A high-power semiconductor device press-mounting device

Abstract

The utility model discloses a kind of high-power semiconductor devices press-fitting device, it is related to semiconductor device press-fitting technical field, including operation platform, the top of operation platform is fixedly connected with support frame, still include clamping assembly, rotating assembly and lifting assembly, clamping assembly includes substrate and clamping plate, clamping plate is symmetrically provided with two and respectively set in the two sides of substrate top end, the middle part of substrate is equipped with first sliding slot, the side of substrate is fixedly connected with driving motor, the utility model is fixedly connected with multiple additional holding components by setting rotating disc, the four corners of rotating disc top end, multiple high-power semiconductor devices can be fixedly clamped, so that multiple rotating disc can make the placement and press-fitting work of device simultaneously, effectively improve the efficiency of work, simultaneously thereby effectively can high-power semiconductor device be placed at its top end, and fixedly clamped work is carried out to it, effectively guarantee the stability of semiconductor device placement, improve subsequent press-fitting effect.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device press-fit technology, and in particular to a high-power semiconductor device press-fit device. Background Technology

[0002] High-power semiconductor devices are core components of power electronic systems, primarily used for controlling, converting, and regulating high-voltage, high-current electrical energy. They play a crucial role in modern industry, new energy, transportation, and power grids. The purpose of press-fitting high-power semiconductor devices is to ensure high reliability and stability of the devices under harsh operating conditions. High-power semiconductor devices are typically composed of multiple layers of different materials, such as chips, substrates, and heat sinks. The press-fitting process enables these materials to form a tight mechanical bond, significantly improving the bonding strength. This helps prevent the devices from detaching or delaminating under harsh conditions such as high voltage, high current, and high temperature, thereby ensuring the structural integrity of the devices.

[0003] Utility model patent with patent number 202322884615.2 discloses a high-power semiconductor device pressing device, including a base and a bracket. The bracket is disposed on one side of the base, and a connecting frame is fixedly installed on the bracket. A hydraulic cylinder is disposed on the top surface of the connecting frame. Multiple sets of sliding rods are fixedly installed inside the connecting frame, and pressing plates are slidably installed on the multiple sets of sliding rods. A turntable is disposed on the base, and multiple sets of slots are formed around the edges of the turntable. Workpiece conveying components for carrying and conveying semiconductor devices are disposed in the slots around the turntable.

[0004] However, the aforementioned device still has some drawbacks in actual use. The most obvious one is that during the press-fitting process of the high-power semiconductor device, it cannot effectively fix and clamp the semiconductor device during transportation, which can easily lead to the semiconductor device shifting during transportation. In the subsequent press-fitting process, misalignment of the contact surface between the semiconductor device and the press-fitting plate can easily occur, resulting in uneven force on the semiconductor device, causing press-fitting problems, damage to the semiconductor device, reduced reliability, and affecting the quality of the finished semiconductor device. At the same time, the existing clamping components cannot adjust the actual press-fitting height of the semiconductor according to the size and height of the semiconductor. As a result, when pressing some smaller semiconductor devices, the semiconductor device is placed inside the clamping components and cannot be fully exposed, affecting the subsequent press-fitting work.

[0005] Therefore, it is necessary to invent a high-power semiconductor device press-fitting device to solve the above problems. Utility Model Content

[0006] The purpose of this invention is to provide a high-power semiconductor device press-fitting device to solve the problems mentioned in the background art, which easily lead to misalignment of the contact surface between the semiconductor device and the press-fitting plate, resulting in uneven force on the semiconductor device, causing press-fitting problems, damage to the semiconductor device, reduced reliability, and affecting the quality of the finished semiconductor device.

[0007] According to one aspect of this disclosure, the following technical solution is provided: a high-power semiconductor device press-fit apparatus, comprising:

[0008] The operating table has a support frame, a clamping assembly, a rotating assembly, and a lifting assembly fixedly connected to its top.

[0009] The clamping assembly includes a base plate and clamping plates. Two clamping plates are symmetrically arranged and are respectively located on both sides of the top of the base plate. A first sliding groove is formed in the middle of the base plate, and a drive motor is fixedly connected to the side of the base plate.

[0010] The bottom end of the clamping plate is fixedly connected to a sliding plate, and the output end of the drive motor is driven by a bidirectional lead screw. The middle part of the sliding plate has a threaded hole corresponding to the bidirectional lead screw. The bidirectional lead screw is threadedly connected to the threaded hole inside the sliding plate. The bidirectional lead screw is rotatably connected to the first slide groove, and the sliding plate is slidably connected to the first slide groove.

[0011] As a preferred embodiment, the lifting assembly includes a support plate, which is slidably disposed on the side of the clamping plate. A support plate is provided on each side of the clamping plate on both sides. A connecting rod is fixedly connected to the end of the support plate. A second sliding groove is provided in the middle of the clamping plate, and the connecting rod is slidably connected in the second sliding groove.

[0012] As a preferred embodiment, a lever plate is fixedly connected to the end of the connecting rod, the lever plate is slidably connected to the side of the clamping plate, and a fixing pin is provided on both sides of the lever plate. An insertion hole is provided on both sides of the second slide groove, and the insertion hole is correspondingly provided with the fixing pin.

[0013] As a preferred embodiment, the rotating assembly includes a rotating disk, which is rotatably mounted on the top of the operating table, and the base plate is provided with four evenly fixedly connected to the four corners of the top of the rotating disk.

[0014] As a preferred embodiment, a servo motor is provided at the bottom of the operating platform, and a first mounting plate is fixedly connected to the top of the servo motor. The first mounting plate is fixedly connected to the bottom of the operating platform by bolts, and a second mounting plate is fixedly connected to the output end of the servo motor. The second mounting plate is fixedly connected to the bottom of the rotating disk by bolts.

[0015] As a preferred embodiment, a cylinder is fixedly connected to the top of the support frame, and a pressure plate is fixedly connected to the output end of the cylinder, with the pressure plate positioned above the base plate.

[0016] The technical effects and advantages of this utility model are as follows:

[0017] 1. This utility model sets up a rotating disk, with multiple clamping components fixedly connected to the four corners of the top of the rotating disk to fix and hold high-power semiconductor devices. This allows multiple rotating disks to simultaneously perform the placement and pressing of devices, effectively improving work efficiency. At the same time, it can effectively place high-power semiconductor devices on the top and fix and hold them, effectively ensuring the stability of the semiconductor device placement and improving the subsequent pressing effect.

[0018] 2. This utility model provides a support plate at the top of the substrate. The height of the support plate is adjustable. The height of the semiconductor device can be adjusted according to its size and height, so that the semiconductor device can be completely placed above the clamping assembly. This allows the pressure plate on top to fully contact the semiconductor device during the pressure process without obstructing the pressure process due to the clamping plate, thus effectively improving the pressure effect. Attached Figure Description

[0019] The accompanying drawings illustrate exemplary embodiments of the present disclosure and, together with the description thereof, serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0020] Figure 1 This is a schematic diagram of the overall structure of a high-power semiconductor device press-fitting apparatus according to one embodiment of the present disclosure.

[0021] Figure 2 This is a schematic diagram of the main structure of a rotating disk and a servo motor in a high-power semiconductor device pressing apparatus according to one embodiment of the present disclosure.

[0022] Figure 3 This is a schematic diagram of the main structure of a substrate in a high-power semiconductor device press-fitting apparatus according to one embodiment of the present disclosure.

[0023] Figure 4 This is a schematic diagram of the main structure of a drive motor and a bidirectional lead screw in a high-power semiconductor device press-fitting apparatus according to one embodiment of the present disclosure.

[0024] Figure 5 This is a schematic diagram of the main structure of the pressure plate in a high-power semiconductor device pressure fitting apparatus according to one embodiment of the present disclosure.

[0025] In the picture:

[0026] 1. Control panel; 11. Support frame;

[0027] 2. Rotate the disc;

[0028] 3. Cylinder; 31. Press plate;

[0029] 4. Substrate; 41. First groove;

[0030] 5. Clamping plate; 51. Second slide groove; 52. Slide plate; 53. Insertion hole;

[0031] 6. Bearing plate; 61. Connecting rod; 62. Pulley;

[0032] 7. Drive motor; 71. Double-acting lead screw;

[0033] 8. Fixing pin;

[0034] 9. Servo motor; 91. First mounting plate; 92. Second mounting plate. Detailed Implementation

[0035] like Figures 1-5 As shown, this disclosure discloses a high-power semiconductor device press-fitting apparatus, comprising:

[0036] The control panel 1 has a support frame 11 fixedly connected to its top end, and also includes a clamping assembly, a rotating assembly, and a lifting assembly.

[0037] The clamping assembly includes a base plate 4 and a clamping plate 5. Two clamping plates 5 are symmetrically arranged and are respectively located on both sides of the top of the base plate 4. A first sliding groove 41 is opened in the middle of the base plate 4, and a drive motor 7 is fixedly connected to the side of the base plate 4.

[0038] The bottom end of the clamping plate 5 is fixedly connected to the slide plate 52, and the output end of the drive motor 7 is connected to the bidirectional lead screw 71. The middle part of the slide plate 52 is provided with a threaded hole corresponding to the bidirectional lead screw 71. The bidirectional lead screw 71 is threadedly connected to the threaded hole provided inside the slide plate 52. The bidirectional lead screw 71 is rotatably connected to the first slide groove 41 and the slide plate 52 is slidably connected to the first slide groove 41.

[0039] Specifically, by setting clamping plates 5, two clamping plates 5 are symmetrically arranged. After placing the semiconductor device between the two clamping plates 5, the semiconductor device can be fixed and clamped by the movement of the two clamping plates 5. By setting a drive motor 7, the drive motor 7 can drive the bidirectional lead screw 71 to rotate. The outer threads of the two ends of the bidirectional lead screw 71 are set in opposite directions. The sliding plates 52 fixed at the bottom of the two clamping plates 5 are respectively threaded to the two ends of the bidirectional lead screw 71. Thus, when the bidirectional lead screw 71 rotates, it can effectively drive the sliding plates 52 on both sides to move in the same or opposite directions, which facilitates the fixed clamping of the semiconductor device. At the same time, it can be quickly released to facilitate subsequent pressing work. It is also convenient to quickly remove and place new semiconductor devices for fixing work.

[0040] like Figure 3 As shown, in a preferred embodiment, the lifting assembly includes a support plate 6, which is slidably disposed on the side of the clamping plate 5. A support plate 6 is provided on the corresponding side of both clamping plates 5. A connecting rod 61 is fixedly connected to the end of the support plate 6. A second sliding groove 51 is provided in the middle of the clamping plate 5, and the connecting rod 61 is slidably connected in the second sliding groove 51.

[0041] Specifically, by setting up the carrier plate 6, it is easy to place the semiconductor device on top of the carrier plate 6. At the same time, the height of the carrier plate 6 can be adjusted so that the semiconductor device placed on the carrier plate 6 is completely higher than the clamping plate 5, which facilitates the subsequent pressing work.

[0042] like Figure 3 As shown in this disclosure, the end of the connecting rod 61 is fixedly connected to a lever plate 62, the lever plate 62 is slidably connected to the side of the clamping plate 5, and both sides of the lever plate 62 are provided with fixing pins 8. Both sides of the second slide groove 51 are provided with insertion holes 53, and the insertion holes 53 are corresponding to the fixing pins 8.

[0043] Specifically, by setting a dial plate 62, which is fixedly connected to the carrier plate 6 via a connecting rod 61, when it is necessary to adjust the height of the carrier plate 6, the dial plate 62 is moved to move the carrier plate 6. After adjusting to the appropriate position, the fixing pin 8 is inserted into the inside of the dial plate 62 and finally into the socket 53 to limit the position of the dial plate 62 and the carrier plate 6. The socket 53 is provided with multiple holes evenly distributed on the side of the clamping plate 5, so that the height of the dial plate 62 can be precisely adjusted, which is convenient for the carrier plate 6 to be used with semiconductor devices of different sizes.

[0044] like Figure 1 and Figure 2As shown, in a preferred embodiment, the rotating assembly includes a rotating disk 2, which is rotatably mounted on the top of the operating table 1. The base plate 4 is provided with four evenly fixedly connected to the four corners of the top of the rotating disk 2. The bottom of the operating table 1 is provided with a servo motor 9, and the top of the servo motor 9 is fixedly connected to a first mounting plate 91. The first mounting plate 91 is fixedly connected to the bottom of the operating table 1 by bolts. The output end of the servo motor 9 is fixedly connected to a second mounting plate 92, which is fixedly connected to the bottom of the rotating disk 2 by bolts.

[0045] Specifically, a first mounting plate 91 is provided, with holes on all four sides and corresponding holes at the bottom of the operating table 1. This facilitates the fixing of the first mounting plate 91 to the bottom of the operating table 1 using bolts. A through hole is provided in the center of the operating table 1, allowing the second mounting plate 92 to pass through and be fixedly connected to the rotating disk 2. The bottom of the rotating disk 2 has a groove corresponding to the second mounting plate 92, facilitating the placement of the second mounting plate 92 inside it and fixing it to the bottom of the rotating disk 2. The servo motor 9 drives the second mounting plate 92 to rotate simultaneously. The servo motor 9 can effectively drive the rotating disk 2 to rotate, thereby driving the substrate 4 and semiconductor devices mounted on it to rotate. The servo motor 9 can precisely control the rotation angle, thereby driving the rotating disk 2 to rotate precisely. This allows the substrate 4 to be accurately positioned at the four corners of the rotating disk 2 each time, which facilitates the placement of the semiconductor devices and the pressing work. The servo motor 9 is started to drive the rotating disk 2 to rotate. The servo motor 9 drives the rotating disk 2 to rotate 90° each time, and stops for a period of time after each 90° rotation. The time interval can be adjusted and controlled, and the time interval is the time required to press the semiconductor devices to completion each time.

[0046] like Figure 1 and Figure 5 As shown in this disclosure, a cylinder 3 is fixedly connected to the top of the support frame 11, and a pressure plate 31 is fixedly connected to the output end of the cylinder 3. The pressure plate 31 is disposed above the base plate 4.

[0047] Specifically, by setting cylinder 3, pressure plate 31 passes through support frame 11 and is fixedly connected to the output end of support frame 11, thereby effectively driving pressure plate 31 to move up and down. When substrate 4 rotates to near the bottom of support frame 11, it is just below pressure plate 31, so that cylinder 3 can easily drive pressure plate 31 to move down and perform pressure fitting work on semiconductor device set on top of substrate 4.

[0048] In actual use, the staff stands in front of the operating table 1, adjusts the height of the carrier plate 6 according to the size of the semiconductor device, and places the semiconductor device to be pressed on the two carrier plates 6, so that the side of the semiconductor device is higher than the clamping plate 5.

[0049] The drive motor 7 is started to drive the bidirectional lead screw 71 to rotate, thereby moving the clamping plates 5 on both sides to press and fix the semiconductor device set on the support plate 6. The servo motor 9 is started to drive the rotating disk 2 to rotate. The servo motor 9 drives the rotating disk 2 to rotate 90° each time, and stops for a period of time after each 90° rotation. The time can be adjusted and controlled. The time interval is the time for each semiconductor device to be pressed and installed.

[0050] When the substrate 4 moves close to the bottom of the support frame 11, the cylinder 3 is activated to move the pressing plate 31 downwards, completing the pressing of the semiconductor device. The cylinder 3 then resets the pressing plate 31, and the servo motor 9 continues to rotate the rotating disk 2. At the same time, the drive motor 7 reverses the bidirectional lead screw 71, causing the two clamping plates 5 to move away from each other, making it easier to remove the semiconductor device. After the substrate 4 moves back to the front of the operating table 1, it is easy for the operator to remove it and place a new semiconductor device on it, so that it moves back to the bottom of the support frame 11 for subsequent pressing work.

[0051] Those skilled in the art should understand that the above embodiments are merely for illustrating the present disclosure and are not intended to limit the scope of the disclosure. Those skilled in the art can make other changes or modifications based on the above disclosure, and these changes or modifications still fall within the scope of the present disclosure.

Claims

1. A high power semiconductor device press mounting apparatus characterized by comprising: include: The operating table (1) is fixedly connected to a support frame (11) at its top end, and also includes a clamping assembly, a rotating assembly and a lifting assembly; The clamping assembly includes a base plate (4) and a clamping plate (5). Two clamping plates (5) are symmetrically arranged and are respectively arranged on both sides of the top of the base plate (4). A first sliding groove (41) is opened in the middle of the base plate (4). A drive motor (7) is fixedly connected to the side of the base plate (4). The bottom end of the clamping plate (5) is fixedly connected to a sliding plate (52), and the output end of the drive motor (7) is connected to a bidirectional lead screw (71). The middle part of the sliding plate (52) is provided with a threaded hole corresponding to the bidirectional lead screw (71). The bidirectional lead screw (71) is threadedly connected to the threaded hole provided inside the sliding plate (52). The bidirectional lead screw (71) is rotatably connected to the first slide groove (41), and the sliding plate (52) is slidably connected to the first slide groove (41).

2. The apparatus of claim 1, wherein: The lifting assembly includes a support plate (6), which is slidably disposed on the side of the clamping plate (5). A support plate (6) is provided on the corresponding side of both sides of the clamping plate (5). A connecting rod (61) is fixedly connected to the end of the support plate (6). A second sliding groove (51) is provided in the middle of the clamping plate (5), and the connecting rod (61) is slidably connected in the second sliding groove (51).

3. The apparatus of claim 2, wherein: The end of the connecting rod (61) is fixedly connected to a lever plate (62), which is slidably connected to the side of the clamping plate (5). Both sides of the lever plate (62) are provided with fixing pins (8), and both sides of the second slide groove (51) are provided with insertion holes (53), which are corresponding to the fixing pins (8).

4. The apparatus of claim 3, wherein: The rotating assembly includes a rotating disk (2), which is rotatably mounted on the top of the operating table (1). The base plate (4) has four evenly fixed connections to the four corners of the top of the rotating disk (2).

5. The apparatus of claim 4, wherein: A servo motor (9) is provided at the bottom of the operating table (1). A first mounting plate (91) is fixedly connected to the top of the servo motor (9). The first mounting plate (91) is fixedly connected to the bottom of the operating table (1) by bolts. A second mounting plate (92) is fixedly connected to the output end of the servo motor (9). The second mounting plate (92) is fixedly connected to the bottom of the rotating disk (2) by bolts.

6. The apparatus of claim 5, wherein: A cylinder (3) is fixedly connected to the top of the support frame (11), and a pressure plate (31) is fixedly connected to the output end of the cylinder (3). The pressure plate (31) is located above the base plate (4).

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