Ceramic multilayer component with improved functional stability in the event of cracking.

Abstract

Ceramic multilayer component, comprising: a component body (110) with spaced-apart side surfaces (112) and circumferentially extending surfaces (114) that connect the side surfaces (112) to each other; internal electrodes (120) which are arranged in the longitudinal direction of the component body (110) in the component body (110); outer electrodes (130) with a front section (131a) covering the side surfaces (112) and with a band section (131b) extending from the front section (131a) and covering sections of the circumferentially extending surfaces (114); and Crack guidance patterns (140) arranged in the component body (110) and guiding the growth direction of a crack that has been generated by the circumferentially extending surfaces (114), so that the crack (C) is directed in the direction of the side surface (112), the crack propagation pattern (140) comprises: a plate without broken sections as a first metal sample (142); and a second metal pattern (144) with several gaps (144a) at fixed intervals in the longitudinal direction, wherein the second metal pattern (144) is arranged such that it is closer to the circumferentially extending surface (114) compared to the first metal pattern (142).

Description

Background of the invention 1. Technical field

[0001] The present invention relates to a ceramic multilayer component, and more particularly to a ceramic multilayer component capable of preventing deterioration of its function caused by the generation of a crack. 2. Description of the state of the art

[0002] A chip component such as a thin-film multilayer ceramic capacitor (MLCC) is constructed to include a device body, internal electrodes, external electrodes, and the like. The device body has a structure in which a plurality of electrical layers, called green sheets, are stacked in multiple layers, and internal electrodes are provided on the electrical layers. In addition, the external electrodes have a structure in which they cover both end portions of an outer portion of the device body while being electrically connected to the internal electrodes.

[0003] Generally, since the ceramic multilayer component is designed primarily to improve its properties, it is relatively vulnerable to external physical pressure or shock, thermal stress, other vibrations, or the like. Accordingly, when a physical or thermal shock is applied to the ceramic multilayer component, a crack is generated in the component body. The crack is generally generated on a surface of the component body adjacent to a distal end portion of the outer electrode and propagates to an inner portion of the component body. If the crack propagates to an active region of the component body, the ceramic multilayer component struggles to perform its function.

[0004] For example, publication KR 10 2005 0 093 879 A shows a ceramic multilayer capacitor in which a plurality of layers made of a dielectric ceramic are arranged one upon the other. At least one internal electrode is arranged between the layers along the longitudinal direction of the ceramic layers. An external electrode is formed at each end of the layer stack, which is connected to the internal electrode. A reinforcement pattern is formed along a longitudinal direction of the ceramic layers. This structure increases the mechanical stability and service life of the capacitor because the formation of a crack between the outer electrode and the inner electrode can be prevented.

[0005] JP H08-316 086 A describes a ceramic multilayer capacitor in which internal electrodes are applied inside a sintered ceramic body. In addition, dummy electrodes made of the same electrode material as the internal electrodes are arranged at a fixed distance from the internal electrodes in a stress relief layer of the ceramic body. This structure allows internal stresses that occur due to the decreasing temperature after sintering to be reduced.

[0006] JP 2005-252 104 A describes a ceramic multilayer capacitor in which cracks arising due to thermal or mechanical stresses develop along a predetermined crack path. This prevents the cracks from extending to an internal electrode of the capacitor. For this purpose, dummy electrodes are inserted inside the capacitor to prevent crack formation toward the internal electrode.

[0007] JP 2002-75 780 A discloses an electronic component designed as a ceramic multilayer capacitor. Ceramic layers and internal electrodes are arranged alternately in an active layer. Outside the active region, additional metal layers are provided as reinforcement layers to improve the component's stability against mechanical or thermal stresses.

[0008] US 2010 / 0002356 A1 describes a monolithic ceramic electronic component. Dummy conductors are inserted within the component's ceramic body to improve the adhesion of external electrodes attached to the side surfaces of the ceramic body.

[0009] To prevent damage to the chip component due to cracking, a technology has been proposed to enable the outer electrode to have a structure capable of absorbing external shock. To this end, the outer electrode may have a structure including an inner metal layer directly covering the component body, an outer metal layer exposed to the outside, and an interlayer sandwiched between the inner metal layer and the outer metal layer. However, since the interlayer is made of a composite material of a metal and a polymer resin, the polymer resin is thermally decomposed during a reflow process or a wave soldering process for attaching the chip component, so that the inner metal layer and the interlayer are separated from each other, creating an internal cavity.The phenomenon of cavity generation and delamination described above, which is a problem of the chip component itself rather than a problem in the operation of an electronic device in which the chip component is mounted, deteriorates the function of the chip component.

[0010] Another method involves providing a reinforcement pattern in the device body adjacent to a point where cracks are frequently generated to prevent crack growth. However, since the number of multilayer patterns in the device body is increased to implement the reinforcement pattern described above, the cost required for device manufacturing increases and the thickness of a dielectric is relatively reduced, making it difficult to achieve high capacitance.

[0011] Prior art document: Patent Document 1: Korean Patent Application Laid-Open KR 10 2006 0 047 733 A. Summary of the invention

[0012] The present invention is based on the object of providing a ceramic multilayer component which is capable of maintaining its function even if a crack occurs due to an external impact.

[0013] To achieve this object, a ceramic multi-layer component is provided, comprising: a component body having spaced-apart side surfaces and circumferentially extending surfaces that connect the side surfaces to one another; internal electrodes arranged in the component body in the longitudinal direction of the component body; external electrodes having a front side portion covering the side surfaces and a band portion extending from the front side portion and covering portions of the circumferentially extending surfaces; and crack guiding patterns arranged in the component body and guiding the growth direction of a crack generated by the circumferentially extending surfaces so that the crack is directed towards the side surface, wherein the crack guiding pattern comprises: a plate without broken sections as a first metal pattern;and a second metal pattern having a plurality of gaps at predetermined intervals in the longitudinal direction, the second metal pattern being arranged to be closer to the circumferentially extending surface compared to the first metal pattern;

[0014] A plurality of gaps are arranged in the longitudinal direction of the second metal pattern so as to be spaced from each other, and the ratio of the total length of the longitudinally arranged gaps to the total length of the second metal pattern may be greater than 0.02.

[0015] A plurality of gaps are arranged in the longitudinal direction of the second metal pattern so as to be spaced from each other, and the ratio of the total length of the longitudinally arranged gaps to the total length of the second metal pattern may be less than 0.51.

[0016] A plurality of gaps are arranged in the longitudinal direction of the second metal pattern so as to be spaced from each other, and the ratio of the total length of the longitudinally arranged gaps to the total length of the second metal pattern may be greater than 0.02 or less than 0.51.

[0017] The crack guiding pattern may extend from the side surface to an inner portion of the component body, and the length of the crack guiding pattern may be equal to or greater than the length of the band portion.

[0018] The device body may include: an active region having the inner electrode disposed therein; an inactive region corresponding to a region other than the active region, and the crack guide pattern may be disposed in the inactive region.

[0019] According to another exemplary embodiment of the present invention, there is provided a ceramic multilayer component, comprising: a component body having an active region and an inactive region, and having spaced-apart side surfaces and circumferentially extending surfaces connecting the side surfaces to each other; internal electrodes disposed in the active region; external electrodes electrically connected to the internal electrodes, covering the side surfaces of the component body; and crack guiding patterns disposed in the inactive region and guiding a crack generated in the inactive region to remain in the inactive region, the crack guiding pattern comprising: a plate without broken sections as a first metal pattern;and a second metal pattern having a plurality of gaps at predetermined intervals in the longitudinal direction, the second metal pattern being arranged closer to the circumferentially extending surface compared to the first metal pattern and having gaps;

[0020] A plurality of gaps are arranged in the longitudinal direction of the second metal pattern so that they are spaced from each other.

[0021] A plurality of gaps are arranged in the longitudinal direction of the second metal pattern so as to be spaced from each other, and the ratio of the total length of the gaps arranged in the longitudinal direction to the total length of the second metal pattern may be greater than 0.02.

[0022] A plurality of gaps are arranged in the longitudinal direction of the second metal pattern so as to be spaced from each other, and the ratio of the total length of the longitudinally arranged gaps to the total length of the second metal pattern may be less than 0.51.

[0023] A plurality of gaps are arranged in the longitudinal direction of the second metal pattern so as to be spaced from each other, and the ratio of the total length of the longitudinally arranged gaps to the total length of the second metal pattern may be greater than 0.02 or less than 0.51. Short description of the drawings Fig. 1 is a view showing a ceramic multilayer component according to an exemplary embodiment of the present invention; Fig. Figure 2 is an enlarged view of area A shown in Fig. 1 is shown; and Fig. 3 is a view showing a shape that guides the growth direction of a crack of the ceramic multilayer component according to the exemplary embodiment of the present invention. Description of the preferred embodiments

[0024] Various advantages and features of the present invention and methods for implementing them will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings. However, the present invention may be modified in many different ways and should not be construed as being limited to the exemplary embodiments described herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Like reference numerals designate the same elements throughout the specification.

[0025] The terms used in this specification are intended to explain exemplary embodiments rather than to limit the present invention. Unless expressly stated otherwise, a singular form in this specification includes the plural. The word "comprise" and variations such as "comprises" or "comprising" are intended to include specified components, steps, modes of operation, and / or elements, but not to exclude any other components, steps, modes of operation, and / or elements.

[0026] In addition, the exemplary embodiments described in the specification are described with reference to sectional views and / or plan views, which are ideal exemplary drawings. In the drawings, the thickness of layers and regions may be exaggerated in order to effectively describe the technical contents. Therefore, exemplary shapes may be changed by manufacturing technologies and / or tolerances. Accordingly, the exemplary embodiments of the present invention are not limited to specific shapes, but include the modification of shapes produced according to manufacturing methods. For example, an etching region shown vertically may be rounded or it may have a predetermined curved shape.

[0027] Hereinafter, a ceramic multilayer component and a method for producing the same according to exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0028] Fig. 1 is a view showing a ceramic multilayer component according to an exemplary embodiment of the present invention; and Fig. Figure 2 is an enlarged view of area A shown in Fig. 1. In addition, Fig. 3 is a view showing a shape in which the growth direction of a crack of the ceramic multilayer component according to the exemplary embodiment of the present invention is directed (guided).

[0029] With reference to the Fig.1 to 3, the ceramic multilayer component 100 according to the exemplary embodiment of the present invention is constructed to include the component body 110, internal electrodes 120, external electrodes 130, and a crack guide pattern 140.

[0030] The device body 110 may have a multilayer structure in which multiple layers or sheets are stacked one upon another. The dielectric sheets 111, called green sheets, may be used as sheets, and the product formed by stacking the dielectric sheets may have a substantially hexahedral shape. Accordingly, the device body 110 may have two side surfaces 112 spaced apart from each other and four circumferentially extending surfaces 114 connecting the side surfaces. The device body 110 may be divided into an active region and an inactive region. The active region may be generally located at the center of the inner portion of the device body 110, and it may be a region where the internal electrodes 120 are disposed.The inactive region, which is a region different from the active region, may be a region in which the inner electrodes 120 are not arranged.

[0031] The inner electrodes 120 may be arranged substantially parallel to the longitudinal direction of the component body 110. The inner electrodes 120 may be circuit patterns formed on all layers. The inner electrodes 120 may be metal patterns that contact the outer electrodes 130. The inner electrodes 120 may be formed on all layers and have a structure in which they extend from the sides 112 to the inner portion of the component body 110. Optionally, the inner electrodes 120 may further include floating patterns. The flow patterns may be arranged between the side surfaces 112 without contacting the outer electrodes 130.

[0032] The external electrodes 130 may cover both end portions of the component body 110. The external electrode 130 may include a front portion 131a and a band portion 131b, wherein the front portion 131a covers the side surface 112, and the band portion 131b may extend from the front portion 131a and cover a portion of the circumferentially extending surface 114. The band portion 131b may be a bonding portion for bonding (connecting) the ceramic multilayer component 100 to an external device (not shown), such as a printed circuit board.

[0033] The crack guidance pattern 140 can direct or guide the growth direction of a crack C generated by the circumferentially extending surface 114, so that the crack C is directed or guided toward the side surface 112 into the inactive region of the component body 110. For example, in the case where the ceramic multilayer component is mounted in a fixed electronic component (not shown) to form a structure, the crack C can be formed in the ceramic multilayer component 100, as shown in Fig. 3, when the structure is subjected to an impact. The crack C, as described above, may be generated substantially at an end portion of the band portion 131b and in an edge portion of the circumferentially extending surface, and may propagate toward the active region of the device body 110.

[0034] If the crack C propagates to the active region of the component body 110, a defect may be generated in the ceramic multilayer component 100. Therefore, the propagation of the crack C is modified to prevent the crack C from growing to the active region, thereby making it possible to maintain the function of the ceramic multilayer component 100. The crack guidance pattern 140, which serves to maintain the function of the ceramic multilayer component even if the crack C is generated as described above, can redirect or guide the growth direction of the generated crack C, which is generated in the circumferential direction 114, to the side surface 112.

[0035] To this end, the crack guiding pattern 140 may be arranged in the inactive region of the component body 110 to allow the crack C to propagate into the inactive region without growing into the active region. As an example, the crack guiding pattern 140 may include a first metal pattern 142 and a second metal pattern 144 arranged to be closer to the circumferentially extending surface 114 compared to the first metal pattern 142. The first and second metal patterns 142 and 144 may be arranged in the inactive region of the component body 110 so that they are substantially parallel to each other. The first and second metal patterns 142 and 144 may be patterns made of different metals and including an oxide film (not shown) formed on their surfaces.

[0036] It is preferable that the length (hereinafter referred to as "first length" L1) of the crack guide pattern 140 be equal to or longer than the length (hereinafter referred to as "second length" L2) of the band portion 131b. In particular, it is preferable that the length of the second metal pattern 144 be equal to or longer than that of the second length L2. In the case where the first length L1 is shorter than the second length L2, the area of ​​the crack guide pattern 140 that overcomes the crack C is small, so the crack C prevents the crack guide pattern 140 from penetrating the active region of the device body 110.

[0037] In addition, the first and second metal patterns 142 and 144 may have different structures. For example, the first metal pattern 142 may have a flat plate structure without broken sections. On the other hand, the second metal pattern 144 may have broken sections to allow the formation of gaps 144a. There may be a plurality of gaps 144a. In this case, the gaps 144a may be arranged at predetermined intervals in the longitudinal direction of the second metal pattern 144. In the case where each of the gaps 144a has a line shape substantially perpendicular to the longitudinal direction of the second metal pattern 144, the second metal pattern 144 may be provided in a structure in which patterns having a plurality of line shapes are arranged parallel to each other.Alternatively, in the case where each of the gaps 144a has an island shape, the second metal pattern 144 may be provided in a mesh structure in which a plurality of holes are formed locally or regularly.

[0038] The gaps 144a formed in the second metal pattern 144 may be provided to provide a bonding force between the second metal pattern 144 and a BaTaO3 layer, which is the material of the dielectric layers 111. The ratio (hereinafter referred to as the "gap ratio") of the gaps 144a formed in the second metal pattern 144 may be calculated as a value, namely Tg / Tt, obtained by dividing the total length Tg of the gaps corresponding to the sum of the lengths of all the gaps 144a by the total length Tt of the second metal pattern 144.

[0039] In the case where the gap ratio (Tg / Tt) is excessively small, the function of the crack-guiding pattern 140 may be lost because the bonding force becomes excessively large. That is, although the crack C propagates in the surface direction of the crack-guiding pattern 140 through a separation between the crack-guiding pattern 140 and the BaTaO3 layer, it may be difficult to achieve this effect when the bonding force is excessively large. On the other hand, in the case where the gap ratio Tg / Tt is excessively large, the bonding force may be excessively weak as described above, so that a delamination phenomenon, by which the second metal pattern 144 and the BaTaO3 layer are separated from each other, may be generated in a method for manufacturing the ceramic multilayer component 100.

[0040] Although the case where the second metal pattern 144 has a different structure compared to the first metal pattern 142, with the gaps 144a formed only in the second metal pattern 144, was described as an example in the present embodiment, gaps like the above-mentioned gaps 144a may also be formed in the first metal pattern. In this case, the first and second metal patterns 142 and 144 may have a structure that is the same or similar. Alternatively, in the case where shapes, arrangements, or the like of the gaps formed in both the first and second metal patterns 142 and 144 are different, the first and second metal patterns 142 and 144 may also have different structures.

[0041] In addition, although the case where all the gaps 144a have the line shape substantially perpendicular to the longitudinal direction of the second metal pattern 144 and the gap ratio Tg / Tt is the total length of the gaps 144a arranged along the second metal pattern 144 has been described as an example in the present embodiment, since the gap ratio Tg / Tt indicates an area occupied by the gaps 144a on the entire surface of the second metal pattern 144, the ratio of the gaps 144a in the second metal pattern 144 can be calculated by various methods.

[0042] Besides, although the case where the crack C continues in a form where it is directed to the side surface 112 along the second metal pattern 144, in Fig.3, the crack C may also continue in a form in which it passes through the gap 144a of the second metal pattern 144 and is then directed to the side surface 112 along the first metal pattern 142.

[0043] As described above, the ceramic multilayer component 100 according to the exemplary embodiment of the present invention may include the component body 110 having the internal electrodes 120 formed therein, the external electrodes 130 covering both end portions of the component body 110, and the crack guide pattern 140 directs the growth direction of the generated crack from the circumferentially extending surface 114 in the component body 110, so that the crack C is directed to the side surface 112 in the inactive region. In this case, although the crack is generated in the component body 110, the growth direction of the crack can be directed to a region other than the active region of the component body, thus maintaining the function of the ceramic multilayer component 100.Accordingly, in the ceramic multilayer component and the method for manufacturing the same according to the exemplary embodiment of the present invention, the crack guiding pattern directs the growth direction of the crack generated in the component body so that the crack does not progress to an active region, thereby making it possible to prevent deterioration of the function of the ceramic multilayer component due to the generated crack. Example

[0044] Five hundred ceramic multilayer components measuring 1.6 mm x 0.8 mm x 0.8 mm and having a capacitance of 1 nF were manufactured. In this case, two nickel metal patterns were fabricated as crack-guiding patterns on a single dielectric layer, forming a layered multilayer component body, in a component body manufacturing process. In this case, the nickel metal pattern placed on the inside of the component body was fabricated in the shape of a flat plate without being broken, and the nickel metal pattern placed on the outside of the component body was fabricated to have gaps with a gap ratio (Tg / Tt) as shown in Table 1.

[0045] In the case of an evaluation of the warpage strength, after a warpage up to 5 mm at a speed of 1 mm / s was applied to fifty samples for each condition, the number of samples in which a final crack path was directed along the crack guidance pattern was confirmed by an internal destructive polishing analysis (DPA).

[0046] In the case of delamination evaluation, DPA was performed to confirm delamination after one hundred samples were immersed for five seconds in a solder bath maintained at a temperature of approximately 290 °C for each condition.

[0047] The warpage strength and delamination evaluation of samples classified according to the thickness of the oxide film as described above are shown in Table 1. Table 1 Nr. Gap ratio (Tg / Tt) Curvature strength Delamination 1 0,01 5 / 50 0 / 500 2 0,02 17 / 50 0 / 500 3 0,03 50 / 50 0 / 500 4 0,05 50 / 50 0 / 500 5 0,10 50 / 50 0 / 500 6 0,20 50 / 50 0 / 500 7 0,35 50 / 50 0 / 500 8 0,40 50 / 50 0 / 500 9 0,45 50 / 50 0 / 500 10 0,50 50 / 50 0 / 500 11 0,51 50 / 50 6 / 500 12 0,53 50 / 50 12 / 500 13 0,58 50 / 50 22 / 500

[0048] As shown in Table 1 above, when the gap ratio was greater than 0.02, at the time of performing DPA after evaluating the camber strength, it was confirmed that all cracks generated in the circumferential direction of the part body were directed along the crack leading pattern or remained in the crack leading pattern. On the other hand, when the gap ratio Tg / Tt was 0.02 or less, the crack was not directed along the crack leading pattern but progressed to an active area in the patterns. As a result, the number of patterns in which the crack was directed along the crack leading pattern decreased.Thereby, it was confirmed that in the case where cracks exist in the outermost metal pattern of the crack guiding pattern and the gap ratio of the crack guiding pattern is greater than 0.02, the growth direction of the crack is guided by the crack guiding pattern even if the crack is generated in the surface extending in the circumferential direction of the component body, so that the crack is induced in the side surface of the component body, thereby maintaining the function of the ceramic multilayer component.

[0049] In addition, it was confirmed that when the gap ratio Tg / Tt is 0.51 or greater, although the function of the crack-guiding pattern is maintained, a phenomenon occurs that a dielectric layer is separated from the crack-guiding pattern. This is because the bonding force between the outermost metal pattern and the dielectric layers is exceptionally weak, so that the outermost metal layer and the dielectric layer are separated from each other. In this case, although the properties of the component are not deteriorated due to the crack, it is preferable that the gap ratio Tg / Tt be less than 0.51 because the defect of the component is generated in a manufacturing step. Accordingly, when a manufacturing defect is considered, it is preferable that the gap ratio Tg / Tt be greater than 0.02 or less than 0.51.

[0050] In the ceramic multilayer component according to the exemplary embodiment of the present invention, the crack guidance pattern directs the growth direction of the crack generated in the component body so that the crack does not propagate to the active region, thereby making it possible to prevent deterioration of the function of the ceramic multilayer component due to the generation of the crack.

[0051] By the method for manufacturing the ceramic multilayer component according to the exemplary embodiment of the present invention, it is possible to manufacture the ceramic multilayer component having a structure capable of preventing deterioration of a function due to the generation of the crack by allowing the crack not to propagate to an active region of the component body even if the crack is generated in the component body.

Claims

[1] Ceramic multilayer component, comprising: a component body (110) having spaced-apart side surfaces (112) and circumferentially extending surfaces (114) connecting the side surfaces (112) to one another; inner electrodes (120) arranged in the component body (110) in the longitudinal direction of the component body (110); outer electrodes (130) having a front side portion (131a) covering the side surfaces (112) and a band portion (131b) extending from the front side portion (131a) and covering portions of the circumferentially extending surfaces (114); and Crack guidance patterns (140) arranged in the component body (110) and guiding the growth direction of a crack generated by the circumferentially extending surfaces (114) so ​​that the crack (C) is directed towards the side surface (112), wherein the crack guide pattern (140) comprises: a plate without broken sections as a first metal sample (142); and a second metal pattern (144) having a plurality of gaps (144a) at predetermined intervals in the longitudinal direction, wherein the second metal pattern (144) is arranged to be closer to the circumferentially extending surface (114) compared to the first metal pattern (142). [2] Ceramic multilayer component according to claim 1, characterized by that the ratio of the total length of the longitudinally arranged gaps (144a) to the total length of the second metal patterns (144) is greater than 0.

02. [3] Ceramic multilayer component according to claim 1, characterized by that the ratio of the total length of the longitudinally arranged gaps (144a) to the total length of the second metal pattern (144) is less than 0.

51. [4] Ceramic multilayer component according to claim 1, characterized bythat the ratio of the total length of the longitudinally arranged gaps (144a) to the total length of the second metal patterns (144) is greater than 0.02 and less than 0.

51. [5] Ceramic multilayer component according to claim 1, characterized by that the crack guide pattern (140) extends from the side surface (112) to an inner portion of the component body (110), and the length (L1) of the crack guide pattern (140) is equal to or longer than that of the band portion (131b). [6] Ceramic multilayer component according to claim 1, characterized by that the component body (110) comprises: an active region having internal electrodes (120) arranged therein; an inactive area corresponding to an area that does not correspond to the active area, and the crack guidance pattern (140) is arranged in the inactive region. [7] Ceramic multilayer component, comprising: a component body (110) having an active region and an inactive region and having spaced-apart side surfaces (112) and circumferentially extending surfaces (114) connecting the side surfaces (112) to one another; inner electrodes (120) arranged in the active region; outer electrodes (130) electrically connected to the inner electrodes (120), covering the side surfaces (112) of the component body (110); and Crack guidance patterns (140) arranged in the inactive region and guiding a crack (C) generated in the inactive region, so that it remains in the inactive area, wherein the crack guide pattern (140) comprises: a plate without broken sections as a first metal sample (142); and a second metal pattern (144) having a plurality of gaps (144a) at predetermined intervals in the longitudinal direction, wherein the second metal pattern (144) is arranged to be closer to the circumferentially extending surface (114) compared to the first metal pattern (142). [8] Ceramic multilayer component according to claim 7, characterized by that the ratio of the total length of the longitudinally arranged gaps (144a) to the total length of the second metal pattern (144) is greater than 0.

02. [9] Ceramic multilayer component according to claim 7, characterized by that the ratio of the total length of the longitudinally arranged gaps (144a) to the total length of the second metal pattern (144) is less than 0.

51. [10] Ceramic multilayer component according to claim 7, characterized bythat the ratio of the total length of the longitudinally arranged gaps (144a) to the total length of the second metal patterns (144) is greater than 0.02 and less than 0.51.

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