Thermal management controller

Abstract

The utility model discloses a heat management controller, include: main control chip, first step -down module, first high side drive module, second step -down module and second high side drive module, first step -down module reduces first direct current voltage and exports second direct current voltage, and first high side drive module receives second direct current voltage and provides first load under the control of main control chip, and second step -down module is connected with first step -down module, main control chip and second high side drive module, and second step -down module is used for reducing second direct current voltage and provides third direct current voltage for main control chip and second high side drive module, and second high side drive module provides third direct current voltage for second load under the control of main control chip.The utility model discloses heat management controller has integrated the power supply function of traditional need low voltage battery direct power supply's first load, both convenient for power supply management, also be favorable to reduce heat management system's circuit complexity and reduce system electronic cost.

Description

Technical Field

[0001] This utility model relates to the field of vehicle thermal management technology, and in particular to a thermal management controller. Background Technology

[0002] With the gradual maturation of new energy technologies and vigorous promotion by the government, the market share of new energy vehicles is growing rapidly. Among these developments, thermal management systems are becoming increasingly important to improve the efficiency and safety performance of batteries, motors, and electronic controls in new energy vehicles. Thermal management is a complex system; because different components of a vehicle have different thermal requirements during operation, thermal management controllers are crucial for the rational distribution of heat.

[0003] A complex thermal management system often includes various electronic components such as compressors, PTC (Power Transmitter), electric fans, electric water pumps, temperature sensors, refrigerant temperature and pressure sensors, electronic expansion valves, and multi-way valves. Currently, most electronic expansion valves and multi-way valves on the market are powered directly from low-voltage batteries, and most are only available in 12V models. If a 12V electronic expansion valve or multi-way valve is used in a 24V system, a 24V to 12V step-down circuit module needs to be added to each valve, resulting in lower integration, more complex power management, and higher costs.

[0004] Moreover, with the increasing number of thermal management components and the growing complexity of pipelines, the demand for electronic expansion valves and multi-way valves is increasing, thus requiring more integrated management of the power supply for electronic expansion valves and multi-way valves. Utility Model Content

[0005] The purpose of this invention is to provide a thermal management controller that can integrate the power supply function of loads that traditionally require direct power supply from low-voltage batteries, which facilitates power supply management and helps reduce system electronic costs.

[0006] To achieve the above objectives, this utility model provides a thermal management controller, including: a main control chip, a first buck module, a first high-side drive module, a second buck module, and a second high-side drive module. The first buck module is used to reduce the input first DC voltage to a second DC voltage output. The first buck module is connected to the first high-side drive module, which is connected to the main control chip and a first load. The first high-side drive module receives the second DC voltage output by the first buck module and provides the second DC voltage to the first load under the control of the main control chip. The second buck module is connected to the first buck module, the main control chip, and the second high-side drive module. The second buck module is used to receive the second DC voltage output by the first buck module and reduce the second DC voltage to a third DC voltage, which is provided to the main control chip and the second high-side drive module. The second high-side drive module is connected to the main control chip and a second load, and provides the third DC voltage to the second load under the control of the main control chip.

[0007] Optionally, the first step-down module is a BUCK step-down module, and the second step-down module is a low-dropout linear regulator.

[0008] Optionally, the first DC voltage is 24V, the second DC voltage is 12V, and the third DC voltage is 5V.

[0009] Optionally, the first load includes at least one of an electronic expansion valve, a multi-way valve, a solenoid valve, a thermistor, and a compressor.

[0010] Optionally, the second load includes a pressure sensor.

[0011] Optionally, the first buck module includes a BUCK buck chip, which includes a BOOT pin, an input voltage pin, an enable pin, an RT / SYNC pin, a feedback pin, a voltage indicator pin, a ground pin, and a switching node pin. The input voltage pin is connected to the negative terminal of a reverse polarity protection diode, the positive terminal of which is connected to an external voltage terminal to access the first DC voltage. An enable current-limiting resistor is connected between the negative terminal of the reverse polarity protection diode and the enable pin. A TVS diode and a frequency adjustment resistor are connected between the external voltage terminal and the RT / SYNC pin. The first terminal is connected to the positive terminal of the TVS diode and grounded. The second terminal of the frequency adjustment resistor is connected to the RT / SYNC pin. An input filter capacitor is connected between the reverse connection protection diode and ground. The switching node pin is connected to the first terminal of the energy storage inductor and a freewheeling diode is connected between it and ground. A first feedback resistor and a second feedback resistor are connected in series between the second terminal of the energy storage inductor and ground. An output filter capacitor is also connected between the second terminal of the energy storage inductor and ground. The feedback pin is connected between the first feedback resistor and the second feedback resistor. A startup capacitor is connected between the BOOT pin and the switching node pin. The grounding pin is grounded.

[0012] Optionally, the main control chip receives a first load feedback signal from the first high-side drive module and determines whether to output a corresponding first high-level control signal to the first high-side drive module based on the first load feedback signal. After detecting the first high-level control signal, the first high-side drive module outputs the second DC voltage to the corresponding first load. The main control chip receives a second load feedback signal from the second high-side drive module and determines whether to output a corresponding second high-level control signal to the second high-side drive module based on the second load feedback signal. After detecting the second high-level control signal, the second high-side drive module outputs the third DC voltage to the corresponding second load.

[0013] Optionally, the first high-side drive module includes a high-side drive chip. The high-side drive chip includes multiple input pins, multiple output pins, multiple load feedback pins, multiple high-side drive control pins, a current limiting pin, a ground pin, and a high-side drive enable pin. The multiple input pins are respectively used to connect to the second DC voltage, and the multiple output pins are respectively used to output the second DC voltage to each of the first loads. Each output pin is respectively connected to the positive terminal of a corresponding diode and grounded through the diode. The multiple load feedback pins are respectively used to output load feedback signals to the main control chip. The multiple high-side drive control pins are respectively used to receive control signals from the main control chip so that the high-side drive chip outputs the second DC voltage to the corresponding first load under the control of the control signal. The current limiting pin is grounded through a current limiting resistor, and the maximum current of the high-side drive chip is adjusted by adjusting the resistance value of the current limiting resistor. The ground pin is grounded, and the high-side drive enable pin is connected to the main control chip to receive an enable signal.

[0014] Optionally, the main control chip is connected to multiple real-time data detection modules. These modules are used to detect at least some of the real-time data, including DC-DC water temperature, battery inlet temperature, battery outlet temperature, high-pressure refrigerant pressure, low-pressure refrigerant pressure, and coolant level. The main control chip controls the operation of at least a portion of the load based on the real-time data provided by the real-time data detection modules.

[0015] Optionally, the main control chip is connected to a first CAN communication module, and the main control chip connects to the compressor and the thermistor, which serve as the first load, through the first CAN communication module to control the operation of the compressor and the thermistor; and / or,

[0016] The main control chip is connected to a second CAN communication module, and the main control chip communicates and interacts with the overall controller through the second CAN communication module; and / or,

[0017] The main control chip is connected to a LIN communication module, and the main control chip controls the operation of the multi-way valve and the electronic expansion valve, which serve as the first load, through the LIN communication module; and / or,

[0018] The main control chip is connected to a fan PWM conversion module and a water pump PWM conversion module. The fan PWM conversion module is used to generate a fan PWM drive signal based on the PWM signal from the main control chip and output it to the fan. The water pump PWM conversion module is used to generate a water pump PWM drive signal based on the PWM signal from the main control chip and output it to the water pump.

[0019] In this embodiment of the invention, the thermal management controller includes a first buck module, a first high-side drive module, a second buck module, and a second high-side drive module. The first buck module reduces a first DC voltage to a second DC voltage and outputs it to the second buck module and the first high-side drive module, respectively. The second buck module reduces the second DC voltage to a third DC voltage and outputs it to the main control chip and the second high-side drive module, respectively. Thus, the thermal management controller of this embodiment can power the second load through the second high-side drive module, and also power the first load using the additional first buck module and the second high-side drive module. In other words, the thermal management controller of this embodiment integrates the power supply function of the first load that traditionally requires direct power supply from a low-voltage battery. This facilitates power supply management and also helps to reduce the circuit complexity of the thermal management system and reduce the electronic cost of the system. Attached Figure Description

[0020] Figure 1 This is a schematic block diagram of the thermal management controller according to an embodiment of the present invention.

[0021] Figure 2 This is a circuit diagram of the first step-down module in an embodiment of the present invention.

[0022] Figure 3 This is a circuit diagram of the first high-side driving module in an embodiment of this utility model. Detailed Implementation

[0023] To explain in detail the technical content, structural features, and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0024] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0025] Please see Figures 1 to 3 This utility model discloses a thermal management controller.

[0026] The thermal management controller includes: a main control chip 1, a first buck module 2, a first high-side drive module 3, a second buck module 4, and a second high-side drive module 5. The first buck module 2 is used to reduce the input first DC voltage to a second DC voltage output. The first buck module 2 is connected to the first high-side drive module 3. The first high-side drive module 3 is connected to the main control chip 1 and a first load (not shown). The first high-side drive module 3 receives the second DC voltage output by the first buck module 2 and provides the second DC voltage to the first load under the control of the main control chip 1. The second buck module 4 is connected to the first buck module 2, the main control chip 1, and the second high-side drive module 5. The second buck module 4 is used to receive the second DC voltage output by the first buck module 2 and reduce the second DC voltage to a third DC voltage to provide to the main control chip 1 and the second high-side drive module 5. The second high-side drive module 5 is connected to the main control chip 1 and the second load (not shown). The second high-side drive module 5 provides the third DC voltage to the second load under the control of the main control chip 1.

[0027] In this embodiment of the present invention, the thermal management controller includes a first buck module 2, a first high-side drive module 3, a second buck module 4, and a second high-side drive module 5. The first buck module 2 reduces the first DC voltage to a second DC voltage and outputs it to the second buck module 4 and the first high-side drive module 3, respectively. The second buck module 4 reduces the second DC voltage to a third DC voltage and outputs it to the main control chip 1 and the second high-side drive module 5, respectively. Thus, the thermal management controller of this embodiment of the present invention can power the second load through the second high-side drive module 5, and can also power the first load using the additional first buck module 2 and the second high-side drive module 5. That is, the thermal management controller of this embodiment of the present invention integrates the power supply function of the first load that traditionally requires direct power supply from a low-voltage battery, which facilitates power supply management and also helps to reduce the circuit complexity of the thermal management system and reduce the electronic cost of the system.

[0028] In some embodiments, the first DC voltage is 24V, the second DC voltage is 12V, and the third DC voltage is 5V. That is, this embodiment integrates a 24V to 12V step-down module into a thermal management controller, which can then power and manage 12V loads.

[0029] Specifically, the first load includes at least one of an electronic expansion valve, a multi-way valve, a solenoid valve, a thermistor (PTC), and a compressor.

[0030] In a specific example, the first load includes an electronic expansion valve, a multi-way valve, a solenoid valve, a thermistor, and a compressor.

[0031] Of course, in different embodiments, the values ​​of the first DC voltage, the second DC voltage, and the third DC voltage are not specifically limited. Furthermore, in different embodiments, the electronic expansion valve, multi-way valve, solenoid valve, thermistor, and compressor are not limited to being powered by a 12V voltage.

[0032] In some embodiments, the second load includes a pressure sensor.

[0033] Specifically, the pressure sensor is powered by a 5V voltage, but it is not limited to this.

[0034] In some embodiments, the first step-down module 2 is a BUCK step-down module, and the second step-down module 4 is a low-dropout linear regulator (LDO). Of course, this is not a limitation.

[0035] In some embodiments, the first buck module 2 includes a BUCK buck chip U1. The BUCK buck chip U1 includes a BOOT pin, an input voltage pin VIN, an enable pin EN (the BUCK buck chip U1 starts working when set to a high level), an RT / SYNC pin (switching frequency configuration / external clock synchronization pin), a feedback pin FB, a voltage indicator pin PGOOD (used to determine whether the set output voltage has been stably reached), a ground pin GND, and a switch node pin SW. The input voltage pin VIN is connected to the negative terminal of the reverse polarity protection diode D1. The positive terminal of the reverse polarity protection diode D1 is connected to an external voltage terminal to access a first DC voltage. An enable current limiting resistor R1 is connected between the negative terminal of the reverse polarity protection diode D1 and the enable pin EN. A TVS diode D2 and a frequency adjustment resistor R2 are connected between the external voltage terminal and the RT / SYNC pin. The first terminal of the frequency adjustment resistor R2 is connected to the anode of the TVS diode D2 and grounded, while the second terminal is connected to the RT / SYNC pin. Since the RT / SYNC pin is grounded through the frequency adjustment resistor R2, the operating frequency of the BUCK switch can be adjusted by changing the resistance of R2. The TVS diode D2 is used for surge and ESD protection at the port. An input filter capacitor C1 is connected between the reverse polarity protection diode D1 and ground. The switching node pin SW is connected to the first terminal of the energy storage inductor L1 and a freewheeling diode D3 is connected between it and ground. The second terminal of the energy storage inductor L1 is connected in series with the first feedback resistor R3 and the second feedback resistor R4 (the resistance values ​​of both resistors are adjustable to adjust the output voltage). The second terminal of the energy storage inductor L1 is also connected to the ground with the output filter capacitor C3. The feedback pin FB is connected between the first feedback resistor R3 and the second feedback resistor R4. The startup capacitor C2 (the startup capacitor of the high-side MOSFET) is connected between the BOOT pin and the switching node pin SW. The ground pin GND is grounded.

[0036] In the circuit described above, the freewheeling diode D3 provides a path for the freewheeling current of the energy storage inductor L1, preventing the back electromotive force from damaging the switching transistor. Specifically:

[0037] The core of the Boost circuit is the inductor's energy storage and release, and the working process is divided into two stages:

[0038] During the switching transistor conduction phase (the internal NMOS transistor of the BUCK buck chip U1 is turned on): the switching node pin SW is grounded, and the current flows from the input terminal VBAT (24V) through the reverse polarity protection diode D1, the input voltage pin VIN (powering the chip), the energy storage inductor L1, the switching node pin SW, and the switching transistor to ground. At this time, the energy storage inductor L1 stores magnetic field energy (the current increases linearly), and the freewheeling diode D3 is reverse cut off (its anode voltage, the voltage of the switching node pin SW, and the ground voltage are equal, and its cathode voltage is equal to VDD, specifically 12V, with the anode voltage < the cathode voltage).

[0039] During the switch-off phase (the internal NMOS transistor of the BUCK buck chip U1 is turned off): The current in the energy storage inductor L1 cannot change abruptly (Lenz's law), resulting in a reverse electromotive force (EMF) across the energy storage inductor L1 (i.e., the voltage at the switch node pin SW rises sharply, much higher than VDD). At this time, the freewheeling diode D3 is forward-biased (its anode voltage is equal to the voltage at the switch node pin SW, and its cathode voltage is equal to VDD, with anode voltage > cathode voltage), providing a freewheeling path for the energy storage inductor L1, preventing the reverse EMF from damaging the switch, and transferring the inductor energy to the output terminal to maintain a stable VDD = 12V.

[0040] The BUCK step-down chip U1 can be implemented based on existing chips. Furthermore, the first step-down module 2 is not limited to the specific implementation described above.

[0041] Specifically, the first step-down module 2 in the above specific embodiment can convert 24V voltage to 12V voltage.

[0042] In some embodiments, the main control chip 1 receives the first load feedback signal from the first high-side drive module 3 and determines whether to output the corresponding first high-level control signal to the first high-side drive module 3 based on the first load feedback signal. After detecting the first high-level control signal, the first high-side drive module 3 outputs the second DC voltage to the corresponding first load.

[0043] Specifically, the first load feedback signal includes at least a portion of the compressor low-pressure load feedback signal, the thermistor low-pressure load feedback signal, the multi-way valve load feedback signal, the electronic expansion valve load feedback signal, and the solenoid valve load feedback signal. Of course, it is not limited to this.

[0044] Specifically, the first high-level control signal includes at least a portion of the compressor low-pressure power supply drive control signal, the thermistor low-pressure power supply drive control signal, the multi-way valve power supply drive control signal, the electronic expansion valve power supply drive control signal, and the solenoid valve power supply drive control signal. However, this is not a limitation.

[0045] Specifically, the first high-side drive module 3 includes a high-side drive chip U3. The high-side drive chip U3 includes multiple input pins VS, multiple output pins OUT1, OUT2, OUT3, OUT4, multiple load feedback pins ST1, ST2, ST3, ST4, multiple high-side drive control pins IN1, IN2, IN3, IN4, a current limiting pin CL, a ground pin GND, and a high-side drive enable pin DIAG_EN. The multiple input pins VS are used to connect to a second DC voltage, and the multiple output pins OUT1, OUT2, OUT3, OUT4 are used to output the second DC voltage to each of the first loads. Each output pin OUT1, OUT2, OUT3, OUT4 is connected to the first load. The positive terminals of diodes D4, D5, D6, and D7 are grounded through diodes D4, D5, D6, and D7. Multiple load feedback pins ST1, ST2, ST3, and ST4 are used to output load feedback signals to the main control chip 1. Multiple high-side drive control pins IN1, IN2, IN3, and IN4 are used to receive control signals from the main control chip 1 so that the high-side drive chip U3 outputs a second DC voltage to the corresponding first load under the control of the control signal. The current limiting pin CL is grounded through the current limiting resistor R5. The maximum current of the high-side drive chip U3 is adjusted by adjusting the resistance value of the current limiting resistor R5. The grounding pin GND is grounded. The high-side drive enable pin DIAG_EN is connected to the main control chip 1 to receive the enable signal.

[0046] Specifically, the high-side drive chip U3 only outputs the second DC voltage to the corresponding first load when the high-side drive control signal is high. If it is not necessary to power the back-end load, simply set the high-side drive control signal low, thereby disconnecting the power supply to the corresponding module. For example, when the compressor low-voltage power supply drive control signal is high, the high-side drive chip U3 outputs the second DC voltage to the compressor. If it is not necessary to provide low-voltage power to the compressor, simply set the compressor low-voltage power supply drive control signal low.

[0047] In a specific example, multiple input pins VS are connected to a 12V voltage, and multiple output pins OUT1, OUT2, OUT3, and OUT4 output the 12V voltage to the compressor, thermistor, electronic expansion valve, multi-way valve, etc. Multiple load feedback pins ST1, ST2, ST3, and ST4 output the compressor low-pressure load feedback signal, thermistor low-pressure load feedback signal, multi-way valve load feedback signal, and electronic expansion valve load feedback signal to the main control chip 1, respectively. Multiple high-side drive control pins IN1, IN2, IN3, and IN4 receive the compressor low-pressure power supply drive control signal, thermistor low-pressure power supply drive control signal, multi-way valve power supply drive control signal, and electronic expansion valve power supply drive control signal from the main control chip 1, respectively.

[0048] Specifically, the high-side driver chip U3 also includes a THER (temperature protection) pin and an NC (no) pin. The THER (temperature protection) pin is grounded.

[0049] In some embodiments, the main control chip 1 receives the second load feedback signal from the second high-side drive module 5 and determines whether to output the corresponding second high-level control signal to the second high-side drive module 5 based on the second load feedback signal. After detecting the second high-level control signal, the second high-side drive module 5 outputs the third DC voltage to the corresponding second load.

[0050] Specifically, the second load feedback signal includes the pressure sensor load feedback signal. Of course, it is not limited to this.

[0051] Specifically, the second high-level control signal includes the pressure sensor power supply drive control signal. Of course, it is not limited to this.

[0052] The second high-side drive module 5 can adopt existing solutions from existing thermal management controllers, which will not be elaborated here. Of course, it is not limited to this.

[0053] In some embodiments, the main control chip 1 is connected to multiple real-time data detection modules. These modules detect at least some of the real-time data, including DC-DC water temperature, battery inlet temperature, battery outlet temperature, high-pressure refrigerant pressure, low-pressure refrigerant pressure, and coolant level. The main control chip 1 controls the operation of at least a portion of the load based on the real-time data provided by the detection modules. This achieves real-time monitoring and real-time control based on the monitoring results.

[0054] Specifically, the results detected by the real-time data detection module are converted from analog to digital and then output to the main control chip 1.

[0055] In a specific example, the real-time data detection module includes a DC-DC water temperature detection module 61, a battery inlet water temperature detection module 62, a battery outlet water temperature detection module 63, a high-pressure refrigerant pressure detection module 64, a low-pressure refrigerant pressure detection module 65, and a coolant level detection module 66.

[0056] Specifically, the main control chip 1 is connected to a first CAN communication module. The main control chip 1 connects to the compressor and thermistor, which serve as the first load, through the first CAN communication module to control the operation of the compressor and thermistor, thereby realizing the cooling and heating functions. The first CAN communication module includes a CAN chip 71 and a CAN transceiver module 72.

[0057] Specifically, the main control chip 1 is connected to a second CAN communication module, through which the main control chip 1 communicates and interacts with the overall controller (VCU, not shown). The second CAN communication module includes a CAN chip 73 and a CAN transceiver module 74.

[0058] Specifically, the main control chip 1 is connected to a LIN communication module. The main control chip 1 controls the operation of the multi-way valve and the electronic expansion valve, which serve as the primary load, through the LIN communication module to achieve switching between different water circuits. The LIN communication module 8 includes a LIN chip 81 and a LIN transceiver module 82.

[0059] Specifically, the main control chip 1 is connected to fan PWM conversion modules 91 and 92 and water pump PWM conversion modules 93 and 94. Fan PWM conversion modules 91 and 92 are used to generate fan PWM drive signals based on the PWM signals from the main control chip 1 and output them to the fan (not shown in the figure). Water pump PWM conversion modules 93 and 94 are used to generate water pump PWM drive signals based on the PWM signals from the main control chip 1 and output them to the water pump (not shown in the figure). This achieves control of the fan and its speed.

[0060] To better understand this utility model, the power supply process of the thermal management controller in the example is described below:

[0061] When powered on, the first step-down module 2 starts working, converting the 24V vehicle low-voltage electricity to 12V low-voltage electricity. The second step-down module 4 converts the 12V low-voltage electricity to 5V low-voltage electricity. The main control chip 1 starts working after being connected to the 5V low-voltage electricity.

[0062] After confirming that there are no abnormal high-level signals output by the load feedback of the first high-side drive module 3 and the second high-side drive module 5, the main control chip 1 outputs a first high-level control signal to the first high-side drive module 3 and a second high-level control signal to the second high-side drive module 5. Upon detecting the high-level signal output by the main control chip 1, the first high-side drive module 3 begins normal operation, outputting 12V power to the downstream thermistor, compressor, electronic expansion valve, multi-way valve, and other first loads. Upon detecting the high-level signal output by the main control chip 1, the second high-side drive module 5 outputs 5V power to the downstream pressure sensor.

[0063] The above-disclosed examples are merely preferred embodiments of the present utility model, intended to facilitate understanding and implementation by those skilled in the art. They should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model are still within the scope of the present utility model.

Claims

1. A thermal management controller, characterized in that, include: Main control chip, first buck module, first high-side driver module, second buck module and second high-side driver module; The first step-down module is used to reduce the input first DC voltage to a second DC voltage output. The first step-down module is connected to the first high-side drive module, the first high-side drive module is connected to the main control chip and the first load, and the first high-side drive module receives the second DC voltage output by the first step-down module and provides the second DC voltage to the first load under the control of the main control chip; The second step-down module is connected to the first step-down module, the main control chip, and the second high-side drive module. The second step-down module is used to receive the second DC voltage output by the first step-down module and reduce the second DC voltage to a third DC voltage to provide to the main control chip and the second high-side drive module. The second high-side drive module is connected to the main control chip and the second load. Under the control of the main control chip, the second high-side drive module provides the third DC voltage to the second load.

2. The thermal management controller as described in claim 1, characterized in that, The first step-down module is a BUCK step-down module, and the second step-down module is a low-dropout linear regulator.

3. The thermal management controller as described in claim 1 or 2, characterized in that, The first DC voltage is 24V, the second DC voltage is 12V, and the third DC voltage is 5V.

4. The thermal management controller as described in claim 1, characterized in that, The first load includes at least one of an electronic expansion valve, a multi-way valve, a solenoid valve, a thermistor, and a compressor.

5. The thermal management controller as described in claim 1, characterized in that, The second load includes a pressure sensor.

6. The thermal management controller as described in claim 1, characterized in that, The first buck module includes a BUCK buck chip, which includes a BOOT pin, an input voltage pin, an enable pin, an RT / SYNC pin, a feedback pin, a voltage indicator pin, a ground pin, and a switching node pin. The input voltage pin is connected to the negative terminal of a reverse polarity protection diode, and the positive terminal of the reverse polarity protection diode is connected to an external voltage terminal to receive the first DC voltage. An enable current-limiting resistor is connected between the negative terminal of the reverse polarity protection diode and the enable pin. A TVS diode and a frequency adjustment resistor are connected between the external voltage terminal and the RT / SYNC pin. The frequency adjustment resistor... One end of the resistor is connected to the positive terminal of the TVS diode and grounded. The second end of the frequency adjustment resistor is connected to the RT / SYNC pin. An input filter capacitor is connected between the reverse connection protection diode and ground. The switching node pin is connected to the first end of the energy storage inductor and a freewheeling diode is connected between it and ground. A first feedback resistor and a second feedback resistor are connected in series between the second end of the energy storage inductor and ground. An output filter capacitor is also connected between the second end of the energy storage inductor and ground. The feedback pin is connected between the first feedback resistor and the second feedback resistor. A startup capacitor is connected between the BOOT pin and the switching node pin. The grounding pin is grounded.

7. The thermal management controller as described in claim 1, characterized in that, The main control chip receives a first load feedback signal from the first high-side drive module and determines whether to output a corresponding first high-level control signal to the first high-side drive module based on the first load feedback signal. After detecting the first high-level control signal, the first high-side drive module outputs the second DC voltage to the corresponding first load. The main control chip receives a second load feedback signal from the second high-side drive module and determines whether to output a corresponding second high-level control signal to the second high-side drive module based on the second load feedback signal. After detecting the second high-level control signal, the second high-side drive module outputs the third DC voltage to the corresponding second load.

8. The thermal management controller as described in claim 7, characterized in that, The first high-side drive module includes a high-side drive chip, which includes multiple input pins, multiple output pins, multiple load feedback pins, multiple high-side drive control pins, a current limiting pin, a ground pin, and a high-side drive enable pin. The multiple input pins are respectively used to connect to the second DC voltage, and the multiple output pins are respectively used to output the second DC voltage to each of the first loads. Each output pin is connected to the anode of a corresponding diode and grounded through the diode. The multiple load feedback pins are respectively used to output load feedback signals to the main control chip. The multiple high-side drive control pins are respectively used to receive control signals from the main control chip so that the high-side drive chip outputs the second DC voltage to the corresponding first load under the control of the control signals. The current limiting pin is grounded through a current-limiting resistor, and the maximum current of the high-side drive chip is adjusted by adjusting the resistance value of the current-limiting resistor. The ground pin is grounded, and the high-side drive enable pin is connected to the main control chip to receive an enable signal.

9. The thermal management controller as described in claim 1, characterized in that, The main control chip is connected to multiple real-time data detection modules. These modules are used to detect at least some of the real-time data, including DC-DC water temperature, battery inlet temperature, battery outlet temperature, high-pressure refrigerant pressure, low-pressure refrigerant pressure, and coolant level. The main control chip controls the operation of at least a portion of the load based on the real-time data provided by the real-time data detection modules.

10. The thermal management controller as described in claim 9, characterized in that, The main control chip is connected to a first CAN communication module, and the main control chip connects to the compressor and the thermistor, which serve as the first load, through the first CAN communication module to control the operation of the compressor and the thermistor; and / or, The main control chip is connected to a second CAN communication module, and the main control chip communicates and interacts with the overall controller through the second CAN communication module; and / or, The main control chip is connected to a LIN communication module, and the main control chip controls the operation of the multi-way valve and the electronic expansion valve, which serve as the first load, through the LIN communication module; and / or, The main control chip is connected to a fan PWM conversion module and a water pump PWM conversion module. The fan PWM conversion module is used to generate a fan PWM drive signal based on the PWM signal from the main control chip and output it to the fan. The water pump PWM conversion module is used to generate a water pump PWM drive signal based on the PWM signal from the main control chip and output it to the water pump.

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