Needle chart and manufacturing process for it

Abstract

Needle chart (10), including: a probe holder (11); a first substrate (12) having an upper surface (121) wherein the upper surface (121) is provided with several first contacts (1211); a second substrate (13) located between the probe holder (11) and the first substrate (12) and arranged on the upper surface (121) of the first substrate (12) and having a lower surface (132) and a side surface (133), wherein the lower surface (132) of the second substrate (13) faces the upper surface (121) of the first substrate (12), the lower surface (132) of the second substrate (13) is provided with several second contacts (1321) and the several second contacts (1321) are electrically connected to the corresponding first contacts (1211); a first elastomer (14) located between the upper surface (121) of the first substrate (12) and the lower surface (132) of the second substrate (13) and surrounding all of the multiple second contacts (1321) of the second substrate (13); and a first gel (15) that is arranged on the upper surface (121) of the first substrate (12) and surrounds the side surface (133) of the second substrate (13) and is located on an outside of the first elastomer (14).

Description

Field of invention

[0001] The present invention relates to a needle card and a method for manufacturing the needle card. State of the art

[0002] A probe card is a signal transmission interface between a testing machine and a device under test (DUT). In some probe card products used in soldering processes, when the probe of the probe card holder comes into contact with a DUT, the normal force generated by the probe holder accommodating the contact surface is transmitted through the probe holder, which can lead to the breakage of the solder joints on the probe card substrate. Fig. Figure 1A shows a schematic view of a conventional needle card in a static state. In the conventional manufacturing process for needle cards, in which soldering takes place, the needle card comprises a test circuit board 7, a substrate 2, and a probe holder 11, wherein the substrate 2 is soldered to the test circuit board 7 using solder balls to form a plurality of solder joints 4. Fig. Figure 1B shows a schematic view of the conventional pin card in use. As in Fig. As shown in Figure 1B, the substrate 2 connected to the probe holder 11 bends when the probe of the probe holder 11 comes into contact with a test specimen and is subjected to a normal force 5, thereby subjecting the solder joints 4 arranged around the substrate 2 to tensile stress in the vertical direction shown in the figure. After a certain time, the solder joints 4 arranged around the substrate 2 can break, resulting in an open signal transmission circuit.

[0003] Fig. Figure 2A shows an enlarged partial view of the framed area of ​​the needle card according to Fig. 1A. To solve the problem of the solder joints arranged around the substrate 2 breaking, the inventor has set himself the task of fixing the perimeter of the substrate 2 with adhesive 3. Fig. Figure 2B shows a schematic view according to Fig. 1A in a state where adhesive is provided on the needle card. As in Fig. As shown in Figure 2B, the perimeter of substrate 2 is bonded and fixed by adhesive 3 to prevent the solder joints 4 from breaking. The function of adhesive 3 is to fill the vertical space between the fixed substrate 2 and the test board 7, thus preventing the solder joints 4 from cracking or breaking if substrate 2 is deformed. Adhesive 3 can easily penetrate the space between substrate 2 and test board 7, thereby encasing some of the solder joints 4. If, in this case, the probe card needs to be disassembled and repaired, and the substrate 2 and probe holder need to be desoldered and separated, and some of the solder joints 4 are surrounded and fixed by adhesive 3, the disassembly difficulties and the likelihood of damage to the joints increase simultaneously, leading to a waste of resources and increased production costs.

[0004] A conventional probe card, which has an inspection contact structure on the underside of a printed circuit board, is further described in document US 2006 / 0154497 A1. Document DE 10031952 A1 relates to a multi-chip semiconductor module and its manufacturing process. Document US 2013 / 0069680 A1 relates to risers with a multitude of high aspect ratio electrical conductors, as well as systems and methods for manufacturing and / or using them. Object of the invention

[0005] The invention is based on the objective of avoiding the aforementioned disadvantages and creating a needle card comprising a probe holder, a first substrate, a second substrate, a first elastomer, and a first gel, wherein the first substrate has an upper surface with several first contacts, the second substrate is located between the probe holder and the first substrate and is arranged on the upper surface of the first substrate, the second substrate has a lower surface and a side surface, the lower surface of the second substrate facing the upper surface of the first substrate and provided with several second contacts, the several second contacts being electrically connected to the corresponding first contacts.the first elastomer is located between the upper surface of the first substrate and the lower surface of the second substrate and is arranged on the outside of the multiple second contacts of the second substrate, and the first gel is arranged on the upper surface of the first substrate and surrounds the side surface of the second substrate and is located on the outside of the first elastomer.

[0006] It is a further object of the present invention to provide a method for manufacturing the needle card. The needle card comprises a first substrate, a second substrate, and a probe holder, wherein the upper surface of the first substrate is provided with several first contacts and the lower surface of the second substrate is provided with several second contacts. The method comprises arranging the second substrate on the upper surface of the first substrate, wherein each second contact is electrically connected to the corresponding first contact. The method further comprises arranging the first elastomer between the first substrate and the second substrate, wherein the first elastomer is located on the outside of the several second contacts of the second substrate.The process further comprises arranging the first gel on the upper surface of the first substrate, wherein the first gel surrounds the side surface of the second substrate and the outside of the first elastomer, and then cures. Brief description of the drawings Fig. Figure 1A shows a schematic view of a conventional needle card in a static state; Fig. Figure 1B shows a schematic view of the conventional pin card in a state of use; Fig. Figure 2A shows an enlarged partial view of the framed area of ​​the needle card according to Fig. 1A; Fig. Figure 2B shows a schematic view according to Fig. 1A in a state in which adhesive is provided on the needle card; Fig. Figure 3A shows a schematic view of an embodiment of the needle card according to the invention; Fig. Figure 3B shows an enlarged partial view of the framed area of ​​the pin card according to Fig. 3A; Fig. Figure 4 shows a schematic view of another embodiment of the needle card according to the invention; Fig. Figure 5 shows a schematic view of the configuration of the third gel of an embodiment according to the present invention; Fig. Figure 6 shows a schematic view of the configuration of the first elastomer and the first gel of an embodiment according to the present invention; Fig. Figure 7 shows a schematic view of the configuration of the first elastomer and the first gel of a further embodiment according to the present invention; Fig. Figure 8 shows a flowchart of the process for manufacturing the needle card of an embodiment according to the present invention; Fig. Figure 9 shows a flowchart of the process for manufacturing the needle card of a further embodiment according to the present invention. Detailed description of the exemplary implementations

[0007] Fig. Figure 3A shows a schematic view of an embodiment of the needle card according to the invention. The needle card 10 shown comprises a probe holder 11, a first substrate 12, a second substrate 13, a first elastomer 14, and a first gel 15. The first substrate 12 has an upper surface 121 with several first contacts 1211. The second substrate 13 is located between the probe holder 11 and the first substrate 12 and is arranged on the upper surface 121 of the first substrate 12. The second substrate 13 has a lower surface 132 and a side surface 133, and the lower surface 132 of the second substrate 13 faces the upper surface 121 of the first substrate 12. The lower surface 132 of the second substrate 13 is provided with several second contacts 1321, and the several second contacts 1321 are electrically connected to the corresponding first contacts 1211.The first elastomer 14 is located between the upper surface 121 of the first substrate 12 and the lower surface 132 of the second substrate 13 and is arranged on the outside of the multiple second contacts 1321 of the second substrate 13. The first gel 15 is arranged on the upper surface 121 of the first substrate 12 and surrounds the side surface 133 of the second substrate 13 and is located on the outside of the first elastomer 14.

[0008] The probe holder 11 is equipped with several probes 111. The probes 111 transmit the test signal coming from the test machine to a device under test (DUT) and send the measurement result returned by the DUT back to the test machine. The electrical contacts of the probe holder 11 and the electrical contacts of the second substrate 13 can be connected to each other, for example by physical contact, soldering, wire bonding, etc., so that the electrical signals can be conducted. According to some embodiments, the probe holder 11 is attached to the first substrate 12 by means of a mounting seat 19.

[0009] In some embodiments, the first substrate 12 is a printed circuit board. The first substrate 12 has a top surface 121, the top surface 121 being provided with several first contacts 1211. In some embodiments, the first substrate 12 includes wiring for transmitting signals to the test machine, with an electrically conductive connection between the first contacts 1211 and the wiring. The second substrate 13 is located between the probe holder 11 and the first substrate 12 and is arranged on the top surface 121 of the first substrate 12 to form a multilayer structure. The second substrate 13 can be, but is not limited to, a printed circuit board, a multilayer organic substrate (MLO), or a multilayer ceramic substrate (MLC).The second substrate 13 has a lower surface 132 and a side surface 133, the lower surface 132 facing the upper surface 121 of the first substrate 12. The lower surface 132 of the second substrate 13 is provided with several second contacts 1321, the second contacts 1321 of the second substrate 13 being electrically connected to the corresponding first contacts 1211 of the first substrate 12. Preferably, the second substrate 13 can be a ceramic substrate with higher hardness to reduce the degree of bending of the second substrate 13 during the test procedure, thereby reducing the probability of fracture occurring between the first contacts 1211 arranged around the second substrate 13 and the second contacts 1321.Electrical connection can be any method of connection that enables the transmission of electrical signals, such as, but not limited to, physical contact, soldering, reflow soldering, wire bonding, etc. Electrical connection is not limited to a direct connection or an indirect connection achieved via other elements.

[0010] The first elastomer 14 can consist of materials such as rubber, silicone, plastic, organic materials, or a combination thereof, but is not limited to such materials. According to some embodiments, the first elastomer 14 is formed by curing a gel. The first elastomer 14 is located between the upper surface 121 of the first substrate 12 and the lower surface 132 of the second substrate 13. According to some embodiments, the first elastomer 14 is located entirely within the space provided between the first substrate 12 and the second substrate 13. According to some embodiments, a portion of the first elastomer 14 is located within the space provided between the first substrate 12 and the second substrate 13, and the first elastomer 14 is located on the outside of the multiple second contacts 1321 of the second substrate 13.According to some embodiments, the first elastomer 14 is arranged on the outside of all second contacts 1321 of the second substrate 13. Here, "on the outside" means that the first elastomer 14 is not located between any two designated contacts 1321; that is, the line connecting the two second contacts 1321 does not pass through the first elastomer 14. For example, in some embodiments, the second contacts 1321 are located near the center of the second substrate 13, and the first elastomer 14 is located near the outer circumference of the second substrate 13, so that all second contacts 1321 are surrounded by the first elastomer 14. The first elastomer 14 has a first elasticity value, and the first gel 15 has a second elasticity value, the first elasticity value being greater than the second elasticity value.

[0011] In some embodiments, the upper surface and the lower surface of the first elastomer 14 are in contact with the lower surface 132 of the second substrate 13 and the upper surface 121 of the first substrate 12, respectively, wherein the first elastomer 14 is fastened by the frictional force between the upper surface 121 of the first substrate 12 and the lower surface 132 of the second substrate 13 between it and the first substrate 12 and the second substrate 13.

[0012] According to some embodiments, the first elastomer 14 provides a support function for the second substrate 13 in order to avoid deformation of the second substrate 13 caused by external forces.

[0013] The first gel 15 is arranged on the upper surface 121 of the first substrate 12 and surrounds the side surface 133 of the second substrate 13 to fix the relative position between the first substrate 12 and the second substrate 13. The term "surrounds" refers to the perimeter of the substrate, without being limited to a continuous arrangement, an arrangement with fixed intervals, or an arrangement without fixed intervals. The first gel 15 is arranged on the outside of the first elastomer 14. In some embodiments, the first gel 15 borders the first elastomer 14. In some embodiments, the first gel 15 completely covers the first elastomer 14. In some embodiments, the first gel 15 covers a portion of the first elastomer 14.According to some embodiments, when the first gel 15 is in a liquid state before curing, it cannot penetrate the areas of the second contacts 1321 (or the first contacts 1211) located between the first substrate 12 and the second substrate 13, because the first gel is blocked by the first elastomer 14. This prevents the first gel 15 from flowing into the area of ​​the first contacts 1211 or the second contacts 1321, thus making it difficult to separate the first substrate 12 and the second substrate 13 during desoldering, as otherwise the first contacts 1211 and the second contacts 1321 would be severely damaged. According to some embodiments, the first elastomer 14 has a first coefficient of thermal expansion and the first gel 15 has a second coefficient of thermal expansion, the value of the first coefficient of thermal expansion being less than or equal to the value of the second coefficient of thermal expansion.In this way, during a temperature increase of the test environment, the second substrate 13 is not lifted by excessive deformation of the needle card 10. Given that the first gel 15 adheres to the second substrate 13, the surface material of the first gel 15 and the first substrate 12 or the second substrate 13 should have sufficient affinity, and the first gel 15 should have low flowability so that the first gel 15 can form an inclined surface before curing and adhere completely to the first substrate 12 or the second substrate 13. Therefore, according to some embodiments, there is a first adhesive force between the first elastomer 14 and the second substrate 13 and a second adhesive force between the first gel 15 and the second substrate 13, the value of the first adhesive force being less than the value of the second adhesive force.Furthermore, as in the embodiments above, the first elastomer 14 can be formed by curing a gel, so that the first elastomer 14 exhibits an initial adhesive force. A portion of the first elastomer 14 is arranged between the first substrate 12 and the second substrate 13, with the first elastomer 14 adhering to the upper surface 121 of the first substrate 12 and the lower surface 132 of the second substrate 13. This means that there are no gaps between the first substrate 12 and the first elastomer 14, nor between the second substrate 13 and the first elastomer 14. In the arrangement of the first gel 15, the first gel 15 is blocked by the first elastomer 14 and does not flow into or penetrate the space provided between the first substrate 12 and the second substrate 13.To ensure that the first gel 15 adheres to the second substrate 13 and to prevent deformation of the second substrate 13 caused by external forces, the value of the first adhesive force should be high. To facilitate disassembly and repair of the first substrate 12 and the second substrate 13, such as desoldering them, the value of the first adhesive force between the first elastomer 14 and the second substrate 13 should be low to avoid difficulties during disassembly or damage to either the first substrate 12 or the second substrate 13.

[0014] Fig. Figure 4 shows a schematic view of a further embodiment of the needle card according to the invention. The needle card 20 shown therein comprises a probe holder 11, a first substrate 12, a second substrate 13, a third substrate 16, a first elastomer 14, a second elastomer 17, a first gel 15, and a second gel 18. The second substrate 13 has a top surface 131, a bottom surface 132, a side surface 133, and internal wiring 134. The top surface 131 of the second substrate 13 is provided with several fourth contacts 1311. The third substrate 16 is located between the probe holder 11 and the second substrate 13 and is arranged on the top surface 131 of the second substrate 13. In this way, a multilayer structure is formed with the first substrate 12, the second substrate 13, the third substrate 16, and the probe holder 11.

[0015] The third substrate 16 can be, but is not limited to, a printed circuit board, a multilayer organic substrate, or a multilayer ceramic substrate. The third substrate 16 has a top surface 161, a bottom surface 162, and a side surface 163, with the bottom surface 162 of the third substrate 16 facing the top surface 131 of the second substrate 13.The lower surface 162 of the third substrate 16 is provided with several third contacts 1621, wherein the third contacts 1621 of the third substrate 16 are electrically connected to the fourth contacts 1311 of the second substrate 13 and the internal wiring 134 of the second substrate 13 is electrically connected to the second contacts 1321 of the second substrate 13 and the fourth contacts 1311 of the second substrate 13, so that an electrically conductive connection exists between the first contacts 1211 of the first substrate 12, the second contacts 1321 of the second substrate 13, the fourth contacts 1311 of the second substrate 13 and the third contacts 1621 of the third substrate 16, in which electrical signals can be conducted.According to some embodiments, on the second substrate 13, an electrically conductive connection exists between two sets of second contacts 1321 and fourth contacts 1311 by means of two internal wires 134, wherein the distance between two adjacent second contacts 1321 is greater than the distance between two adjacent fourth contacts 1311. In this way, by adjusting the distance, the original distance between the probes 111 can be increased such that a continuous connection is formed with respect to the original distance and the distance between the first contacts 1211 of the first substrate 12 of the needle card 20. According to some embodiments, the distance between any two adjacent second contacts 1321 of the second substrate 13 is greater than the distance between any two adjacent fourth contacts 1311 of the second substrate 13.According to some embodiments, the third substrate 16 is electrically connected to the probe holder 11, wherein the third substrate 16 also has internal wiring for adjusting the contact distance so that the contacts can be redistributed.

[0016] The second elastomer 17 can consist of materials such as rubber, silicone, plastic, organic materials, or a combination thereof, but is not limited to such materials. According to some embodiments, the second elastomer 17 is formed by curing a gel. The second elastomer 17 is arranged between the upper surface 131 of the second substrate 13 and the lower surface 162 of the third substrate 16. According to some embodiments, the second elastomer 17 is located entirely within the space provided between the second substrate 13 and the third substrate 16. According to some embodiments, a portion of the second elastomer 17 is located within the space provided between the second substrate 13 and the third substrate 16, and the second elastomer 17 is arranged on the outside of the multiple third contacts 1621 of the third substrate 16.According to some embodiments, the second elastomer 17 is arranged on the outside of all third contacts 1621 of the third substrate 16.

[0017] In some embodiments, the upper surface and the lower surface of the second elastomer 17 are in contact with the lower surface 162 of the third substrate 16 and the upper surface 131 of the second substrate 13, respectively, wherein the second elastomer 17 is fastened by the frictional force between the upper surface 131 of the second substrate 13 and the lower surface 162 of the third substrate 13, respectively, between the second substrate 17 and the second substrate 13 or the third substrate 16.

[0018] According to some embodiments, the second elastomer 17 provides a support function for the third substrate 17 in order to avoid deformation of the third substrate 16 caused by external forces.

[0019] The second gel 18 is arranged on the upper surface 131 of the second substrate 13 and surrounds the side surface 133 of the third substrate 16 to fix the relative position between the second substrate 13 and the third substrate 16. The second gel 18 is arranged on the outside of the second elastomer 17. In some embodiments, the second gel 18 borders the second elastomer 17. In some embodiments, the second gel 18 completely covers the second elastomer 17. In some embodiments, the second gel 18 covers part of the second elastomer 17. Fig. Figure 5 shows a schematic view of the configuration of the third gel of an embodiment according to the present invention. It is shown on Fig. 5 Referenced. According to some embodiments, the first gel 15 and the second gel 18 of the needle card 30 are made of the same material and are joined together to form a third gel 181.

[0020] Fig. Figure 6 shows a schematic view of the configuration of the first elastomer and the first gel of an embodiment according to the present invention. As in Fig. As shown in Figure 6, the first elastomer 14 has a first through-hole 141, wherein the first through-hole 141 is continuously connected to the environment and to the space provided between the first substrate 12 and the second substrate 13. To allow the needle card 10 to be disassembled and repaired, according to some embodiments, the first gel 15 is prevented by the first elastomer 14 from penetrating the space provided between the first substrate 12 and the second substrate 13. However, since the first gel 15 must not fill the space provided between the first substrate 12 and the second substrate 13, gas is instead present between the first substrate 12 and the second substrate 13.If the needle card 10 is used in test environments with frequent changes between room temperature, high temperature, or low temperature, the thermal expansion and contraction of the gas can cause the contacts between the first substrate 12 and the second substrate 13 to fatigue and break. Therefore, according to some embodiments, the first through-hole 141 provides a gas flow channel to prevent the contacts between the first substrate 12 and the second substrate 13 from being subjected to gas-induced pressure. According to some embodiments, the first gel 15 has a second through-hole 151, the second through-hole 151 being fully connected to the first through-hole 141. The shape of the first through-hole 141 and the second through-hole 151 is not restricted to a circular, regular, or irregular shape.According to some embodiments, the diameter of the through-hole can be the smallest inner diameter, the largest inner diameter, or the average inner diameter. According to some embodiments, the diameter of the first through-hole 141 can be large enough to separate the first elastomer 14, thus creating a gap.

[0021] According to some embodiments, the first elastomer 14 has several first through holes 141. Fig. Figure 7 shows a schematic view of the configuration of the first elastomer and the first gel of a further embodiment according to the present invention. As in Fig. As shown in Figure 7, the first elastomer 14 has four first through-holes 141 and the first gel 15 has four second through-holes 151, wherein each first through-hole 141 and the corresponding second through-hole 151 are arranged opposite each other and are continuously connected. According to some embodiments, the first gel 15 has at least one second through-hole 151 on each side surface 133 of the second substrate 13. As shown in Fig. As shown in Figure 7, for example, the square second substrate 13 has four side faces 133, wherein the first gel 15 surrounds the four side faces 133 of the second substrate 13 and each side face 133 has a second through-hole 151. According to some embodiments, the hole diameter of each second through-hole 151 is greater than or equal to the hole diameter 1411 of the corresponding first through-hole 141, so that the first gel 15 does not flow through the first through-holes 141 into the space provided between the first substrate 12 and the second substrate 13 before curing.

[0022] According to some embodiments, the first gel 15 adheres to the side surface 133 of the second substrate 13, wherein the height of the first gel 15 is greater than or equal to the position at one-quarter of the side surface height 1331 of the second substrate 13 and less than or equal to the top surface 131 of the second substrate 13, to ensure that the first gel 15 is sufficient to adhere and fix the second substrate 13, wherein the first gel 15 does not spread onto the top surface 131 of the second substrate 13 and is not adhered and attached to the fourth contacts 1311 located on the top surface 131 of the second substrate 13. Preferably, the height of the first gel 15 is greater than or equal to the position at half the side surface height of the second substrate 13 and less than or equal to the top surface 131 of the second substrate 13. Fig. Figure 3B shows an enlarged partial view of the framed area of ​​the pin card according to Fig. 3A. As in Fig. As shown in Figure 3B, the height of the first gel 15 is calculated from the upper surface 121 of the first substrate 12 and extends upwards to the top of the first gel 15 located on the side surfaces 133 of the second substrate 13. According to some embodiments, the upper region of the first gel 6 is higher than or equal to the position at one-quarter of the side surface height 1331 of the second substrate 13, but does not exceed the area of ​​the upper surface 131 of the second substrate 13. As shown in Fig. As shown in Figure 3B, if, for example, the lower surface 132 of the second substrate 13 and the upper surface 121 of the first substrate 12 are subdivided into 100 units and the height of the second substrate 13 is 100 units, the height between the top of the first gel 15 and the upper surface 121 of the first substrate 12 can have a value between 125 and 200 units. Preferably, the upper region of the first gel 6 is higher than or equal to the position at half the side surface height of the second substrate 13, but does not exceed the area of ​​the upper surface 131 of the second substrate 13. As shown in Fig. As shown in Figure 3B, if, for example, the lower surface 132 of the second substrate 13 and the upper surface 121 of the first substrate 12 are divided into 100 units and the height of the second substrate 13 is 100 units, the height between the top of the first gel 15 and the upper surface 121 of the first substrate 12 can have a value between 150 and 200 units.

[0023] Fig. Figure 8 shows a flowchart of the method for manufacturing the needle card of an embodiment according to the present invention. The method comprises the following steps: First, the second substrate 13 is placed on the upper surface 121 of the first substrate 12 (step S01). Subsequently, the second contacts 1321 of the second substrate 13 are electrically connected to the corresponding first contacts 1211 of the first substrate 12, wherein the electrical connection method is, for example, but not limited to, physical contact, soldering, reflow soldering, and wire bonding. Subsequently, the first elastomer 14 is arranged between the first substrate 12 and the second substrate 13 and is located outside the multiple second contacts 1321 of the second substrate 13 (step S02).The first gel 15 is then applied to the upper surface 121 of the first substrate 12, surrounding the side surface 133 of the second substrate 13 and the outer surface of the first elastomer 14 (step S03), so that the first gel is blocked by the first elastomer 14 and does not flow into the area of ​​the multiple second contacts 1321 between the first substrate 12 and the second substrate 13. Finally, the first gel 15 cures (step S04).

[0024] According to some embodiments, step S02 of arranging the first elastomer 14 further comprises arranging the first through-hole 141 in the first elastomer 14, wherein in step S03 of arranging the first gel 15 the second through-hole 151 is arranged in the first gel 15, thereby connecting the second through-hole 151 of the first gel 15 to the first through-hole 141 of the first elastomer 14. According to some embodiments, the first through-hole 141 can be formed by selectively choosing the first elastomer 14 whose length is less than the outer circumference of the second substrate 13. In this way, if the first elastomer 14 is arranged along the outer edge of the second substrate 13 between the first substrate 12 and the second substrate 13, a first through-hole 141 is automatically formed, as shown in Fig. 6 shown. In some embodiments, if two first through-holes 141 are to be formed, two first elastomers 14 can be used. If the two first elastomers 14 are arranged along the outer edge of the second substrate 13 between the first substrate 12 and the second substrate 13, two first through-holes 141 can be formed automatically, as long as the two first elastomers 14 are kept separate from each other. In the same way, if four first through-holes 141 are to be formed, four first elastomers 14 can be used (see Fig. 7) When the four first elastomers 14 are arranged along the outer edge of the second substrate 13 between the first substrate 12 and the second substrate 13, four first through-holes 141 can be automatically formed as long as the four first elastomers 14 are kept separate from each other. Subsequently, the outer surfaces of the first elastomers 14 are coated with the first gel 15. It should be noted that during the coating process, the first gel 15 does not penetrate the first through-holes 141. In this way, one, two, or four second through-holes 151 can be automatically formed, corresponding to the number of first through-holes 141.

[0025] Fig.Figure 9 shows a flowchart of the method for manufacturing the needle card of a further embodiment according to the present invention. The method comprises the following steps: First, the second substrate 13 is placed on the upper surface 121 of the first substrate 12 (step S11). Subsequently, the second contacts 1321 of the second substrate 13 are electrically connected to the corresponding first contacts 1211 of the first substrate 12, wherein the electrical connection method is, for example, but not limited to, physical contact, soldering, reflow soldering, and wire bonding. Subsequently, the first elastomer 14 is arranged between the first substrate 12 and the second substrate 13 and is located outside the multiple second contacts 1321 of the second substrate 13 (step S12).The first gel 15 is then applied to the upper surface 121 of the first substrate 12, surrounding the side surface 133 of the second substrate 13 and the outer surface of the first elastomer 14 (step S13), so that the first gel is blocked by the first elastomer 14 and does not flow into the area of ​​the multiple second contacts 1321 between the first substrate 12 and the second substrate 13. Finally, the first gel 15 cures (step S14). The third substrate 16 is placed on the upper surface 131 of the second substrate 13 (step S15). Subsequently, the third contacts 1621 of the third substrate 16 are electrically connected to the fourth contacts 1311 of the second substrate 13, the electrical connection method being, for example, but not limited to, physical contact, soldering, reflow soldering, and wire bonding.The second elastomer 17 is then positioned between the second substrate 13 and the third substrate 16 and is located outside the multiple third contacts 1621 of the third substrate 16 (step S16). The second gel 18 is then applied to the upper surface 131 of the second substrate 13, with the second gel 18 surrounding the side surfaces 163 of the third substrate 16 and the outer surface of the second elastomer 17 (step S17), so that the second gel is blocked by the second elastomer 17 and does not flow into the area of ​​the multiple third contacts 1621 between the second substrate 13 and the third substrate 16. Finally, the second gel 18 cures (step S18). The preceding steps are not necessarily performed sequentially. For example, steps S15 to S18 can be performed first, followed by steps S11 to S14.

[0026] The present invention has been described with reference to the above embodiments, without, however, being limited by them. A person skilled in the art could make numerous modifications to the disclosed embodiments without departing from the spirit or scope of this invention. Reference symbol list 10, 20, 30 needle card 11 probe holders 111 Probe 12 first substrate 121 upper surface 1211 first contact 13 second substrate 131 upper surface 1311 fourth contact 132 lower surface 1321 second contact 133 side surface area 1331 Position at one quarter of the side surface height 134 internal wiring 14 first elastomer 141 first through hole 1411 Hole diameter 15 first gel 151 second through hole 1511 Hole diameter 16 third substrate 161 upper surface 162 lower surface 1621 third contact 163 side surface area 17 second elastomer 18 second gel 181 third gel 19 Mounting seat 2 Substrat 3 Adhesive 4 soldered connections 5 Normal force 6 upper area of ​​the first gel 7 Test circuit board S01 to S04 steps S11 to S18 steps

Claims

[1] Needle card (10), comprising: a probe holder (11); a first substrate (12) having an upper surface (121) wherein the upper surface (121) is provided with several first contacts (1211); a second substrate (13) located between the probe holder (11) and the first substrate (12) and arranged on the upper surface (121) of the first substrate (12) and having a lower surface (132) and a side surface (133), wherein the lower surface (132) of the second substrate (13) faces the upper surface (121) of the first substrate (12), the lower surface (132) of the second substrate (13) is provided with several second contacts (1321) and the several second contacts (1321) are electrically connected to the corresponding first contacts (1211); a first elastomer (14) located between the upper surface (121) of the first substrate (12) and the lower surface (132) of the second substrate (13) and surrounding all of the multiple second contacts (1321) of the second substrate (13); and a first gel (15) that is arranged on the upper surface (121) of the first substrate (12) and surrounds the side surface (133) of the second substrate (13) and is located on an outside of the first elastomer (14). [2] Needle card (10) according to claim 1, wherein the second substrate (13) further comprises an upper surface (131) and internal wiring (134), wherein the upper surface (131) is provided with several fourth contacts (1311); wherein the needle card (10) further comprises: a third substrate (16) located between the probe holder (11) and the second substrate (13) and arranged on the upper surface (131) of the second substrate (13) and having a lower surface (162) and a side surface (163), wherein the lower surface (162) of the third substrate (16) faces the upper surface (131) of the second substrate (13) and is provided with several third contacts (1621), wherein the internal wiring (134) is electrically connected to the first contacts (1211), the second contacts (1321), third contacts (1621) and the fourth contacts (1311); a second elastomer (17) located between the upper surface (131) of the second substrate (13) and the lower surface (162) of the third substrate (16) and surrounding all of the multiple third contacts (1621) of the third substrate (16); and a second gel (18) arranged on the upper surface (131) of the second substrate (13) and surrounding the side surface (163) of the third substrate (16) and located on an outer surface of the second elastomer (17). [3] Needle card (10) according to claim 2, wherein the first gel (15) and the second gel (18) are combined to form a third gel (181). [4] Needle card (10) according to claim 1, wherein the first elastomer (14) has a first through hole (141), the first through hole (141) being continuously connected to the environment and to the space provided between the first substrate (12) and the second substrate (13). [5] Needle card (10) according to claim 4, wherein the first gel (15) is adjacent to the first elastomer (14) and has at least one second through-hole (151), wherein each second through-hole (151) is opposite the corresponding first through-hole (141) and the hole diameter (1511) of each second through-hole (151) is greater than or equal to the hole diameter (1411) of the corresponding first through-hole (141). [6] Needle card (10) according to claim 5, wherein the first gel (15) has at least one second through-hole (151) on a respective side surface (133) of the second substrate (13). [7] Needle card (10) according to claim 1, wherein the first gel (15) adheres to the side surface (133) of the second substrate (13), the height of the first gel (15) being higher than or equal to the position at one quarter of the height of the side surface (133) and lower than or equal to the top surface (131) of the second substrate (13). [8] Needle card (10) according to claim 7, wherein the first gel 15 adheres to the side surface (133) of the second substrate (13), the height of the first gel (15) being higher than or equal to the position at half the height of the side surface (133) and lower than or equal to the top surface (131) of the second substrate (13). [9] Needle card (10) according to claim 1, wherein the first elastomer (14) has a first coefficient of expansion and the first gel (15) has a second coefficient of expansion, wherein the value of the first coefficient of expansion is less than the value of the second coefficient of expansion. [10] Needle card (10) according to claim 1, wherein a first adhesive force is present between the first elastomer (14) and the second substrate (13) and a second adhesive force is present between the first gel (15) and the second substrate (13), wherein the value of the first adhesive force is less than the value of the second adhesive force. [11] Method for manufacturing a needle card (10), wherein the needle card (10) comprises a first substrate (12), a second substrate (13) and a probe holder (11), wherein an upper surface (121) of the first substrate (12) is provided with multiple first contacts (1211) and a lower surface (132) of the second substrate (13) is provided with multiple second contacts (1321), the method comprising: Arranging the second substrate (13) on the upper surface (121) of the first substrate (12), wherein each second contact (1321) is electrically connected to a corresponding first contact (1221); Arranging a first elastomer (14) between the first substrate (12) and the second substrate (13), wherein the first elastomer (14) surrounds all of the multiple second contacts (1321) of the second substrate (13); Arranging a first gel (15) on the upper surface (121) of the first substrate (12), wherein the first gel (15) surrounds the side surface (133) of the second substrate (13) and an outer surface of the first elastomer (14); and Curing of the first gel (15). [12] Manufacturing method according to claim 11, wherein the step of arranging the first elastomer (14) further comprises the arrangement of a first through-hole (141) in the first elastomer (14); wherein the step of arranging the first gel (15) comprises the arrangement of a second through-hole (151) in the first gel (15), whereby the second through-hole (151) of the first gel (15) is continuously connected to the first through-hole (141) of the first elastomer (14). [13] Manufacturing method according to claim 11, wherein the needle card (10) further comprises a third substrate (16), wherein a lower surface (162) of the third substrate (16) is provided with several third contacts (1621) and an upper surface (131) of the second substrate (13) is provided with several fourth contacts (1311), wherein the method further comprises: Arranging the third substrate (16) on the upper surface (131) of the second substrate (13), wherein each second contact (1621) is electrically connected to a corresponding fourth contact (1311); Arranging a second elastomer (17) between the second substrate (13) and the third substrate (16), wherein the second elastomer (17) surrounds all of the multiple third contacts (1621) of the third substrate (16); Arranging a second gel (18) on the upper surface (131) of the second substrate (13), wherein the second gel (18) surrounds the side surface of the third substrate (16) and an outer surface of the second elastomer (17); and Curing of the second gel (18).

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