3 does not contact the heat dissipation assembly 4 or the power supply 2. This prevents the heat from the power supply 2 and the heat dissipation assembly 4 from being directly conducted to the circuit board 3 when the heat dissipation pad 100 is started, thus preventing damage to the circuit board 3 due to high temperature or damage to the connection points between the circuit board 3 and the power supply 2, the cooling fan 41, and the heat exchange plate 43. This improves the service life of the circuit board 3 and indirectly improves the service life of the heat dissipation pad 100. It should also be noted that when the circuit board 3 is placed inside the body cavity 124, to prevent the shaking of the circuit board 3 from impacting the cooling fan 41 during operation, in some embodiments, a protective mesh is provided on the cooling fan 41.

[0057] It should also be noted that when the cooling fan 41 is fixed on the heat dissipation body 42, there is a gap between the cooling fan 41 and the heat dissipation body 42, that is, the cooling fan 41 and the heat dissipation body 42 do not contact each other.

[0058] In this embodiment, by placing the main air outlet 13 on the right side of the housing 1, compared to placing the main air outlet 13 on the upper side of the housing 1, it is more in line with the exhaust direction of the fan and will not cause the exhaust direction of the fan to change. Therefore, the hot air discharged by the fan will not form turbulence and affect the exhaust of the hot air, thus the heat dissipation efficiency is higher. Placing the power supply 2 at the end away from the main air outlet 13, compared to placing it at the end of the main air outlet 13, prevents the hot air from affecting the power supply 2 and causing the power supply 2 to be damaged due to overheating. Therefore, the service life of the power supply 2 is improved, which indirectly improves the service life of the heat dissipation system and the heat dissipation pad 100. At the same time, when the temperature of the power supply 2 is too high, there may be dangers such as spontaneous combustion or explosion. Therefore, placing the power supply 2 at the end away from the main air outlet 13 improves the safety of the heat dissipation pad 100.

[0059] Furthermore, when the cooling fan 41 is located on one side of the heat dissipation body 42, the cooling fan 41 and the air outlet are located on both ends of the heat dissipation body 42, respectively.

[0060] In this embodiment, in another embodiment, the cooling fan 41 can be fixedly disposed on the left side of the heat dissipation body 42, that is, the cooling fan 42 is on the left side of the heat dissipation body 41, and the air outlet for air discharge is on the right side of the heat dissipation body 41, that is, the main air outlet 13 is on the right side of the heat dissipation body 41.

[0061] Furthermore, the heat dissipation body 42 includes a heat dissipation substrate 421 and a plurality of spaced lower guide strips 422 protruding on the side of the heat dissipation substrate 421 facing the upper cover, and each lower guide strip 422 extends along the flow direction of the air outlet, and a lower guide groove 423 is formed between adjacent lower guide strips 422.

[0062] Furthermore, the inner side of the lower guide bar 422 is interrupted to form an exhaust area 424 on the heat dissipation body 42, and the heat dissipation fan 41 is fixedly installed in the exhaust area 424.

[0063] In this embodiment, the heat dissipation body 42 of the heat dissipation assembly 4 will be described in detail. The heat dissipation body 42 includes a heat dissipation substrate 421 and a plurality of spaced lower guide bars 422 protruding from the side of the heat dissipation substrate 421 facing the air inlet 111. It should be noted that the heat dissipation substrate 421 includes a lower end face facing the mounting port 122 and an upper end face facing the air inlet 111. The lower end face of the heat dissipation substrate 421 abuts against the heat exchange plate 43, and heat exchange is achieved between the heat exchange plate 43 and the heat dissipation substrate 421 when the heat exchange plate 43 is working. The plurality of lower guide bars 422 are spaced apart on the upper end face of the heat dissipation substrate 421. After the heat dissipation substrate 421 and the heat exchange plate 43 exchange heat, the exchanged heat will be conducted to each lower guide bar 422. It should be noted that each lower guide strip 422 extends along the air outlet direction of the main air outlet 13, that is, the two ends of each lower guide strip 422 face the left and right directions of the heat dissipation pad 100, respectively, and a lower guide groove 423 is formed between two adjacent lower guide strips 422. The inner lower guide strip 422 of the plurality of lower guide strips 422 on the upper surface of the heat dissipation substrate 421 is interrupted to form an exhaust area 424 on the heat dissipation body 42. It should be noted that the interruption described here means that the middle of the same lower guide strip 422 among the plurality of horizontally arranged lower guide strips 422 is interrupted with a certain gap, thereby forming an exhaust area 424 sufficient to install the cooling fan 41. The cooling fan 41 is disposed within the exhaust area 424 and fixed to the upper surface of the heat dissipation substrate 421. It should be noted that when the cooling fan 41 is disposed on the heat dissipation substrate 421, it is not limited to fixing with screws; in some embodiments, it can also be fixed by bonding, welding, or other methods.

[0064] In this embodiment, by providing a plurality of lower guide strips 422 on the upper surface of the heat dissipation substrate 421, the contact area between the heat dissipation component 4 and the air is increased compared to the case where the lower guide strips 422 are not provided. This increases the efficiency of the heat dissipation body 42 in transferring heat to the air, so as to facilitate the rapid discharge of heat from the body cavity 124, thereby improving the heat dissipation efficiency of the heat dissipation system. At the same time, two adjacent lower guide strips 422 will clamp together to form a lower guide groove 423. When the heat dissipation fan 41 exhausts air, the air will flow along the lower guide groove 423 to the main air outlet 13 to prevent turbulence and further improve the heat dissipation efficiency.

[0065] Furthermore, the installation port 122, the exhaust area 424, and the air inlet 111 are in the air inlet direction of the air inlet.

[0066] In this embodiment, the specific locations of the mounting port 122 and the exhaust zone 424 will be described in detail. The mounting port 122 is located in the middle of the bottom wall 121 of the lower cover 12, and the air inlet 111 is located in the middle of the upper cover 11. Therefore, the mounting port 122 and the air inlet 111 are corresponding in the upper and lower directions. The exhaust zone 424 is located between the mounting port 122 and the air inlet 111. When the cooling fan 41 is located in the exhaust zone 424, it facilitates the air intake efficiency of the air inlet 111. At the same time, since the position where the heat dissipation body 42 directly contacts the heat exchange plate 43 is in the air intake direction of the air inlet 111, this position directly absorbs the heat generated by the heat exchange plate 43 and then conducts it to other positions. Therefore, there is more heat at this position. When the cooling fan 41 is directly located in the exhaust zone 424, the heat dissipation efficiency is higher.

[0067] Furthermore, each lower guide bar 422 has the same protrusion height, and the protrusion height of each lower guide bar 422 is 3mm to 50mm. When the cooling fan 41 is located in the exhaust area 424, the fan blades of the cooling fan 41 at least partially intersect with the lower guide bar 422. The distance between two adjacent lower guide bars 422 is 5mm to 10mm.

[0068] In this embodiment, the heat dissipation body 42 will be described in detail again. Several lower guide strips 422 protruding from the heat dissipation substrate 421 have the same protrusion height, and the protrusion height of each lower guide strip 422 is between 3mm and 50mm. When the cooling fan 41 is placed within the exhaust area 424, the heat dissipation of the cooling fan 41 at least partially intersects with the lower guide strips 422. This intersection means that when the cooling fan 41 is within the exhaust area 424, at least a portion of the heat dissipation of the cooling fan 41 is below the protrusion height of the lower guide strips 422. The spacing between two adjacent lower guide strips 422 is 5mm to 10mm. It should be noted that in some embodiments, the width of each guide groove is the same. In this embodiment, by setting the height of the protrusions of the lower guide strips 422 to be the same, compared with the case where the protrusion heights of the lower guide strips 422 are not the same, it is simpler to open the mold when manufacturing the heat dissipation body 42 individually, thereby reducing the manufacturing cost. At the same time, the depth and height of each guide groove are the same, and the air flow rate in each heat dissipation groove is the same when heat dissipation is performed, so the heat dissipation is more uniform.

[0069] It should be noted that when the height of the guide strip protrusion and the spacing between two adjacent guide strips are set to 3mm-50mm and 5mm-10mm respectively, that is, the height and width of the guide groove are 3mm-50mm and 5mm-10mm respectively, the heat dissipation body 42 is thinner when the height and width of the guide groove are at their minimum values, i.e., the height is 3mm and the width is 5mm. The 3mm height provides sufficient contact area with the air for heat conduction, while the 5mm width is sufficient to allow airflow and expel it from the housing cavity 124. Therefore, in this embodiment, the heat dissipation pad 100 is thinner. When the height and width of the guide groove are implemented at their maximum values, i.e., the height is 50mm and the width is 10mm, the higher height of the protrusion results in a larger contact area between the guide ribs and the air, leading to higher heat conduction efficiency. Furthermore, the 10mm width of the guide groove allows for faster airflow, resulting in better heat dissipation.

[0070] Furthermore, on the side of the upper cover 11 facing the body cavity 124, there is an upper guide bar 112 corresponding to the lower guide bar 422, and an upper guide groove 113 is formed between adjacent upper guide bars 112; when the upper cover 11 is closed to the opening, the upper guide groove 113 and the lower guide groove 423 form a heat dissipation air duct 44.

[0071] In this embodiment, refer to Figure 3As shown, the upper cover 11 will be described in detail. The lower end face of the upper cover 11 has an upper guide strip 112 corresponding to each lower guide strip 422, and an upper guide groove 113 is formed between two adjacent upper guide strips 112. It should be noted that the upper guide strip 112 is only provided for the lower guide strip 422 on the right side of the exhaust area 424. When the upper cover 11 is closed at the opening, the upper guide groove 113 and the lower guide groove 423 form a heat dissipation airflow channel 44. During heat dissipation, air enters the body cavity 124 through the air inlet 111, flows into the main air outlet 13 through the heat dissipation airflow channel 44, and exits through the heat dissipation pad 100, dissipating heat during the outflow process. In this embodiment, the upper guide strip 112 and the lower guide strip 422 form a complete heat dissipation airflow channel 44, giving the air a fixed flow direction, resulting in better airflow efficiency and thus better heat dissipation efficiency. At the same time, the upper guide strip 112 also improves the quality of the upper cover 11, making it less prone to damage.

[0072] Furthermore, it also includes a partition plate 5 fixedly mounted on the heat dissipation assembly 4. One end of the partition plate 5 abuts against the bottom wall 121 and extends upward along the direction of the opening. The extension height of the partition plate 5 is greater than the height of the heat dissipation body 42, thus separating the heat dissipation assembly 4 from the power supply 2.

[0073] In this embodiment, refer to Figure 5 and Figure 6 , Figure 11 As shown, the heat dissipation system also includes a partition plate 5 fixedly disposed on the left side of the heat dissipation assembly 4. One side of the partition plate 5 is bonded to the heat dissipation body 42, and its lower end abuts against the bottom wall 121. The other end extends upward, reaching a height higher than that of the heat dissipation body 42 within the housing cavity 124. It should be noted that the partition plate 5 may be made of, but is not limited to, thermal insulation cotton, and places the power supply 2 and the heat dissipation assembly 4 on both sides of the partition plate 5 to prevent the temperatures of the heat dissipation assembly 4 and the power supply 2 from affecting each other.

[0074] Furthermore, it also includes a guide plate 6 disposed in the body cavity 124. One end of the guide plate 6 abuts against the end of the heat dissipation body 42 away from the partition plate 5, and the other end abuts against the side wall 123 of the lower cover 12 facing the air outlet. The end of the guide plate 6 that abuts against the heat dissipation body 42 is higher than the end that abuts against the side wall 123, so that the guide plate 6 is tilted upward on the side wall 123 of the air outlet. The tilt angle of the guide plate 6 is 10° to 30°.

[0075] In this embodiment, refer to Figure 5 , Figure 6 , Figure 9 , Figure 11As shown, the heat dissipation system also includes a guide plate 6, which is disposed at the main air outlet 13 of the housing cavity 124. One end of the guide plate 6 abuts against the heat dissipation base plate 421 of the heat dissipation body 42, and the other end abuts against the side wall 123 on the right side of the lower cover 12. The end of the guide plate 6 abutting against the heat dissipation base plate 421 is higher than the end abutting against the side wall 123, so that the guide plate 6 is inclined upward on the side wall 123. The inclination angle of the guide plate 6 is 10° to 30°. In this embodiment, the air flowing out of the heat dissipation air duct 44 is guided again by the guide plate 6 so that the air can flow into the main air outlet 13 and be discharged from the housing cavity 124, thereby improving the heat dissipation efficiency. It should be noted that since the heat dissipation component 4 has a certain curvature, the air guide plate 6 has a certain tilt angle, and the air guide plate 6 is tilted upward on the side wall 123, so that after the air flows out from the heat dissipation air duct 44, it prevents the air from accumulating at the main air outlet 13. Therefore, after setting the air guide plate 6, the air can be directly discharged through the main air outlet 13, thereby improving the heat dissipation efficiency.

[0076] It should be noted that the heat dissipation component 4 is provided with brackets 8 on both sides, that is, the two brackets 8 are set on the left and right. In this embodiment, support frames 81 are provided on the opposite wall surfaces of the two brackets 8. It should be noted that support frames 81 are provided at the front and rear ends of the two brackets 8, and several buckles 82 are provided on the free ends of the two brackets 8. The lower wall surface of the heat dissipation body 42 of the heat dissipation component 4 abuts against each support frame 81, and the buckles 82 on the brackets 8 are engaged with the side of the heat dissipation body 42 away from the support frame 81, that is, the buckles 82 on the brackets 8 are engaged with the upper wall surface of the heat dissipation body 42. In this embodiment, when the heat dissipation component 4 is supported by the support frame 81 of the bracket 8, the heat dissipation body 42 is prevented from directly contacting the bottom wall 121, so as to prevent the heat absorbed by the heat dissipation body 42 from being conducted to the bottom wall 121. Since the bottom wall 121 is in direct contact with the forehead, after the heat dissipation body is separated from the bottom wall, the heat of the heat dissipation body is prevented from being conducted to the forehead through the bottom wall, thereby improving the cooling efficiency. At the same time, the heat dissipation body 42 is snapped and fixed by the buckle 82, which facilitates the installation and disassembly of the heat dissipation component 4.

[0077] It should be noted that the support frame 81 includes auxiliary support plates 82 and main support plates 812. The auxiliary support plates 82 are arranged at the front and rear, and at both ends of the bracket 8, along the air outlet direction. Each auxiliary support plate 82 is arranged opposite to the other. The opposite arrangement described here means that the auxiliary support plates 82 on the same side of the two brackets are opposite to each other. For example, the front auxiliary support plate 82 on the left bracket 8 is opposite to the front auxiliary support plate 82 on the right bracket 8. The main support plate 812 is located at the other end of the auxiliary support plates 82, and the main support plates 812 at both ends of the same bracket 8 are arranged opposite to each other. That is, the front main support plate 812 on the same bracket 8 faces the rear end of the bracket 8, and the rear main support plate 812 on the same bracket 8 faces the front end of the bracket 8. It should be noted that the auxiliary support plate 82 is higher than the main support plate 812. When the heat dissipation body 42 is mounted on the support frame 81, the lower wall surface of the heat dissipation body 42 abuts against each main support plate 812, the front and rear sides of the heat dissipation body 42 abut against each auxiliary support plate 82, and the left and right sides of the heat dissipation body 42 abut against the bracket 8 respectively. In this embodiment, the heat dissipation body 42 is supported by the main support plate 812, and the front and rear of the heat dissipation body 42 are limited by the auxiliary support plate 82. The left and right sides of the heat dissipation body 42 are limited by the two brackets 8, making the position of the heat dissipation body 42 more stable. It should also be noted that each buckle 82 is provided with a guide surface, and each guide surface is inclined towards the bottom wall 121, so that when the heat dissipation body 42 is installed on the bracket 8, the guide surface plays a guiding role, thereby facilitating installation.

[0078] It should be noted that a pin seat 126 is provided on the front and rear ends of the side wall 123 on both sides of the lower cover 12, and a pin hole 127 is provided on the free end of the pin seat 126. A pin head 115 is provided on the lower end surface of the upper cover 11 corresponding to each pin seat 126, and the free end of the pin head 115 can be engaged with the pin hole 127. When the upper cover 11 is closed in the opening, the pin head 115 on the upper cover 11 is inserted into the pin hole 127 to fix the upper cover 11.

[0079] In this embodiment, the bottom wall 121 is rectangular, and pin seats 126 are respectively provided on the side walls 123 on both sides of the bottom wall 121 along the air outlet direction. That is, pin seats 126 are respectively provided on the left and right side walls 123 of the bottom wall 121. When the upper cover 11 is closed to the opening, a pin head 115 is provided on the surface of the upper cover 11 facing the body cavity 124 corresponding to each pin seat 126. A pin hole 127 is provided on the free end of the pin seat 126. When the upper cover 11 is closed to the opening, the free end of the pin head 115 is inserted into the pin hole 127. It should be noted that in some embodiments, the pin seat 126 may be provided on the upper cover 11, and the pin head 115 may be provided on the lower cover 12. It should be noted that when the upper cover 11 is closed in the opening, the upper cover 11 and the lower cover 12 are separated, that is, the length of the pin head 115 is greater than the depth of the pin hole 127, so that the upper cover 11 and the lower cover 12 do not contact each other, forming a gap. In this embodiment, when the upper cover 11 and the lower cover 12 are fixed by the pin seat 126 and the pin head 115, compared with the fixing by adhesive, screws or other methods, the position of the upper cover 11 and the lower cover 12 can be corrected by the pin seat 126, so that the relationship between the upper cover 11 and the lower cover 12 is more accurate when the upper cover 11 is closed in the opening. At the same time, the cooperation between the pin seat 126 and the pin head 115 makes it easier to install the upper cover 11. The gap between the upper cover 11 and the lower cover 12 can play a certain role in ventilation and heat dissipation, which improves the heat dissipation efficiency of the heat dissipation patch 100 compared with the upper cover 11 and the lower cover 12 being in complete contact.

[0080] When the power supply 2 is placed inside the body cavity 124, the power supply 2 is fixed by the bracket 8 on the left side and the plug seat 126.

[0081] Additionally, it should be noted that the guide plate 6 has a fixing hole 61 corresponding to the right-side pin seat 126. When installing the guide plate 6, the pin seat 126 is inserted into the fixing hole 61. Furthermore, a snap-fit ​​groove 62 is provided at the end of the guide plate 6 that abuts against the heat dissipation substrate 421. Each snap-fit ​​groove 62 corresponds to a snap fastener 82. When setting the guide plate 6, each snap-fit ​​groove 62 snaps onto the snap fastener 82 to fix the guide plate 6. A fixing post 116 is provided on the lower end face of the upper cover 11 at a position corresponding to the guide plate 6. When the upper cover 11 is closed over the opening, the free end of the fixing post 116 abuts against the upper end face of the guide plate 6 to further fix the position of the guide plate 6.

[0082] Furthermore, a heat exchange groove 15 is provided on the side of the bottom wall 121 facing away from the body cavity 124. The heat dissipation system also includes a heat conduction plate 7 disposed in the heat exchange groove 15. When the heat conduction plate is disposed in the heat exchange groove, at least one end face of the heat conduction plate abuts against the heat exchange plate.

[0083] Furthermore, the heat conduction sheet 7 has several protrusions on the side facing away from the heat exchange groove 15.

[0084] In this embodiment, a heat exchange groove 15 is provided on the side of the bottom wall 121 facing away from the body cavity 124, and the heat exchange groove 15 is recessed towards the body cavity 124. The heat dissipation system also includes a heat conduction plate 7, which is made of a metal material, including but not limited to aluminum, copper, iron, etc. In this embodiment, the heat conduction plate 7 is made of aluminum for description and implementation. The upper end face of the heat conduction plate 7 is in contact with the heat exchange plate 43, and the lower end face of the heat conduction plate 7 is provided with a plurality of protrusions. When the heat dissipation patch 100 is used, the plurality of protrusions on the lower end face of the heat conduction plate 7 form sweat channels to facilitate the user's perspiration, while preventing the heat conduction plate 7 from being completely pressed against the user's forehead to prevent excessive cooling.

[0085] Furthermore, a number of grooves 9 are provided on the wall surface around the mounting port 122; when one end face of the heat conduction plate 7 abuts against the heat exchange plate 43, a portion of the surface of the heat exchange plate 43 that abuts against the heat conduction plate 7 is filled into the groove 9 with silicon-containing thermal paste.

[0086] In this embodiment, refer to the figure. Figure 4 As shown, the mounting port 122 will be described in detail again. Several grooves 9 are provided on the peripheral wall of the mounting port 122. When one side of the heat exchange plate 43 abuts against the heat dissipation body 42, the space between the heat exchange plate 43 and the heat dissipation body 42 is filled with silicon-containing thermal grease, so that the contact between the heat exchange plate 43 and the heat dissipation body 42 can be tight, and the heat conduction can be more efficient. When the heat exchange plate 43 abuts against the heat dissipation body 42, since the silicon-containing thermal grease is fluid, excess silicon-containing thermal grease will flow into the groove due to the squeezing between the heat exchange plate 43 and the heat dissipation body 42. Similarly, when the other side of the heat exchange plate 43 comes into contact with the heat conduction plate 7, the space between the heat exchange plate 43 and the heat conduction plate 7 is also filled with silicon-containing thermal paste, so that the contact between the heat exchange plate 43 and the heat dissipation body 42 can be tighter and the heat conduction can be more efficient. When the heat exchange plate 43 and the heat conduction plate 7 come into contact, since the silicon-containing thermal paste is a fluid, the silicon-containing thermal paste will flow into the groove due to the squeezing between the heat exchange plate 43 and the heat conduction plate 7. It should be noted that the silicon-containing thermal paste described in this embodiment is a fluid capable of heat conduction. Since the heat exchange plate 43 is usually inflexible, while the heat conduction plate 7 is usually designed to conform to the curvature of the forehead in order to increase the contact area with the forehead, the heat conduction plate 7 is usually curved. Therefore, if the heat exchange plate 43 and the heat conduction plate 7 directly come into contact, the contact area is small, resulting in low heat dissipation efficiency for the forehead. However, when the silicon-containing thermal paste is filled between the heat exchange plate 43 and the heat conduction plate 7, the heat conduction contact area between the heat exchange plate 43 and the heat conduction plate 7 is maximized. Compared with not filling with silicon-containing thermal paste, the contact area is increased, thereby increasing the heat dissipation efficiency.

[0087] Furthermore, a number of heat insulation grooves 125 are provided on the bottom wall 121 around the mounting port 122.

[0088] In this embodiment, the lower cover 12 will be described in detail again. Insulation grooves 125 are provided at intervals on the bottom wall 121 around the mounting opening 122 to prevent the heat generated by the power supply 2 and the heat dissipation component 4 from affecting the cooling of the heat exchange plate 43, thereby reducing the impact on the cooling effect of the heat dissipation patch 100. In this embodiment, the insulation grooves 125 provided around the mounting opening 122 prevent the heat generated by the power supply 2 and the heat dissipation component 4 from affecting the heat exchange plate 43, thereby improving the cooling effect of the heat sink.

[0089] Furthermore, on the side of the upper cover 11 facing the body cavity 124, there are light shields 114 on both sides of the flow port on the upper cover 11 along the flow direction of another flow port, and each light shield 114 is intermittently arranged with the flow port on the upper cover 11 to form auxiliary ventilation ports 14 respectively.

[0090] In this embodiment, refer to Figure 3 , Figure 12 As shown, the upper cover 11 will be described in detail again. A light shield 114 is provided on the lower end surface of the upper cover 11, and the two ends of the light shield 114 face left and right respectively. The light shield 114 is intermittently positioned opposite the air inlet 111 to form auxiliary ventilation openings 14. Some air that does not flow out through the main air outlet 13 flows out through the auxiliary ventilation openings 14. In this embodiment, by providing the light shield 114 and the auxiliary ventilation openings 14 on the light shield 114, some air can be discharged through the auxiliary ventilation openings 14, which improves the heat dissipation efficiency of the heat dissipation pad 100 compared to when the auxiliary ventilation openings 14 are not provided. At the same time, the light shield 114 provided on the upper cover 11 can strengthen the structural strength of the upper cover 11, and the structural strength of the upper cover 11 is better than when the light shield 114 is not provided.

[0091] It should be noted that, for reference Figure 10 , Figure 13 , Figure 14 As shown, front, top, and left views of the heat dissipation pad 100 are provided to illustrate its specific external outline. (See also...) Figure 15 , Figure 16 As shown, a schematic diagram of the heat dissipation patch 100 in use is provided. The heat dissipation patch 100 is provided with a strap (not marked) to facilitate placing the heat dissipation patch 100 on the forehead.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation system of a heat dissipation patch, characterized in that, Includes housing, power supply, and heat dissipation components; among which, The housing includes an upper cover and a lower cover; the lower cover includes a bottom wall and a side wall extending upward from the bottom wall, the bottom wall has an installation opening, and the bottom wall and the side wall enclose a body cavity with an opening; the housing has a flow port, the upper cover covers the opening of the body cavity and forms another flow port on one side of the housing, wherein one of the flow ports is used for air intake and the other flow port is used for air exhaust; The heat dissipation assembly includes a heat exchange plate with silicone thermal paste on both ends, a heat dissipation body, and a heat dissipation fan; wherein, the heat exchange plate is fixedly disposed in the mounting port, one end face of the heat dissipation body is connected to the heat exchange plate and located inside the body cavity, the heat dissipation fan is fixedly disposed on the other end face of the heat dissipation body, and there is a gap between the heat dissipation fan and the heat dissipation body, or, the heat dissipation fan is fixedly disposed on one side of the heat dissipation body; The power supply is located inside the housing cavity and at one end away from the air outlet, and the power supply is electrically connected to the cooling fan and the heat exchange plate respectively.

2. The heat dissipation system of the heat dissipation patch of claim 1, wherein, The heat dissipation body includes a heat dissipation substrate and a plurality of spaced lower guide strips protruding from the side of the heat dissipation substrate facing the upper cover, and each of the lower guide strips extends along the flow direction of the flow port for air outlet, and a lower guide groove is formed between adjacent lower guide strips.

3. The heat dissipation system of the heat dissipation patch of claim 2, wherein, The inner side of one of the lower guide bars is interrupted to form an exhaust zone on the heat dissipation body, and the heat dissipation fan is fixedly disposed in the exhaust zone.

4. The heat dissipation system of the heat dissipation patch of claim 3, wherein, The installation port and the exhaust area are in the flow direction of the flow port used for air intake.

5. The heat dissipation system of the heat dissipation patch according to claim 1, wherein, When the cooling fan is located on one side of the heat dissipation body, the cooling fan and the air outlet are located on both ends of the heat dissipation body.

6. The heat dissipation system of the heat dissipation patch as described in claim 3, characterized in that, The protrusion height of each of the lower guide bars is the same, and the protrusion height of each of the lower guide bars is 3mm to 50mm; when the cooling fan is located in the exhaust area, the fan blades of the cooling fan at least partially intersect with the lower guide bars; The spacing between two adjacent lower guide strips is 1mm to 10mm.

7. The heat dissipation system of the heat dissipation patch as described in claim 3, characterized in that, The upper cover has an upper guide strip on the side facing the body cavity, corresponding to each of the lower guide strips, and an upper guide groove is formed between adjacent upper guide strips; When the upper cover is closed on the opening, the upper guide groove and the lower guide groove form a heat dissipation channel.

8. The heat dissipation system of the heat dissipation patch as described in any one of claims 1 to 3, characterized in that, It also includes a partition plate fixedly disposed on the heat dissipation assembly. One end of the partition plate abuts against the bottom wall and extends upward along the direction of the opening. The extension height of the partition plate is greater than the height of the heat dissipation body, thereby separating the heat dissipation assembly from the power supply.

9. The heat dissipation system of the heat dissipation patch as described in claim 8, characterized in that, It also includes a flow guide plate disposed in the cavity of the body, one end of which abuts against the end of the heat dissipation body away from the partition plate, and the other end abuts against the side wall of the lower cover facing the flow port.

10. The heat dissipation system of the heat dissipation patch as described in any one of claims 1 to 3, characterized in that, The bottom wall is provided with a heat exchange groove on the side facing away from the body cavity. The heat dissipation system also includes a heat conduction plate disposed in the heat exchange groove. When the heat conduction plate is disposed in the heat exchange groove, at least one end face of the heat conduction plate abuts against the heat exchange plate.

11. The heat dissipation system of the heat dissipation patch as described in claim 10, characterized in that, The heat conduction sheet has several raised dots on the side facing away from the heat exchange groove.

12. The heat dissipation system of the heat dissipation patch according to claim 10, characterized in that, The wall surface around the mounting port is provided with several grooves; when one end face of the heat conduction sheet abuts against the heat exchange sheet, a portion of the silicon-containing thermal paste on the surface of the heat exchange sheet abutting against the heat conduction sheet is filled into the groove.

13. The heat dissipation system of the heat dissipation patch as described in any one of claims 1 to 3, characterized in that, The bottom wall is provided with several heat insulation grooves around the mounting port.

14. The heat dissipation system of the heat dissipation patch as described in any one of claims 1 to 3, characterized in that, The upper cover has light shields on the side facing the body cavity and on both sides of the flow port on the upper cover along the flow direction of the other flow port. Each light shield is intermittently arranged relative to the flow port on the upper cover to form an auxiliary ventilation port.

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