Gene chip detection well plate heating device

Abstract

This utility model discloses a heating device for a well plate used in gene chip detection, comprising: a heat-conducting mechanism, including a heat-conducting plate and a heat-conducting seat detachably disposed on top of the heat-conducting plate; the heat-conducting seat includes a base plate and a plurality of heat-conducting pillars arranged on top of the base plate; a ring of limiting pillars is disposed around the periphery of the heat-conducting pillars, the height of the limiting pillars being less than the height of the heat-conducting pillars; a fixing mechanism, including a fixing plate fixed to the bottom of the heat-conducting plate and a fixing bracket disposed at the bottom of the fixing plate; a heating mechanism, including a heating element disposed between the fixing plate and the heat-conducting plate; a temperature measuring mechanism, including a temperature measuring probe disposed inside the heat-conducting plate; and a temperature control mechanism, including a temperature control module disposed on the fixing bracket. This solution can achieve efficient, uniform, and constant-temperature heating of the analyte within the well plate.

Description

Technical Field

[0001] This utility model relates to the field of gene chip detection, and in particular to a heating device for a well plate used in gene chip detection. Background Technology

[0002] In gene detection, both fragmentation precipitation and denaturation of DNA require the addition of specific reagents and exposure to controlled temperatures. Since DNA library construction in solid-phase gene chip assays typically uses well plates (e.g., 96-well plates) as carriers, heating of these plates is necessary for temperature control. Existing heating devices mainly employ ovens or plate-type metal baths. However, conventional ovens have slow heating rates and a long time to stabilize the temperature after opening, leading to extended experimental cycles. While using a constant-temperature metal bath for incubation provides a more uniform temperature, the poor adhesion between the plate-type metal bath and the well plate results in longer heating times and poorer incubation effects.

[0003] To improve the above heating method, utility model patent CN206624867U provides a heat-conducting component and heating device, which includes a substrate, a baffle, and multiple pillars. The substrate has a heating area, the baffle is arranged along the periphery of the heating area, and the multiple pillars are located in the heating area and within the baffle. Existing perforated plates typically have multiple holes arranged in a matrix, with a tube for accommodating the object to be tested at the bottom of each hole. Simultaneously, a limiting step or skirt is usually formed around the top outer periphery of the perforated plate. When the heat-conducting component is connected to the perforated plate, the pillars can be inserted into the gap between adjacent tubes, with the baffle abutting against the limiting step or skirt. However, because the height of the pillar and the baffle is similar, the pillar cannot be inserted to the deepest point of the gap between adjacent tubes (there is a height difference consistent with the height of the limiting step or skirt). This results in a relatively poor heating effect and limited heating efficiency in the area of ​​the perforated plate that is not in direct contact with the heat-conducting component. In addition, the baffle is arranged along the periphery of the heating zone. To improve the deformation adaptability of the baffle and the outer periphery of the perforated plate, and to avoid overheating due to the baffle blocking the heating zone, some additional strip-shaped notches need to be added to the baffle. However, the distribution of the strip-shaped notches will also affect the heat dissipation of different areas. Furthermore, this heat-conducting component does not provide a temperature measurement and control structure, making it impossible to accurately control the heating temperature. Utility Model Content

[0004] Therefore, in order to solve the above problems, this utility model provides a heating device for a well plate for gene chip detection.

[0005] This utility model is achieved through the following technical solution: A heating device for a well plate used in gene chip detection includes: A heat conduction mechanism includes a heat conduction plate and a heat conduction seat detachably disposed on the top of the heat conduction plate. The heat conduction seat includes a base plate and a plurality of heat conduction pillars arranged on the top of the base plate. A ring of limiting pillars is disposed around the periphery of the heat conduction pillars, and the height of the limiting pillars is less than the height of the heat conduction pillars. The fixing mechanism includes a fixing plate fixed to the bottom of the heat-conducting plate, and a fixing bracket disposed at the bottom of the fixing plate; The heating mechanism includes a heating element disposed between the fixed plate and the heat-conducting plate; The temperature measuring mechanism includes a temperature probe disposed inside the heat-conducting plate; The temperature control mechanism includes a temperature control module mounted on the fixed bracket.

[0006] Preferably, the heat-conducting pillars are arranged in a matrix, and the limiting pillars are equally spaced around the outer periphery of the heat-conducting area, with the spacing between adjacent limiting pillars being the same as the spacing between adjacent heat-conducting pillars.

[0007] Preferably, the contact surface between the heat-conducting plate and the heating element is provided with a mounting hole, and the temperature probe is installed in the mounting hole.

[0008] Preferably, a silicone grease layer for defining the position of the heating element is further provided between the heat-conducting plate and the fixing plate, and a limiting hole for defining the position of the heating element is provided in the silicone grease layer, and the heating element is disposed in the limiting hole.

[0009] Preferably, the fixing bracket includes four guide columns disposed around the bottom of the fixing plate, and a base plate is disposed at the bottom of the guide columns, the base plate being parallel to the fixing plate.

[0010] Preferably, the upper surface of the base plate is further provided with a positioning bracket for installing the temperature control module. The positioning bracket includes four pillars fixed to the upper surface of the base plate and a positioning plate connected to the top of the pillars. The temperature control module is fixed to the bottom of the positioning plate.

[0011] Preferably, it further includes a housing disposed between the base plate and the substrate, the housing wrapping around the outer periphery of the base plate and the substrate.

[0012] Preferably, the top of the housing is provided with an opening, the base plate of the heat-conducting seat is fixed in the opening, the outer periphery of the opening is provided with a limiting groove for fixing the heat-conducting seat, and the outer periphery of the base plate of the heat-conducting seat is provided with a limiting block that matches the limiting groove.

[0013] Preferably, positioning posts are provided at the four corners of the inner circumferential surface of the housing, the bottom plate covers the bottom of the housing, and the bottom plate and the positioning posts are riveted together with screws.

[0014] Preferably, a wiring board is also provided on the top side of the base plate, and the wiring board is provided with wiring holes. The housing is provided with a clearance hole on the same side of the wiring board to avoid the wiring board.

[0015] The beneficial effects of this utility model's technical solution are mainly reflected in: 1. The heat-conducting pillars at the top of the heat-conducting plate are directly inserted into the gap between adjacent tubes of the orifice plate, so that the tube walls of each tube are fully and evenly heated. The bottom of the tubes of the orifice plate is heated by the base plate, which effectively increases the overall heating area of ​​the orifice plate. At the same time, the height difference between the limiting pillars and the heat-conducting pillars can offset the height difference caused by the limiting steps or skirts, thereby increasing the contact area between the heat-conducting pillars and the tubes, ensuring that the heating of each area of ​​the orifice plate is balanced and improving the heating efficiency.

[0016] 2. An embedded heating element is installed between the heat-conducting plate and the fixed plate to achieve connection and positioning between the heat-conducting plate, the fixed plate, and the heating element. The heating element can be limited by the silicone grease layer. On the one hand, the silicone grease layer has a certain viscosity, which generates viscous force and surface tension between the heat-conducting plate and the fixed plate, thereby effectively limiting the heating element and preventing it from moving during heating. On the other hand, the silicone grease material can also protect the heating element, preventing it from being accidentally displaced or damaged due to excessive stress. In addition, the silicone grease material has good thermal conductivity, which can ensure that the area in contact between the heat-conducting plate and the silicone grease layer can also be heated evenly and effectively.

[0017] 3. A temperature probe is installed inside the heat-conducting plate, positioned between the heat-conducting plate and the heating element, to detect the current heating temperature in real time. At the same time, the temperature control module controls the heating temperature in real time, forming a closed-loop temperature control system, thereby achieving efficient, uniform, and constant temperature heating of the object to be tested in the orifice plate.

[0018] 4. The heat-conducting base and heat-conducting plate adopt a detachable structure. The heat-conducting base can be replaced with a matching heat-conducting base according to different specifications of orifice plates, thus being compatible with multiple types of orifice plates and reducing equipment iteration costs. Attached Figure Description

[0019] Figure 1 This is a first-view perspective stereoscopic view of the heating device for the well plate used in gene chip detection. Figure 2 This is a stereoscopic view of the well plate heating device for gene chip detection from a second perspective. Figure 3 This is a second-view perspective perspective of the heating device for the well plate used in gene chip detection (the housing is omitted here). Figure 4 This is a top view of the heating device for the well plate used in gene chip detection; Figure 5This is a front view of the heating device for the well plate used in gene chip detection; Figure 6 yes Figure 5 Sectional view along the middle AA; Figure 7 This is a schematic diagram of the heating device for gene chip detection in the state where the base plate is separated. Detailed Implementation

[0020] To make the objectives, advantages, and features of this utility model clearer and more detailed, the following non-limiting description of preferred embodiments will be illustrated and explained. These embodiments are merely typical examples of applying the technical solutions of this utility model; any technical solutions formed by equivalent substitutions or equivalent transformations fall within the scope of protection claimed by this utility model.

[0021] It should also be stated that, in the description of the solution, the terms "center", "upper", "lower", "left", "right", "front", "rear", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of description and simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] Furthermore, the terms "first" and "second" in this solution are used for descriptive purposes only and should not be construed as indicating or implying a ranking of importance, or implicitly specifying the number of technical features shown. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In this utility model, "multiple" means two or more, unless otherwise explicitly specified.

[0023] This utility model discloses a heating device for a well plate used in gene chip detection, such as... Figures 1-6 As shown, it includes: The heat conduction mechanism includes a heat conduction plate 1 and a heat conduction seat 2 detachably disposed on the top of the heat conduction plate 1. The connection between the heat conduction plate 1 and the heat conduction seat 2 can be in various ways, such as screw fixing, snap-fit ​​connection, etc., which will not be elaborated here. When it is necessary to match different models of perforated plates (such as 24 holes, 48 ​​holes, 96 holes, 384 holes, etc.), it is only necessary to replace the heat conduction seat 2 that matches the current perforated plate, thereby improving the flexibility of the heating device and reducing the overall equipment iteration cost.

[0024] The heat-conducting base 2 includes a base plate 201 and a plurality of heat-conducting pillars 202 arranged on the top of the base plate 201. A ring of limiting pillars 203 is provided around the periphery of each heat-conducting pillar 202, and the height of the limiting pillars 203 is less than the height of the heat-conducting pillars 202. When the heat-conducting base 2 is engaged with the orifice plate, the heat-conducting pillars 202 on the top of the heat-conducting base 2 are inserted one-to-one into the gaps between adjacent tubes at the bottom of the orifice plate, heating the test object inside the hole through heat conduction through the tube wall. At the same time, the plurality of heat-conducting pillars 202 and the limiting pillars 203 divide the base plate into heating holes with the same number of holes as the orifice plate. At this time, the bottom of the orifice plate... The tubes are placed one-to-one in the heating holes. A ring of limiting posts 203 surrounding the heat-conducting post 202 abuts against the skirt of the outer periphery of the orifice plate. Therefore, when the height of the heat-conducting post 202 is greater than the height of the limiting post 203, the height difference caused by the skirt can be effectively offset, thereby increasing the contact area between the heat-conducting post 202 and the tube wall. In a preferred embodiment, the height difference between the limiting post 203 and the heat-conducting post 202 is equal to the height of the skirt of the orifice plate, and the height of the heat-conducting post 202 is equivalent to that of the tube at the bottom of the orifice plate, further increasing the contact area between the heat-conducting post 202 and the tube wall.

[0025] In one embodiment, the heat-conducting base 2 can be made of metal. By setting multiple metal heat-conducting pillars 202, the heat-conducting base 2 and the heat-conducting plate 1 will be controlled at the same temperature during preheating. Compared with the existing flat metal bath, the metal ratio is increased, which can bring a larger heat capacity, thereby effectively avoiding drastic temperature fluctuations when the component comes into contact with the cold liquid in the hole.

[0026] like Figure 3 , Figure 6 , Figure 7 As shown, the heating device for the well plate of gene chip detection also includes a fixing mechanism, which includes a fixing plate 3 fixed to the bottom of the heat-conducting plate 1 and a fixing bracket disposed at the bottom of the fixing plate 3.

[0027] like Figure 6 As shown, the heating device for the well plate of gene chip detection also includes a heating mechanism, which includes a heating element 4 disposed between the fixed plate 3 and the heat-conducting plate 1. In one embodiment, the heating element 4 may be a mica heating element 4.

[0028] like Figure 3 , Figure 6 , Figure 7As shown, the heating device for the well plate used in gene chip detection also includes a temperature measuring mechanism and a temperature control mechanism. The temperature measuring mechanism includes a temperature probe 5 disposed inside the heat-conducting plate 1, and the temperature control mechanism includes a temperature control module 11 disposed on the fixed bracket. The temperature probe 5 and the temperature control module 11 are connected by an electrical signal to monitor and control the heating temperature in real time to ensure constant temperature heating. In a preferred embodiment, a mounting hole is provided on the contact surface between the heat-conducting plate 1 and the heating element 4, and the temperature probe 5 is installed in the mounting hole.

[0029] like Figure 4 As shown, in some embodiments, the heat-conducting pillars 202 are arranged in a matrix, and the limiting pillars 203 are equally spaced around the outer periphery of the heat-conducting area. The spacing between adjacent limiting pillars 203 is the same as the spacing between adjacent heat-conducting pillars 202, so as to ensure that the heating holes separated by multiple heat-conducting pillars 202 and limiting pillars 203 on the substrate are of the same size, so as to match the tubes of the same size at the bottom of the perforated plate.

[0030] like Figure 6 As shown, in some embodiments, a silicone grease layer 6 for defining the position of the heating element 4 is further provided between the heat-conducting plate 1 and the fixing plate 3. A limiting hole 601 for defining the position of the heating element 4 is provided in the silicone grease layer 6. The heating element 4 is disposed in the limiting hole 601, thereby preventing the heating element 4 from moving during the heating process.

[0031] like Figure 3 , Figure 6 , Figure 7 As shown, in some embodiments, the fixed bracket includes four guide columns 7 arranged around the bottom of the fixed plate 3. A base plate 8 is also provided at the bottom of the guide columns 7. The base plate 8 is parallel to the fixed plate 3. A positioning bracket for installing the temperature control module 11 is also provided on the upper surface of the base plate 8. The positioning bracket includes four support columns 9 fixed on the upper surface of the base plate 8 and a positioning plate 10 connected to the top of the support columns 9. The temperature control module 11 is fixed on the top of the positioning plate 10, thereby ensuring that the heat conduction seat 2, the heat conduction plate 1, and the temperature control module 11 all move synchronously with the fixed bracket when the fixed bracket is raised and lowered.

[0032] like Figure 2 , Figure 6 , Figure 7As shown, in some embodiments, the heating device for the well plate of gene chip detection further includes a housing 12 disposed between the base plate 8 and the substrate 201. The housing 12 covers the outer periphery of the base plate 8 and the substrate 201. The top of the housing 12 is provided with an opening 1201. The substrate 201 of the heat-conducting seat 2 is fixed in the opening 1201. The outer periphery of the opening 1201 is provided with a limiting groove 1202 for fixing the heat-conducting seat 2. The limiting groove 1202 protrudes outward from the opening 1201. The outer periphery of the substrate 201 of the heat-conducting seat 2 is provided with a limiting block 204 that matches the limiting groove 1202. When the substrate 201 is fixed in the opening 1201, the limiting block 204 is embedded in the limiting groove 1202. The number, shape and position of the limiting groove 1202 and the limiting block 204 can be adjusted according to actual needs, which will not be described in detail here.

[0033] like Figure 6 , Figure 7 As shown, in some embodiments, positioning posts 1203 are respectively provided at the four corners of the inner circumferential surface of the housing 12, the bottom plate 8 covers the bottom of the housing 12, and the bottom plate 8 and the positioning posts 1203 are riveted together with screws, thereby fixing the bottom plate 8 to the housing 12.

[0034] like Figure 2 , Figure 3 , Figure 7 As shown, in some embodiments, a wiring board 13 is also provided on the top side of the base plate 8. The wiring board 13 is provided with wiring holes 1301. The housing 12 is provided with a clearance hole 1204 on the same side of the wiring board 13 to avoid the wiring board 13. In one embodiment, the length of the wiring board 13 is greater than the length of the clearance hole 1204, and the two sides of the wiring board 13 are fixed to the housing 12 on both sides of the clearance hole 1204 by screws.

[0035] This utility model has many other embodiments. All technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of this utility model.

Claims

1. A heating device for a well plate used in gene chip detection, characterized in that: include: The heat conduction mechanism includes a heat conduction plate (1) and a heat conduction seat (2) detachably disposed on the top of the heat conduction plate (1). The heat conduction seat (2) includes a base plate (201) and a plurality of heat conduction pillars (202) arranged on the top of the base plate (201). A ring of limiting pillars (203) is disposed around the periphery of the heat conduction pillars (202). The height of the limiting pillars (203) is less than the height of the heat conduction pillars (202). The fixing mechanism includes a fixing plate (3) fixed to the bottom of the heat-conducting plate (1) and a fixing bracket disposed at the bottom of the fixing plate (3); The heating mechanism includes a heating element (4) disposed between the fixed plate (3) and the heat-conducting plate (1); The temperature measuring mechanism includes a temperature measuring probe (5) disposed inside the heat-conducting plate (1); The temperature control mechanism includes a temperature control module (11) mounted on the fixed bracket.

2. The heating device for a well plate used in gene chip detection according to claim 1, characterized in that: The heat-conducting pillars (202) are arranged in a matrix, and the limiting pillars (203) are evenly spaced around the outer periphery of the heat-conducting area. The spacing between adjacent limiting pillars (203) is the same as the spacing between adjacent heat-conducting pillars (202).

3. The heating device for gene chip detection well plate according to claim 1, characterized in that: The heat-conducting plate (1) and the heating element (4) have mounting holes on their contact surfaces, and the temperature probe (5) is installed in the mounting holes.

4. The heating device for a well plate for gene chip detection according to claim 3, characterized in that: A silicone grease layer (6) for limiting the position of the heating element (4) is also provided between the heat-conducting plate (1) and the fixing plate (3). A limiting hole (601) for limiting the position of the heating element (4) is provided in the silicone grease layer (6). The heating element (4) is disposed in the limiting hole (601).

5. The heating device for gene chip detection well plate according to claim 1, characterized in that: The fixed bracket includes four guide posts (7) arranged around the bottom of the fixed plate (3), and a base plate (8) is also provided at the bottom of the guide posts (7), which is parallel to the fixed plate (3).

6. The heating device for a well plate for gene chip detection according to claim 5, characterized in that: The upper surface of the base plate (8) is also provided with a positioning bracket for installing the temperature control module (11). The positioning bracket includes four pillars (9) fixed on the upper surface of the base plate (8) and a positioning plate (10) connected to the top of the pillars (9). The temperature control module (11) is fixed on the top of the positioning plate (10).

7. The heating device for a well plate for gene chip detection according to claim 6, characterized in that: It also includes a housing (12) disposed between the base plate (8) and the substrate (201), the housing (12) covering the outer periphery of the base plate (8) and the substrate (201).

8. The heating device for a well plate for gene chip detection according to claim 7, characterized in that: The top of the housing (12) is provided with an opening (1201), the base plate (201) of the heat-conducting seat (2) is fixed in the opening (1201), the outer periphery of the opening (1201) is provided with a limiting groove (1202) for fixing the heat-conducting seat (2), and the outer periphery of the base plate (201) of the heat-conducting seat (2) is provided with a limiting block (204) that matches the limiting groove (1202).

9. The heating device for a well plate for gene chip detection according to claim 7, characterized in that: Positioning posts (1203) are respectively provided at the four corners of the inner circumferential surface of the housing (12). The bottom plate (8) covers the bottom of the housing (12), and the bottom plate (8) and the positioning posts (1203) are riveted together by screws.

10. The heating device for a well plate for gene chip detection according to claim 9, characterized in that: A wiring board (13) is also provided on one side of the top of the base plate (8). A wiring hole (1301) is provided on the wiring board (13). A clearance hole (1204) for avoiding the wiring board (13) is provided on the same side of the housing (12).

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