A PCB board clamp for biasing high accelerated stress test

CN224745010UActive Publication Date: 2026-09-11GUANGZHOU MEADVILLE ELECTRONICS
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Patent Information

Application Number
CN202521991739.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-16
Publication Date
2026-09-11
Estimated Expiration
2035-09-16

AI Technical Summary

Technical Problem

[0005]本实用新型的目的是:提供一种用于偏压高加速应力测试的PCB板夹具,解决目前缺乏专用的连接夹具而只能通过焊接测试线连接而导致的实际可靠性测试结果受到干扰的问题

Benefits of technology

本实用新型提供的一种用于偏压高加速应力测试的PCB板夹具,其包括安装组件、测试组件和盖合组件;通过与所述安装座弹性连接且滑设于所述安装通道的所述安装板中开设的放置槽放置PCB板,且在PCB板的重力作用下,所述第一弹簧受压压缩,所述安装板随之下降,以使得部分插设于所述接触孔的测试针插入所述放置槽中,从而使得测试针与PCB板上的测试网络焊盘实现连接,并通过测试线连接偏压高加速应力测试电阻系统,以将偏置电压引入PCB板中;并且通过盖合结构使所述盖板盖合所述安装通道的顶端并使得PCB板紧贴所述放置槽的槽底,以防止PCB板被测试针顶起而导致接触不良,而通过盖板上开设的第一透气孔可以使得PCB板充分暴露于高温高湿环境中,由此可通过所述用于偏压高加速应力测试的PCB板夹具夹持PCB板进行偏压高加速应力测试,以省去测试线与PCB板焊接的步骤,避免板面污染,由此减少测试过程中因板面污染导致相邻网络桥接的风险,确保测试结果的可靠性。

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Abstract

The utility model relates to a circuit board test technical field discloses a kind of PCB board clamps for bias high acceleration stress test, the placing groove being set in through mounting plate is placed PCB board, under the gravity of PCB board, first spring is compressed to make mounting plate descend, part test needle is inserted into placing groove and realizes connection with the test network pad on PCB board, and bias voltage is introduced into PCB board by test line;PCB board is tightly placed in the groove bottom of placing groove by lid structure, guarantee the contact of PCB board and test needle, PCB board is exposed in high temperature and high humidity environment by first air hole, whereby bias high acceleration stress test can be carried out by the PCB board clamps for bias high acceleration stress test clamping PCB board, to save the step of test line and PCB board welding, avoid board surface pollution, thereby reduce the risk of adjacent network bridging caused by board surface pollution in testing process, ensure the reliability of test result.
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Description

Technical Field

[0001] This utility model relates to the field of circuit board testing technology, and in particular to a PCB board fixture for bias high accelerated stress testing. Background Technology

[0002] With the continuous development of electronic technology, the PCB industry is moving towards higher precision and higher density, leading to increasingly higher demands for PCB product reliability testing. Product reliability testing involves simulating various real-world usage conditions and environments to comprehensively evaluate the product's tolerance to these conditions, ensuring that the product can stably perform its intended functions within a specified time and under specified conditions. Through reliability testing, potential defects and failures can be identified in advance, allowing for timely improvements and optimizations, enhancing product quality and reliability, reducing maintenance costs, and strengthening market competitiveness.

[0003] Traditional reliability testing methods often require lengthy observation and recording. High Accelerated Temperature and Humidity Stress Testing (HAST), however, accelerates the aging process, simulating the effects of long-term product use in a shorter time, thus significantly shortening the testing cycle and improving R&D efficiency. To further shorten the testing cycle and improve efficiency, a bias voltage can be introduced during HAST testing. This causes the PCB board under test to experience both high temperature and high humidity, as well as electrical stress. This combined effect of dual stress aims to accelerate the corrosion process inside the device, thereby shortening the testing cycle and improving efficiency.

[0004] To introduce bias voltage into the PCB under test, the test network pads (i.e., test points) of the PCB under test need to be connected to the bias high-accelerated stress test resistor system. Currently, the connection method involves manually soldering the test leads to the test network pads of the PCB under test using a soldering iron, and then connecting the test leads to the bias high-accelerated stress test resistor system. The disadvantages of this method are that the pads are small, requiring a high level of expertise from the soldering personnel, and the rosin and solder paste residue left on the board surface during manual soldering can cause ion migration on the contaminated board surface after exposure to high temperature and humidity, easily leading to short circuits and interfering with the actual reliability test results of the product. Utility Model Content

[0005] The purpose of this invention is to provide a PCB board fixture for bias high accelerated stress testing, which solves the problem that the actual reliability test results are interfered with by the lack of dedicated connection fixtures and the need to connect by soldering test leads.

[0006] To achieve the above objectives, this utility model provides a PCB board fixture for bias high accelerated stress testing, which includes a mounting assembly, a testing assembly, and a cover assembly. The mounting assembly includes a base and a mounting seat; the base has multiple insertion holes penetrating its upper and lower surfaces; the mounting seat is fixedly disposed above the base at intervals, and the mounting seat has mounting channels penetrating its upper and lower surfaces. The test assembly includes a mounting plate, a first spring, and multiple test probes; the mounting plate is slidably disposed in the mounting channel and is elastically connected to the mounting base through the vertically arranged first spring; the mounting plate is provided with a number of placement slots for placing PCB boards at intervals, and the bottom of the placement slots is provided with a number of contact holes that are the same as the number of insertion holes and are arranged in a one-to-one correspondence. The test probe is inserted into the insertion hole and connected to the base. The bottom end of the test probe is connected to the test wire and conducts electricity. The top end of the test probe passes through the contact hole at least partially, so that when the mounting plate is subjected to force and drops, at least part of the test probe is inserted into the placement slot. The cover assembly includes a cover plate and a cover structure; the cover plate is hinged to one end of the mounting base and has multiple first vent holes penetrating its upper and lower surfaces; the cover structure is used to cover the top of the mounting channel with the cover plate and make the PCB board fit tightly against the bottom of the placement slot.

[0007] Furthermore, the test needle includes a needle body, a retaining ring, and a second spring; The needle body is vertically inserted into the insertion hole, and at least part of the needle body passes through the contact hole, such that when the mounting plate is subjected to force and descends, at least part of the needle body is inserted into the placement groove. The fixing ring is fixedly sleeved on the outer periphery of the needle body, and the fixing ring is located between the mounting plate and the base; The second spring is vertically sleeved on the outer periphery of the needle body, and the two ends of the second spring are respectively connected to the fixing ring and the base.

[0008] Furthermore, the test assembly also includes a guide plate; The guide plate is spaced below the mounting plate and is fixedly connected to the mounting base; the guide plate has a number of guide holes that correspond one-to-one with the contact holes; the test needle passes through the guide holes and the contact holes in sequence.

[0009] Furthermore, the upper surface edge of the guide plate is provided with a plurality of first connecting grooves spaced apart; the lower surface of the mounting plate is provided with a number of second connecting grooves the same as the number of first connecting grooves, and the second connecting grooves and the first connecting grooves are arranged in a one-to-one correspondence in the vertical direction; Each of the first connecting slots is provided with a first spring, and the two ends of the first spring are respectively connected to the first connecting slot and the second connecting slot.

[0010] Furthermore, the cover structure includes a snap-fit; The upper surface of the mounting base is defined to have a first direction; one end of the mounting base in the first direction extends outward and is provided with a locking block, and the other end is fixedly provided with a hinge seat; One end of the cover plate is hinged to the hinge seat, and the other end is rotatably provided with the buckle; the buckle engages with the locking block.

[0011] Furthermore, the cover plate includes an outer plate and an inner plate; The outer plate is hinged to the hinge seat, and a fixing groove with a shape matching the mounting channel is formed on the side surface of the outer plate opposite to the mounting seat. The shape of the inner plate matches the fixing groove, and the inner plate is fixed in the fixing groove; The inner plate has a number of protrusions on the side of the inner plate facing away from the outer plate, which are the same as the number of protrusions in the placement groove. When the buckle engages with the card block, at least a portion of the protrusion is inserted into the placement groove.

[0012] Furthermore, the cover structure also includes a third spring; The cover plate has an opening at one end away from the hinge seat, and the opening penetrates the side surface and the top surface of the cover plate away from the hinge seat; a third connecting groove is provided at the bottom of the opening. The buckle includes a connecting part, a snap-fit ​​part, and an extension part; the connecting part is connected to the inner walls of both sides of the opening in a second direction by a pin; the snap-fit ​​part and the extension part are fixedly connected to the connecting part, and the snap-fit ​​part and the extension part are perpendicular to each other and extend away from the connecting part. The snap-fit ​​part snaps into the snap-fit ​​block; a fourth connecting groove is provided on the side surface of the extension part opposite to the third connecting groove; The two ends of the third spring are respectively connected to the third connecting groove and the fourth connecting groove; The second direction is perpendicular to the first direction.

[0013] Furthermore, a second vent hole is provided at the bottom of the placement groove, and the second vent hole penetrates the lower surface of the mounting plate.

[0014] Furthermore, the guide plate has multiple third vent holes penetrating its upper and lower surfaces.

[0015] Furthermore, the base includes a base plate and an extension block; The lower surface of the extension block is provided with a wiring groove, the bottom of the wiring groove is provided with the insertion hole, and the insertion hole penetrates the upper surface of the extension block. The base plate is circumferentially disposed around the bottom end of the extension block and is fixedly connected to the extension block.

[0016] Compared with the prior art, the PCB board fixture for bias high-acceleration stress testing provided by this utility model has the following advantages: This utility model provides a PCB board fixture for bias high accelerated stress testing, comprising a mounting assembly, a testing assembly, and a cover assembly. A PCB board is placed in a placement slot within a mounting plate that is elastically connected to the mounting base and slides within the mounting channel. Under the weight of the PCB board, a first spring is compressed, causing the mounting plate to descend. This allows a portion of the test pins inserted into the contact holes to be inserted into the placement slot, thereby connecting the test pins to the test network pads on the PCB board. The test pins are then connected to a bias high accelerated stress testing resistor system via test leads to introduce a bias voltage into the PCB. In board B; and through the cover structure, the cover plate covers the top of the mounting channel and makes the PCB board tightly attached to the bottom of the placement slot, so as to prevent the PCB board from being lifted by the test probe and causing poor contact. The first vent hole opened on the cover plate allows the PCB board to be fully exposed to the high temperature and high humidity environment. Thus, the PCB board can be clamped by the PCB board fixture for bias high accelerated stress testing, so as to eliminate the step of soldering the test line to the PCB board, avoid board surface contamination, thereby reducing the risk of adjacent network bridging due to board surface contamination during the test and ensuring the reliability of the test results. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural schematic diagram of a PCB board fixture for bias high-acceleration stress testing according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the disassembly structure of a PCB board fixture for bias high accelerated stress testing according to an embodiment of this utility model. Figure 3 This is a three-dimensional structural diagram of the PCB board fixture for bias high accelerated stress testing in an embodiment of the present invention, without the mounting plate. Figure 4 This is a top view schematic diagram of a PCB board fixture for bias high accelerated stress testing according to an embodiment of the present invention; Figure 5 yes Figure 4 Schematic diagram of the cross section of AA; Figure 6 yes Figure 4 Cross-sectional view of BB; Figure 7 yes Figure 6 Enlarged view of region A in the middle; Figure 8 yes Figure 4 Cross-sectional view of CC; Figure 9 Figure 8 A magnified view of region B in the middle.

[0018] In the diagram, 100 is a PCB fixture for bias high-acceleration stress testing; 200 is a PCB board; 1 is a mounting assembly; 11 is a base; 110 is a plug hole; 111 is a base plate; 112 is an extension block; 1120 is a wiring groove; 12 is a mounting seat; 120 is a mounting channel; 121 is a mounting block; 122 is a locking block; 123 is a hinge seat; 13 is a mounting post; 2 is a test assembly; 21 is a mounting plate; 210 is a placement groove; 2101 is a contact hole; 2102 is a second connecting groove; 2103 is a second vent hole; 211 is a positioning pin; 22 is a first spring; 23 is a test probe; 231 is a test pin. 1. Needle body; 232. Fixing ring; 233. Second spring; 24. Test line; 25. Guide plate; 250. Guide hole; 251. First connecting groove; 252. Third vent hole; 3. Cover assembly; 31. Cover plate; 310. First vent hole; 3101. Opening; 3102. Third connecting groove; 311. Outer plate; 3110. Fixing groove; 312. Inner plate; 3121. Protrusion; 32. Cover structure; 321. Buckle; 3210. Fourth connecting groove; 3211. Connecting part; 3212. Snap-fit ​​part; 3213. Extension part; 322. Third spring; 323. Pin. Detailed Implementation

[0019] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0020] In the description of this utility model, it should be understood that the term "test network pad" used in this utility model refers to the pad on the PCB board. Its specific setting is related to the design of the PCB board and belongs to the existing mature technology, which will not be elaborated here.

[0021] like Figures 1-9 As shown, a PCB board fixture 100 for bias high accelerated stress testing according to an embodiment of the present invention includes a mounting assembly 1, a testing assembly 2, and a cover assembly 3. The mounting assembly 1 includes a base 11 and a mounting base 12; the base 11 has a plurality of insertion holes 110 extending through its upper and lower surfaces; the mounting base 12 is fixedly disposed above the base 11 at intervals, and the mounting base 12 has mounting channels 120 extending through its upper and lower surfaces. The test assembly 2 includes a mounting plate 21, a first spring 22, and multiple test pins 23; the mounting plate 21 is slidably disposed on the mounting channel 120 and is elastically connected to the mounting base 12 by the vertically arranged first spring 22; the mounting plate 21 has a plurality of placement slots 210 for placing PCB boards at intervals, and the bottom of the placement slots 210 has a number of contact holes 2101 that are the same as the number of insertion holes 110 and are arranged in a one-to-one correspondence. The test pin 23 is inserted into the insertion hole 110 and connected to the base 11. The bottom end of the test pin 23 is connected to the test wire 24 and conducts through it. The top end of the test pin 23 is at least partially inserted through the contact hole 2101, so that when the mounting plate 21 is subjected to force and drops, at least part of the test pin 23 is inserted into the placement groove 210. The cover assembly 3 includes a cover plate 31 and a cover structure 32; the cover plate 31 is hinged to one end of the mounting base 12 and has a plurality of first vent holes 310 penetrating its upper and lower surfaces; the cover structure 32 is used to cover the top of the mounting channel 120 with the cover plate 31 and make the PCB board 200 fit tightly against the bottom of the placement groove 210.

[0022] Based on the above technical solution, a PCB board is placed in a placement slot 210 in the mounting plate 21, which is elastically connected to the mounting base 12 and slides in the mounting channel 120. Under the gravity of the PCB board, the first spring 22 is compressed, and the mounting plate 21 descends accordingly, so that some of the test pins 23 inserted in the contact holes 2101 are inserted into the placement slot 210. This allows the test pins 23 to connect with the test network pads on the PCB board, and connect to a bias high-acceleration stress test resistor system via test leads 24 to introduce bias voltage into the PCB board. The cover plate 3 is then closed by the cover structure 32. 1. The top of the mounting channel 120 is covered and the PCB board 200 is pressed tightly against the bottom of the placement slot 210 to prevent the PCB board from being lifted by the test pin 23 and causing poor contact. The first vent hole 310 on the cover plate 31 allows the PCB board 200 to be fully exposed to the high temperature and high humidity environment. Thus, the PCB board 200 can be clamped by the PCB board fixture 100 for bias high accelerated stress testing to perform bias high accelerated stress testing, thereby eliminating the step of soldering the test lines to the PCB board and avoiding board surface contamination. This reduces the risk of adjacent network bridging due to board surface contamination during the test and ensures the reliability of the test results.

[0023] Preferably, such as Figures 1-3 As shown, in this embodiment, multiple placement slots 210 are spaced apart along the first direction X, so that the mounting plate 21 has multiple slots for mounting PCB boards.

[0024] Preferably, such as Figures 1-3As shown, in this embodiment, the placement slot 210 is provided with two rows of insertion holes 110 spaced apart. Each row of insertion holes 110 includes multiple insertion holes 110 spaced apart along the second direction Y, to match the test network pads spaced apart along two directions in common PCB boards. In other embodiments, the insertion holes 110 can be set according to the test requirements and the arrangement of the pads on the PCB board under test, which will not be elaborated here. Furthermore, the mounting plate 21 slides in the mounting channel 120 and can be removed at any time to replace it with a mounting plate 21 of other specifications.

[0025] Preferably, such as Figures 1-3 As shown, in order to smoothly accommodate the PCB board, the placement slot 210 is configured to have a size larger than the PCB board in the first direction X or the second direction Y. In order to stably place the PCB board in the placement slot 210, at least two spaced placement holes are provided in the placement slot 210, and positioning pins 211 for matching the positioning holes of the PCB board are placed in any two placement holes.

[0026] Furthermore, such as Figure 4 , Figure 6 and Figure 7 As shown, the test needle 23 includes a needle body 231, a retaining ring 232, and a second spring 233; The needle body 231 is vertically inserted into the insertion hole 110, and at least part of the needle body 231 passes through the contact hole 2101, such that when the mounting plate 21 is subjected to force and descends, at least part of the needle body 231 is inserted into the placement groove. The fixing ring 232 is fixedly sleeved on the outer periphery of the needle body 231, and the fixing ring 232 is located between the mounting plate 21 and the base 11; The second spring 233 is vertically sleeved on the outer periphery of the needle body 231, and the two ends of the second spring 233 are respectively connected to the fixing ring 232 and the base 11.

[0027] It is understandable that the needle body 231 and the base 11 are elastically connected by a fixing ring 232 fixedly sleeved on the outer periphery of the needle body 231. Compared with fixing the needle body 231 to the base 11, elastic connection of the needle body 231 to the base 11 has the following advantages: First, when the cover plate 31 is closed and acts on the PCB board 200 to make it fit tightly against the bottom of the placement groove 210, the second spring 233 is compressed, causing the needle body 231 to drop slightly to buffer the impact and avoid the tip of the needle body 231 from causing a large impact on the PCB board 200 and thus causing damage. Second, after the cover plate 31 is closed, the upward elastic force of the second spring 233 keeps the needle body 231 in contact with the PCB board 200, so as to ensure contact between the needle body 231 and the PCB board 200 when the cover plate 31 cannot be pressed down due to loosening or other reasons.

[0028] Furthermore, such as Figure 4 , Figure 6 and Figure 7 As shown, since the test needle 23 has a certain length and needs to withstand the impact when the cover plate 31 closes, in order to keep the test needle 23 moving stably in the vertical direction, the test assembly 2 also includes a guide plate 25; The guide plate 25 is spaced below the mounting plate 21 and is fixedly connected to the mounting base 12; the guide plate 25 has a number of guide holes 250 that are the same as the number of contact holes 2101 and are arranged in a one-to-one correspondence; the test needle 23 passes through the guide hole 250 and the contact hole 2101 in turn.

[0029] Preferably, such as Figure 1 As shown, in order to achieve a fixed connection between the guide plate 25 and the mounting base 12, a mounting block 121 is fixedly provided at the bottom of the mounting channel 120. The two mounting blocks 121 are horizontally arranged and extend relative to each other, and the guide plate 25 is fixedly mounted on the mounting block 121.

[0030] Furthermore, such as Figure 8 As shown, to facilitate the elastic connection between the mounting plate 21 and the mounting base 12 via the first spring 22, a plurality of first connecting grooves 251 are spaced apart on the upper surface edge of the guide plate 25; a number of second connecting grooves 2102, the same number as the first connecting grooves 251, are opened on the lower surface of the mounting plate 21, and the second connecting grooves 2102 and the first connecting grooves 251 are arranged in a one-to-one correspondence in the vertical direction; Each of the first connecting slots 251 is provided with a first spring 22, and the two ends of the first spring 22 are respectively connected to the first connecting slot 251 and the second connecting slot 2102.

[0031] Furthermore, such as Figure 4 , Figure 8 and Figure 9 As shown, the cover structure 32 is designed to cover the top of the mounting channel 120 with the cover plate 31; the cover structure 32 includes a snap fastener 321. The upper surface of the mounting base 12 is defined to have a first direction X; one end of the mounting base 12 in the first direction X extends outward and is provided with a locking block 122, and the other end is fixedly provided with a hinge seat 123; One end of the cover plate 31 is hinged to the hinge seat 123, and the other end is rotatably provided with the buckle 321; the buckle 321 is engaged with the locking block 122.

[0032] Furthermore, such as Figure 4 , Figure 6 and Figure 7 As shown, to specifically achieve the purpose of the cover plate 31 covering the top of the mounting channel 120 and making the PCB board 200 tightly attached to the bottom of the placement groove 210; the cover plate 31 includes an outer plate 311 and an inner plate 312; the outer plate 311 is hinged to the hinge seat 123, and a fixing groove 3110 with a shape matching the mounting channel 120 is opened on the side surface of the outer plate 311 opposite to the mounting seat 12; The shape of the inner plate 312 matches the fixing groove 3110, and the inner plate 312 is fixed in the fixing groove 3110; The inner plate 312 has outward protrusions on the side surface facing away from the outer plate 311, with the same number of protrusions 3121 as the placement groove 210; When the buckle 321 engages with the block 122, at least a portion of the protrusion 3121 is inserted into the placement groove 210.

[0033] It should be noted that by inserting at least a portion of the protrusions 3121 into the placement groove 210, the portion of the protrusions 3121 inserted into the placement groove 210 presses down on the PCB board, thereby making the PCB board tightly adhere to the bottom of the placement groove 210, thus ensuring contact between the PCB board and the test probe 23.

[0034] Furthermore, such as Figure 6 and Figure 8 As shown, the cover structure 32 also includes a third spring 322; The cover plate 31 has an opening 3101 at one end away from the hinge seat 123. The opening 3101 penetrates the side surface and the top surface of the cover plate 31 away from the hinge seat 123. A third connecting groove 3102 is provided at the bottom of the opening 3101. The buckle 321 includes a connecting part 3211, a snap-fit ​​part 3212, and an extension part 3213; the connecting part 3211 is connected to the inner walls of both sides of the opening 3101 in the second direction Y by a pin 323; the snap-fit ​​part 3212 and the extension part 3213 are fixedly connected to the connecting part 3211, and the snap-fit ​​part 3212 and the extension part 3213 are perpendicular to each other and extend in a direction away from the connecting part 3211; The snap-fit ​​portion 3212 snaps into the snap-fit ​​block 122; the extension portion 3213 has a fourth connecting groove 3210 on the side surface opposite to the third connecting groove 3102; The two ends of the third spring 322 are respectively connected to the third connecting groove 3102 and the fourth connecting groove 3210; Wherein, the second direction Y is perpendicular to the first direction X.

[0035] It is understood that the connecting part 3211 of the buckle 321 is connected to the inner walls of both sides of the opening 3101 in the second direction Y by the pin 323, so as to realize the rotational connection between the buckle 321 and the cover plate 31. The cover plate 31 is connected to the mounting base 12 by the engagement of the engaging part 3212 and the engaging block 122. Furthermore, to improve the reliability of the latching and prevent accidental failure of the latch 321, an extension 3213 perpendicular to the latching portion 3212 is provided, and a third spring 322 connects the extension 3213 to the cover plate 31. When the latch 321 is engaged with the latch block 122, the third spring 322 is in its natural state. If the latching portion 3212 rotates and tends to disengage from the latch block 122, the rotation of the latching portion 3212 will synchronously drive the extension 3213 to rotate, compressing the third spring 322. The third spring 322 provides a counterforce to the extension 3213 to suppress the rotation of the latching portion 3212, preventing accidental separation of the latching portion 3212 from the latch block 122. When it is actually necessary for the latching portion 3212 to separate from the latch block 122, a larger force can be applied for separation.

[0036] Furthermore, such as Figures 1-3 As shown, in order to improve the air permeability of the placement groove 210 and make the test PCB board 200 fully contact the test environment, a second air vent 2103 is also provided at the bottom of the placement groove 210, and the second air vent 2103 penetrates the lower surface of the mounting plate 21.

[0037] Similarly, in order to improve the air permeability of the placement slot 210 and ensure that the test PCB board 200 is in full contact with the test environment, the guide plate 25 is provided with a plurality of third air holes 252 penetrating its upper and lower surfaces.

[0038] Furthermore, such as Figure 5 , Figure 6 and Figure 8 As shown, the base 11 includes a base plate 111 and an extension block 112; The lower surface of the extension block 112 is provided with a wiring groove 1120, the bottom of the wiring groove 1120 is provided with a plug hole 110, and the plug hole 110 penetrates the upper surface of the extension block 112. The base plate 111 is circumferentially disposed around the bottom outer periphery of the extension block 112 and is fixedly connected to the extension block 112.

[0039] It is understandable that, since the bottom end of the test pin 23 needs to be connected to the test line 24, a wiring groove 1120 is opened on the lower surface of the extension block 112 to provide sufficient space for connection and wiring; and in order to make the base 11 have sufficient stability, the base plate 111 is arranged around the extension block 112 to increase the overall contact area between the base 11 and the placement platform.

[0040] Preferably, in order to achieve the mounting base 12 being fixedly disposed above the base 11 at intervals, the mounting assembly 1 further includes a plurality of mounting posts 13; the plurality of mounting posts 13 are arranged at intervals along the edge of the mounting base 12, and the two ends of the mounting posts 13 are respectively fixedly connected to the base 11 and the mounting base 12.

[0041] The working process of this utility model is as follows: The PCB board 200 is placed in the placement slot 210. The mounting plate 21 is compressed by the gravity of the PCB board 200, causing the first spring 22 to drop. Part of the test pins 23 are inserted into the placement slot 210 and contact the pads of the PCB board 200. The bias voltage is introduced into the PCB board 200 by the test system through the test line 24.

[0042] The cover plate 31 covers the top of the mounting channel 120, the buckle 321 engages with the buckle block 122, and part of the protrusion 3121 is inserted into the placement groove 210, so that the PCB board 200 is close to the bottom of the placement groove 210 and keeps in contact with the test probe 23.

[0043] In summary, this utility model provides a PCB board fixture 100 for bias high accelerated stress testing, comprising a mounting assembly 1, a testing assembly 2, and a cover assembly 3. A PCB board is placed in a placement groove 210 formed in a mounting plate 21 that is elastically connected to the mounting base 12 and slides in the mounting channel 120. Under the weight of the PCB board, the first spring 22 is compressed, causing the mounting plate 21 to descend. This allows a portion of the test pins 23 inserted into the contact holes 2101 to be inserted into the placement groove 210, thereby connecting the test pins 23 to the test network pads on the PCB board. The test pins 23 are then connected to a bias high accelerated stress testing resistor system via test leads 24 to conduct the bias test. The test leads are pressed into the PCB board; and the cover plate 31 covers the top of the mounting channel 120 through the cover structure 32, so that the PCB board 200 is in close contact with the bottom of the placement groove 210, to prevent the PCB board from being lifted by the test leads 23 and causing poor contact. The first vent hole 310 on the cover plate 31 allows the PCB board 200 to be fully exposed to the high temperature and high humidity environment. Thus, the PCB board 200 can be clamped by the PCB board fixture 100 for bias high accelerated stress testing to perform bias high accelerated stress testing, thereby eliminating the step of soldering the test leads to the PCB board and avoiding board surface contamination. This reduces the risk of adjacent network bridging due to board surface contamination during the test and ensures the reliability of the test results.

[0044] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A PCB board fixture for bias high-acceleration stress testing, characterized in that, Includes mounting components, testing components, and fitting components; The mounting assembly includes a base and a mounting seat; the base has multiple insertion holes penetrating its upper and lower surfaces; the mounting seat is fixedly disposed above the base at intervals, and the mounting seat has mounting channels penetrating its upper and lower surfaces. The test assembly includes a mounting plate, a first spring, and multiple test probes; the mounting plate is slidably disposed in the mounting channel and is elastically connected to the mounting base through the vertically arranged first spring; the mounting plate is provided with a number of placement slots for placing PCB boards at intervals, and the bottom of the placement slots is provided with a number of contact holes that are the same as the number of insertion holes and are arranged in a one-to-one correspondence. The test probe is inserted into the insertion hole and connected to the base. The bottom end of the test probe is connected to the test wire and conducts electricity. The top end of the test probe passes through the contact hole at least partially, so that when the mounting plate is subjected to force and drops, at least part of the test probe is inserted into the placement slot. The cover assembly includes a cover plate and a cover structure; the cover plate is hinged to one end of the mounting base and has multiple first vent holes penetrating its upper and lower surfaces; the cover structure is used to cover the top of the mounting channel with the cover plate and make the PCB board fit tightly against the bottom of the placement slot.

2. The PCB board fixture for bias high-acceleration stress testing as described in claim 1, characterized in that, The test needle includes a needle body, a retaining ring, and a second spring; The needle body is vertically inserted into the insertion hole, and at least part of the needle body passes through the contact hole, such that when the mounting plate is subjected to force and descends, at least part of the needle body is inserted into the placement groove. The fixing ring is fixedly sleeved on the outer periphery of the needle body, and the fixing ring is located between the mounting plate and the base; The second spring is vertically sleeved on the outer periphery of the needle body, and the two ends of the second spring are respectively connected to the fixing ring and the base.

3. The PCB board fixture for bias high-acceleration stress testing as described in claim 1, characterized in that, The test assembly also includes a guide plate; The guide plate is spaced below the mounting plate and is fixedly connected to the mounting base; the guide plate has a number of guide holes that correspond one-to-one with the contact holes; the test needle passes through the guide holes and the contact holes in sequence.

4. The PCB board fixture for bias high-acceleration stress testing as described in claim 3, characterized in that, The upper surface edge of the guide plate is provided with a plurality of first connecting grooves spaced apart; the lower surface of the mounting plate is provided with a number of second connecting grooves the same as the number of first connecting grooves, and the second connecting grooves and the first connecting grooves are arranged in a vertical direction in a one-to-one correspondence; a first spring is provided in each of the plurality of first connecting grooves, and the two ends of the first springs are respectively connected to the first connecting groove and the second connecting groove.

5. The PCB board fixture for bias high-acceleration stress testing as described in claim 1, characterized in that, The cover structure includes a snap-fit; The upper surface of the mounting base is defined to have a first direction; one end of the mounting base in the first direction extends outward and is provided with a locking block, and the other end is fixedly provided with a hinge seat; One end of the cover plate is hinged to the hinge seat, and the other end is rotatably provided with the buckle; the buckle engages with the locking block.

6. The PCB board fixture for bias high-acceleration stress testing as described in claim 5, characterized in that, The cover plate includes an outer plate and an inner plate; The outer plate is hinged to the hinge seat, and a fixing groove with a shape matching the mounting channel is formed on the side surface of the outer plate opposite to the mounting seat. The shape of the inner plate matches the fixing groove, and the inner plate is fixed in the fixing groove; The inner plate has a number of protrusions on the side of the inner plate facing away from the outer plate, which are the same as the number of protrusions in the placement groove. When the buckle engages with the card block, at least a portion of the protrusion is inserted into the placement groove.

7. The PCB board fixture for bias high-acceleration stress testing as described in claim 5, characterized in that, The cover structure also includes a third spring; The cover plate has an opening at one end away from the hinge seat, and the opening penetrates the side surface and the top surface of the cover plate away from the hinge seat; a third connecting groove is provided at the bottom of the opening. The buckle includes a connecting part, a snap-fit ​​part, and an extension part; the connecting part is connected to the inner walls of both sides of the opening in a second direction by a pin; the snap-fit ​​part and the extension part are fixedly connected to the connecting part, and the snap-fit ​​part and the extension part are perpendicular to each other and extend away from the connecting part. The snap-fit ​​part snaps into the snap-fit ​​block; a fourth connecting groove is provided on the side surface of the extension part opposite to the third connecting groove; The two ends of the third spring are respectively connected to the third connecting groove and the fourth connecting groove; The second direction is perpendicular to the first direction.

8. The PCB board fixture for bias high-acceleration stress testing as described in claim 1, characterized in that, The bottom of the placement groove is also provided with a second vent hole, which penetrates the lower surface of the mounting plate.

9. The PCB board fixture for bias high-acceleration stress testing as described in claim 3, characterized in that, The guide plate has multiple third ventilation holes that penetrate its upper and lower surfaces.

10. The PCB board fixture for bias high-acceleration stress testing as described in claim 1, characterized in that, The base includes a base plate and an extension block; The lower surface of the extension block is provided with a wiring groove, the bottom of the wiring groove is provided with the insertion hole, and the insertion hole penetrates the upper surface of the extension block. The base plate is circumferentially disposed around the bottom end of the extension block and is fixedly connected to the extension block.