Smart speaker with integrated functions

CN224709730UActive Publication Date: 2026-09-01SHANDONG WEIZAN INFORMATION TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202522187322.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-16
Publication Date
2026-09-01
Estimated Expiration
2035-10-16

AI Technical Summary

Technical Problem

[0003]本实用新型提供了集成多功能的智能音响,以解决现有智能音响中,4G通信、WiFi热点、语音交互模块多为独立组件,布局分散,导致音响体积大、内部信号干扰严重,功能模块集成度低,影响4G/WiFi信号稳定性与语音拾音效果;物理按键布局混乱,用户操作不便;且多模块工作时发热集中,散热结构设计不合理,易导致设备死机的问题

Benefits of technology

1、本实用新型中采用分区布局,通信区靠近散热孔与天线,语音区靠近拾音孔,控制区位于中心,减少各模块间的信号干扰与热量叠加,提升 4G/WiFi 信号稳定性与语音拾音效果,集成度高,干扰小。

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model provides an integrated multi-functional smart speaker, relating to the field of smart speaker hardware structure technology, including a housing head, a housing body, and a housing base; the housing head is hemispherical, with an OLED display screen inside, and four microphone pickup holes on the outside of the housing head, the microphone pickup holes being covered with dustproof mesh. This utility model adopts a partitioned layout, with the communication area near the heat dissipation holes and antenna, the voice area near the pickup holes, and the control area located in the center, reducing signal interference and heat accumulation between modules, improving 4G / WiFi signal stability and voice pickup effect. It features high integration and low interference, solving the problem in existing smart speakers where 4G communication, WiFi hotspot, and voice interaction modules are mostly independent components with scattered layouts, resulting in large speaker size, severe internal signal interference, low integration of functional modules, and affecting 4G / WiFi signal stability and voice pickup effect.
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Description

Technical Field

[0001] This utility model relates to the field of intelligent speaker hardware structure technology, and in particular to an integrated multi-functional intelligent speaker. Background Technology

[0002] Smart speakers are audio devices that integrate artificial intelligence technology, combining voice interaction, music playback, and home control functions. They capture user voice commands through a built-in microphone array, which are then analyzed by cloud-based AI for accurate responses. Their core advantages lie in convenient voice operation and contextualized services, making them an important entry point into the smart home ecosystem. Users can complete various tasks through natural dialogue, improving life efficiency and the technological experience. Currently, in existing smart speakers, 4G communication, WiFi hotspot, and voice interaction modules are mostly independent components with a scattered layout. This results in large speaker sizes, severe internal signal interference, low integration of functional modules, and affects the stability of 4G / WiFi signals and voice pickup effects. Physical button layouts are also disorganized, making operation inconvenient. Furthermore, the concentrated heat generated when multiple modules are working, coupled with an unreasonable heat dissipation structure design, easily leads to device crashes. Utility Model Content

[0003] This utility model provides a multi-functional smart speaker to solve the problems in existing smart speakers where 4G communication, WiFi hotspot, and voice interaction modules are mostly independent components with scattered layouts, resulting in large speaker size, severe internal signal interference, low integration of functional modules, affecting the stability of 4G / WiFi signals and voice pickup effect; chaotic physical button layout, inconvenient user operation; and concentrated heat generation when multiple modules are working, with unreasonable heat dissipation structure design, which easily leads to device crashes.

[0004] This utility model provides an integrated multi-functional smart speaker, comprising a housing head, a housing body, and a housing base. The housing head is hemispherical and houses an OLED display screen. Four microphone pickup holes are located on the exterior of the housing head, each covered with a dustproof mesh. A wake-up interruption button is mounted on the exterior of the housing head and is connected to the OLED display screen via an electrical connection cable. A button area is located on the front of the housing body, including an M button and volume buttons. Heat dissipation holes are located on both sides of the housing body. The housing base is disc-shaped and houses a power supply module. A USB-C charging port and a SIM card slot are located on the side wall of the housing base. A protective silicone pad is bonded to the bottom of the housing base. A motherboard is fixedly connected inside the housing body. The motherboard includes a control area, a communication area, a voice area, and a power supply area. The control area has a control chip, which is electrically connected to an OLED display, a wake-up interrupt button, and a button area. The communication area has a cellular module and a WiFi module. The voice area has a microphone array consisting of four microphones and an audio decoding chip. The four microphones are located inside the microphone pickup holes, and the audio decoding chip is connected to a speaker inside the housing base. The power supply area has a DC-DC converter and a charging management chip, which are connected to a power supply module via electrical connection lines. The audio decoding chip is also connected to a speaker located inside the housing body via electrical connection lines.

[0005] Furthermore, a heat sink is attached to the back of the motherboard via a thermally conductive silicone sheet. The heat sink is fixedly connected inside the housing body and is a finned aluminum plate. Both ends of the heat sink contact two heat dissipation holes respectively.

[0006] Furthermore, a circular cavity fan chamber is provided at the center of the bottom of the housing base, and a heat dissipation vent is provided at the upper end of the fan chamber.

[0007] Furthermore, the upper part of the heat dissipation vent connects to the interior of the housing body, and the bottom surface of the housing base has an air inlet slot that connects to the fan cavity. The air inlet slots are evenly distributed radially around the fan cavity.

[0008] Furthermore, a cooling fan is installed inside the fan cavity, and a filter screen is fixedly connected inside the fan cavity, with the filter screen located below the cooling fan.

[0009] Furthermore, the head of the housing is connected to the body of the housing by screws, and the body of the housing is connected to the base of the housing by screws.

[0010] Furthermore, the housing base has two power sockets on its side, and the power supply module is inserted into the power socket, with the inner end face of the power supply module connected to the inner surface of the power socket via Velcro.

[0011] This utility model provides an integrated multi-functional smart speaker, which has the following beneficial effects: 1. This utility model adopts a partitioned layout, with the communication area close to the heat dissipation holes and antenna, the voice area close to the pickup hole, and the control area located in the center. This reduces signal interference and heat accumulation between modules, improves the stability of 4G / WiFi signals and voice pickup effect, and has high integration and low interference.

[0012] 2. This utility model integrates a multi-module structure. The layout of the head microphone hole, torso buttons and heat dissipation holes, and base power supply interface conforms to user operating habits. The internal space is fully utilized, and the integrated multi-module structure still maintains a compact size. 3. The physical buttons of this utility model are concentrated on the front of the torso and head, with clear markings, allowing users to operate blindly; the display screen is located on the head, making it easy to check the working status and operate conveniently; the thermal conductive silicone sheet is combined with the cooling fan to achieve efficient heat dissipation, avoiding equipment crashes caused by overheating when multiple modules are working, and improving equipment stability. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings of the embodiments will be briefly described below.

[0014] The accompanying drawings described below are only related to some embodiments of the present invention and are not intended to limit the scope of the present invention.

[0015] In the attached diagram: Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the bottom structure of this utility model; Figure 3 This is a schematic diagram of the internal structure of this utility model; Figure 4 This is a schematic diagram of the power supply module of this utility model when it is removed; Figure 5 This is a schematic diagram of the structure of the housing base of this utility model; Figure 6 This is a schematic diagram of the structure of the heat sink of this utility model; Figure 7 This is the utility model Figure 3 A magnified structural diagram of point A in the middle.

[0016] Figure label: 1. Head of the casing; 101. OLED display; 102. Microphone pickup hole; 103. Dustproof mesh; 104. Wake-up interrupt button; 2. Body of the casing; 201. Heat dissipation vents; 3. Base of the casing; 301. Power socket; 302. Power supply module; 303. Protective silicone pad; 304. USB-C charging port; 305. SIM card slot; 306. Fan cavity; 307. Heat dissipation vent; 308. Air intake slot; 4. Motherboard; 401. Control chip; 402. Cellular module; 403. WiFi module; 404. Microphone array; 405. Audio decoding chip; 406. DC-DC converter; 407. Charging management chip; 408. Thermal conductive silicone pad; 409. Heat sink; 5. Button area; 6. Speaker; 7. Cooling fan. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the described embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Example 1:

[0018] Please refer to Figures 1 to 7This utility model discloses an integrated multifunctional smart speaker, comprising a housing head 1, a housing body 2, and a housing base 3. The housing head 1 is hemispherical and houses an OLED display screen 101. Four microphone pickup holes 102 are located on the outside of the housing head 1, each covered with a dustproof mesh 103. A wake-up interruption button 104 is installed on the outside of the housing head 1 and is connected to the OLED display screen 101 via an electrical connection cable. A button area 5 is located on the front of the housing body 2, including an M button and volume buttons. Heat dissipation holes 201 are provided on both sides of the housing body 2. The housing base 3 is disc-shaped and houses a power supply module 302. A USB-C charging port 304 and a SIM card slot 305 are located on the side wall of the housing base 3. A protective silicone pad 303 is bonded to the bottom of the housing base 3. A motherboard 4 is fixedly connected inside the housing body 2. The motherboard 4 includes a control area, a communication area, a voice area, and a power supply area. The control area houses a control chip 401. The system is electrically connected to the OLED display 101, the wake-up interrupt button 104, and the button area 5. The communication area includes a cellular module 402 and a WiFi module 403. The voice area includes a microphone array 404 consisting of four microphones and an audio decoding chip 405. The four microphones are located inside the microphone pickup holes 102, and the audio decoding chip 405 is connected to the speaker 6 inside the housing base 3. The power supply area includes a DC-DC converter 406 and a charging management chip 407. The DC-DC converter 406 and the charging management chip 407 are connected to the power supply module 302 via electrical connection lines, and are connected to the speaker 6 located inside the housing body 2 via electrical connection lines with the audio decoding chip 405. The motherboard 4 is divided into multiple modules, forming a partitioned layout. The communication area is close to the heat dissipation hole 201, the voice area is close to the microphone pickup hole 102, and the control area is located in the center. This reduces signal interference and heat accumulation between modules, improves the stability of 4G / WiFi signals and voice pickup effect, and has high integration and low interference.

[0019] In this embodiment, a heat sink 409 is attached to the rear of the motherboard 4 via a thermally conductive silicone pad 408. The heat sink 409 is fixedly connected inside the housing body 2. The heat sink 409 is a finned aluminum plate. The two ends of the heat sink 409 contact two heat dissipation holes 201 respectively. Through the setting of the heat dissipation holes 201 and the function of the thermally conductive silicone pad 408 and the heat sink 409, the heat of the motherboard 4 can be dissipated more quickly, improving the heat dissipation efficiency of the internal circuit of the speaker.

[0020] In this embodiment, a circular fan cavity 306 with a central cavity structure is provided at the bottom of the housing base 3. A heat dissipation vent 307 is provided at the upper end of the fan cavity 306. The heat dissipation vent 307 is connected to the interior of the housing body 2. An air inlet groove 308 communicating with the fan cavity 306 is provided on the bottom surface of the housing base 3. The air inlet groove 308 is radially and evenly distributed around the fan cavity 306. A cooling fan 7 is installed inside the fan cavity 306. A filter screen is fixedly connected inside the fan cavity 306 and is located below the cooling fan 7. By setting the cooling fan 7, air from the bottom of the housing base 3 is introduced into the fan cavity 306 through the air inlet groove 308 and delivered into the interior of the housing body 2 through the heat dissipation vent 307, so that the air inside the housing body 2 flows. The air flow carries away the heat generated during the operation of the speaker, thereby achieving the function of efficient heat dissipation.

[0021] In this embodiment, the shell head 1 and shell body 2 are connected by screws, and the shell body 2 and shell base 3 are connected by screws, so that the composite shell composed of the shell head 1, shell body 2 and shell base 3 is detachable, which facilitates the maintenance of the internal microphone array and display screen. The composite shell composed of the shell head 1, shell body 2 and shell base 3 has an astronaut shape and is made of ABS+PC composite material, which has both decorative and functional properties. Example 2:

[0022] Based on Embodiment 1, two power sockets 301 are provided on the side of the housing base 3. The power supply module 302 is inserted into the power socket 301, and the inner end face of the power supply module 302 is connected to the inner surface of the power socket 301 by Velcro. The arrangement of the power socket 301 and the power supply module 302 in this structure makes the power supply module 302 easy to disassemble and facilitates the efficient replacement and maintenance of the battery inside the power supply module 302.

[0023] In use, this invention first allows a SIM card to be inserted through the SIM card slot 305, connecting to the network via a communication area consisting of a cellular module 402 and a WiFi module 403. External voice commands are received and detected through the microphone array 404, decoded by the audio decoding chip 405, and then transmitted to the control chip 401 for processing. The signal is then transmitted to the OLED display 101 for synchronous display. The control chip 401 sends a signal to the audio decoding chip 405, controlling the speaker 6 to convert the signal into sound. The smart speaker can be manually controlled via the wake-up interrupt button 104 and the button area 5. During this process, the cooling fan 7 draws air from the bottom of the housing base 3 into the fan cavity 306 through the air inlet slot 308 and delivers it into the housing body 2 through the cooling vent 307, causing airflow inside the housing body 2. This airflow carries away the heat generated during the speaker's operation, achieving efficient heat dissipation.

[0024] All the above components are installed, connected, or set up using common mechanical methods, such as welding, threaded connections, and screw connections. Furthermore, the specific structure, model, and coefficient specifications of all components are based on their own technologies, and any method that achieves the desired effect can be implemented. The OLED display screen 101, speaker 6, cooling fan 7, etc., mentioned above are all common components on the market. When purchasing and using them, simply follow the instructions provided with the purchase to connect them for operation; therefore, further details are omitted here.

[0025] The technical solution of this utility model is not limited to the scope of the embodiments of this utility model. All technical contents not described in detail in this utility model are known technologies.

Claims

1. An integrated multifunctional smart sound system, comprising: The housing consists of a head (1), a body (2), and a base (3); characterized in that the head (1) is equipped with an OLED display screen (101) inside, and four microphone pickup holes (102) are opened on the outside of the head (1), with a dustproof mesh (103) covering the inside of the microphone pickup holes (102); a wake-up interruption button (104) is installed on the outside of the head (1), and the wake-up interruption button (104) is connected to the OLED display screen (101) via an electrical connection cable; a button area (5) is provided on the front side of the body (2), including an M button and a volume button; heat dissipation holes (201) are opened through both sides of the body (2); a power supply module (302) is provided inside the base; a USB-C charging port (304) and a SIM card slot (305) are provided on the side wall of the base (3); a protective silicone pad (303) is glued to the bottom of the base (3); and a motherboard (4) is fixedly connected inside the body (2). The motherboard (4) includes a control area, a communication area, a voice area, and a power supply area. The control area is equipped with a control chip (401), which is electrically connected to an OLED display (101), a wake-up interrupt button (104), and a button area (5). The communication area is equipped with a cellular module (402) and a WiFi module (403). The voice area is equipped with a microphone array (404) consisting of four microphones and an audio decoding chip (405). The four microphones are located inside the microphone pickup hole (102), and the audio decoding chip (405) is connected to a speaker (6) inside the housing base (3). The power supply area is equipped with a DC-DC converter (406) and a charging management chip (407). The DC-DC converter (406) and the charging management chip (407) are connected to a power supply module (302) via an electrical connection line. The audio decoding chip (405) is connected to a speaker (6) located inside the housing body (2) via an electrical connection line.

2. The integrated multifunctional smart sound system of claim 1, wherein, The motherboard (4) has a heat sink (409) attached to the back by a thermally conductive silicone sheet (408). The heat sink (409) is fixedly connected inside the body (2) of the housing. The heat sink (409) is a finned aluminum plate, and the two ends of the heat sink (409) contact two heat dissipation holes (201) respectively. 3.The integrated multifunctional smart sound system of claim 2, wherein, The bottom center of the housing base (3) is provided with a fan cavity (306) with a circular cavity structure, and the upper end of the fan cavity (306) is provided with a heat dissipation vent (307).

4. The integrated multifunctional smart speaker according to claim 3, characterized in that, The heat dissipation vent (307) is connected to the inside of the shell body (2) above, and the bottom surface of the shell base (3) is provided with an air inlet groove (308) that connects to the fan cavity (306). The air inlet groove (308) is evenly distributed radially around the fan cavity (306).

5. The integrated multifunctional smart speaker according to claim 4, characterized in that, A cooling fan (7) is installed inside the fan cavity (306), and a filter screen is fixedly connected inside the fan cavity (306), with the filter screen located below the cooling fan (7).

6. The integrated multifunctional smart speaker according to claim 5, characterized in that, The head (1) of the shell is connected to the body (2) of the shell by screws, and the body (2) of the shell is connected to the base (3) of the shell by screws.

7. The integrated multifunctional smart speaker according to claim 6, characterized in that, The housing base (3) has two power sockets (301) on its side. The power supply module (302) is inserted into the power socket (301), and the inner end face of the power supply module (302) is connected to the inner surface of the power socket (301) by Velcro.