Process fluid supply device and process fluid supply method

Abstract

Process fluid supply device comprising a feed pump (6) arranged in a feed channel (503, 501), wherein the process fluid supply device uses the feed pump (6) to discharge a process fluid supplied from a process fluid source to a process target via a discharge part (51), wherein the feed pump (6) includes: an elastic hose (62) which serves as part of the feed channel (503, 501); a guide element (61) extending in an axial direction of the hose (62) to support an outer surface of the hose (62); a pinch element (65) that is movable along the axial direction of the hose (62), wherein the hose (62) is compressed between the pinch element (65) and the guide element (61), thereby conveying the process fluid; and a movement mechanism (64, 67) that moves the pinch element (65) from a first axis position of the hose (62), at which the pinch element (65) begins to compress the hose (62), to a second axis position of the hose (62), at which the pinch element (65) leaves the hose (62) in the direction of the discharge part (51) after the process fluid has been supplied, wherein the pinch element (65) and the movement mechanism (64, 67) are arranged such that only a compressed part, which is compressed between the pinch element (65) and the guide element (61), is formed between the first axis position and the second axis position of the hose (62), and this compressed part moves along the axis direction of the hose (62) during the dispensing of a dose of process fluid towards the ejection part (51), the process fluid supply device further comprises: a shut-off valve (V4) which is located in the feed channel (503) at a position closer to the process fluid source than to the hose (62), so that it allows either blocking or feeding of the process fluid to the feed pump (6); a filter (52) arranged in the feed channel (501) at a position closer to the discharge part (51) than to the hose (62); and a control unit (200) configured to output a control signal for controlling the movement mechanism (64, 67) and the shut-off valve (V4) such that: the pinch element (65) compresses the hose (62), with a portion of the feed channel (503) between the shut-off valve (V4) and the hose (62) being filled with the process fluid;The pinch element (65), which compresses the hose (62), then moves towards a downstream side of the hose (62) while the shut-off valve (V4) is closed, thereby depressurizing the portion of the feed channel (503) between the shut-off valve (V4) and the hose (62) and degassing the process fluid located in that portion of the feed channel (503) between the shut-off valve (V4) and the hose (62) filled with the process fluid, utilizing the elasticity of the flexible hose (62) which causes the flexible hose (62) to return to its original shape; then the shut-off valve (V4) is opened to allow the degassed process fluid to flow into the hose (62);and then the squeezing element (65) again compresses the hose (62) and moves towards a downstream side of the hose (62) to feed the process fluid into the filter (52) so that the degassed process fluid is filtered.;

Description

Field of invention

[0001] The present invention relates to a technique for conveying a process fluid that is to be supplied to a process target. background

[0002] In a photoresist step, a process step in semiconductor manufacturing, a photoresist is applied to the surface of a semiconductor wafer (hereinafter referred to as "wafer") with the aim of forming a resistant film. The resulting resistant film is exposed with a predetermined pattern and then developed to form a resistant pattern.

[0003] Some process fluid feeding methods that eject a process fluid, such as a photoresist or a developing fluid, onto a wafer through a nozzle (ejection part) are designed to supply the process fluid from a chemical fluid reservoir (process fluid source) to the nozzle using a feed pump. For example, JP2008-305980A (see paragraph

[0022] and Fig. 2) A chemical liquid feeding system in which a piston is attached to one end of a bellows body provided in a container, and a photoresist is fed to a coating nozzle by expansion and contraction of the bellows body. Additionally, the chemical liquid feeding system described in JP2012-151197A (see paragraphs

[0035] and

[0041] ) Fig. 4 and Fig. 5) is described, a photoresist is supplied to a spray nozzle by a diaphragm pump which has a diaphragm that moves back and forth in a pump chamber.

[0004] In a piston pump of the aforementioned type, some of the drawn-in fluid can remain in a dead space within the pump. If the pump does not discharge all of the process fluid, particles, such as those from chips formed during pump manufacturing and those remaining in the pump immediately after installation, can accumulate in the pump along with the process fluid for an extended period. This can delay the start of wafer processing and / or cause contamination.

[0005] A peristaltic pump is known as a pump in which process fluid stagnates less frequently. However, peristaltic pumps are prone to strong pulsation, making them generally unsuitable for reliably delivering a predetermined quantity of process fluid to a wafer at a specific time.

[0006] The JP2003-118147A (see paragraphs 0025 and 0029 and Fig. Sections 3 to 5 describe how a squeeze roller compresses an elastic tube to deliver ink from a receiving head to a used ink treatment element. However, this document cannot describe a technique for the stable delivery of a process fluid to a process destination.

[0007] Further information helpful for understanding the present invention can be found in the following documents:

[0008] US 4 019 816 A relates to a coating device with a stationary wing and a reciprocating applicator wing.

[0009] DE 10 2009 058 279 B4 relates to a peristaltic hose pump for generating a flow through a body cavity. Summary of the invention

[0010] The objective of the present invention is to provide a technique for supplying a process fluid, whereby the amount of process fluid that accumulates in a process fluid supply device can be reduced and the process fluid can be supplied continuously.

[0011] According to one embodiment of the present invention, a process fluid supply device is provided comprising: a feed pump arranged in a feed channel, wherein the feed pump discharges a process fluid supplied from a process fluid source to a process target via a discharge element, the feed pump comprising: an elastic hose serving as part of the feed channel; a guide element extending in an axial direction of the hose to support an outer surface of the hose; a squeeze element movable along the axial direction of the hose, wherein the hose is compressed between the squeeze element and the guide element, thereby conveying the process fluid; and a movement mechanism that moves the squeeze element from a first axial position of the hose.The process fluid supply device, where the pinch element begins to compress the hose, moves it to a second axial position of the hose, where the pinch element leaves the hose in the direction of the discharge section after conveying the process fluid. The pinch element and the movement mechanism are configured such that only a compressed portion, which is compressed between the pinch element and the guide element, is formed between the first axial position and the second axial position of the hose, and this compressed portion moves along the axial direction of the hose towards the discharge section during the dispensing of a dose of process fluid. According to the embodiment, the process fluid supply device further comprises a shut-off valve arranged in the supply channel at a position closer to the process fluid source than to the hose.so that it optionally allows the process fluid to be blocked or fed to the feed pump; and a filter arranged in a feed channel at a position closer to the discharge part than to the hose; and a control unit configured to output a control signal for controlling the movement mechanism and the shut-off valve, such that: the pinch element compresses the hose, with a portion of the feed channel between the shut-off valve and the hose filled with the process fluid; then the pinch element compressing the hose moves towards a downstream side of the hose, with the shut-off valve closed, thereby depressurizing the portion of the feed channel between the shut-off valve and the hose, and degassing the process fluid located in that portion of the feed channel between the shut-off valve and the hose filled with the process fluid.the elasticity of the elastic hose is used, causing it to return to its original shape; then the shut-off valve is opened to allow the degassed process fluid to flow into the hose; and then the pinch element again compresses the hose and moves towards a downstream side of the hose to feed the process fluid into the filter, so that the degassed process fluid is filtered.

[0012] According to a further embodiment of the present invention, a process fluid supply method is provided which conveys a process fluid from a process fluid source by means of a feed pump arranged in a feed channel for discharging the process fluid from a discharge part to a process target, wherein the method comprises: providing a feed pump comprising: an elastic hose serving as part of the feed channel; a guide element extending in an axial direction of the hose to support an outer surface of the hose; and a squeeze element movable along the axial direction of the hose and compressed between the squeeze element and the guide element, thereby conveying the process fluid;moving the pinch element to a first axial position of the hose to allow the hose to be compressed between the pinch element and the guide element; then, moving the pinch element in the axial direction of the hose towards its downstream side, compressing the hose between the pinch element and the guide element, thereby conveying the process fluid towards the discharge part; and afterwards, separating the pinch element from the hose;wherein only a compressed portion, which is compressed between the pinch element and the guide element, is formed in the hose between the first and second axial directions, and this compressed portion moves along the axial direction of the hose during the dispensing of a dose of process fluid towards the discharge part. According to a further embodiment, the process fluid supply method additionally comprises: providing a shut-off valve arranged in the supply channel at a position closer to the process fluid source than to the hose, in order to selectively allow blocking or supplying the process fluid to the feed pump, and providing a filter arranged in the supply channel at a position closer to the discharge part than to the hose;The hose is squeezed by the pinch element, with a portion of the feed channel between the shut-off valve and the hose filled with the process fluid; then, the pinch element is moved towards a downstream side of the hose, with the shut-off valve closed, thereby depressurizing the portion of the feed channel between the shut-off valve and the hose, and degassed, utilizing the elasticity of the flexible hose, which causes the flexible hose to return to its original shape; then, the shut-off valve is opened, allowing the degassed process fluid to flow into the hose;and then squeezing the hose through the squeezing element and moving the squeezing element towards a downstream side of the hose, thereby forcing the process fluid into the filter so that the degassed process fluid is filtered.

[0013] According to the preceding embodiments, since the hose is compressed between the pinch element and the guide element to convey the process fluid, there is a lower probability of the process fluid stagnating in the pump. Additionally, since the hose is compressed by only one pinch element, pulsation caused by the conveying process can be reduced, thereby enabling a predetermined quantity of the process fluid to be supplied continuously. Brief description of the characters Fig. Figure 1 is a top view as a sectional representation of a coating and developing device in which a photoresist feeding device according to an embodiment of the present invention is integrated; Fig. Figure 2 is a perspective view of a coating and developing device; Fig. 3 is a diagram of the tubing of the photoresist feed device; Fig. 4 is a top view as a sectional representation of a peristaltic pump provided in the photoresist feed device; Fig. 5 is a side view as a sectional representation of the peristaltic pump; Fig. Figure 6 is a first explanatory description to explain the operation of the photoresist feed device; Fig. Figure 7 is a second explanatory illustration to explain the operation of the photoresist feed device; Fig. Figure 8 is a third explanatory illustration to explain the operation of the photoresist feed device; Fig. Figure 9 is a fourth explanatory illustration to explain the operation of the photoresist feed device; Fig. Figure 10 is a fifth explanatory illustration to explain the operation of the photoresist feed device; Fig. Figure 11 is a first explanatory illustration to explain a further operation of the photoresist feed device; Fig. Figure 12 is a second explanatory illustration to explain a further operation of the photoresist feed device; Fig. Figure 13 is an exemplary illustration to explain yet another operation of the photoresist feed device; Fig. 14 is a top view as a sectional representation of a peristaltic pump according to a modification; Fig. 15 is a top view as a sectional representation of the hose pump according to a further modification; Fig. 16 is a side view as a sectional representation of the peristaltic pump of Fig. 15; Fig. 17 is a top view as a sectional representation of a peristaltic pump according to yet another modification; Fig. Figure 18 is a top view showing the construction of a peristaltic pump used in a comparative example 1; Fig. Figure 19 is a representation showing the change in the supply pressure of the peristaltic pump over time in Example 1; Fig. Figure 20 is a representation showing the change in the supply pressure of the peristaltic pump over time in comparison example 1; Fig. 21 is a copy of a photograph showing the ejection state of the photoresist from a nozzle in Example 1; Fig. 22 is a copy of a photograph showing the ejection state of the photoresist from a nozzle in comparison example 1; Fig. Figure 23 is a top view as a sectional representation of a peristaltic pump to explain discharge start positions in Example 2; and Fig. Figure 24 is a representation showing the change in the output quantity depending on the output starting position. Detailed description of the invention

[0014] One embodiment of the present invention is described below with reference to the accompanying drawings. An example is given in which a process fluid supply device according to one embodiment of the present invention is applied to a coating and developing device.

[0015] As in the Fig. 1 and Fig. As shown in Figure 2, the coating and developing device comprises a carrier station 1, a processing station 2, and an interface section 3. The carrier station 2 is used to load or unload a carrier 10, which, sealed, contains a plurality, e.g., 25, of wafers W as process targets. The processing station 2 performs a photoresist coating process (hereinafter referred to as the "coating process") and a development process on the wafers W, which are removed from the carrier station 1. The interface section 3 transports the wafers W between the processing station 2 and an exposure station 4, where the surface of each wafer W is treated with a light-transmitting liquid layer that forms on the surface of the wafer W.

[0016] The carrier station 1 is equipped with: a table 11 on which a plurality of carriers 10 can be arranged in a row; an opening and closing part 12, which is formed in a wall in front of the table 11; and a transport mechanism A1, which removes a wafer W from the carrier 10 via the opening and closing part 12.

[0017] Interface section 3 comprises a first transport chamber 3A and a second transport chamber 3B, which are arranged in a back-and-forth direction between processing station 2 and exposure station 4. The first transport chamber 3A is equipped with a first wafer transport unit 30A. The second transport chamber 3B is equipped with a second wafer transport unit 30B.

[0018] The processing station 2 is surrounded by a housing 20, which is located behind and connected to the support section 1. The processing station 2 is equipped with: rack units U1, U2, and U3, each formed by stacking heating / cooling units; liquid processing units U4 and U5; and main transport mechanisms A2 and A3 for transporting a wafer W between the units. The main transport mechanisms A2 and A3 are arranged in a space surrounded by a sub-area 21, which has a wall on the side of the rack units U1, U2, and U3, a wall on the side of each of the liquid processing units U4 and U5, and front and rear walls.A temperature / humidity control unit 22 includes process fluid control units for controlling the temperature of the process fluids used in the respective process units, and temperature / humidity control channels for controlling the temperature / humidity in the respective control unit are provided in a space between the carrier station 1 and the processing section 2 and a space between the processing section 2 and the interface section 3.

[0019] Each of the rack units U1, U2, and U3 is formed by stacking, in a plurality (e.g., ten) levels, various units are provided for performing upstream processes (pretreatments) and downstream processes (posttreatments) of a process (treatment) carried out by the liquid processing units U4 and U5. The combination of units in the rack units U1, U2, and U3 can include a heating unit (not shown) for heating (baking) a wafer W, a cooling unit (not shown) for cooling a wafer W, and the like. Each of the liquid processing units U4 and U5 is configured to supply a process liquid to a wafer W to perform a liquid treatment on the wafer W. As shown in Fig. As shown in Figure 2, each of the liquid processing units U4 and U5 is formed by stacking, e.g., in a plurality of (e.g., five) levels, with a receiving unit for chemical liquids 14 for receiving a photoresist and a developer, a coating unit for applying an antireflective coating (BCT) 23 to a wafer W, and a developing unit (DEW) 25 for developing a wafer W by feeding a developer onto it. The feeding device for the process liquid is incorporated into each of the units 23, 24, and 25.

[0020] An example of a pass of a wafer W in the aforementioned coating and development device will be briefly described with reference to the Fig. 1 and Fig. 2. In the coating and developing device, wafers W belonging to the same production batch are transported sequentially. First, if the carrier 10, for example, holds twenty-five wafers W, these are placed on the table 11. The opening and closing part 12 opens a cover of the carrier 10. Then, each wafer W is removed from the carrier 10 by the transport mechanism A1.

[0021] The wafer W, removed in this way, is transferred to the main transport mechanism A2 via a transfer unit (not shown) contained in the rack unit U1. The wafer W then undergoes a pretreatment process for the coating process, such as a forming process for an antireflective coating, which is performed by the coating unit to apply an antireflective coating (BCT) 23, and is then cooled. The wafer W is then coated with a photoresist by the coating unit (COT) 24. Afterward, the wafer W is conveyed by the main transport mechanism A2 to the heating unit contained in the rack units U1 to U3, where it is heated (baked). The wafer W is then cooled and loaded into the interface section 3 by the transfer unit contained in the rack unit U3.Afterwards, the wafer W is cooled and then loaded into the interface section 3 by the transfer unit of the rack unit U3.

[0022] From interface section 3, the wafer W is transported to exposure section 4 by the first wafer transport unit 30A in the first transport chamber 3A and the second wafer transport unit 30B in the second transport chamber 3B. In exposure section 4, the wafer W is exposed by an exposure device (not shown) positioned so that it faces the surface of the wafer W. After exposure, the wafer W is transferred to the main transport mechanism A2 along a route that is the reverse of the one along which the wafer W was transported to exposure section 4, and is then transferred to the developing unit (DEV) 25, where the wafer W is developed so that the resist pattern is formed on the wafer. The wafer, now bearing the resist pattern, is then returned to the original support 10, which is located on the table 11.

[0023] Next, the design of the feed device for the process fluid, which is incorporated into units 23, 24 and 25 in the liquid processing units U4 and U4, will be described with reference to Fig. 3 described. Fig. Figure 3 shows a feed device for a photoresist 5 according to an embodiment of the process fluid feed device, which feeds a photoresist (e.g., a developing fluid) to a nozzle 51 of the coating unit (COT) 24. The feed device for a photoresist 5 includes a photoresist bottle 54, an intermediate tank 53 for temporarily storing a photoresist transported by the photoresist bottle 54, and a peristaltic pump 6 (feed pump) for supplying the photoresist dispensed from the intermediate tank 53 to a nozzle 51 (ejection part).

[0024] The photoresist bottle 54 is an interchangeable container that can be attached externally to the feed device for the photoresist 5. A pressure line 506, which has an electromagnetic switching valve V7, is connected to the photoresist bottle 54, so that the photoresist bottle 54 can receive a pressurized inert gas (e.g. nitrogen (N2) gas) from a pressurized gas source in order to pressurize the photoresist inside, in order to convey the photoresist from there towards the intermediate container 53.

[0025] The intermediate tank 53 temporarily stores the photoresist supplied from the photoresist bottle 54 and conveys it towards the wafer W. The intermediate tank 53 is equipped with level sensors 531, the readings of which are used to determine the start and end timing of the photoresist feed from the photoresist bottle 54. The photoresist is transported between the photoresist bottle 54 and the intermediate tank 53 via a transport line 505. A drain line 504, used to discharge the photoresist into the intermediate tank 53, is connected to an upper part of the intermediate tank 53. The drain line 504 is equipped with an electromagnetic shut-off valve V6. The intermediate tank 53 is also equipped with a pressure line (not shown) to receive pressurized gas from a pressurized gas source 55. In this embodiment, the photoresist bottle 54 and the intermediate tank 53 form a process fluid source.

[0026] The intermediate tank 53 is connected to a peristaltic pump 6 via a supply line 503, which is equipped with a shut-off valve V4. The peristaltic pump 6 is connected to the nozzle 51 via a discharge line 501, which is equipped with a filter 52 and a dispensing valve V1. A vent line 507, equipped with a shut-off valve V2, is provided on one side of the filter 52 (inlet side of the filter element) to allow particles and / or bubbles present in the photoresist to be discharged outside the filter 52. The supply line 503 and the discharge line 501 form a supply channel for the photoresist. The supply line 503 serves as a feed path on the side of the process fluid source, and the discharge line 501 serves as a feed path on the side of the dispensing part (nozzle 51).

[0027] A return line 502 (branch channel) branches off from the discharge line 501 at a point between the filter 52 and the dispensing valve V1. The discharge line 502 joins the supply line 503 at a point upstream of the shut-off valve V4. By using the return line 502, the photoresist flowing out of the peristaltic pump 6 can be returned to the peristaltic pump 6. Through the use of the return line 502, the dispensing valve V1 and the shut-off valve V3 form a switching unit to direct the photoresist discharged from the peristaltic pump 6 between the nozzle 51 and the return line 502.

[0028] In the feed device for a photoresist 5 according to this embodiment, the peristaltic pump 6 has a design for the continuous supply of a predetermined quantity of the photoresist to the nozzle 51, while suppressing pulsation. The design of the peristaltic pump is described below with reference to the Fig. 4 and Fig. 5 explained.

[0029] As in the Fig. 4 and Fig. As shown in Figure 5, the pump 6 comprises: a tube 62 through which the photoresist flows; a guide element 61 having a wall surface extending along an outer surface of the tube 62 in an axial direction of the tube 62; a roller 65 (e.g., a squeeze element) arranged opposite the guide element 61 with respect to the tube 62, so that it squeezes the tube 62 between the roller 65 and the guide element 61; rotating bodies 64 holding the roller 65; and an electric motor 67 driving the rotating body 64 to rotate.

[0030] The hose 62 is an elastic hose, made, for example, of synthetic resin. An inlet end for receiving the photoresist and an outlet end for removing the photoresist from the hose 62 are each connected to a supply line 503 and a discharge line 501, respectively, via connection points 63. The guide element 61 has a cutout sector in which the hose 62, the roller 65, and the rotating body 64 are arranged. The hose 62 is arranged in a U-shape along an inner side wall that has an arc shape.

[0031] Within the hose 62, extending along the guide element 61, the two disc-shaped rotating bodies 64 (64a, 64b) are arranged with a vertical gap between them. These rotating bodies 64 (64a, 64b) are held by a motor shaft 671. The nearest end of the motor shaft 671 is connected to an electric motor 67, the direction of rotation of which can be reversed. Therefore, the rotating bodies 64 (64a, 64b) can be rotated in the same direction and at the same angle.

[0032] A roller shaft 651 extends vertically through the rotating bodies 64 (64a, 64b) at a point near the peripheral sections of the rotating bodies 64 (64a, 64b). The roller 65 is held by the roller shaft 651 so that it is rotatable about the roller shaft 651. The roller 65 is arranged such that its peripheral side face projects outwards behind the outer periphery of the rotating bodies 64 (64a, 64b). Therefore, the roller 65 can clamp the hose 62 between its peripheral side face and the guide element 61, thus compressing the hose 62. The peristaltic pump 6 according to this embodiment has only one roller 65.

[0033] When the rotating body 64 is turned, thereby compressing the hose 62 as previously described, the roller 65 itself is rotated about the roller shaft 651, and furthermore, the roller 65 is moved so that it rotates about the motor shaft 671. As a result, the point where the roller 65 compresses the hose 62 is moved, so that the photoresist in the hose 62 is transported from the compressed point according to the movement. The rotating body 64, the motor shaft 671, and the electric motor 67 form a movement mechanism for the roller 65.

[0034] In this embodiment, the guide element 61, the hose 62, the roller 65, and the rotating body 64 of the peristaltic pump 6 are arranged in a common housing 60. A photoelectric sensor 662 is arranged in the housing to detect when the roller 65 has returned to its home position. The photoelectric sensor 662 includes, for example, a light emission unit and a light reception unit, which are not shown. When a light beam emitted by the light emission unit is reflected by a reflecting plate 661, which is attached to an upper end of the roller 65, and falls onto the light reception unit, the photoelectric sensor 662 detects that the roller 65 is in its original position.In the case of the peristaltic pump 6 according to this embodiment, the basic position is fixed at a position which is within an area in which the roller 65 is located away from the hose 62 and does not compress the hose 62.

[0035] As in Fig. As outlined in Figure 1, the coating and developing device is equipped with a control unit 200, which controls all operations of the coating and developing device. As shown in Figure 1. Fig. As shown in Figure 3, the control unit 200 also controls the feed device for the photoresist 5. The control unit 200 comprises a computer containing a CPU and a memory unit. The memory unit stores a program for controlling the feed device for the photoresist 5. Based on the program, the photoresist is fed from the photoresist bottle 54 to the intermediate reservoir 53, and the photoresist in the intermediate reservoir 53 is then fed to the nozzle 51 by the peristaltic pump 6. The program is stored on a storage medium, such as a floppy disk, a CD, a magneto-optical data carrier, or a memory card, and from there installed on the computer.

[0036] As in the Fig. 4 and Fig. As shown in Figure 5, the control unit, in conjunction with controlling the operation of the peristaltic pump 6, receives a signal indicating that reflected light from the reflector plate 661 has been detected by the photoelectric sensor 662, thus confirming that the roller 65 is in its original position. Additionally, the control unit 200 outputs a signal to the electric motor 67 to specify the direction and circumference of rotation (angle of rotation) of the rotating body 64. Therefore, the control unit 200 can determine the current position of the roller 65 based on the direction and circumference of rotation of the rotating body 64, relative to its original position.

[0037] The operation of the feed device for the photoresist 5, which has the aforementioned structure, is described below with reference to the Fig. Explained in sections 6 to 10. To simplify the figures, the guide element 61, the photoelectric sensor 662, and so on are shown in the Fig. Numbers 6 to 13 are not shown.

[0038] The shut-off valve V4 on the supply line 503 and the dispensing valve V1 on the discharge line 501 are opened first, thus establishing a flow path from the photoresist bottle 54 to the nozzle 51. Then, the switching valve V7 of the pressure line 506 is opened to receive the pressurized gas from the pressurized gas source 55. When the interior of the photoresist bottle 54 is pressurized by the pressurized gas, the photoresist in the photoresist bottle 54 is fed to the intermediate container 53.

[0039] When the interior of the intermediate container 53 is pressurized by the pressurized gas received from the pressurized gas line (not shown), the flow path extending from the supply line 503 to the nozzle 51 via the peristaltic pump 6 and the filter 52 is filled with the photoresist, and therefore the air is vented from the flow path. Fig. 6) Then the dispensing valve V1 is closed and the shut-off valve V3 is opened, thus reversing the flow path so that it no longer extends to the nozzle 51 but to the return line 502. Furthermore, the shut-off valve V2 on the vent line 507 is opened and the pressurization of the intermediate tank 53 continues, so that the channel of the return line 502 is filled with photoresist and air is discharged to the vent line 507 (this process is not shown). During these processes, the roller 65 is in its original position, so that the photoresist filling process is carried out without the hose 62 being compressed.

[0040] After the flow path encompassing lines 503, 62, 501, and 502 of the photoresist feed device 5 has been vented, the supply of pressurized gas is stopped, and the shut-off valve V2 on the vent line 507 of the filter 52 is closed, while the outlet of the peristaltic pump 6 remains continuously connected to the return line 502. The rotating body 64 is then rotated so that the roller 65, which is in its original position, is moved to a first axial position of the hose 62, at which point the compression of the hose 62 between the roller 65 and the guide element 61 begins. Fig. 7).

[0041] When the roller 65 is moved to the first axial position of the tube 62, the tube 62 is pinched or compressed. As the roller 65 continues to move, the photoresist in the tube 62 is transported, so that it is forced (squeezed) out of the peristaltic pump 6.

[0042] At this point, as in Fig. As shown in Figure 7, since the discharge line 501 is connected to the return line 502, and part of the discharge line 501 is closed at the side of the nozzle 51, the photoresist that was pushed out of the hose 62 by the roller 65 is returned to the inlet side of the peristaltic pump 6.

[0043] The filter 52 is arranged on an outlet side of the peristaltic pump 6, whereby the photoresist filtered by the filter 52 is returned to the peristaltic pump 6. Therefore, when the photoresist is discharged by the peristaltic pump 6 towards a wafer W, the returned photoresist can be filtered again by the filter 52 (see Figure 5). Fig. 8, described below). As a result, the photoresist with fewer particles and / or bubbles can be ejected to wafer W.

[0044] If the scooter continues to move at 65 km / h so that it reaches a predetermined ejection start position (e.g., the position specified in the...) Fig. (as shown in Figure 7) reaches its target position, the movement of the roller 65 is stopped. When the roller's position is adjusted as described above, the photoresist dispensed from the peristaltic pump 6 flows towards the return line 502, thus preventing unnecessary ejection of the photoresist from the nozzle 51. Furthermore, since the return line 502 is connected to the outlet side of the peristaltic pump 6, allowing the photoresist dispensed from the pump to be returned to the pump, the photoresist can be used without loss.

[0045] When the movement of the roller 65 is stopped at its ejection start position and the pressure of the photoresist in the hose 62 and the discharge line 501 becomes stable, as in Fig. As shown in Figure 8, the shut-off valve V3 on the return line 502 is closed and the dispensing valve V1 on the discharge line 501 is opened, so that the photoresist dispensed by the peristaltic pump 6 is directed to the nozzle 51. The roller then moves towards the outlet of the peristaltic pump 62, which is connected to the discharge line 501. The photoresist dispensed by the peristaltic pump 6 is filtered through the filter 52 and then fed to the nozzle 51. The photoresist fed to the nozzle 51 is ejected onto the surface of the wafer W, which is rotated about a vertical axis, to spread across the wafer's surface and form a resistant film.

[0046] In this way, each movement of the roller 65 from the predetermined discharge start position to the discharge end position, to transport the photoresist in the tube 62, precisely delivers a predetermined quantity of the photoresist to the nozzle 51. At this point, the photoresist is delivered in such a way that not only is the distance from the discharge start position to the discharge end position constant, but the discharge start position itself is also fixed. According to this operation, compared to a case where the discharge start position changes each time, the quantity of photoresist to be delivered to the nozzle 51 can be achieved more consistently. The advantageous effect was confirmed by an experiment (see Experiment 2, described below).

[0047] Furthermore, since only one roller 65 squeezes the hose 62, the photoresist can be applied evenly with fewer pressure fluctuations, compared to the case where the photoresist is applied using a peristaltic pump 6c including a plurality of rollers 65 ( Fig. 18), which simultaneously compress the tube 62 at multiple points (see comparative example, as described later), transports and supplies the photoresist (see Experiment 1, as described below). As a result, the photoresist can be ejected from nozzle 51 without interruption, thus forming a very good photoresist film.

[0048] After the roller 65 has been moved to the ejection end position for the photoresist, an operation to remove bubbles caught by the filter 52 can be carried out as needed (e.g. after each predetermined number of processing of wafers W or after a predetermined time period ( Fig. 9)). When the bubble removal process is performed, the dispensing valve V1 on the supply line 501 is closed and the shut-off valve V2 on the vent line 507 is opened. Then the roller 65 is moved further from the discharge end position towards the outlet of the hose 62, which is connected to the discharge line 501, in order to supply the photoresist towards the filter 52, so that the bubble-containing photoresist is ejected and collects in the filter 52.

[0049] In the company, which is located in Fig. As shown in Figure 9, the roller 65 is moved to the ejection end position for the photoresist (second axis position of the tube), and the bubble removal process then follows. However, the bubble removal process can also be carried out in the following way: namely, by moving the roller 65 from the ejection end position to its original position, with the outlet opening of the filter 52 connected to the return line 502. Then, the roller 65 is moved again from its original position to a position where it compresses the tube 62. After that, the valves V1 to V4 are switched to the conditions shown in Figure 9. Fig. 9 are shown, and the blister removal process is performed.

[0050] The aforementioned processes can be summarized as follows. If the bubble removal process is not carried out, starting from the state (see valves V1 to V4) as it is in Fig. As shown in Figure 8, the dispensing valve V1 on the discharge line 501 is closed and the shut-off valve V3 on the return line 502 is open. When the bubble removal process is carried out, starting from the state (see valves V1 to V4) as ... Fig. As shown in Figure 9, the shut-off valve V2 on the ventilation line 507 is closed. Then, the roller 65, which is stopped at the discharge end position or the finished position of the bubble removal process, is moved further towards the outlet of the hose 62, so that the roller 65 leaves the hose 62 and returns to its home position ( Fig. 10).

[0051] Furthermore, in the aforementioned process, the photoresist dispensed by the peristaltic pump 6 flows into the return line 502, thus preventing unnecessary ejection of the photoresist through the nozzle 51. Additionally, since the photoresist dispensed by the peristaltic pump 6 is returned to the pump 6, it can be used without loss. By repeating the aforementioned processes, which are described in the Fig. 7, Fig. 8, ( Fig. 9, depending on need) and Fig. Since 10 wafers are represented sequentially, a predetermined amount of the photoresist can be continuously supplied to each of the plurality of wafers W, and therefore a very good coating process with photoresist can be carried out for each of the plurality of wafers W.

[0052] The feed device for the photoresist 5 is advantageous in this embodiment with respect to the following aspects. Since the tube 62 is squeezed by the roller 65 to convey the photoresist, the photoresist is unlikely to stagnate in the peristaltic pump 6. Additionally, since only one roller 65 is used to squeeze and compress the tube 62 to deliver a dose of the photoresist (i.e., the amount of photoresist to be ejected onto a wafer), pulsation (pressure fluctuations) caused by a drop in the fluid supply can be avoided, thus ensuring a steady delivery of a predetermined amount of photoresist at all times.

[0053] Next, the photoresist is degassed using the photoresist feeder 5 with reference to the Fig. 11 and Fig. 12 explained, with basic components that belong to those that are in the Fig. 3 to 10 are identical, represented by the same reference symbols as those in the Fig. 3 to 10 are designated. When the degassing process is started, the shut-off valve V4 is opened and the flow path downstream of the shut-off valve V4 (i.e., the supply line 503 to the hose 62) is filled with the photoresist. At this time, the dispensing valve V1 on the discharge line 501 and the shut-off valve V2 on the vent line 507 are closed, and the shut-off valve V3 on the return line 502 is opened. Then, the roller 65 is moved from its home position to a position where the roller 65 is brought into contact with the hose 62, pinching the hose 62 between the roller 65 and the guide element 61. After that, the shut-off valve V4 on the supply line 503 is closed ( Fig. 11).

[0054] After the shut-off valve V4 has been closed, even if the roller 65 is moved towards the outlet of hose 62, no photoresist is supplied from the upstream side of hose 62 into hose 62. Therefore, as in Fig. As shown in Figure 11, the hose 62 collapses. However, since the elastic hose 62 has a restoring force to return to its original shape, the interior of a portion of the supply line 503, which extends from the shut-off valve V4 to the inlet of the hose 62, is depressurized, allowing any gas dissolved in the photoresist to degasse. At this point, the destination for the photoresist from the peristaltic pump 6 can be the vent line 507 instead of the return line 502. In a preliminary experiment, it was found that for a resin hose (62) with an inner diameter of 6 mm and a thickness of 1.25 mm, a vacuum of -70 kPa relative to atmospheric pressure could be achieved at the restoring force of the hose 62. This vacuum is sufficient to degas the photoresist.

[0055] After the condition that was in Fig. As shown in Figure 11, after the degassing process has been maintained for a predetermined time, the shut-off valve V4 on the feed line 503 is opened, and the roller 65 is moved (forward) in the same direction of rotation to its home position. As a result, the tube 62 returns to its original shape due to its elasticity, so that the degassed photoresist comes into contact with the tube 62. Subsequently, the roller 65 is moved so that the tube 62 is pinched between the roller 65 and the guide element 61, and the roller 65 is moved further forward, so that the photoresist is fed in. Therefore, the degassed photoresist passes through the filter 52, and bubbles that were formed in the photoresist during degassing are removed by the filter. Fig. 12) The bubble removal process is then carried out at a suitable time and the bubbles removed by filter 52 are discharged outside the filter, as described in Fig. 9 is shown.

[0056] Furthermore, the photoresist feeder 5 can be used for a process in which the photoresist is collected from the discharge line 501 when the operation of the coating and developing device is stopped or when the photoresist feeder 5 is undergoing maintenance. In this case, the roller 65 is driven in the opposite direction (the direction of rotation is opposite to the direction of rotation for feeding the photoresist to the nozzle 51) to bring the roller 65 into contact with the tube 62 from the outlet side of the tube 62 ( Fig. 13) Then the dispensing valve V1 on the discharge line 501 and the shut-off valve V4 on the supply line 503 are opened, while the shut-off valve V3 on the return line 502 and the shut-off valve V2 on the vent line 507 are closed, so that an open flow path (indicated by bold lines in Fig. (as shown in Figure 13) extends from the nozzle 51 to the intermediate container 53. In this situation, the roller 65 is moved in the opposite direction towards the inlet of the hose. As a result of this process, the photoresist remaining in the discharge line 501 is drawn into the hose 62; and the photoresist remaining in the hose 62 is returned to the supply line 502 (and towards the intermediate container 53).

[0057] Next, variations of the peristaltic pump 6 are described. The peristaltic pump 6, which is used in the Fig. 4 and Fig. As shown in Figure 5, the guide element 61 can be replaced by another guide element 61, selected from a plurality of guide elements 61 with different lengths (e.g., the length from the inner peripheral wall of each guide element 61 opposite the roller 65), measured in the axial direction of the guide element 62. Therefore, the distance between the ejection start position and the ejection end position can be changed, thereby altering the amount of photoresist supplied to the nozzle 51. Alternatively, the tube 62 can be replaced by another tube 62, selected from a plurality of tubes 62 having different inner diameters, thereby altering the amount of photoresist supplied to the nozzle 51.

[0058] Additionally, the rotating body 64 can have a plurality of rollers 65, as shown in Fig. Figure 14 shows a peristaltic pump 6a. In this case, the angular interval of the roller 65 and / or the length of the guide element 61, measured in the axial direction of the guide element 62, are suitably adapted so that when one of the rollers 65 compresses the tube 62 to supply the photoresist, the other roller(s) 65 do not compress the tube 62. Therefore, because the fluid delivery process is always performed by only one roller 65, the occurrence of pulsation can be limited, thus ensuring that a predetermined quantity of the photoresist is supplied continuously each time.

[0059] Furthermore, the configurations of hose 62 and roller 65 with regard to the movement mechanism are not identical to those of hose pumps 6 and 6a, as in the Fig. 4 and Fig. 14 shown, limited. Fig. 15 and Fig. Figure 16 shows another type of peristaltic pump 6b, in which the guide element 61 is provided along a straight-extending hose 62 (instead of the hose 62 being curved in a U-shape), and the roller 65 is guided by a guide wall 611 that is separate from the guide element 61. The peristaltic pump 6b has two drive belts 68 wound around pulleys 641 arranged with a vertical gap between them, and a roller shaft 651 connects the drive belts 68 to each other.

[0060] One pulley 641 with the drive belt 68 and the other pulley 641 with the drive belt 68 are held by a common roller shaft 651. When the drive belts 68 are rotated by an electric motor 67, which is arranged at a proximal end of the roller shaft 651, the roller is moved in such a way that the photoresist is supplied. In the peristaltic pump 6b of this example, the guide wall 611, in addition to the guide element 61, forms the guide element. The pulleys 641, the roller shafts 651, the electric motor 67, and the drive belts 68 form the movement mechanism.

[0061] It is not necessary for the feed device for the photoresist 5 to have the return line 502. For example, as it Fig. Figure 17, which depicts a peristaltic pump 6c, shows the roller shaft 651 held by a shaft 691, which can be retracted in the radial direction of the rotating body 64 by a drive unit 692. In this embodiment, until the roller 65 reaches the discharge start position (angular position), the roller 65 is retracted to a radial position where it has no contact with the hose 62. After the roller 65 reaches the discharge start position (angular position), it is moved to a radial position where the peripheral side surface of the roller 65 projects away from the rotating body 64, thus pinching the hose 62.

[0062] After the photoresist has been supplied, the roller 65 is retracted to a radial position in which the roller 65 does not touch the hose 62, and the roller 65 is moved to its home position (angular position) with the roller 65 retracted. In the embodiment described in Fig. As shown in Figure 17, the roller 65 does not touch the hose 62 while the roller 65 is moved to an area other than the area between the ejection start position and the ejection end position. Therefore, unnecessary ejection of the photoresist from the nozzle 51 can be prevented, even if the photoresist is not introduced into the return line 502. Additionally, since the roller can be moved without pressing on the hose 62 in this embodiment, the roller can be moved to the ejection start position from both the upstream and downstream sides of the hose 62.

[0063] Furthermore, the design of the feed device for the photoresist 5 can be modified such that the return line 502 branches off from the discharge line 501 at a point upstream of the filter 52. In this case, it is preferred that an additional filter is provided on the return line 502.

[0064] Additionally, the process of returning the roller 65 to its home position does not necessarily need to be performed every time. For example, a plurality of ejection start positions (ejection stop positions) can be provided on the tube 62 at regular intervals along the axis of the tube 62; in this case, when the roller 65 reaches a first ejection end position after supplying a dose of photoresist, the supply of photoresist is stopped and the wafer is replaced by another wafer W, and then the photoresist is supplied to the next wafer W by moving the roller 65 from the first ejection end position to a second ejection start position.As described below (Experiment 2), as long as the photoresist can be supplied in substantially the same quantity each time, even if the ejection start positions differ, the aforementioned process can be carried out (see (Examples 2-1 and 2-2)).

[0065] The description is provided for the case where the feed device for the photoresist 5, according to one embodiment of the feed device for a process fluid, is provided in a photoresist coating unit that is integrated into the coating and developing unit. However, without being limited to the preceding embodiment, the feed device for a process fluid can be incorporated into various types of process fluid processing units to supply different types of process fluids to substrates. For example, the feed device for a process fluid can be incorporated into the aforementioned coating unit for an antireflective coating, or into the developing unit (DEV) 25 for supplying a developing fluid, or into a protective film formation unit (ITV) for supplying liquid material from a protective film to be formed on the photoresist.

[0066] Furthermore, without being limited to the liquid processing units of the coating and development apparatus, the feed device for a process fluid can be incorporated into a liquid processing unit for supplying an acidic or basic cleaning fluid to clean the wafer W. A process target to be supplied with the process fluid via the feed device is not limited to a semiconductor wafer, but can be a wide variety of substrates, such as a glass substrate for a flat panel display (FPD). Examples Experiment 1

[0067] An experiment was carried out in which a photoresist was applied to the nozzle 51 using the peristaltic pump 6, which only had one roller 65, as in the Fig. 4 and Fig. 5 shown, and using the hose pump 6d, the four rollers 65, as in Fig. Figure 18 shows that the photoresist is supplied. The change in the feed pressure of the photoresist over time and the ejection condition of the photoresist from nozzle 51 were observed. A. Experimental conditions (Example 1)

[0068] The hose pump 6, which is in the Fig. 4 and Fig. 5 shown, was in the feeding device for a photoresist 5, which is in Fig. Figure 3 shows the installation. The roller 65 was moved such that the flow rate of the photoresist delivered by the peristaltic pump 6 was 0.5 ml / second. The change in the feed pressure of the photoresist over time was measured with a manometer (pressure gauge) 56, which was arranged on the discharge line 501 at the outlet side of the peristaltic pump 6. In addition, the discharge state of the photoresist from the nozzle 51 was visually observed. The tubing 62 used in this experiment is a resin-coated tubing with an inner diameter of 6 mm and a thickness of 1.25 mm. (Comparative example 1)

[0069] The change in the feed pressure of the photoresist over time was measured, and the ejection state of the photoresist from nozzle 51 was visually observed under the same conditions as in Experiment 1. The comparative experiment 1 uses a peristaltic pump having four rollers 65 arranged at regular angular intervals on an outer periphery of the rotating body 64, as shown in Fig. Figure 18 shows that in comparative example 1, the hose 62 was simultaneously compressed by two or three rollers 65 when the peristaltic pump 6d delivered a dose of photoresist. B. Result of the experiment

[0070] Fig. Figure 19 shows the change in the feed pressure of the photoresist over time in (Example 1) and Fig. Figure 21 shows the ejection state of the photoresist from nozzle 51 in (Example 1). Additionally, Figure 21 shows... Fig. 20 the change in the feed pressure of the photoresist over time in (comparative example 1) and Fig. 22(a) and Fig. Figure 22(b) shows the ejection state of the photoresist from the nozzle in (comparative example 1). In the Fig. 19 and Fig. 21 The horizontal axes represent the “time” and the vertical axes represent the value of the manometer 56 expressed as “instrument pressure”.

[0071] The experimental result of (Experiment 1) in Fig. Figure 19 shows that when the photoresist was supplied using only one roller 65, the photoresist was supplied at a constant pressure of approximately 3 kPa during the movement of the roller 65. The pressure changed significantly only at the time after the movement of the roller 65 was started and at the time immediately after the movement of the roller 65 was stopped. As a result, as in Fig. As shown in Figure 21, the photoresist can be ejected from nozzle 51 without any discontinuity or interruption.

[0072] On the other hand, as in Fig. As shown in Figure 20, comparative example 1 demonstrates that the pressure of the photoresist at the outlet of the peristaltic pump 6d pulsates noticeably at all times within a range of approximately +20 kPa to approximately -20 kPa. Due to this pulsation, there were periods during which the photoresist was continuously expelled from the nozzle 51, as shown in Figure 20. Fig. 22(a) shown; and time periods in which the photoresist was intermittently ejected from nozzle 51, as in Fig. Figure 22b(b) shows that the photoresist could not be supplied continuously.

[0073] The discharge line 501 was formed by means of a transparent tube, and the photoresist flowing through the discharge line 501 towards the nozzle 51 was observed. In comparative example 1, it was confirmed that a number of fine bubbles were present in the photoresist, which could not be seen in example 1. The reason for this is considered to be that a section of the tube 62 between the compressed sections of the tube 62, which was compressed by two adjacent rollers 65, was under negative pressure, causing the gas dissolved in the photoresist to be released and form bubbles. The introduction of a photoresist containing bubbles leads to an uneven coating and / or defects in the coating. (Experiment 2)

[0074] By using the same peristaltic pump 6 as in Example 1, the change in the amount of photoresist ejected from the nozzle was observed while changing the ejection start position, while maintaining the distance between the ejection start position and the ejection end position. A. Experimental conditions (Example 2-1)

[0075] As indicated by the arrow with the reference symbol (a) in Fig. As shown in Figure 23, the peristaltic pump 6 supplies the photoresist to the nozzle by moving the roller 65 from an angular position of 0 degrees (the ejection start position) to an angular position of 90 degrees (the ejection end position). The amount of photoresist dispensed by the nozzle 51 was measured ten times. (Example 2-2)

[0076] As indicated by the arrow with the reference symbol (b) in Fig. As shown in Figure 23, the peristaltic pump 6 supplies the photoresist to the nozzle by moving the roller 65 from an angle of 45 degrees (the ejection start position) to an angle of 135 degrees (the ejection end position). The same measurement was performed as in Example 2-1. (Example 2-3)

[0077] As indicated by the arrow with the reference symbol (c) in Fig. As shown in Figure 23, the peristaltic pump 6 supplies the photoresist to the nozzle by moving the roller 65 from an angle of 90 degrees (the ejection start position) to an angle of 180 degrees (the ejection end position). The same measurement was performed as in Example 2-1. B. Result of the experiment

[0078] Fig. Figure 24 shows experimental results from Experiment 2-1 to Experiment 2-3. The horizontal axis of Fig. 24 indicates the number of times the photoresist was ejected from nozzle 51, and the vertical axis indicates the measured quantity of photoresist ejected each time. Fig. 24 is the result of (Example 2-1) represented by crosses (X), the result of (Example 2-2) represented by circles (O) and the result of (Example 2-3) represented by rectangles (□).

[0079] The experimental results in Fig.Figure 24 shows that in each of Example 2-1 to Example 2-3, when the ejection start position of roller 65 was not changed, the amount of photoresist ejected was essentially constant, regardless of the number of photoresist feed times. On the other hand, the average photoresist ejection quantity was 0.722 ml in Example 2-1; the average photoresist ejection quantity in Example 2-1 was 0.716 ml, which is slightly less than in Example 2-1; and the average photoresist ejection quantity was 0.807 ml in Example 2-3, which is significantly more than in Example 2-1 and Example 2-2.

[0080] The exact reason why the amount of photoresist ejected from nozzle 51 varies based on the ejection start position of roller 65 is not clear, however, it is assumed that the elastic restoring force for restoring the shape of the deformed (compressed) tube 62 varies depending on the position of the tube 62 due to the intended profile of the tube 62.

[0081] As previously described, the experimental results from Example 2-1 to Example 2-3 showed that the amount of photoresist ejected from nozzle 51 is significantly influenced by the ejection start position of roller 65. Therefore, it was found that with the peristaltic pump 6, from which the process fluid was dispensed via roller 65, the same amount of photoresist can be continuously supplied to each wafer W by maintaining the ejection start position of roller 65.

Claims

[1] Process fluid supply device comprising a feed pump (6) arranged in a feed channel (503, 501), wherein the process fluid supply device uses the feed pump (6) to discharge a process fluid supplied from a process fluid source to a process target via a discharge part (51), wherein the feed pump (6) includes: an elastic hose (62) which serves as part of the feed channel (503, 501); a guide element (61) extending in an axial direction of the hose (62) to support an outer surface of the hose (62); a pinch element (65) that is movable along the axial direction of the hose (62), wherein the hose (62) is compressed between the pinch element (65) and the guide element (61), thereby conveying the process fluid; and a movement mechanism (64, 67) that moves the pinch element (65) from a first axis position of the hose (62), at which the pinch element (65) begins to compress the hose (62), to a second axis position of the hose (62), at which the pinch element (65) leaves the hose (62) in the direction of the discharge part (51) after the process fluid has been supplied, wherein the pinch element (65) and the movement mechanism (64, 67) are arranged such that only a compressed part, which is compressed between the pinch element (65) and the guide element (61), is formed between the first axis position and the second axis position of the hose (62), and this compressed part moves along the axis direction of the hose (62) during the dispensing of a dose of process fluid towards the ejection part (51), the process fluid supply device further comprises: a shut-off valve (V4) which is located in the feed channel (503) at a position closer to the process fluid source than to the hose (62), so that it allows either blocking or feeding of the process fluid to the feed pump (6); a filter (52) arranged in the feed channel (501) at a position closer to the discharge part (51) than to the hose (62); and a control unit (200) configured to output a control signal for controlling the movement mechanism (64, 67) and the shut-off valve (V4) such that: the pinch element (65) compresses the hose (62), with a portion of the feed channel (503) between the shut-off valve (V4) and the hose (62) being filled with the process fluid;The pinch element (65), which compresses the hose (62), then moves towards a downstream side of the hose (62) while the shut-off valve (V4) is closed, thereby depressurizing the portion of the feed channel (503) between the shut-off valve (V4) and the hose (62) and degassing the process fluid located in that portion of the feed channel (503) between the shut-off valve (V4) and the hose (62) filled with the process fluid, utilizing the elasticity of the flexible hose (62) which causes the flexible hose (62) to return to its original shape; then the shut-off valve (V4) is opened to allow the degassed process fluid to flow into the hose (62);and then the squeezing element (65) again compresses the hose (62) and moves towards a downstream side of the hose (62) to feed the process fluid into the filter (52) so that the degassed process fluid is filtered.; [2] Process fluid supply device according to claim 1, wherein the squeezing element (65) starts to move from a predetermined discharge start axis position of the hose (62), wherein the hose (62) is compressed between the squeezing element (65) and the guide element (61) when the feed pump (6) starts to supply the process fluid in the direction of the discharge part (51). [3] Process fluid supply device according to claim 1 or 2, comprising: a branch channel (502) which branches off from the feed channel (501) at a junction between the feed pump (6) and the discharge part (51); a flow channel switching device (V1, V3) that switches a target of the process fluid, which is conveyed by the feed pump (6), between the discharge part (51) and the branch channel (502); and a control unit (200) which is configured to output a control signal for controlling the flow channel switching device (V1, V3) so that the process fluid supplied by the feed pump (6) is fed to the branch channel (502) when the squeeze element (65) moves from the first axis position to the discharge start axis position with the hose (62) between the squeeze element (65) and the guide element (61) compressed, and the process fluid supplied by the feed pump (6) is fed to the discharge part (51) when the squeeze element (65) moves from the discharge start axis position towards the second axis position. [4] Process fluid supply device according to claim 3, wherein the branch channel (502) opens into the supply channel (503) at an inlet which is closer to the process fluid source than the hose (62), wherein the process fluid which is conveyed by the feed pump (6) is returned to the feed pump (6) via the branch channel (502) when the flow channel switching device (V1, V3) switches the destination of the process fluid to the branch channel (502). [5] Process fluid supply device according to claim 3 or 4, further comprising a filter arranged on a flow path extending from an outlet of the feed pump (6) through the branch channel (502) to an inlet of the feed pump (6). [6] Process fluid supply device according to one of the preceding claims, wherein the feed pump (6) is arranged such that the guide element (61) is interchangeable, so that the quantity of the process fluid conveyed by a single conveying operation of the squeeze element (65) can be changed by using a guide element (61) selected from a plurality of guide elements (61) having different lengths measured in the axial direction of the hose (62). [7] Process fluid supply device according to one of the preceding claims, wherein the feed pump (6) is arranged such that the hose (62) is interchangeable, so that the quantity of process fluid supplied by a single feed operation of the squeeze element (65) can be changed by using a hose (62) selected from a plurality of hoses having different inner diameters. [8] Process fluid supply device according to one of the preceding claims, wherein the movement mechanism (64, 67) carries a plurality of squeeze elements (65), and the movement mechanism (64, 67) is arranged such that when one of the squeeze elements (65) that compresses the hose (62) moves to supply the process fluid, the other squeeze elements (65) or elements do not squeeze the hose (62). [9] Process fluid supply method, which supplies a process fluid from a process fluid source by means of a feed pump (6) arranged in a feed channel (503, 501) for ejecting the process fluid from an ejection part (51) to a process target, the method comprising: providing a feed pump (6) comprising: an elastic hose (62) forming part of the feed channel (503, 501); a guide element (61) extending in an axial direction of the hose (62) to support an outer surface of the hose (62); and a squeeze element (65) movable along the axial direction of the hose (62), the hose (62) being squeezed between the squeeze element (65) and the guide element (61), thereby conveying the process fluid; moving the pinch element (65) to a first axis position of the hose (62) to allow the hose (62) to be compressed between the pinch element (65) and the guide element (61); then, moving the pinch element (65) in the axial direction of the hose (62) towards its downstream side, whereby the hose (62) is compressed between the pinch element (65) and the guide element (61), thereby conveying the process fluid towards the discharge part (51); and then, separating the crimping element (65) from the hose (62); wherein only a compressed part, which is compressed between the squeezing element (65) and the guide element (61), is formed in the hose (62) between the first axial direction and the second axial direction, and this only compressed part moves along the axial direction of the hose (62) during the dispensing of a dose of the process fluid towards the ejection part (51), the process fluid supply method additionally includes: Providing a shut-off valve (V4) located in the feed channel (503) at a position closer to the process fluid source than the hose (62) to selectively allow blocking or feeding of the process fluid to the feed pump (6), and providing a filter (52) located in the feed channel (501) at a position closer to the discharge part (51) than the hose (62); squeezing the hose (62) through the squeezing element (65), wherein a portion of the feed channel (503) is located between the shut-off valve (V4) and the hose (62). is filled with process fluid; then moving the pinch element (65) towards a downstream side of the hose (62) while the shut-off valve (V4) is closed, thereby depressurizing the part of the feed channel (503) between the shut-off valve (V4) and the hose (62), and degassing the process fluid located in the part of the feed channel (503) between the shut-off valve (V4) and the hose (62) filled with the process fluid, using the elasticity of the elastic hose (62) which causes the elastic hose (62) to return to its original shape; then opening the shut-off valve (V4), which allows the degassed process fluid to enter the to flow through hose (62); and then squeeze the hose (62) through the squeeze element (65) and move the squeeze element (65) towards a downstream side of the hose (62), thereby conveying the process fluid into the filter (52) so that the degassed process fluid is filtered. [10] Process fluid supply method according to claim 9, wherein the squeezing element (65) starts to move from a predetermined discharge start axis position of the hose (62), the hose (62) being compressed between the squeezing element (65) and the guide element (61) while the process fluid is discharged in the direction of the discharge part (51). [11] Process fluid supply method according to claim 9 or 10, comprising: providing a branch channel (502) branching off from the feed channel (501) at a junction between the feed pump (6) and the discharge section (51); and a flow channel switching device (V1, V3) switching a target of the process fluid conveyed by the feed pump (6) between the discharge section (51) and the branch channel (502); and control the flow channel switching device (V1, V3) such that the destination of the process fluid is the branch channel (502) in order to enable the process fluid to be conveyed towards the branch channel (502) when the squeezing element (65) moves from the first axis position to the discharge start axis position of the hose (62); and control the flow channel switching device (V1, V3) so that the destination of the process fluid is the discharge part (51) in order to enable the process fluid to be conveyed towards the discharge part (51) when the squeezing element (65) reaches the discharge start axis position of the hose (62). [12] Process fluid supply method according to claim 11, wherein the branch channel (502) opens into the supply channel (503) at an inlet which is closer to the process fluid source than to the hose (62), wherein the process fluid which is conveyed by the feed pump (6) is returned to the feed pump (6) via the branch channel (502) when the flow channel switching device (V1, V3) switches the destination of the process fluid to the branch channel (502). [13] Process fluid supply method according to claim 12, further comprising filtering the process fluid, which is conveyed by the feed pump (6) and returned to the feed pump (6) via the branch channel (502), by means of a filter.

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