Display Module

Abstract

This application provides a display module, which includes a display panel, a driver chip, and an electromagnetic shielding composite layer. The display panel has a bonding area. The driver chip is bonded to the bonding area. At least a portion of the electromagnetic shielding composite layer is located on the side of the driver chip opposite to the bonding area and includes at least two stacked electromagnetic shielding layers, both of which overlap with the driver chip. Since at least two stacked electromagnetic shielding layers are located above the driver chip, they can shield the radiated signals generated during the operation of the driver chip, thus better mitigating electromagnetic interference caused by radiated signals.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display module. Background Technology

[0002] Display screens typically generate radiated signals during operation, which can potentially affect external electronic devices such as smartphones in the vicinity. Furthermore, strong radiated signals can cause signal crosstalk within the display screen itself. These effects are commonly referred to as electromagnetic interference (EMI). To mitigate EMI, electromagnetic shielding structures are typically placed around the signal source generating the radiated signal. However, existing electromagnetic shielding structures often fail to provide adequate protection against strong EMI. Utility Model Content

[0003] This application provides a display module to better mitigate electromagnetic interference caused by radiated signals, thereby at least partially solving the aforementioned technical problems.

[0004] To achieve the above objectives, according to a first aspect of this application, a display module is provided, including a display panel, a driver chip, and an electromagnetic shielding composite layer. The display panel has a bonding area. The driver chip is bonded to the bonding area. At least a portion of the electromagnetic shielding composite layer is located on the side of the driver chip opposite to the bonding area and includes at least two stacked electromagnetic shielding layers, both of which overlap with the driver chip.

[0005] Optionally, the at least two stacked electromagnetic shielding layers comprise at least one of copper foil and aluminum foil.

[0006] Optionally, the at least two stacked electromagnetic shielding layers may further include an electromagnetic wave absorbing layer.

[0007] Optionally, the electromagnetic wave absorbing layer is located on the side of the copper foil closest to the driver chip; and / or, the electromagnetic wave absorbing layer is located on the side of the aluminum foil closest to the driver chip.

[0008] Optionally, the electromagnetic wave absorbing layer includes a substrate layer and electromagnetic wave absorbing particles, wherein the electromagnetic wave absorbing particles are dispersed in the substrate layer.

[0009] Optionally, at least two stacked electromagnetic shielding layers include copper foil and aluminum foil, with the aluminum foil located on the side of the copper foil facing away from the driver chip.

[0010] Optionally, the display module further includes an insulating layer located between the electromagnetic shielding composite layer and the driver chip.

[0011] Optionally, the insulating layer is adhesive and adheres to the driver chip and the electromagnetic shielding composite layer.

[0012] Optionally, the display module further includes a printed circuit board and a flexible circuit board. One end of the flexible circuit board is bonded to the bonding area, and the other end of the flexible circuit board is connected to the printed circuit board. The electromagnetic shielding composite layer extends to overlap with both the printed circuit board and the flexible circuit board, and the insulating layer is located between the electromagnetic shielding composite layer and the printed circuit board, and between the electromagnetic shielding composite layer and the flexible circuit board.

[0013] Optionally, the backlight module includes a back panel, and the display module further includes a polarizer located on the light-emitting side of the display panel; the first end of the electromagnetic shielding composite layer is electrically connected to the polarizer, and the second end of the electromagnetic shielding composite layer is electrically connected to the back panel, with the first end and the second end disposed opposite to each other.

[0014] Optionally, at least one of the first end and the second end extends outward relative to the insulating layer.

[0015] Optionally, the polarizer includes a first surface and a second surface opposite to each other, the second surface being located on the side of the first surface away from the display panel; the first surface protrudes from the electromagnetic shielding composite layer, or the first surface is flush with at least a portion of the surface of the electromagnetic shielding composite layer.

[0016] Optionally, the display panel includes an array substrate and an opposing substrate disposed opposite each other, the array substrate including the bonding area.

[0017] In the display module of this application embodiment, since at least two stacked electromagnetic shielding layers are located above the driver chip, they can both shield the radiation signals generated during the operation of the driver chip, which can better improve the electromagnetic interference problem caused by the radiation signals. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the display module provided in an exemplary embodiment of this application;

[0019] Figure 2 This is a partial schematic diagram of a display module provided in an exemplary embodiment of this application;

[0020] Figure 3 This is another partial schematic diagram of the display module provided in an exemplary embodiment of this application;

[0021] Figure 4 This is another partial schematic diagram of the display module provided in an exemplary embodiment of this application;

[0022] Figure 5 This is another partial schematic diagram of the display module provided in an exemplary embodiment of this application.

[0023] Explanation of reference numerals in the attached figures:

[0024] 100. Display module;

[0025] 10. Display panel; AA, display area; BA, binding area;

[0026] 101. Array substrate; 102. Opposing substrate;

[0027] 11. Backlight module; 111. Back panel; 112. Side panel; 113. Base plate; 115. Light source assembly; 116. Light guide plate; 117. Optical film assembly; 118. Support unit;

[0028] 12. Driver chip;

[0029] 13. Polarizing film; S1, first surface; S2, second surface;

[0030] 14. Electromagnetic shielding composite layer; 140. Electromagnetic shielding layer; 141. Aluminum foil; 142. Copper foil; 143. Electromagnetic wave absorption layer; E1. First end; E2. Second end;

[0031] 15. Insulation layer;

[0032] 16. Light-blocking layer;

[0033] 171. Flexible circuit board; 172. Printed circuit board. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0035] Figure 1 This is a schematic diagram of the overall structure of the display module provided in an exemplary embodiment of this application. Figure 2 This is a partial schematic diagram of a display module provided in an exemplary embodiment of this application.

[0036] Please see Figure 1 and Figure 2The display module 100 includes a display panel 10 and a driver chip 12. The display panel 10 has a display area AA and a non-display area. The display area AA is provided with a pixel driving circuit. The non-display area is located around the display area AA and includes a bonding area BA. The bonding area BA is used to bond the driver chip 12, and the driver chip 12 is connected to the pixel driving circuit to provide signals to the pixel driving circuit.

[0037] In some embodiments, the display panel 10 may be a liquid crystal display panel. In this case, the display panel 10 includes an array substrate 101 and an opposing substrate 102 disposed opposite each other. The array substrate 101 includes a bonding region BA and is provided with a pixel driving circuit. The display module 100 also includes a backlight module 11 and two polarizers 13. The backlight module 11 is located on the light-incident side of the display panel 10. One polarizer 13 is located between the backlight module 11 and the display panel 10, and the other polarizer 13 is located on the light-emitting side of the display panel 10. The backlight module 11 may include a back plate 111, and the display panel 10 may be fixed on the back plate 111 by an adhesive layer. The back plate 111 includes side plates 112 and a bottom plate 113. The four side plates 112 are arranged along the edge of the bottom plate 113 and are connected to each other. The bottom plate 113 and the side plates 112 enclose an accommodating space. A light source assembly 115, a light guide plate 116, and an optical film assembly 117 are arranged in the accommodating space. The light-emitting surface of the light source assembly 115 faces the light guide plate 116, and the optical film assembly 117 is located on the light-emitting surface of the light guide plate 116. The back plate 111 may include conductive materials such as aluminum.

[0038] In other embodiments, the display panel 10 can be any one of an organic light-emitting diode display panel, a micro light-emitting diode display panel, a quantum dot display panel, and a sub-millimeter light-emitting diode display panel.

[0039] In some embodiments, the number of driver chips 12 can be one or more. When the number of driver chips 12 is one, the driver chip 12 can integrate the functions of multiple identical or different chips in the prior art, such as integrating the functions of at least two of timing controllers, source drivers and gate drivers, to reduce the cost of display module 100.

[0040] In some embodiments, the display module 100 further includes an electromagnetic shielding composite layer 14. At least a portion of the electromagnetic shielding composite layer 14 is located on the side of the driver chip 12 away from the bonding region BA and includes at least two stacked electromagnetic shielding layers 140, both of which overlap with the driver chip 12. Since the at least two stacked electromagnetic shielding layers 140 are located above the driver chip 12, they can shield the radiated signals generated during the operation of the driver chip 12. This not only better mitigates the electromagnetic interference caused by the radiated signals generated by the driver chip 12 to external electronic devices, but also improves the signal crosstalk problem inside the display panel 10 caused by excessively strong radiated signals generated by the driver chip 12. Furthermore, the at least two stacked electromagnetic shielding layers 140 can also shield radiated signals generated by external electronic devices other than the driver chip 12, reducing the risk of interference from radiated signals generated by external electronic devices to the driver chip 12.

[0041] It should be noted that, compared with using a single aluminum foil tape as an electromagnetic shielding layer, which results in limited electromagnetic shielding effect, the embodiments of this application use at least two electromagnetic shielding layers 140, which can improve the overall electromagnetic shielding effect of the electromagnetic shielding composite layer 14.

[0042] In some embodiments, at least two stacked electromagnetic shielding layers 140 include at least one of aluminum foil 141 and copper foil 142. Since both copper foil 142 and aluminum foil 141 have good conductivity, they can effectively reflect electromagnetic waves such as radiated signals, thereby improving the problem of mutual electromagnetic interference between the display module and external electronic devices, and also improving the problem of signal crosstalk inside the display panel caused by electromagnetic waves.

[0043] In some embodiments, please refer to Figure 2 As shown, at least two stacked electromagnetic shielding layers 140 include a copper foil 142 and an aluminum foil 141, with the aluminum foil 141 located on the side of the copper foil 142 facing away from the driver chip 12. Since the copper foil 142 has better conductivity than the aluminum foil 141, its ability to reflect electromagnetic waves is stronger. Positioning the copper foil 142 closer to the driver chip 12 allows for better reflection of the radiated signals generated by the driver chip 12. Furthermore, the aluminum foil 141's location on the side of the copper foil 142 facing away from the driver chip 12 effectively shields the copper foil 142, mitigating the glare caused by the curled edges from the cutting of the copper foil 142.

[0044] In some embodiments, the thickness of the aluminum foil 141 can be 0.02 mm to 0.06 mm to ensure the electromagnetic shielding effect of the aluminum foil 141. In some embodiments, the thickness of the copper foil 142 can be 0.015 mm to 0.06 mm to ensure the electromagnetic shielding effect of the copper foil 142.

[0045] In some embodiments, the thickness of the aluminum foil 141 can be greater than the thickness of the copper foil 142. Since the aluminum foil 141 is generally lighter than the copper foil 142, using a thicker aluminum foil 141 provides better electromagnetic shielding while ensuring that the weight of the display module 100 is not too high.

[0046] In some embodiments, the electromagnetic shielding composite layer 14 may further include a first conductive adhesive layer (not shown in the figure), which is located between the copper foil 142 and the aluminum foil 141 to bond the copper foil 142 and the aluminum foil 141. The first conductive adhesive layer may include a first adhesive layer and conductive particles dispersed in the first adhesive layer. The conductive particles include, but are not limited to, at least one of metals and metal oxides. The metals include, but are not limited to, at least one of silver and copper. The metal oxides include, but are not limited to, at least one of indium tin oxide and indium zinc oxide.

[0047] In some embodiments, please refer to Figure 2 As shown, the display module 100 may further include a light-shielding layer 16, which is located on the side of the electromagnetic shielding composite layer 14 opposite to the driving chip 12. The light-shielding layer 16 blocks light emitted from the backlight module 11, improving the problem of light leakage from the edges of the display module 100. In some embodiments, the light-shielding layer 16 includes, but is not limited to, light-shielding tape.

[0048] In some embodiments, the light-shielding layer 16, the aluminum foil 141, and the first conductive adhesive layer can constitute an aluminum foil tape. A copper foil 142 is bonded to the first conductive adhesive layer of the aluminum foil tape to form an electromagnetic shielding composite layer 14 and a light-shielding layer 16.

[0049] In some embodiments, please continue reading Figure 1 and Figure 2 As shown, the display module 100 also includes an insulating layer 15, which is located between the electromagnetic shielding composite layer 14 and the driver chip 12. The insulating layer 15 serves to isolate the electromagnetic shielding composite layer 14 from the driver chip 12, thereby mitigating the problem of adverse interference to the driver chip 12 caused by the electrical connection between the conductive layers such as the copper foil 142 in the electromagnetic shielding composite layer 14 and the driver chip 12.

[0050] In some embodiments, the insulating layer 15 is adhesive and adheres to the driver chip 12 and the electromagnetic shielding composite layer 14. Since the insulating layer 15 fixes the electromagnetic shielding composite layer 14 to the driver chip 12, the problem of abnormal noise caused by the electromagnetic shielding composite layer 14 swinging is reduced.

[0051] In some embodiments, the insulating layer 15 may include insulating tape, the third surface of which faces the driver chip 12 and the fourth surface of which faces the electromagnetic shielding composite layer 14 are both adhesive, and the third and fourth surfaces are disposed opposite to each other. In some embodiments, the thickness of the insulating tape may be 0.015 mm to 0.03 mm to ensure that the insulating tape has good adhesion and insulation properties, while also reducing the risk of poor appearance caused by the electromagnetic shielding composite layer 14 protruding from the polarizer 13 due to excessively thick insulating tape.

[0052] In some embodiments, please refer to Figure 1 The display module 100 also includes a flexible circuit board 171 and a printed circuit board 172. One end of the flexible circuit board 171 is bonded to the bonding area BA, and the other end of the flexible circuit board 171 is connected to the printed circuit board 172. Thus, the electrical signals output by the printed circuit board 172 can be output to the driver chip 12 via the flexible circuit board 171. At least two electromagnetic shielding layers 140 of the electromagnetic shielding composite layer 14 extend from above the driver chip 12 to overlap with the flexible circuit board 171 and the printed circuit board 172, positioned above them, to shield the reflected signals generated when the flexible circuit board 171 transmits signals, and to shield the radiated signals generated by the printed circuit board 172. This further improves the electromagnetic interference problem caused by the display module 100 to external electronic devices and reduces the risk of signal crosstalk inside the display panel caused by the reflected and radiated signals generated by the flexible circuit board 171 and the printed circuit board 172. Furthermore, at least two electromagnetic shielding layers 140 of the electromagnetic shielding composite layer 14 can also shield the electromagnetic interference caused by radiation signals generated by other external electronic devices to the flexible circuit board 171 and the printed circuit board 172.

[0053] In some embodiments, the insulating layer 15 is also located between the electromagnetic shielding composite layer 14 and the printed circuit board 172, and between the electromagnetic shielding composite layer 14 and the flexible circuit board 171, so as to isolate the flexible circuit board 171 and the printed circuit board 172 from the electromagnetic shielding composite layer 14 and reduce the risk of mutual interference between the circuits of the flexible circuit board 171 and the printed circuit board 172 and the conductive structure in the electromagnetic shielding composite layer 14.

[0054] In some embodiments, please refer to Figure 1 The insulating layer 15 is also bonded to the printed circuit board 172, which provides support for the insulating layer 15 and the electromagnetic shielding composite layer 14 on the insulating layer 15, and fixes the electromagnetic shielding composite layer 14 to the printed circuit board 172.

[0055] In some embodiments, the printed circuit board 172 may be located on the backlight module 11 to fix the printed circuit board 172. See also [link to related documentation] in some embodiments. Figure 1 Two adjacent and spaced-apart support portions 118 extend from one side plate 112 of the backplate 111 of the backlight module 11. A printed circuit board 172 can be disposed on the two support portions 118. One side plate 112 can be cut to form a strip structure, and the strip structure can be bent to form the two support portions 118. The printed circuit board 172 can be fixed to the two support portions 118 by a fixing assembly. The fixing assembly can include bolts and nuts.

[0056] In some embodiments, the first end E1 of the electromagnetic shielding composite layer 14 is electrically connected to the polarizer 13 on the light-emitting side of the display panel 10, and the second end E2 of the electromagnetic shielding composite layer 14 is electrically connected to the back plate 111. The first end E1 and the second end E2 are arranged opposite to each other. During the use of the display module 100, static electricity usually accumulates in the polarizer 13 on the light-emitting side of the display panel 10. By using the design of connecting the electromagnetic shielding composite layer 14 to the polarizer 13 and the back plate 111, static electricity can be transmitted to the back plate 111 through the conductive layer in the electromagnetic shielding composite layer 14, and then output through the back plate 111, thereby improving the impact of static electricity on the display module 100.

[0057] In some embodiments, at least one of the first end E1 and the second end E2 extends outward relative to the insulating layer 15, simplifying the electrical connection between the electromagnetic shielding composite layer 14 and at least one of the polarizer 13 and the backplate 111. When the first end E1 of the electromagnetic shielding composite layer 14 extends outward relative to the insulating layer 15, the conductive layer in the electromagnetic shielding composite layer 14 (e.g., the first conductive adhesive layer, copper foil 142, or aluminum foil 141) is electrically connected to the polarizer 13 on the light-emitting side of the display panel 10. When the second end E2 of the electromagnetic shielding composite layer 14 extends outward relative to the insulating layer 15, the conductive layer of the electromagnetic shielding composite layer 14 is electrically connected to the backplate 111. In some embodiments, see... Figure 1 As shown, both the first end E1 and the second end E2 extend outward relative to the insulating layer 15.

[0058] In some embodiments, see Figure 2 As shown, at the first end E1 and the second end E2 of the electromagnetic shielding composite layer 14, the first conductive adhesive layer can extend outward relative to the insulating layer 15 to electrically connect with the polarizer 13 and the back plate 111. Exemplarily, the first conductive adhesive layer is connected to the conductive adhesive layer in the polarizer 13 on the light-emitting side of the display panel 10 and is bonded to the back plate 111.

[0059] In some embodiments, at the first end E1 and the second end E2 of the electromagnetic shielding composite layer 14, copper foil 142 or aluminum foil 141 may extend outward relative to the insulating layer 15, and copper foil 142 or aluminum foil 141 may be connected to the conductive adhesive layer in the polarizer 13, while being connected to the back plate 111 through an additional conductive adhesive layer.

[0060] In some embodiments, please refer to Figure 2 The polarizer 13 on the light-emitting side of the display panel 10 includes a first surface S1 and a second surface S2 facing each other, with the second surface S2 located on the side of the first surface S1 facing away from the display panel 10. The first surface S1 protrudes beyond the electromagnetic shielding composite layer 14, or the first surface S1 is flush with at least a portion of the surface of the electromagnetic shielding composite layer 14. This reduces the risk of the electromagnetic shielding composite layer 14 protruding beyond the polarizer 13 on the light-emitting side of the display panel 10, thus minimizing the appearance defects.

[0061] Figure 3 This is another partial schematic diagram of the display module provided in an exemplary embodiment of this application. Figure 4 This is another partial schematic diagram of the display module provided in an exemplary embodiment of this application. Figure 5 This is another partial schematic diagram of the display module provided in an exemplary embodiment of this application.

[0062] Please see Figures 3 to 5 The at least two stacked electromagnetic shielding layers 140 also include an electromagnetic wave absorbing layer 143. The electromagnetic wave absorbing layer 143 primarily converts electromagnetic waves into heat energy, thereby absorbing or attenuating them and improving the overall electromagnetic shielding effect of the electromagnetic shielding composite layer 14. Furthermore, because the electromagnetic wave absorbing layer 143 can dissipate electromagnetic waves, its electromagnetic shielding effect is better than that of the copper foil 142 and the aluminum foil 141.

[0063] In some embodiments, the electromagnetic wave absorbing layer 143 includes a substrate layer and electromagnetic wave absorbing particles, which are dispersed in the substrate layer to absorb or attenuate electromagnetic waves. The electromagnetic wave absorbing particles may include at least one of ferrite, magnetic metal, and alloy materials. Magnetic metals include, but are not limited to, iron. The substrate layer may include, but is not limited to, an adhesive layer.

[0064] In some embodiments, the electromagnetic wave absorbing layer 143 is located on the side of the copper foil 142 closer to the driving chip 12; and / or, the electromagnetic wave absorbing layer 143 is located on the side of the aluminum foil 141 closer to the driving chip 12. Since the electromagnetic wave absorbing layer 143 is closer to the driving chip 12 than at least one of the copper foil 142 and the aluminum foil 141, a large amount of electromagnetic waves generated by the driving chip 12, etc., are first absorbed or attenuated by the electromagnetic wave absorbing layer 143, and the remaining small amount of electromagnetic waves are then reflected by the copper foil or the aluminum foil 141. The reflected electromagnetic waves can be absorbed again by the electromagnetic wave absorbing layer 143 to improve the overall electromagnetic shielding effect of the electromagnetic shielding composite layer 14.

[0065] In some embodiments, see Figure 3The electromagnetic wave absorbing layer 143 is located on the side of the aluminum foil 141 closest to the driving chip 12. The insulating layer 15 is disposed between the electromagnetic wave absorbing layer 143 and the driving chip 12. A second conductive adhesive layer (not shown in the figure) is disposed between the aluminum foil 141 and the electromagnetic wave absorbing layer 143. In this way, the electromagnetic wave absorbing layer 143 and the aluminum foil 141 work together to improve the overall electromagnetic shielding effect of the electromagnetic shielding composite layer 14.

[0066] In some embodiments, see Figure 4 The electromagnetic wave absorption layer 143 is located on the side of the copper foil 142 and aluminum foil 141 closest to the driver chip 12, and the insulating layer 15 is disposed between the electromagnetic wave absorption layer 143 and the driver chip 12. After the electromagnetic wave absorption layer 143 absorbs or attenuates a large amount of electromagnetic waves, the copper foil 142 and aluminum foil 141 cooperate to reflect the remaining small amount of electromagnetic waves back to the electromagnetic wave absorption layer 143, where they are absorbed, thus improving the overall shielding effect of the electromagnetic shielding composite layer 14.

[0067] In some embodiments, see Figure 5 The electromagnetic wave absorbing layer 143 is located between the copper foil 142 and the aluminum foil 141. In this way, the copper foil 142 reflects a portion of the electromagnetic waves, the electromagnetic wave absorbing layer 143 absorbs a portion of the electromagnetic waves, and the aluminum layer reflects a portion of the electromagnetic waves to the electromagnetic wave absorbing layer 143, where they are absorbed, thereby improving the overall shielding effect of the electromagnetic shielding composite layer 14.

[0068] It should be noted that if it is necessary to further enhance the electromagnetic shielding effect of the electromagnetic shielding layer 140, the number of electromagnetic shielding layers 140 in the electromagnetic shielding composite layer 14 can be more than three.

[0069] In summary, in the display module of this application embodiment, since at least two stacked electromagnetic shielding layers are located above the driver chip, they can both shield the radiation signals generated during the operation of the driver chip, which can better improve the electromagnetic interference problem caused by radiation signals.

[0070] The above description of the embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application; those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display module, characterized in that, include: The display panel has a binding area; The driver chip is bound to the binding area; An electromagnetic shielding composite layer, at least a portion of which is located on the side of the driver chip away from the bonding area and includes at least two stacked electromagnetic shielding layers, both of which overlap with the driver chip.

2. The display module according to claim 1, characterized in that, The electromagnetic shielding layer, consisting of at least two stacked layers, comprises at least one of copper foil and aluminum foil.

3. The display module according to claim 2, characterized in that, The electromagnetic shielding layers, which are stacked at least twice, also include an electromagnetic wave absorbing layer.

4. The display module according to claim 3, characterized in that, The electromagnetic wave absorbing layer is located on the side of the copper foil closest to the driver chip; and / or, the electromagnetic wave absorbing layer is located on the side of the aluminum foil closest to the driver chip.

5. The display module according to claim 3, characterized in that, The electromagnetic wave absorbing layer includes a substrate layer and electromagnetic wave absorbing particles, wherein the electromagnetic wave absorbing particles are dispersed in the substrate layer.

6. The display module according to claim 2, characterized in that, The electromagnetic shielding layer comprises at least two stacked layers, including copper foil and aluminum foil, with the aluminum foil located on the side of the copper foil facing away from the driver chip.

7. The display module according to any one of claims 1 to 6, characterized in that, Also includes: An insulating layer is located between the electromagnetic shielding composite layer and the driving chip.

8. The display module according to claim 7, characterized in that, The insulating layer is adhesive and adheres to the driver chip and the electromagnetic shielding composite layer.

9. The display module according to claim 7, characterized in that, The display module also includes: Printed circuit boards; A flexible circuit board, one end of which is bonded to the bonding area, and the other end of which is connected to the printed circuit board; The electromagnetic shielding composite layer extends to overlap with the printed circuit board and the flexible circuit board, and the insulating layer is located between the electromagnetic shielding composite layer and the printed circuit board, and between the electromagnetic shielding composite layer and the flexible circuit board.

10. The display module according to claim 9, characterized in that, The display module further includes a backlight module and a polarizer. The backlight module includes a back panel, and the polarizer is located on the light-emitting side of the display panel. The first end of the electromagnetic shielding composite layer is electrically connected to the polarizer, and the second end of the electromagnetic shielding composite layer is electrically connected to the back panel. The first end and the second end are arranged opposite to each other.

11. The display module according to claim 10, characterized in that, At least one of the first end and the second end extends outward relative to the insulating layer.

12. The display module according to claim 10, characterized in that, The polarizer includes a first surface and a second surface opposite to each other, the second surface being located on the side of the first surface away from the display panel; wherein the first surface protrudes from the electromagnetic shielding composite layer, or the first surface is flush with at least a portion of the surface of the electromagnetic shielding composite layer.

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